Electrical and interfacial properties of Au/P3HT:PCBM/n-Si Schottky barrier diodes at room temperature

In this study, a gold/poly(3-hexylthiophene):[6,6]-phenyl C61 butyric acid methyl ester/n-type silicon (Au/P3HT:PCBM/n-Si) metal-polymer-semiconductor (MPS) Schottky barrier diode (SBD) was fabricated. To accomplish this, a spin-coating system and a thermal evaporation were used for preparation of a P3HT/PCBM layer system and for deposition of metal contacts, respectively. The forward- and reverse-bias current–voltage (I–V) characteristics of the MPS SBD at room temperature were studied to investigate its main electrical parameters such as ideality factor (n), barrier height (Φ_B), series resistance (R_s), shunt resistance (R_sh), and density of interface states (N_ss). The I–V characteristics have nonlinear behavior due to the effect of R_s, resulting in an n value (3.09) larger than unity. Additionally, it was found that n, Φ_B, R_s, R_sh, and N_ss have strong correlation with the applied bias. All results suggest that the P3HT/PCBM interfacial organic layer affects the Au/P3HT:PCBM/n-Si MPS SBD, and that R_s and N_ss are the main electrical parameters that affect the Au/P3HT:PCBM/n-Si MPS SBD. Furthermore, a lower N_ss compared with that of other types of MPS SBDs in the literature was achieved by using the P3HT/PCBM layer. This lowering shows that high-quality electronic and optoelectronic devices may be fabricated by using the Au/P3HT:PCBM/n-Si MPS SBD.     

Effect of fullerene doping on the electrical properties of P3HT/PCBM layers

Poly (3-hexylthiophene-2, 5-diyl) (P3HT) and its blend with Phenyl-C₆₁-Butyric acid-Methyl-Ester (PCBM) and fullerene (C₆₀) thin films were prepared and their electrical properties for memory applications were studied. Due to doping, a sharp decrease in the resistance for a P3HT:PCBM:C₆₀ device was observed at around 70 °C which makes it useful for thermal switching applications. Addition of C₆₀ to P3HT:PCBM blend gave a high value for R_RESET/R_SET in thermal switching. For bias switching, threshold voltage reduces to 1.4 V from 25 V with the addition of C₆₀ to P3HT layer.     

A detailed comparative study on the main electrical parameters of Au/n-Si and Au/PVA:Zn/n-Si Schottky barrier diodes

We have fabricated Au/n-Si and Au/PVA:Zn/n-Si Schottky barrier diodes (SBDs) to investigate the effect of organic interfacial layer on the main electrical characteristics. Zn doped poly(vinyl alcohol) (PVA:Zn) was successfully deposited on n-Si substrate by using the electrospinning system and surface morphology of PVA:Zn was presented by SEM images. The current–voltage (I–V) characteristics of these SBDs have been investigated at room temperature. The experimental results show that interfacial layer enhances the device performance in terms of ideality factor (n), zero-bias barrier height (Φ_B0), series resistance (R_s), and shunt resistance (R_sh) with values of 1.38, 0.75 eV, 97.64 Ω, and 203 MΩ whereas those of Au/n-Si SBD are found as 1.65, 0.62 eV, 164.15 Ω and 0.597 MΩ, respectively. Also, this interfacial layer at metal/semiconductor (M/S) interface leads to a decrease in the magnitude of leakage current and density of interface states (N_ss). The values of N_ss range from 1.36×10¹² at E_c—0.569 eV to 1.35×10¹³ eV^?1 cm^?2 at E_c—0.387 eV for Au/PVA:Zn/n-Si SBD and 3.34×10¹² at E_c—0.560 eV to 1.35×10¹³ eV^?1 cm^?2 at E_c—0.424 eV for Au/n-Si SBD. The analysis of experimental results reveals that the existence of PVA:Zn interfacial layer improves the performance of such devices.     

