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1.
热障涂层金属元素扩散阻挡层研究进展   总被引:1,自引:0,他引:1  
介绍了热障涂层金属元素扩散阻挡层的需求背景,综述了热障涂层金属扩散阻挡层的设计原则、要求及发展历程并且进行了展望研究,重点讨论了难熔金属和贵金属、双多金属和陶瓷层等扩散阻挡层的性质,并从制备技术、阻扩散效果和应用范围等方面进行了对比.最后指出多元扩散阻挡层在未来长寿命热障涂层中具有较大的发展潜力,提出了在高温合金上制备...  相似文献   

2.
集成电路Cu互连扩散阻挡层的研究进展   总被引:1,自引:0,他引:1  
陈海波  周继承  李幼真 《材料导报》2006,20(12):8-11,15
简要介绍了集成电路的发展趋势及其带来的相关问题和解决办法.综述了国内外对Cu互连扩散阻挡层的制备方法与工艺、阻挡层的选材、阻挡层薄膜的特性等最新研究的进展.评述了该领域的发展趋势及可能的影响因素.  相似文献   

3.
采用直流反应磁控溅射方法在P型(100)Si衬底上制备了Ta-Al—N纳米薄膜与Cu/Ta-Al—N复合膜,并对薄膜样品进行了卤钨灯快速热退火(RTP)。用四探针电阻测试仪(VPP)、AFM、SEM—EDS、Alpha—stepIQ台阶仪和XPd)等分析测试方法对样品的形貌结构与特性进行了分析表征。实验结果表明,本实验条件下制得的Ta-Al—N纳米薄膜表面光滑;随着Al靶溅射功率的增加,Ta-Al—N薄膜中Al含量和方块电阻相应增大,均方根粗糙度降低,而沉积速率变化不大,且Ta-Al—N膜层对Cu扩散的阻挡能力增强。但在过高的温度下退火,导致Cu通过Ta-Al—N的晶界扩散到Ta-Al—N/Si界面并形成Cu3Si,从而引起阻挡层的失效。  相似文献   

4.
Fatigue tests of 2024-T3 aluminum sheet were run to determine the effects of constituent particles and particle clusters on fatigue life for all three metallurgical planes. In addition, a model to account for crack coalescence within particle clusters was developed to determine if particle clusters can be more damaging than single particles as crack nucleation sites. On the LS and ST planes, cracks formed primarily at single particles or holes, indicating that coalescence was not an issue. On the LT plane, coalescence was observed when the particle clusters were aligned with the crack growth direction, and the life was reduced about 30%. The crack coalescence and growth model showed that varying the initial separation between two particles (potential cracks) causes at most about a 15–20% change in fatigue life over a separation range of 5 μm to 1200 μm for a pair of 50 μm2 particles.  相似文献   

5.
集成电路Cu金属化中的扩散阻挡层   总被引:1,自引:0,他引:1  
阐述了集成电路Cu互连中的技术难题,重点讨论了Cu的扩散问题,综述了扩散阻挡层的研究发展进程,重点介绍了当今研究较多的难熔金属、难熔金属氮化物及其三元结构阻挡层的最新进展情况.研究表明,阻挡层的阻挡性能与制备工艺、薄膜组分及微观结构密切相关,其失效机制多为高温下阻档层晶化所产生的晶界为Cu扩散提供了快速通道,掺入Si或其它原子的难熔金属氮化物由于其较高的晶化温度和良好的阻挡性能正成为研究热点.  相似文献   

