Molecular simulations of cluster ejection by CO2 cluster impact on carbon-based surfaces

Single (CO₂)_N (N = 1-20) cluster impact on three different carbon-based surfaces of fullerite (1 1 1), graphite and diamond (1 0 0) has been investigated by MD simulations with the cluster collision energy from 5 to 14 keV/cluster as a first step toward the general modeling of the reactive sputtering by cluster impact of a solid surface. A crater permanently remained on the fullerite and graphite surfaces while it was quickly replenished with fluidized carbon material on the diamond surface. In spite of the smaller crater size as well as the crater recovery resulting in the reduction of the surface area, the sputtering yields were the highest on diamond. The effective energy deposition near the surface contributes to the temperature rise and consequent sputtering seemed highly reduced due to the collision cascades especially on the fullerite target.     

MD study on temperature dependence of sputtering yield

Temperature dependence of sputtering yield is studied through molecular dynamics (MD) simulation that is performed for Ag sputtered by 12.6 keV Ar impacting at normal incidence. The target temperature is considered from 300 to 1235 K. It is found that the target temperature has little effect on the monomer yield because it comes from the energetic collision cascade. On the other hand, the sputtered cluster yield increases with the target temperature. It seems that the sputtered cluster is produced due to the thermal spike near the surface and the thermal spike is strongly influenced by the target temperature.     

Study of crater formation and sputtering process with large gas cluster impact by molecular dynamics simulations

Molecular dynamics (MD) simulations of large argon clusters impacting on silicon solid targets were performed in order to study the transient process of crater formation and sputtering. The MD simulations demonstrate that the initial momentum of incident cluster is transferred to target surface atoms through multiple collision mechanism, where the initial momentum, which is along to the surface normal before impact, is deflected to lateral direction. This momentum transfer process was analyzed by the calculation of the velocity at the crater edge (the interface between cluster and target). In the case of Ar₁₀₀₀ cluster impact on Si(1 0 0) target at low energy per atom less than 40 eV/atom, the maximum value of lateral velocity of the crater edge increases in proportional to the velocity of incident cluster atoms. On the other hand, the crater edge velocity saturates over 40 eV/atom of incident energy per atom. In this case, the whole of constituent cluster atoms are implanted into the target and expand in both lateral and reflective directions at the subsurface region of the target. These MD simulations demonstrated that this collisional process result in the high yield sputtering of the target atoms.     

The emission process of secondary ions from solids bombarded with large gas cluster ions

We investigated the effects of size and energy of large incident Ar cluster ions on the secondary ion emission of Si. The secondary ions were measured using a double deflection method and a time-of-flight (TOF) technique. The size of the incident Ar cluster ions was between a few hundreds and several tens of thousands of atoms, and the energy up to 60 keV. Under the incidence of keV energy atomic Ar ions, mainly atomic Si ions were detected, whereas Si cluster ions were rarely observed. On the other hand, under the incidence of large Ar cluster ions, the dominant secondary ions were  (2 ? n ? 11). It has become clear that the yield ratio of secondary Si cluster ions was determined by the velocity of the incident cluster ions, and this strong dependence of the yield ratio on incident velocity should be related to the mechanisms of secondary ion emission under large Ar cluster ion bombardment.     

Large-scale molecular dynamics simulation of sputtering process with glancing-angle Ar cluster impact on 4H-SiC

Large-scale molecular dynamics simulations with two Ar₆₈₈ cluster impacts on a 4H-SiC surface are performed to investigate the mechanism of lateral sputtering caused by two clusters collisions. The two Ar clusters are composed of 688 atoms each (referred as Ar₆₈₈) which are described by a simple Lennard-Jones potential. The initial velocities of both clusters are 2.55 × 10⁴ m/s when the acceleration voltage is 100 keV. The computational volume is 30 nm × 30 nm × 16 nm, which is constructed by 1444608 4H-SiC atoms. At 0.8 ps after the impact from the first Ar cluster on the 4H-SiC surface, a second argon cluster with predetermined incident-angle collides with 4H-SiC surface at a distance of one “diameter” away from the center of the first impact where the term “diameter” refers to the diameter of the footprint of the first impact on 4H-SiC. The incident-angle of the second argon cluster was set at 0°, 60°, or 80° for three different trials. Consequently, in each case the crater formed by the first cluster showed signs of being smeared out by the impact of the second cluster. Especially at the incident-angle of 80° the effects of surface modification were clearly noticeable.     