The effects of surface states and series resistance on the performance of Au/SnO2/n-Si and Al/SnO2/p-Si (MIS) Schottky barrier diodes

We have fabricated two types of Schottky barrier(SBDs),Au/SnO₂/n-Si (MIS1) and Al/SnO₂/p-Si (MIS2), to investigate the surface (N_ss) and series resistance (R_s) effect on main electrical parameters such as zero-bias barrier height (Φ_Bo) and ideality factor (n) for these SBDs. The forward and reverse bias current–voltage (I–V) characteristics of them were measured at 200 and 295 K, and experimental results were compared with each other. At temperatures of 200 and 295 K, Φ_Bo, n, N_ss and R_s for MIS1 Schottky diodes (SDs) ranged from 0.393 to 0.585 eV, 5.70 to 4.75, 5.42×10¹³ to 4.27×10¹³ eV^?1 cm^?2 and 514 to 388 Ω, respectively, whereas for MIS2 they ranged from 0.377 to 0.556 eV, 3.58 to 2.1, 1.25×10¹⁴ to 3.30×10¹⁴ eV^?1 cm^?2 and 312 to 290 Ω, respectively. The values of n for two types of SBDs are rather than unity and this behavior has been attributed to the particular distribution of N_ss and interfacial insulator layer at the metal/semiconductor interface. In addition, the temperature dependence energy density distribution profiles of N_ss for both MIS1 and MIS2 SBDs were obtained from the forward bias I–V characteristics by taking into account the bias dependence of effective barrier height (Φ_e) and R_s. Experimental results show that both N_ss and R_s values should be taken into account in the forward bias I–V characteristics. It has been concluded that the p-type SBD (MIS2) shows a lower barrier height (BH), lower R_s, n and N_ss compared to n-type SBD (MIS1), which results in higher current at both 200 and 295 K.     

The effect of Mo-doped PVC+TCNQ interfacial layer on the electrical properties of Au/PVC+TCNQ/p-Si structures at room temperature

The effect of Mo-doped and undoped PVC+TCNQ interfacial layer on electrical characteristics of a Au/PVC+TCNQ/p-Si structure was investigated using current–voltage (I–V), capacitance–voltage (C–V) and conductance–voltage (G/ω–V) measurements at room temperature. The energy dependent interface states density (N_ss) was obtained from the forward bias I–V data by taking into account voltage dependent effective barrier height (Φ_e) for two diodes, i.e. with and without Mo doping. The voltage dependent resistance (R_i) of structures was also obtained using Ohm׳s law and the method of Nicollian and Brews for the diodes. In order to eliminate the effect of series resistance (R_s), C and G/ω at high frequency values were corrected. N_ss and R_s values were compared between the diodes and experimental results showed that N_ss and R_s values of the Mo-doped PVC+TCNQ structure are considerably lower than those of the undoped PVC+TCNQ structure. The other important parameters such as ideality factor (n), reverse saturation current (I_s), zero-bias barrier heights (Φ_Bo) and R_s were obtained from forward bias I–V data by using I–V, Cheung and Norde methods. Experimental results confirmed that the Mo-doped (PVC+TCNQ) layer considerably improved the performance of the Au/PVC+TCNQ/p-Si structure.     

Electrical characteristics of Au/<Emphasis Type="Italic">n</Emphasis>-GaAs structures with thin and thick SiO<Subscript>2</Subscript> dielectric layer

The aim of this study, to explain effects of the SiO₂ insulator layer thickness on the electrical properties of Au/n-GaAs Shottky barrier diodes (SBDs). Thin (60 Å) and thick (250 Å) SiO₂ insulator layers were deposited on n-type GaAs substrates using the plasma enganced chemical vapour deposition technique. The current-voltage (I–V) and capacitance-voltage (C-V) characteristics have been carried out at room temperature. The main electrical parameters, such as ideality factor (n), zero-bias barrier height (? _Bo ), series resistance (R _s ), leakage current, and interface states (N _ss ) for Au/SiO₂/n-GaAs SBDs have been investigated. Surface morphologies of the SiO₂ dielectric layer was analyzed using atomic force microscopy. The results show that SiO₂ insulator layer thickness very affects the main electrical parameters. Au/n-GaAs SBDs with thick SiO₂ insulator layer have low leakage current level, small ideality factor, and low interface states. Thus, Au/n-GaAs SBDs with thick SiO₂ insulator layer shows better diode characteristics than other.     