6.
Thin stoichiometric aluminum oxide films were deposited using tris(diethylamino)aluminum precursor and water. Changes in aluminum oxide film and interfacial regions were studied after post deposition annealing under inert ambience at 600, 800 and 1000 °C using Fourier Transform InfraRed (FTIR) spectroscopy, X-ray Photoelectron Spectroscopy, and Scanning Transmission Electron Microscopy (STEM)/Electron Energy Loss spectroscopy (EELS) techniques. STEM/EELS analyses were also done on samples annealed in situ, i.e., inside the electron microscope at temperatures as high as 800 °C. Up to an annealing temperature of 600 °C, the atomic layer deposited alumina film was thermally stable and remained amorphous with no interfacial silica growth observed. After annealing at 800 °C for 5 min, the only change observed was a small increase in the interfacial layer thickness which was found to be mainly silicon oxide without any significant silicate content. Annealing at 1000 °C induced a significant increase in the interfacial layer thickness which consisted of a mixture of silicon oxide and aluminum silicate. The composition of the interfacial layer was found to change with depth, with silicate concentration decreasing with distance from the Si substrate. Also, the FTIR spectra exhibited strong absorption features due to Al-O stretching in condensed AlO6 octahedra which indicate crystallization of the alumina film after annealing at 1000 °C for 5 min.  相似文献   

7.
铜热浸镀铝扩散层生长动力学模型   总被引:2,自引:0,他引:2  
采用一浴法对铜进行了热浸镀铝试验,热浸镀时间为10~25s,热浸镀温度为963~1 013K。研究了热浸镀温度和时间对铜铝复合材料界面扩散层厚度的影响,采用XPL-15型偏光显微镜(PM)测量铜铝复合材料扩散层厚度,并依据热浸镀铝试验建立了铜铝复合材料界面扩散层生长动力学模型。结果表明,铜铝复合材料界面扩散层的生长动力学符合抛物线扩散规律,与热浸镀温度的指数成正比,与热浸镀时间成抛物线增长关系;铜热浸镀铝扩散层生长动力学模型的修正系数k与时间t存在线性关系。  相似文献   

8.
研究了液相外延生长的高铝含量的Al_xGa_(1-x)/GaAs结构中的Mg掺杂特性,测量了各种接触扩散时间所对应的载流子浓度分布和表面质量。表明用Mg掺杂和接触扩散,能得到合适的结深和较高的载流子浓度的P-GaAs层。如果母液组份和生长温度恒定,并适当控制接触扩散时间,可以制备出重复性好的均匀高质量P-N结。  相似文献   

9.
The B3LYP-DFT/6-311+G(d) method has been used to optimize the geometries of (AlAs)n neutrals and charged ions in the size range of n = 1–15. Frequency analyses are performed at the B3LYP/6-31G(d) level to check whether the optimized structures are transition states or true minima on the potential energy surfaces of corresponding clusters. The total energies of these clusters are then used to study the evolution of their binding energy, relative stability, and electronic properties as a function of size. The geometries are found to undergo a structural change from two-dimensional to three-dimensional when the cluster contains 6 atoms. The medium size clusters (n = 6–15) display the hollow globular conformers with large surface effect, which may cause the bulk limit still far from my computed results. The geometrical changes are companied by corresponding changes in the nearest-neighbor distances and coordination numbers. For medium size clusters (n = 6–15), both ionization potential and electron affinity have the tendency of decrease when the number of AlAs units in the cluster increases. Some magic clusters in neutral, cationic, and anionic form compared to its neighboring clusters are argued according to the calculated results of the second energy difference and electronic properties.  相似文献   

10.
于萍  訾艳艳  姜维  王文  朱圣龙 《材料导报》2015,29(9):72-75, 96
综述了镍基单晶高温合金扩散阻挡层的国内外研究进展。简要介绍了高温防护涂层/镍基单晶高温合金基体元素的互扩散现象,说明了扩散阻挡层的作用机理,阐述了扩散阻挡层的设计原则和要求,通过对比分析了各类扩散阻挡层的优缺点。最后对镍基单晶高温合金用扩散阻挡层的研究做出了展望。  相似文献   

11.
Molecular dynamics simulations of the impact deposition of metal clusters on fcc metal surfaces are presented. Two-dimensional elongated islands are formed when the incident cluster travels parallel to the surface. For perpendicular incidence the results of the impact event are very sensitive to the relative cohesive properties of the cluster and substrate atoms.  相似文献   