An attempt to solve Andersen’s puzzle in surface segregation during alloy sputtering

The paper addresses CuPt alloy sputtering by Ar ions and discusses the well-known experiment performed by Andersen et al. 25 years ago, but not yet properly explained. The atomistic (binary-encounter) simulation has been applied to extract the concentrations of surface Cu and Pt atoms from the experimental data. The results of simulations favor segregation of Cu at all bombarding energies studied experimentally (1.25-320 keV). It has been shown that some mysterious results of the experiment can be explained by a reconstruction of the surface undergoing sputtering. For forecasting purposes, the sputtering of CuPt alloy with 0.25-1 keV Ar ions is also considered.     

Computer simulation of sputtering at the low index (1 0 0), (1 1 0) and (1 1 1) surfaces of Ni3Al in a STEM

The present study is relevant to the preferential Al sputtering and/or enhancement of the Ni/Al ratio in Ni₃Al observed by the scanning transmission electron microscopy fitted with a field emission gun (FEG STEM). Atomic recoil events at the low index (1 0 0), (1 1 0) and (1 1 1) surfaces of Ni₃Al through elastic collisions between electrons and atoms are simulated using molecular dynamics (MD) methods. The threshold energy for sputtering, E_sp, and adatom creation, E_ad, are determined as a function of recoil direction. Based on the MD determined E_sp, the sputtering cross-sections for Ni and Al atoms in these surfaces are calculated with the previous proposed model. It is found that the sputtering cross-section for Al atoms is about 7-8 times higher than that for Ni, indicating the preferential sputtering of Al in Ni₃Al, in good agreement with experiments. It is also found that the sputtering cross-sections for Ni atoms are almost the same in these three surfaces, suggesting that they are independent of surface orientation. Thus, the sputtering process is almost independent of the surface orientation in Ni₃Al, as it is controlled by the sputtering of Ni atoms with a lower sputtering rate.     

Molecular dynamics simulations of large fluorine cluster impact on silicon with supersonic velocity

The etching process by very large reactive gas cluster impact was investigated by molecular dynamics (MD) simulations. Fluorine-molecule clusters with the size up to 100,000 atoms (50,000 F₂ molecules) were irradiated on silicon (1 0 0) targets at supersonic velocity regime (0.1-1 eV/atom, 1.0-3.2 km/s). The MD simulations revealed that the existence of threshold energy-per-atom around 0.3 eV/atom (1.75 km/s) to cause surface deformation and enhancement of Si desorption. When the incident energy-per-atom is less than the threshold, the incident cluster breaks up itself on the target without surface deformation. The fluorine molecules in the cluster spread in the lateral direction along the target surface, and some part of them decompose and adsorbs on the target to form silicon fluoride composites. On the other hand, the clusters penetrate the surface of silicon target when the energy-per-atom is larger than 0.3 eV/atom. In these collisional processes, the target surface is deformed to create shallow crater shape. The incident fluorine molecules are preferentially concentrated at the bottom of the crater, which resulted in high desorption yield of silicon as in the form of SiF₂, SiF₃ and SiF₄.     

Incidence-angle dependent Cs incorporation in Si during low-energy bombardment: A dynamic computer simulation study

The implantation of Cs atoms in silicon was investigated by dynamic computer simulations using the Monte-Carlo code T-DYN that takes into account the gradual change of the target composition due to the Cs irradiation. The incorporation of Cs atoms was studied for incidence angles ranging from 0° to 85° and for four impact energies (0.2, 0.5, 1 and 3 keV). The total implantation fluences were (1-2) × 10¹⁷ Cs/cm², well above the values required to reach a stationary state. The steady-state Cs surface concentrations exhibit a pronounced dependence on impact angle and energy. At normal incidence, they vary between ∼0.57 (at 0.2 keV) and ∼0.18 (3 keV), but decrease with increasing incidence angle. Under equilibrium, the partial sputtering yield of Si exhibits the typical dependence on incidence angle, first increasing up to a maximum value (at ∼70°-75°) and declining sharply for larger angles. For all irradiation conditions a strongly preferential sputtering of Cs as compared to Si atoms is found, increasing with decreasing irradiation energy (from 4.6 at 3 keV to 7.2 at 0.2 keV) and for nearer-normal incidence.     

