共查询到19条相似文献,搜索用时 156 毫秒
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研制成功了一种无微空气桥的亚微米InP基异质结双极晶体管(HBT) . 发展了小于100nm的发射极侧向腐蚀工艺,实现了亚微米的InP基HBT. 发射极宽度的减小有效提高了频率特性,发射极面积为0.8μm×15μm的HBT的电流增益截止频率达到了238GHz. 发展了基极-集电极的侧向过腐蚀工艺,有效减小了结面积,提高了最大振荡频率. Kirk电流密度达到了3.1mA/μm2. 据我们所知,电流增益截止频率是目前国内三端器件中最高的,Kirk电流密度是国内报道的HBT中最高的. 这对于HBT器件在超高速电路中的应用具有十分重要的意义. 相似文献
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针对毫米波电路对大电流、高截止频率器件的要求,利用平坦化技术,设计并制作成功了结构紧凑的四指合成InGaAs/InP异质结双极晶体管.实验结果表明发射极的宽度可减小到1μm.Kirk电流可达到110wA,电流增益截止频率达到176GI-Iz.这种器件有望在中等功率的毫米波电路中有所应用. 相似文献
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Yu Jinyong Yan Beiping Su Shubing Liu Xunchun Wang Runmei Xu Anhuai Qi Ming Liu Xinyu 《半导体学报》2006,27(10):1732-1736
报道了发射极自对准的InP基异质结双极型晶体管.在集电极电流Ic=34.2mA的条件下,发射极面积为0.8μm×12μm的InP HBT截止频率fT为162GHz,最大振荡频率fmax为52GHz,最大直流增益为120,偏移电压为0.10V,击穿电压BVCEO达到3.8V(Ic=0.1μA).这种器件非常适合在高速低功耗方面的应用,例如OEIC接收机以及模拟数字转换器. 相似文献
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InP/InGaAs/InP DHBT具有频带宽、电流驱动能力强、线性好、相位噪声低和阈值电压一致性好等优点成为研究热点。通过优化外延材料结构设计和采用四元InGaAsP缓变层消除集电结电流阻塞效应;改进发射极-基极自对准工艺和集电区台面侧向腐蚀工艺,降低Rb和Cbc乘积;优化PI钝化工艺和空气桥互联等工艺,实现了发射极面积为2μm×10μm的自对准InP/InGaAs/InP DHBT器件,其直流增益β约为25,击穿电压BVCEO≥7 V@10μA,在VCE=4 V,Ic=10 mA下,截止频率fT=140 GHz,最高振荡频率fmax=200 GHz,优于同一外延片上的非自对准InP DHB器件,该器件将可应用于高速光通信和微波毫米波通信。 相似文献
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报道了一款在101.6 mm(4英寸)InP晶圆上制备的特征尺寸为0.25μm的磷化铟双异质结双极型晶体管。采用发射极自对准技术和介质钝化工艺,器件的发射极典型尺寸为0.25μm×3.00μm,最大电流增益为25,当发射极电流密度为10μA/μm^(2)时,器件的击穿电压达到了4.2 V,电流增益截止频率为390 GHz,最高振荡频率为620 GHz。建立了用于提取器件寄生参数的小信号等效电路模型,模型的仿真结果与高频实测数据具有很好的拟合精度。 相似文献
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Meng-Wei Hsieh Yue-Ming Hsin Kung-Hao Liang Yi-Jen Chan Denny Tang 《Electron Devices, IEEE Transactions on》2006,53(6):1452-1458
This paper investigates the temperature dependence (from 77 to 300 K) of dc, ac, and power characteristics for n-p-n SiGe heterojunction bipolar transistors (HBTs) with and without selectively implanted collector (SIC). In SiGe HBTs without SIC, the valance band discontinuity at the base-collector heterojunction induces a parasitic conduction band barrier while biasing at saturation region and high current operation at cryogenic temperatures. This parasitic conduction band barrier significantly reduces the current gain and cutoff frequency. For transistors biased with fixed collector current, the measured output power, power-added efficiency, and linearity at 2.4 GHz decrease significantly with decreasing operation temperatures. The temperature dependence of output power characteristic is analyzed by Kirk effect, current gain, and cutoff frequency at different temperatures. The parasitic conduction band barrier in SiGe HBTs with SIC is negligible, and thus the device achieves better power performance at cryogenic temperatures compared with that in SiGe HBT without SIC. 相似文献
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Jae-Woo Park Pavlidis D. Mohammadi S. Guyaux J.-L. Garcia J.-C. 《Electron Devices, IEEE Transactions on》2001,48(7):1297-1303
A new emitter structure based on composite graded AlGaAs-GaInP approach is described, which allows significant reduction of CBE and improved high-frequency performance. A theoretical study of the composite and conventional emitter HBTs is performed to prove the superiority of composite emitter HBTs using Monte Carlo simulation of their transport properties. The self-aligned HBTs fabricated in this study are grown by CBE with TBA/TBP precursors. The current gain cutoff frequency (fT) was 62 GHz for the composite emitter design HBT, and 45 GHz for conventional emitter design HBT. The CBE achieved with the composite emitter designs was at least 3 times lower than that of conventional designs and does not show significant variation with collector current. This leads to enhanced fT characteristics by 15% for composite emitter HBT designs and confirms the theoretical expectations 相似文献
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The frequency performance of AlGaAs/GaAs heterojunction bipolar transistors (HBTs) having different layouts, doping profiles, and layer thicknesses was assessed using the BIPOLE computer program. The optimized design of HBTs was studied, and the high current performances of HBTs and polysilicon emitter transistors were compared. It is shown that no current crowding effect occurs at current densities less than 1×105 A/cm2 for the HBT with emitter stripe width S E<3 μm, and the HBT current-handling capability determined by the peak current-gain cutoff frequency is more than twice as large as that of the polysilicon emitter transistor. An optimized maximum oscillation frequency formula has been obtained for a typical process n-p-n AlGaAs/GaAs HBT having base doping of 1×10 19 cm-3 相似文献