12.
Microstructural damage mechanisms owing to thermal cycling and isothermal exposure at elevated temperature are studied for a short alumina-silicate fiber-reinforced aluminum alloy (A356) composite produced by pressure casting. The tensile strength of the metal matrix composite is found to degrade considerably in each case. An X-ray double-crystal diffraction method is employed to study the mechanisms of recovery in the matrix. The fractal dimension of the X-ray “rocking curves” for individual grains in the composite reflects the substructure formation owing to the rearrangement of dislocations into subdomain walls. Recovery by polygonization is more pronounced in the case of thermal cycling than for equivalent isothermal exposure. The residual stresses in the matrix that provide the fiber clamping force undergo more relaxation in the case of isothermal exposure. The two competing damage mechanisms, thermally activated recovery by polygonization and relaxation of clamping stresses in the matrix, result in identical strength degradation (25%) for both thermal cycling and isothermal exposure.  相似文献   

13.
高温防护涂层扩散阻挡层的研究进展   总被引:1,自引:1,他引:1  
综述了高温防护涂层体系扩散阻挡层的研究进展,说明了扩散阻挡层在高温防护涂层体系中的作用机理,比较了不同种类扩散阻挡层的差别,尤其是元素扩散阻挡能力、界面结合强度和制备成本的差别,从工业应用方面分析了各种扩散阻挡层的优缺点,提出了可通过改变涂层结构和改进加工工艺来提高陶瓷扩散阻挡层的界面结合强度.  相似文献   

14.
In this paper, we present a study of diffusion and clustering of atoms on the titanium (0001) surface using molecular dynamics and molecular statics methods. The formation energy of each defect cluster is calculated using a combination of annealing and quenching techniques. Diffusion mechanisms of clusters are elucidated by the analysis of atomic trajectories, and are confirmed by calculating energy states along the diffusion path and by fitting the diffusion coefficients to one or more Arrhenius functions. Our simulations show that the clusters diffuse by a sequence of atomic jumps; once an atom moves forward by half an atomic diameter, the others follow it. Such a correlated process involves an activation energy that is comparable to that of an adatom. Atoms in each cluster, especially those in clusters consisting of three and seven atoms, are tightly bound. However, due to high mobility, the clusters are less likely to be the critical nuclei in three-dimensional growth of thin films on the (0001) surface. Even the cluster consisting of seven atoms swaps a linear distance of 60 nm during the growth of one monolayer of thin film under typical deposition conditions and at room temperature, making it ineffective as a critical nucleus above room temperature. This revised version was published online in July 2006 with corrections to the Cover Date.  相似文献   

15.
研究了铜与硅之间W/Mo-N薄膜的扩散阻挡性能。在Si(100)基片上利用反应溅射沉积一层Mo-N薄膜,然后再利用直流溅射在Mo-N上面沉积Cu/W薄膜。样品在真空下退火,并利用四点探针、X射线衍射分析、扫描电镜分析、俄歇电子能谱原子深度剖析等测试方法研究了Cu/W/Mo-N/Si的热稳定性及W/Mo-N薄膜对铜与硅的扩散阻挡性能。实验分析表明,Cu/W/Mo-N/Si结构具有非常好的热稳定性,在600℃退火30min仍未发生相变,并能有效的阻挡铜与硅之间的扩散。  相似文献   

16.
The probability and appropriate processing parameters of hot pressing diffusion bonding (HP–DW) of a titanium alloy (TC4) to a stainless steel (1Cr18Ni9Ti) with an aluminum alloy (LF6) interlayer have been investigated. The microstructure of the bonded joints has been observed by optical microscopy, SEM, XRD and EDX, and the main factors affecting hot pressing and diffusion bonding process were analyzed. The results showed that atom diffused well and no intermetallic compound or other brittle compounds appeared at optimum parameters. The fracture way of joints was ductile fracture. With the increment of bonding temperature, large number of intermetallic compounds such as FeAl6, Fe3Al, FeAl2 which were brittle appeared along the interface between the stainless steel and the aluminum alloy interlayer, as a result, the quality of joints was decreased significantly and the fracture way of joints was brittle fracture.  相似文献   

