电子系统热管理设计与验证中的结温估算与测量

针对电子系统容易出现的热失效问题,论述在电子系统的热管理设计与验证中,对半导体器件结温的估算和测量方法。通过测量半导体器件内部二极管参数,来绘制二极管正向压降与其温度关系曲线,进而求解出器件的结温估算值,以指导热管理设计;采用热分布测量和极值测量来计算器件的实际结温,对热管理设计进行评估、验证。使用所述估算和测量方法,可到达±5%精确度的半导体结温测算,能够有效评估器件在特定电子系统中的热可靠性,为实现可靠热管理提供可信的数据分析基础。     

Thermal uniformity and stress minimization during rapid thermalprocesses

The practical development and implementation of rapid thermal processes will significantly influence the semiconductor fabrication industry. With the capability to perform heat cycles quickly and with low thermal budgets, rapid thermal processors have the potential to supplant conventional thermal systems in the years to come. Currently, rapid thermal processors are unable to match the thermal process uniformity produced in conventional convective-based systems. Using a thermal model to approximate the heating characteristics of silicon wafers, it is possible to determine the effects of time-varying intensity profiles on a wafer during a rapid thermal process. Interpretation of this model shows idealized intensity profiles can maintain thermal uniformity at steady-state temperatures. During thermal transients a dynamic continuously changing profile is required to maintain thermal uniformity. As a predictive tool, this analysis can be used to determine and evaluate dynamic uniformity producing intensity profiles before thermal transients occur within a process. This approach can reduce the accumulation of error during high temperature steps not only by providing thermal uniformity at steady states, but by reducing the initial nonuniformities produced by transitions. This paper will review the wafer model, show the results of an idealized profile for steady-state and transient temperatures, and explain the dynamic profiles required for continuous uniformity     

Fast current control for low harmonic distortion at low switchingfrequency

The structure of the current control loop of an induction machine drive determines decisively the dynamic performance of the overall system. Fast current control is a prerequisite for dynamic decoupling between the torque and the flux commands. Standard solutions are well established for drives in the low- and medium-power ranges. The low switching frequency of high-power pulsewidth modulation inverters calls for a tradeoff in controller design between the low harmonic losses and torque ripple in the steady state on one hand, and fast dynamic response during the transients on the other. The problem is developed in detail. A variable-structure approach is proposed as the solution     

Microbeams with Electronically Controlled High Thermal Impedance

In some MEMS (Micro-Electro-Mechanical Systems) applications, a tradeoff much be reached between the mechanical strength of a suspended microstructure and the thermal losses through the support beams. This is typically the case of suspended thermal MEMS, a major domain of application of CMOS-compatible bulk-micromachining technologies. This paper illustrates how suspended MEMS can be strengthened by means of additional support beams which can have a very high thermal impedance, thus having a very small impact in the thermal behavior of the microstructure. The high thermal impedance of a support beam is achieved through self-heating: an electronic control monitors the temperature drop and heats up the beam to reduce the heat flow. The control electronics of a beam is implemented using a single high-gain stage with auto-zeroing. A High Thermal Impedance Beam (HTIB) can be considered as a new MEMS design cell. We illustrate the use of this cell in the design of an Electro-Thermal Converter with long time constant, requiring several HTIB cells which can share the same control electronics. A single low-frequency high-gain stage is used, achieving 60 dB DC gain and DC offset and broadband noise below 100 V, which is suitable for the ETC application.     

Terfenol棒抑制涡流的有效方式及其有限元设计

从描述电磁场宏观性质的Maxwell方程着手,借助于电磁位对（A,V-A）,应用有限元技术,对Terfenol棒几种不同开槽方式抑制涡流损耗的情况进行了分析,结果说明,这种三维涡流有限元技术,可很好地预测Terfenol棒内的涡流分布,仿真结果为Terfenol棒抑制涡流的狭缝切割方式提供了强有力的依据,从而避免了对这种昂贵材料切割的盲目操作。对比3种不同结构的Teffenol棒涡流有限元分析结果,可知提出的梳妆开槽狭缝切割结构在抑制涡流损耗上的效果是显著的。     

电动助力转向系统无刷电机温度研究

电动助力转向系统由控制器ECU根据传感器手力矩、车速等信息确定电机助力,电机与ECU热管理是其成本控制与系统安全的关键。文中提出在控制中区分快速与慢速发热模型,得到了系统温度的增加值,在不同发热均恒条件下与当前温度、输入电流的关系,估算电机温度。仿真与实验证明,通过这种热管理分析与设计方法有效地解决了系统发热问题,成功地实现了系统成本与系统安全的统一。     

Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics

Thermal management of wearable electronics integrated with biological tissues remains one of the critical challenges for their practical applications. The undesired heating can cause thermal discomfort or even thermal damage to biological tissues. Here, a novel thermal protecting substrate design is proposed for wearable electronics with abilities to manipulate the heat flow and efficiently absorb the excessive heat energy without the compromise of substrate flexibility. The thermal protecting substrate features a functional soft composite, which incorporates the embedded phase change material with a thin metal film on the top in a soft polymer. Compared with conventional substrate, the proposed thermal protecting substrate can reduce the peak temperature increase by over 85% with appropriate parameters. Experimental and numerical studies reveal the fundamental aspects of the design and operation of functional soft composite to effectively avoid excessive heating of biological tissues. Influences of geometrical parameters on temperature reduction are investigated. Device demonstration of thermal protecting substrate in a wearable heater on pig skin illustrates the unusual capability to reduce the maximum skin temperature, thereby enabling practical applications of wearable electronics and creating engineering opportunities in biointegrated applications requiring thermal protection of biological tissues.     

航空相机焦面组件相变温控设计及验证

航空相机焦面组件是机载电子设备中具有严格温度要求的重要组件,其工作期间温度过高产生的热噪声和暗电流将导致成像质量下降。讨论分析了某型航空相机焦面组件热设计的特点,采用封装有相变材料的相变温控系统进行散热,根据结构特点和导热路径,给出了热设计方案。采用有限元数值分析方法,建立了热平衡方程和热分析计算模型,应用热分析软件IDEAS-TMG在给定温度边界条件下进行瞬态仿真分析,给出了组件的热响应性能。热分析结果表明:焦面组件和散热器工作温度范围分别为18～31.1 ℃、18～28.2 ℃。所获得的分析结果能够满足热控指标要求。最后通过热实验对采用相变温控系统的热设计方案进行了验证,验证实验结果与数值分析结果吻合较好,结果对比最大偏差均不超过5%,验证了数值分析的正确性和温度预示的有效性。实验过程中焦面组件和散热器工作温度范围分别为18～32.3 ℃、18～29.6 ℃。     

An effective thermal circuit model for electro-thermal simulation of SOI analog circuits

A physics-based thermal circuit model is developed for electro-thermal simulation of SOI analog circuits. The circuit model integrates a non-isothermal device thermal circuit with interconnect thermal networks and is validated with high accuracy against finite element simulations in different layout structures. The non-isothermal circuit model is implemented in BSIMSOI to account for self-heating effect (SHE) in a Spice simulator, and applied to electro-thermal simulation of an SOI cascode current mirror constructed using different layouts. Effects of layout design on electric and thermal behaviors are investigated in detail. Influences of BOX thickness are also examined. It has been shown that the proposed non-isothermal approach is able to effectively account for influences of layout design, self-heating, high temperature gradients along the islands, interconnect temperature distributions, thermal coupling, and heat losses via BOX and interconnects, etc., in SOI current mirror structures. The model provides basic concepts and thermal circuits that can be extended to develop an effective model for electro-thermal simulation of SOI analog ICs.     

Bioinspired Temperature Regulation in Interfacial Evaporation

Human skin shows self‐adaptive temperature regulation through both enhanced heat dissipation in high temperature environments and depressed heat dissipation in cold environments. Inspired by such thermal regulation processes, an interfacial material system with self‐adaptive temperature regulation in the solar‐driven interfacial evaporation system, which can exhibit automatic temperature oscillation to enable pyroelectricity generation while producing water vapor, is reported. The bioinspired interface system is designed with the combination of a thermochromism‐based temperature regulator consisting of tungsten‐doped vanadium dioxide nanoparticles and a polymeric pyroelectric thin film of polyvinylidene fluoride. Under the simulated solar illumination with power density of 1.1 kW m^?2, the bioinspired interfacial evaporation system achieves a self‐adaptive temperature oscillation with the maximum temperature difference of ≈7 °C and this system can simultaneously generate water vapor as well as electricity with an evaporation efficiency of 71.43% and a maximum output electrical power density of 104 µW m^?2, respectively. The study demonstrates a design of thermal management at the interface of solar‐driven evaporation system to exhibit a self‐adaptive temperature oscillation and offers an alternative approach for the multifunctional harvesting of solar energy.     