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DeLuca P.M. Lutz C.R. Welser R.E. Chi T.Y. Huang E.K. Welty R.J. Asbeck P.M. 《Electron Device Letters, IEEE》2002,23(10):582-584
InGaP/GaInAsN double heterojunction bipolar transistors (HBTs) with compositionally graded bases are presented which exhibit superior dc and radio frequency performance. Reducing the average base layer energy gap and optimizing the emitter-base (e-b) and base-collector (b-c) heterojunctions leads to a 100-mV reduction in the turn-on voltage compared to a baseline InGaP/GaAs process. Simultaneously grading the base layer energy band-gap results in over a 66% improvement in the dc current gain and up to a 35% increase in the unity gain cutoff frequency. DC current gains as high as 250 and cutoff frequencies of 70 GHz are demonstrated. In addition, the InGaP/GaInAsN DHBT structure significantly reduces the common emitter offset and knee voltages, as well as improves the dc current gain temperature stability relative to standard InGaP/GaAs HBTs. 相似文献
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Nonequilibrium electron transport phenomena in the emitter and collector regions under high bias conditions were investigated for standard N-p-n (AlGa)As/GaAs heterojunction bipolar transistors (HBTs) by utilizing a previously developed one-dimensional self-consistent particle simulator. A dramatic increase in the cutoff frequency was observed for a lightly doped collector HBT as the current density increased over 105 A/cm2, where the collector transit time was reduced due to the extension of the velocity overshoot region in the collector corresponding to the decrease in electric field near onset of the Kirk effect. A saturation tendency was seen in the collector current versus base-to-emitter bias voltage (V BE ) characteristic for high V BE, where V BE exceeded the base-to-emitter built-in voltage of the conduction band. Simulations indicate that this feature is caused by electron velocity saturation in the neutral n-type (AlGa)As emitter region 相似文献
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Oka T. Hirata K. Suzuki H. Ouchi K. Uchiyama H. Taniguchi T. Mochizuki K. Nakamura T. 《Electron Devices, IEEE Transactions on》2001,48(11):2625-2630
We have developed the advanced performance, small-scale InGaP/GaAs heterojunction bipolar transistors (HBTs) by using WSi/Ti base electrode and buried SiO2 in the extrinsic collector. The base-collector capacitance CBC was further reduced to improve high-frequency performance. Improving the uniformity of the buried SiO 2, reducing the area of the base electrode, and optimizing the width of the base-contact enabled us to reduce the parasitic capacitance in the buried SiO2 region by 50% compared to our previous devices. The cutoff frequency fT of 156 GHz and the maximum oscillation frequency fmax of 255 GHz were obtained at a collector current IC of 3.5 mA for the HBT with an emitter size SE of 0.5×4.5 μm2, and fT of 114 GHz and fmax of 230 GHz were obtained at IC of 0.9 mA for the HBT with SE of 0.25×1.5 μm2. We have also fabricated digital and analog circuits using these HBTs. A 1/8 static frequency divider operated at a maximum toggle frequency of 39.5 GHz with a power consumption per flip-flop of 190 mW. A transimpedance amplifier provides a gain of 46.5 dB·Ω with a bandwidth of 41.6 GHz at a power consumption of 150 mW. These results indicate the great potential of our HBTs for high-speed, low-power circuit applications 相似文献
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Nagata K. Nakajima O. Nittono T. Yamauchi Y. Ishibashi T. 《Electron Devices, IEEE Transactions on》1992,39(8):1786-1792
The fabrication and characterization of a new self-aligned HBT utilizing bridged base-electrode technology (BBT) are presented. This new technology simplifies the fabrication process and relaxes the limitations in device size scaling, thus decreasing the emitter size to 1 μm×1 μm. In spite of a large junction periphery area ratio, a good current gain of more than 10 is obtained in an HBT with an emitter size of 1 μm×1 μm. A series of fabricated HBTs shows excellent high-speed performance. The highest values of f T =90 GHz and f max=63 GHz are obtained in an HBT with an emitter size of 1 μm×5 μm. The realization of HBTs with small emitters and excellent high-frequency characteristics demonstrates the effectiveness of this new technology 相似文献