17.
为了分析Gd吸附原子在Cu(001)、Cu(110)和Cu(111)表面的扩散机制,本文用分子动力学对该扩散过程进行模拟。模拟结果表明在Cu(001)和Cu(111)表面,Gd原子通过跳跃机制扩散;在Cu(110)表面,在[110]方向Gd原子通过跳跃机制扩散,而且多步跳跃频率很高,而在[001]方向则通过交换机制扩散。通过对扩散频率的拟合,发现在各种扩散机制都符合Arrhenius公式,从而确定了在Cu(001)和Cu(111)表面扩散势垒分别为0.19eV和0.013eV,在Cu(110)表面,沿[110]方向跳跃扩散势垒和沿[001]方向交换扩散势垒分别为0.097eV和0.33eV。  相似文献   

18.
Thin films of aluminum oxide were deposited using trimethylaluminum and oxygen. The deposition rate was found to decrease with increasing temperature. Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy (XPS) were used to investigate the film/substrate interface. When dry O2 was used during deposition, the film/substrate interface was free of any silicon dioxide or aluminum silicate phase. On annealing the as-deposited films in Ar, a layer of silicon dioxide film formed at the interface. XPS results indicated that the O/Al ratio in the as-deposited films was higher than that in stoichiometric Al2O3. However, the ratio was found to decrease in the annealed samples suggesting that excess oxygen present in the deposited films is responsible for the formation of interfacial silicon dioxide layer. Interfacial phase formation was observed in the as-deposited samples, when small amounts of ozone along with oxygen were used as the oxygen precursor.  相似文献   

19.
采用固相合成法制备了La0.8Sr0.2(Ga0.8Mg0.2)0.1Fe0.9O3-δ(LSGMF)混合导体和La0.8Sr0.2Ga0.8Mg0.2O3-δ(LSGM)固体电解质, 利用XRD、TGA、范德堡直流四探针法和热膨胀仪等对试样进行了分析。以LSGMF为致密扩散障碍层, 以LSGM为氧泵层, 采用共压共烧结法制备了极限电流型氧传感器, 利用SEM和EDS对LSGMF/LSGM陶瓷体横截面的微观形貌和成分进行了分析。结果表明: LSGMF具有菱方钙钛矿结构(R-3c空间群), 它在650℃失重速率最快, 其电导率随温度的升高而增大; 300~1000℃范围, LSGM与LSGMF的热膨胀系数分别为12.51×10-6/℃和12.80×10-6/℃。650~850℃范围, 氧传感器具有良好的极限电流平台, lgIL(极限电流IL)与1000/T呈线性关系, LSGMF中氧离子的扩散激活能为0.4008 eV。800℃、0.3mol%<x(O2)<21.0mol%时, 极限电流IL与氧含量x(O2)间的关系为: IL(mA)=10.285x(O2)(mol%), R=0.9982。LSGMF和LSGM结合牢固, 未产生裂纹, EDS分析基本符合各化合物的化学计量比。  相似文献   

20.
The diffusion behaviour in theβ -Zr(Al) solid solution phase was investigated in the temperature range 1203-1323 K using a thermodynamic approach. The Boltzmann-Matano relation used for determining interdiffusion coefficients and the Darken’s equations used for evaluating the intrinsic diffusion coefficients from velocity of movement of markers in diffusion couples were modified suitably. The composition dependent thermodynamic interdiffusion coefficients were evaluated using chemical potential gradient. Composition and temperature dependence of the thermodynamic interdiffusion coefficients were also established. The thermodynamic intrinsic diffusion coefficients of Al and Zr and their temperature dependence were determined using the modified Darken’s equations.  相似文献   

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