Sputtering induced by cluster impact on metal targets: Influenceof electronic stopping

The effect of electronic stopping on the sputtering of metals by cluster impact is discussed. We focus on the specific case of Au₁₃ impact on a Au surface. Using molecular-dynamics simulation, we study several strategies to include electronic stopping. Electronic stopping influences both the magnitude of the sputter yield and the duration of the sputter process. In the usual procedure, electronic stopping only affects sufficiently fast atoms with kinetic energies above a threshold energy, which is of the order of the target cohesive energy. When assuming that electronic stopping holds down to thermal energies <1 eV, or even to 0 eV, the collision spike is rapidly quenched and the sputter yields become unrealistically small. Furthermore, we implement a scheme to include electronic stopping based on local (electron) density information readily available in a simulation.     

Proton sputtering from polycrystalline Al surface interacting with highly charged ions at grazing incidence angle

Sputtering processes of protons from a polycrystalline Al surface interacting with Ar^q+ (q = 3-14) ions at a grazing incidence angle (∼0.5°) were investigated. The intensity of protons (I_H) detected in coincidence with scattered Ar atoms was measured as a function of q. I_H saturated at q ? 10, although it increased rapidly with q at 3 ? q ? 8. The angular distribution of protons with low kinetic energy (?2 eV) began to deviate from the cosine distribution and assumed a rather flat equidistribution as q increased. To analyze the sputtering processes of protons at the grazing incidence angle, a modified model of the “above-surface potential sputtering model” was proposed by considering image acceleration of projectile ions.     

Dynamics of cluster induced sputtering in gold

Impacts of 0.13-1.4 MeV Au₁₃ clusters onto Au(1 1 1) target are investigated in molecular dynamics simulations. The evolution of sputtered Au atoms and clusters are simulated up to 10 ns. The total sputtering yield, angular and velocity distributions of the sputtered material, as well as dimensions of impact induced craters are compared to recent experimental results. It is shown that the experimental observations can be explained by a flow of atoms from the craters. Secondary cluster ejection from crowns formed around the craters is found to be one of the main mechanisms of sputtering. The results are summed up in an empirical model.     

Transition from atomistic to macroscopic cluster stopping in Au

Based on large-scale molecular dynamics simulations of Au cluster impacts on a Au surface, we have recently reported that the transition to macroscopic crater volume scaling behavior occurs between 1000 and 100,000 Au atoms at impact velocities comparable to typical meteoroid velocities [J. Samela, K. Nordlund, Atomistic simulation of the transition from atomistic to macroscopic cratering, Phys. Rev. Lett. 101 (2008) 027601]. Now we have analyzed the conditions that lead to this transition in more detail. The main mechanisms of this change is the emergence of the transient high-density region which can store two thirds of the impact energy. This mechanism becomes the dominant cratering mechanisms gradually when the impactor size increases.     

Dependence of cluster ranges on target cohesive energy: Molecular-dynamics study of energetic Au402 cluster impacts

It has long been known that the stopping and ranges of atoms and clusters depends on the projectile-target atom mass ratio. Recently, Carroll et al. [S.J. Carroll, P.D. Nellist, R.E. Palmer, S. Hobday, R. Smith, Phys. Rev. Lett. 84 (2000) 2654] proposed that the stopping of clusters also depends on the cohesive energy of the target. We investigate this dependence using a series of molecular-dynamics simulations, in which we systematically change the target cohesive energy, while keeping all other parameters fixed. We focus on the specific case of Au₄₀₂ cluster impact on van-der-Waals bonded targets. As target, we employ Lennard-Jones materials based on the parameters of Ar, but for which we vary the cohesive energy artificially up to a factor of 20. We show that for small impact energies, E₀ ? 100 eV/atom, the range D depends on the target cohesive energy U, D ∝ U^−β. The exponent β increases with decreasing projectile energy and assumes values up to β = 0.25 for E₀ = 10 eV/atom. For higher impact energies, the cluster range becomes independent of the target cohesive energy. These results have their origin in the so-called ‘clearing-the way’ effect of the heavy Au₄₀₂ cluster; this effect is strongly reduced for E₀ ? 100 eV/atom when projectile fragmentation sets in, and the fragments are stopped independently of each other. These results are relevant for studies of cluster stopping and ranges in soft matter.     