A compare of electrical characteristics in Al/p-Si (MS) and Al/C20H12/p-Si (MPS) type diodes using current–voltage (I–V) and capacitance–voltage (C–V) measurements

In this study, both the metal-semiconductor (MS) and metal-polymer-semiconductor (MPS), (Al/C₂₀H₁₂/p-Si), type Schottky barrier diodes (SBDs) were fabricated using spin coating method and they were called as D₁ and D₂ diodes, respectively. Their electrical characterization have been investigated and compared using the forward and reverse bias I–V and C–V measurements at room temperature. The main electrical parameters such as ideality factor (n), reverse saturation current (I_o), zero-bias barrier height (Φ_Bo), series (R_s) and shunt (R_sh) resistances, energy dependent profile of interface states (N_ss), the doping concentration of acceptor atoms (N_A) and depletion layer width (W_D) were determined and compared each other and literature. The rectifying ratio (RR) and leakage current (I_R) at ±3 V were found as 2.06×10³, 1.61×10⁻⁶ A and 15.7×10³, 2.75×10⁻⁷ A for D₁ and D₂, respectively. Similarly, the R_s and R_sh values of these diodes were found as 544 Ω, 10.7 MΩ and 716 Ω and 1.83 MΩ using Ohm’s Law, respectively. In addition, energy and voltage dependent profiles of N_ss were obtained using the forward bias I–V data by taking into account voltage dependent effective barrier height (Φ_e) and n and low-high frequency capacitance (C_LF–C_HF) methods, respectively. The obtained value of N_ss for D₂ (MPS) diode at about the mid-gap of Si is about two times lower than D₁ (MS) type diode. Experimental results confirmed that the performance in MPS type SBD is considerably high according to MS diode in the respect of lower values of N_ss, R_s and I_o and higher values of RR and R_sh.     

The temperature dependent analysis of Au/TiO2 (rutile)/n-Si (MIS) SBDs using current–voltage–temperature (I–V–T) characteristics

In this study, the main electrical parameters of Au/TiO₂(rutile)/n-Si Schottky barrier diodes (SBDs) were analyzed by using current–voltage–temperature (I–V–T) characteristics in the temperature range 200–380 K. Titanium dioxide (TiO₂) thin film was deposited on a polycrystalline n-type Silicon (Si) substrate using the DC magnetron sputtering system at 200 °C. In order to improve the crystal quality deposited film was annealed at 900 °C in air atmosphere for phase transition from amorphous to rutile phase. The barrier height (Φ_b) and ideality factor (n) were calculated from I–V characteristics. An increase in the value of Φ_b and a decrease in n with increasing temperature were observed. The values of Φ_b and n for Au/TiO₂(rutile)/n-Si SBDs ranged from 0.57 eV and 3.50 (at 200 K) to 0.82 eV and 1.90 (at 380 K), respectively. In addition, series resistance (R_s) and Φ_b values of MIS SBDs were determined by using Cheung's and Norde's functions. Cheung's plots are obtained from the donward concave curvature region in the forward bias semi-logarithmic I–V curves originated from series resistance. Norde's function is easily used to obtain series resistance as a function of temperature due to current counduction mechanism which is dominated by thermionic emission (TE). The obtained results have been compared with each other and experimental results show that R_s values exhibit an unusual behavior that it increases with increasing temperature.     

Performance improvement mechanisms of P3HT:PCBM inverted polymer solar cells using extra PCBM and extra P3HT interfacial layers

A novel P3HT:PCBM inverted polymer solar cell (IPSC) was fabricated and investigated. An extra PCBM and an extra P3HT interfacial layers were inserted into the bottom side and the top side of the P3HT:PCBM absorption layer of the IPSCs to respectively enhance electron transport and hole transport to the corresponding electrodes. According to the surface energy, X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM) measurement results, the extra PCBM interfacial layer could let more P3HT to form on the top side of the P3HT:PCBM blends. It revealed that the non-continuous pathways of P3HT in the P3HT:PCBM absorption layer could be reduced. Consequently, the carrier recombination centers were reduced in the absorption layer of IPSCs. The power conversion efficiency (PCE) of the P3HT:PCBM IPSCs with an extra PCBM interfacial layer greatly increased from 3.39% to 4.50% in comparison to the P3HT:PCBM IPSCs without an extra PCBM interfacial layer. Moreover, the performance of the P3HT:PCBM IPSCs with an extra PCBM interfacial layer could be improved by inserting an extra P3HT interfacial layer between the absorption layer and the MoO₃ layer. The PCE of the resulting IPSCs increased from 4.50% to 4.97%.     