Study of coupled thermal electric behavior of compliant micro-spring interconnects for next generation probing applications

Advances in integrated circuit fabrication have given rise to a need for an innovative, inexpensive, yet reliable probing technology with ultra-fine pitch capability. Flexible micro-spring structures that can exceed the probing needs of the next-generation microelectronic devices have been developed. Highly compliant cantilevered springs have been fabricated at pitches as small as 6/spl mu/m. These micro-springs are designed to accommodate topological variation in probing surfaces while flexing within the elastic regime. Coupled thermal-electric numerical models have been developed to understand the thermal contours and current density developed across these springs. Based on the models and experiments, it is seen that the electrical resistance of the probe spring under study will be less than 1 /spl Omega/. Also, it is seen that the maximum temperature due to Joule heating is localized near the tip of the probe and can be about 93/spl deg/C above the ambient temperature, when temperature dependent bulk material properties are used. Optimization of the spring geometry to reduce this maximum temperature is outlined. In addition, the role of scale effects on the thermal conductivity of the spring material is studied. Based on the work, it can be said that it is possible to design micro-contact springs for probing applications such that the electrical resistance and the temperature increase during probing will be within acceptable limits.     

Thermal effects in n-channel enhancement MOSFET's operated at cryogenic temperatures

Thermal effects in n-channel enhancement-mode MOSFET's operated at cryogenic temperatures are discussed. Device heating is identified as the cause of drain current transients and the origin of this phenomenon is considered. Experimental results are presented in which thermal effects are studied as functions of temperature for various gate and drain biases. Drain current is found to be a monitor of device temperature, From an understanding of the thermal behavior of devices, the channel electron mobility can be examined as a function of temperature and gate bias. The observed thermal effects are explained in terms of material and device properties. The implications for future low-temperature CMOS VLSI development are discussed.     

某星载SAR天线阵面的游离设计与验证

星载SAR在轨展开后天线阵面平面度影响其电性能,其中,热变形是影响阵面平面度的一个重要因素。基于某卫星大口径、长时间工作、高精度天线系统的结构设计要求,提出了天线阵面的游离设计,运用数值仿真方法分析游离设计安装时热变形对天线阵面平面度的影响,并进一步采用非接触式双相机摄影测量系统开展热变形试验。结果表明,天线阵面热变形仿真与试验数据的一致性较好,采用游离设计可有效降低天线阵面的热变形,满足卫星天线系统的结构设计要求。     

A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

Solid State Lighting (SSL) systems, powered by light-emitting diodes (LEDs), are revolutionizing the lighting industry with energy saving and enhanced performance compared to traditional light sources. However, around 70%–80% of the electric power will still be transferred to heat. As the elevated temperature negatively affects the maximum luminous output, efficiency, light quality, reliability and the lifetime of the SSL systems, thermal management is a key design aspect for LED products. In this work, an innovative thermal management with a package, a silicon substrate with temperature sensors and a polymer based loop heat pipe (LHP) was designed, manufactured and assembled. It can supply a low and relatively stable temperature to maintain higher optical power, more luminous flux and less color shift. In a word, the novel design can provide LEDs with the efficient thermal management and temperature monitoring with reduced weight, easy fabrication, less energy consumption and better light quality.     

Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architecture

The emergence of three-dimensional (3D) network-on-chip (NoC) has revolutionized the design of high-performance and energy efficient manycore chips. However, in general, 3D NoC architectures still suffer from high power density and the resultant thermal hotspots leading to functionality and reliability concerns over time. The power consumption and thermal profiles of 3D NoCs can be improved by incorporating a Voltage Frequency Island (VFI)-based power management strategy and Reciprocal Design Symmetry (RDS)-based floor planning. In this paper, we undertake a detailed design space exploration for 3D NoC by considering power-thermal-performance (PTP) trade-offs. We specifically consider a small-world network-enabled 3D NoC (3D SWNoC) in this performance evaluation due to its superior performance and energy-efficiency compared to any other existing 3D NoC architectures. We demonstrate that the VFI-enabled 3D SWNoC lowers the energy-delay-product (EDP) by 57.3% on an average compared to a 2D MESH without VFI. Moreover, by incorporating VFI, we reduce the maximum temperature of 3D SWNoC by 15.2% on an average compared to the non-VFI counterpart. By complementing the VFI-based power management with RDS-based floor planning, the 3D SWNoC reduces the maximum temperature by 25.1% on an average compared to the non-VFI counterpart.     

Optimal vector control of pumping and ventilation induction motor drives

An original speed control for centrifugal pump and fan drives with squirrel-cage induction motors that seeks the maximum energy saving is proposed. The strategy is based on minimizing the motor and converter losses at the steady state and minimizing the transient time that the motor employs in passing from one steady stage to another. The shortest transient time is achieved by applying the Pontriagin's maximum principle taking into account the parabolic load torque-speed dependence of these types of drives. Short-time transients, which take the motor from one point of maximum efficiency to another, contribute to reduce losses and to extend the application of the energy-saving concept to the drives with frequent changes of load torque and speed.     