Ion fluence dependence of the Si sputtering yield by noble gas ion bombardment

The effect of sputtering yield enhancement by implantation of noble gases into solid silicon is investigated with the Monte Carlo program SDTrimSP. The process of diffusion is incorporated into the program to describe the outgassing of noble gases. The bombardment of Si with He, Ne, Ar, Xe at normal incidence is studied in the energy range from 1 to 500 keV. Good agreement of the calculated results with experimental data is found.     

Competition of terrace and step-edge sputtering under oblique-incidence ion impact on a stepped Pt(1 1 1) surface

Using molecular-dynamics simulation, we study the sputtering of a Pt(1 1 1) surface under oblique and glancing incidence 5 keV Ar ions. For incidence angles larger than a critical angle ?_c, the projectile is reflected off the surface and the sputter yield is zero. We discuss the azimuth dependence of the critical angle ?_c with the help of the surface corrugation felt by the impinging ion. If a step exists on the surface, sputtering occurs also for glancing incidence ?>?_c. We demonstrate that for realistic step densities, the total sputtering of a stepped surface may be sizable even at glancing incidence.     

Cluster size effect on reactive sputtering by fluorine cluster impact using molecular dynamics simulation

The mechanism of high-yield sputtering induced by reactive cluster impact was investigated using molecular dynamics (MD) simulations. Various sizes of fluorine clusters were radiated on clean silicon surface. At an incident energy of 1 eV/atom, F atom and F₂ molecule are only adsorbed on the surface and sputtering of Si atom does not occur. However, fluorine cluster, which consists of more than several tens molecules causes sputtering. In this case, most of Si atoms are sputtered as fluorinated material such as SiF_x. This effect is due to the fact that cluster impact induces high-density particle and energy deposition, which enhances both formation of precursors and desorption of etching products. The deposition of atoms and energy becomes denser as the incident cluster size increases, so that larger clusters have shown higher sputtering yield.     

Cluster-induced crater formation

Using molecular-dynamics simulation, we study the crater volumes induced by energetic impacts of projectiles containing up to N=1000 atoms. We find that for Lennard-Jones bonded material the crater volume depends solely on the total impact energy E. Above a threshold E_th, the volume rises linearly with E. Similar results are obtained for metallic materials. By scaling the impact energy E to the target cohesive energy U, the crater volumes become independent of the target material. To a first approximation, the crater volume increases in proportion with the available scaled energy, V=aE/U. The proportionality factor a is termed the cratering efficiency and assumes values of around 0.5.     

Atomistic self-sputtering mechanisms of rf breakdown in high-gradient linacs

Molecular dynamics (MD) models of sputtering solid and liquid surfaces - including the surfaces charged by interaction with plasma, Coulomb explosion, and Taylor cone formation - were developed. MD simulations of self-sputtering of a crystalline (1 0 0) copper surface by Cu⁺ ions in a wide range of ion energies (50 eV-50 keV) were performed. In order to accommodate energetic ion impacts on a target, a computational model was developed that utilizes MD to simulate rapid atomic collisions in the central impact zone, and a finite-difference method to absorb the energy and shock wave for the collisional processes occurring at a longer time scales. The sputtering yield increases if the surface temperature rises and the surface melts as a result of heat from plasma. Electrostatic charging of the surface under bombardment with plasma ions is another mechanism that can dramatically increase the sputtering yield because it reduces the surface binding energy and the surface tension. An MD model of Taylor cone formation at a sharp tip placed in a high electric field was developed, and the model was used to simulate Taylor cone formation for the first time. Good agreement was obtained between the calculated Taylor cone angle (104.3°) and the experimental one (98.6°). A Coulomb explosion (CE) was proposed as the main surface failure mechanism triggering breakdown, and the dynamics of CE was studied by MD.     

Segregation of atoms in NixPdy alloys during ion irradiation

Sputtering of Ni₅Pd and NiPd₅ alloys by 10 keV Ar ions has been studied using the binary-collision simulation. Special attention was given to the angular distributions of sputtered atoms at the steady-state conditions. The results of simulations were compared with the experimental data published recently. For both targets, the concentrations of Ni and Pd atoms in the top monolayer were extracted from the experimental data. The results of simulations favor segregation of Pd in Ni₅Pd and segregation of Ni in NiPd₅. The total concentration of surface vacancies was found to be about 10-30%.