Electrical characterization of MS and MIS structures on AlGaN/AlN/GaN heterostructures

The forward and reverse bias I-V, C-V, and G/ω-V characteristics of (Ni/Au) Schottky barrier diodes (SBDs) on the Al_0.22Ga_0.78N/AlN/GaN high-electron-mobility-transistor (HEMTs) without and with SiN_x insulator layer were measured at room temperature in order to investigate the effects of the insulator layer (SiN_x) on the main electrical parameters such as the ideality factor (n), zero-bias barrier height (Ф_B0), series resistance (R_s), interface-state density (N_ss). The energy density distribution profiles of the N_ss were obtained from the forward bias I-V characteristics by taking into account the voltage dependence of the effective barrier height (Ф_e) and ideality factor (n_V) of devices. In addition, the N_ss as a function of E_c-E_ss was determined from the low-high frequency capacitance methods. It was found that the values of N_ss and R_s in SBD HEMTs decreases with increasing insulator layer thickness.     

Effects of incorporation of copper sulfide nanocrystals on the performance of P3HT: PCBM based inverted solar cells

It has been reported that performance of bulk heterojunction organic solar cells can be improved by incorporation of an additive like metal and semiconducting nanoparticles in the active layer. Here in, we have synthesized Cu₂S nanocrystals (NCs) by chemical route and studied its dispersion in poly (3-hexylthiophene) [6, 6]-phenyl C61-butyric acid methyl ester (P3HT: PCBM) matrix. Variation in the performance parameters with change in the concentration of Cu₂S NCs into the P3HT: PCBM matrix has also been studied and it was found that the inverted geometry device with concentration of 20 wt% of Cu₂S NCs and having the structure ITO/ZnO (NPs)/P3HT: PCBM:Cu₂S NCs/MoO₃/Al has shown maximum efficiency of 3.39% which is more than 100% increase in comparison with devices without Cu₂S NCs. Photoluminescence measurements studies unveiled that the incorporation of Cu₂S NCs into a P3HT: PCBM matrix has helped in quenching photoluminescence which suggests more effective exciton dissociation at the interfaces between the P3HT and PCBM domains. The Nyquist plots obtained from impedance spectroscopy at 1 V bias in the dark has suggested the effective lifetime and global mobilities for P3HT: PCBM as 0.267 ms and 1.17 × 10⁻³ cm²/V-S and for P3HT: PCBM:Cu₂S NCs (20 wt%) systems as 0.156 ms and 2.02 × 10⁻³ cm²/V-S respectively. Based on observed photoluminescence quenching, calculated effective lifetime and global mobility, we have tried to explain the possible reason for improvement in the efficiency with the very well dispersion of Cu₂S NCs into the P3HT: PCBM matrix.     

A new model for PCBM phase segregation in P3HT:PCBM blends

The phase segregation in P3HT:PCBM blend films has been investigated from an experimental and theoretical viewpoint. Optical microscopy, atomic force microscopy, scanning electron microscopy and X-ray diffraction show that thermal annealing of P3HT:PCBM blend films leads to the formation of PCBM aggregates. These aggregates are composed of dense randomly packed ∼50 nm PCBM crystallites with an overall aggregate density of ∼0.85 g cm⁻³. By applying the critical radius of nucleation for PCBM and the Stokes-Einstein equation for mobility of PCBM in a P3HT matrix, a model is developed which explains the formation of both crystallites and aggregates.     

Elaboration of P3HT/CNT/PCBM Composites for Organic Photovoltaic Cells

This Full Paper focuses on the preparation of single‐walled or multi‐walled carbon nanotube solutions with regioregular poly(3‐hexylthiophene) (P3HT) and a fullerene derivative 1‐(3‐methoxycarbonyl) propyl‐1‐phenyl[6,6]C₆₁ (PCBM) using a high dissolution and concentration method to exactly control the ratio of carbon nanotubes (CNTs) to the P3HT/PCBM mixture and disperse the CNTs homogeneously throughout the matrix. The CNT/P3HT/PCBM composites are deposed using a spin‐coating technique and characterized by absorption and fluorescence spectroscopy and by atomic force microscopy to underline the structure and the charge transfer between the CNTs and P3HT. The performance of photovoltaic devices obtained using these composites as a photoactive layer mainly show an increase of the short circuit current and a slight decrease of the open circuit voltage which generally leads to an improvement of the solar cell performances to an optimum CNT percentage. The best results are obtained with a P3HT/PCBM (1 : 1) mixture with 0.1 wt % multi‐walled carbon nanotubes with an open circuit voltage (V_oc) of 0.57 V, a current density at the short‐circuit (I_sc) of 9.3 mA cm^–2 and a fill factor of 38.4 %, which leads to a power conversion efficiency of 2.0 % (irradiance of 100 mW cm^–2 spectroscopically distributed following AM1.5).     