TVS-2000红外热像仪图像信息的快速处理研究

针对ＴＶＳ－２０００红外热像仪原机配置的信息处理软件不能实现实时采集、显示、处理等缺陷，研究开发了热图像数据的快速采集、存储及处理软件技术。通过ＧＰＩＢ接口在ＰＣ机与红外热像仪之间进行通信，实现了温度数据的快速连续采集；将采集存储的温度数据在计算机屏幕上显示出来，并对其进行多种处理，以利于用户获取最关心的信息。这些分析包括静态分析和动态分析。其中静态分析可以得到热图像上任意点的温度值，任意区域内的温度分布直方图，任意水平、垂直线上的温度分布剖面及其最高、最低、平均温度值；动态分析可得到任意点在给定时间段内的温度变化走势。文中介绍的新配置系统及实现的功能和软件设计方法，对于配有ＧＰＩＢ接口的智能仪器具有普遍应用价值     

Efficient Worst-Case Temperature Evaluation for Thermal-Aware Assignment of Real-Time Applications on MPSoCs

The reliability of multiprocessor system-on-chips (MPSoCs) is nowadays threatened by high chip temperatures leading to long-term reliability concerns and short-term functional errors. High chip temperatures might not only cause potential deadline violations, but also increase cooling costs and leakage power. Pro-active thermal-aware allocation and scheduling techniques that avoid thermal emergencies are promising techniques to reduce the peak temperature of an MPSoC. However, calculating the peak temperature of hundreds of design alternatives during design space exploration is time-consuming, in particular for unknown input patterns and data. In this paper, we address this challenge and present a fast analytic method to calculate a non-trivial upper bound on the maximum temperature of a multi-core real-time system with non-deterministic workload. The considered thermal model is able to address various thermal effects like heat exchange between neighboring cores and temperature-dependent leakage power. Afterwards, we integrate the proposed thermal analysis method into a design-space exploration framework to optimize the task to processing component assignment. Finally, we apply the proposed method in various case studies to explore thermal hot spots and to optimize the task to processing component assignment.     

Modeling of concentrating photovoltaic and thermal systems

An energy balance model for concentrating photovoltaic and thermal (CPVT) systems is presented. In the model, the CPVT system and its environment are represented using a set of input parameters. The main outputs of the model are the system's electrical and thermal efficiencies. The model accounts for optical losses. Thermal losses are derived from a thermal network model of the hybrid receiver. The solar cell performance is modeled as a function of the temperature and the irradiance. The robustness of the model is demonstrated by a sensitivity analysis of all input parameters. The influence of the operating temperature on the electrical and thermal performances and the overall efficiency of the CPVT system are discussed. The limiting cases of maximum electrical and thermal power outputs are presented. Further, the influence of the concentration ratio on the electrical and thermal performance and on the partitioning of these two power outputs is analyzed in detail. It is shown that high concentration reduces the thermal losses considerably and increases the electrical efficiency. At concentration ratios above 300, the system operates with an overall efficiency of 75% at temperatures up to 160 °C. Copyright © 2012 John Wiley & Sons, Ltd.     

A Force-Directed-Based Optimization Scheme for Thermal Placement Design of MCMs

Thermal management becomes exceptionally critical to both the reliability and operation performance of electronic packages, particularly for multichip modules (MCMs), as packaging and power densities continue increase while packaging dimension continues decrease. The underlying goal of the study is to pursue the minimum system temperature design of MCMs containing a number of chips of equal and/or unequal power through the optimal chip placement design. To deal with the thermal design problems, an effective indirect optimization approach that integrates a modified force-directed (FD) thermal model, a finite-element (FE) technique and an exterior penalty method (EPM) is proposed. In the modified FD thermal model, a novel representation of the repulsive and attractive forces is proposed, and the sum of these forces in the design system, representing the total system chip junction temperature, constructs the objective of the optimization problems. Together with some geometry constraints, the constrained optimization problems are formed, and furthermore, transformed into unconstrained optimization problems using an EPM. The solution of the optimization problems is sought through a direct, iterative search scheme with two proposed placement strategies. The alternative goal of the study is to address the feature and feasibility of these two proposed placement strategies for the current problems. The applicability of the proposed optimization approach is demonstrated through several design applications, and their results are extensively compared against the published data. It turns out that the current optimization approach can be very effective and robust in providing thermal optimal design of MCMs with a minimal total chip junction temperature through optimal chip placement