A Simple and Effective Modification of PCBM for Use as an Electron Acceptor in Efficient Bulk Heterojunction Solar Cells

[6,6]‐phenyl‐C‐61‐butyric acid methyl ester (PCBM) and poly(3‐hexylthiophene) (P3HT) are the most widely used acceptor and donor materials, respectively, in polymer solar cells (PSCs). However, the low LUMO (lowest unoccupied molecular orbital) energy level of PCBM limits the open circuit voltage (V_oc) of the PSCs based on P3HT. Herein a simple, low‐cost and effective approach of modifying PCBM and improving its absorption is reported which can be extended to all fullerene derivatives with an ester structure. In particular, PCBM is hydrolyzed to carboxylic acid and then converted to the corresponding carbonyl chloride. The latter is condensed with 4‐nitro‐4’‐hydroxy‐α‐cyanostilbene to afford the modified fullerene F . It is more soluble than PCBM in common organic solvents due to the increase of the organic moiety. Both solutions and thin films of F show stronger absorption than PCBM in the range of 250–900 nm. The electrochemical properties and electronic energy levels of F and PCBM are measured by cyclic voltammetry. The LUMO energy level of F is 0.25 eV higher than that of PCBM. The PSCs based on P3HT with F as an acceptor shows a higher V_oc of 0.86 V and a short circuit current (J_sc) of 8.5 mA cm^?2, resulting in a power conversion efficiency (PCE) of 4.23%, while the PSC based on P3HT:PCBM shows a PCE of about 2.93% under the same conditions. The results indicate that the modified PCBM, i.e., F , is an excellent acceptor for PSC based on bulk heterojunction active layers. A maximum overall PCE of 5.25% is achieved with the PSC based on the P3HT: F blend deposited from a mixture of solvents (chloroform/acetone) and subsequent thermal annealing at 120 °C.     

The effect of series resistance on calculation of the interface state density distribution in Schottky diodes

This work presents an attempt related to the importance of the fact that the series resistance value is considered in calculating the inter-face state density distribution from the non-ideal forward bias current–voltage (I-V) characteristics of Au/n-Si Schottky barrier diodes (SBDs). To examine the consistency of this approach, Au/n-Si SBDs with Si bulk thicknesses of 200 and 400μm have been prepared. Both diodes showed non-ideal I-V behaviour with ideality factors of 1.14 and 1.12, respectively, and thus it has been thought that the diodes have a metal–interface layer–semiconductor configuration. At the same energy position near the bottom of the conduction band, the interface state density (N _SS) values, without taking into account the series resistance value of the devices, are almost one order of magnitude larger than the N _SS values obtained taking into account the series resistance value.     

Stabilization of poly(3-hexylthiophene)/PCBM morphology by hydroxyl group end-functionalized P3HT and its application to polymer solar cells

A new concept to stabilize the morphology of poly(3-hexylthiophene) (P3HT) and [6,6]-phenyl-C₆₁-butyric acid methyl ester (PCBM) blend through H-bond formation by using a hydroxyl group end-functionalized P3HT (HOC-P3HT-COH) as a compatibilizer is presented. Domain size of the PCBM crystals in the annealed P3HT/PCBM film is diminished with addition of HOC-P3HT-COH. Surface roughness of the P3HT/PCBM film also becomes smoother with addition of HOC-P3HT-COH. Thermal stability of solar cell device is improved significantly through the H-bond formation between HOC-P3HT-COH and PCBM. A high performance and thermal stable polymer solar cell with 4.06% power conversion efficiency under AM1.5G irradiation is fabricated with 5% HOC-P3HT-COH in P3HT/PCBM layer.     

Temperature dependent electrical and dielectric properties of Au/polyvinyl alcohol (Ni, Zn-doped)/n-Si Schottky diodes

The electrical and dielectric properties of Au/PVA (Ni, Zn-doped)/n-Si Schottky diodes (SDs) were studied in the temperature range of 80-400 K. The investigation of various SDs fabricated with different types of interfacial layer is important for understanding the electrical and dielectric properties of SDs. Therefore, in this study polyvinyl alcohol (PVA) film was used as an interfacial layer between metal and semiconductor. The electrical and dielectric properties of Au/PVA (Ni, Zn-doped)/n-Si SDs were calculated from the capacitance-voltage (C-V) and conductance-voltage (G/w-V) measurements. The effects of interface state density (N_ss) and series resistance (R_s) on C-V characteristics were investigated in the wide temperature range. It was found that both of the C-V-T and G/w-V-T curves included two abnormal regions and one intersection point. The dielectric constant (ε″), dielectric loss (ε″), dielectric loss tangent (tan δ) and the ac electrical conductivity (σ_ac) obtained from the measured capacitance and conductance were studied for Au/PVA (Ni, Zn-doped)/n-Si SDs. Experimental results show that the values of ε′, ε″ and tan δ are a strong function of the temperature. Also, the results indicate the interfacial polarization can be more easily occurred at high temperatures.     

Electrical characterization of current conduction in Au/TiO2/n-Si at wide temperature range

In this study, we have examined Au/TiO₂/n-Si Schottky barrier diodes (SBDs), in order to interpret in detail the experimental observed non-ideal current–voltage–temperature (I–V–T) characteristics. I–V characteristics were measured in the wide temperature range of 80–400 K. TiO₂ was deposited on n-Si substrate by reactive magnetron sputtering. The zero-bias barrier height (ϕ_B0) and ideality factor (n) show strong temperature dependence. While n decreases, ϕ_B0 increases with increasing temperature. Experimental results show that the current across the SBDs may be greatly influenced by the existence of Schottky barrier height (SBH) inhomogeneity. These temperature behaviors have been explained on the basis of the thermionic emission (TE) theory with Gaussian distribution (GD) of the barrier heights (BHs) due to BH inhomogeneities at metal–semiconductor (M/S) interface. From this assumptions, obtaining Richardson constant value of the A^* 121.01 A/cm² K² is perfect agreement with the theoretical value of 120 A/cm² K² for n-type Si. Hence, behaviors of the forward-bias I–V characteristics of the Au/TiO₂/n-Si (SBDs) can be successfully explained on the basis of a TE mechanism with a double Gaussian distribution of the BHs.     

Light-induced electron spin resonance study of galvinoxyl-doped P3HT/PCBM bulk heterojunctions

We report the effects of doping of P3HT/PCBM layers with spin 1/2 radicals of galvinoxyl (Gx) based on light-induced electron spin resonance (LESR), photoluminescence-detected magnetic resonance (PLDMR), and post-annealing experiments.LESR showed both a P3HT⁺ and PCBM⁻ signal for undoped P3HT/PCBM; however, as Gx doping increased (above ∼1 wt%), only the P3HT⁺ signal was evident in the LESR spectra, with no PCBM⁻ signal.The PLDMR exhibited a strong narrow signal at g = 2.002 that originates from nongeminate polaron pairs; no triplet PLDMR signal has been observed throughout the whole range of Gx concentrations (x = 0, 0.1, 1, 2, 4, 12 wt%). Adding Gx to ∼3 wt% led to a decrease of the PL-enhancement.There was big difference between the slow-dried P3HT/PCBM samples and the post-annealed samples. For the slow-dried samples, efficiency monotonously decreased with Gx additives. When post-annealed, however, an enhancement in η was observed at ∼2 wt% for P3HT/PCBM(1:2) samples.The LESR spectra for post-annealed samples revealed disappearance of Gx spin signals, and thus no spin interactions with PCBM⁻ spins. It is unlikely that the increase of efficiency after Gx doping of P3HT/PCBM solar cell is due to an increase of triplet states.     

Controlling the electrical characteristics of Au/n-Si structures by interfacial insulator layer

Admittance (C–V and G/ω–V) measurements of Au/n-Si (metal–semiconductor, MS) and Au/SnO₂/n-Si (metal–insulator–semiconductor, MIS) structures were carried out between 1 kHz and 1 MHz at room temperature to investigate the interfacial insulator layer effect on the electrical characteristics of Au/n-Si structures. Experimental results showed that MIS structure's capacitance (C) values, unlike those of MS structure, became stable especially at high frequencies in the accumulation region. Also, the insulator layer caused structure's shunt resistance (R_sh) to increase. It was found that series resistance (R_s) is more effective in the accumulation region at high frequencies after the correction was applied to C and G/ω data to eliminate the R_s effect. The density of interface states (D_is) was obtained using Hill–Coleman method, D_is values MIS structure was obtained smaller than those of MS structure. Results indicate that interfacial insulator layer brings about some improvements in electrical characteristics of Au/n-Si structures.