Surface micromachined capacitive ultrasonic transducer for underwater imaging

Abstract

This study presents the primary design, fabrication process and device measurement of a Capacitive Micromachined Ultrasonic Transducer (CMUT) for underwater acoustic imaging. Theoretical analysis and computer simulations of the CMUT are performed. The CMUT fabrication uses the full surface micromachining techniques of the Micro Electro Mechanical System (MEMS). These techniques are Low Pressure Chemical Vapor Deposition (LPCVD), photolithography, Reactive Ion Etching System (RIE) dry etching, sacrificial layer wet etching, metal thermal evaporation coating and Plasma‐Enhanced Chemical Vapor Deposition (PECVD). Several important issues regarding fabrication are discussed. The measured input impedance of the CMUT is in agreement with the theoretical prediction. The received signal has a 35 dB signal‐to‐noise ratio indicating that practical applications of the immersion CMUT are feasible and that the radiation pattern measurement of the CMUT array has good beamforming characteristics for underwater imaging.     

Chemical vapor detection using a capacitive micromachined ultrasonic transducer

Distributed sensing of gas-phase chemicals using highly sensitive and inexpensive sensors is of great interest for many defense and consumer applications. In this paper we present ppb-level detection of dimethyl methylphosphonate (DMMP), a common simulant for sarin gas, with a ppt-level resolution using an improved capacitive micromachined ultrasonic transducer (CMUT) as a resonant chemical sensor. The improved CMUT operates at a higher resonant frequency of 47.7 MHz and offers an improved mass sensitivity of 48.8 zg/Hz/μm(2) by a factor of 2.7 compared to the previous CMUT sensors developed. A low-noise oscillator using the CMUT resonant sensor as the frequency-selective device was developed for real-time sensing, which exhibits an Allan deviation of 1.65 Hz (3σ) in the presence of a gas flow; this translates into a mass resolution of 80.5 zg/μm(2). The CMUT resonant sensor is functionalized with a 50-nm thick DKAP polymer developed at Sandia National Laboratory for dimethyl methylphosphonate (DMMP) detection. To demonstrate ppb-level detection of the improved chemical sensor system, the sensor performance was tested at a certified lab (MIT Lincoln Laboratory), which is equipped with an experimental chemical setup that reliably and accurately delivers a wide range of low concentrations down to 10 ppb. We report a high volume sensitivity of 34.5 ± 0.79 pptv/Hz to DMMP and a good selectivity of the polymer to DMMP with respect to dodecane and 1-octanol.     

A 32 x 32 element row-column addressed capacitive micromachined ultrasonic transducer

This paper presents characterization and initial imaging results of a 32 x 32 element two-dimensional capacitive micromachined ultrasonic transducer array. The devices are fabricated using a wafer bonding process in which both the insulation layer and the membrane are user-deposited silicon nitride. The transducers use a row-column addressing scheme to simplify the fabrication process and beamformer. By adjusting the number of rows and columns that are biased, the effective aperture of the transducer can be adjusted. This is significant because it permits imaging in the near-field of the transducer without the use of a lens. The effect on the transmit beam profile is demonstrated. The transducer has a center frequency of 5.9 MHz and a relative bandwidth of 110%. Images of horizontal and vertical wires are taken to demonstrate image resolution. A three-dimensional image of four pin heads is also demonstrated.     

Surface micromachined capacitive ultrasonic transducers

The current state of novel technology, surface microfabricated ultrasonic transducers, is reported. Experiments demonstrating both air and water transmission are presented. Air-coupled longitudinal wave transmission through aluminum is demonstrated, implying a 110 dB dynamic range for transducers at 2.3 MHz in air. Water transmission experiments from 1 to 20 MHz are performed, with a measured 60 dB SNR at 3 MHz. A theoretical model is proposed that agrees well with observed transducer behavior. Most significantly, the model is used to demonstrate that microfabricated ultrasonic transducers constitute an attractive alternative to piezoelectric transducers in many applications.     

Design of a hexagonal air-coupled capacitive micromachined ultrasonic transducer for air parametric array

An air parametric array can generate a highly directional beam of audible sound in air,which has a wide range of applications in targeted audio delivery.Capacitive micromachined ultrasonic transducer(CMUTs)have great potential for air-coupled applications,mainly because of their low acoustic impedance.In this study,an air-coupled CMUT array is designed as an air parametric array.A hexagonal array is proposed to improve the directivity of the sound generated.A finite element model of the CMUT is established in COMSOL software to facilitate the choice of appropriate structural parameters of the CMUT cell.The CMUT array is then fabricated by a wafer bonding process with high consistency.The performances of the CMUT are tested to verify the accuracy of the finite element analysis.By optimizing the component parameters of the bias-T circuit used for driving the CMUT,DC and AC voltages can be effectively applied to the top and bottom electrodes of the CMUT to provide efficient ultrasound transmission.Finally,the prepared hexagonal array is successfully used to conduct preliminary experiments on its application as an air parametric array.     

A 32 x 32 capacitive micromachined ultrasonic transducer array manufactured in standard CMOS

As ultrasound imagers become increasingly portable and lower cost, breakthroughs in transducer technology will be needed to provide high-resolution, real-time 3-D imaging while maintaining the affordability needed for portable systems. This paper presents a 32 x 32 ultrasound array prototype, manufactured using a CMUT-in-CMOS approach whereby ultrasonic transducer elements and readout circuits are integrated on a single chip using a standard integrated circuit manufacturing process in a commercial CMOS foundry. Only blanket wet-etch and sealing steps are added to complete the MEMS devices after the CMOS process. This process typically yields better than 99% working elements per array, with less than ±1.5 dB variation in receive sensitivity among the 1024 individually addressable elements. The CMUT pulseecho frequency response is typically centered at 2.1 MHz with a -6 dB fractional bandwidth of 60%, and elements are arranged on a 250 μm hexagonal grid (less than half-wavelength pitch). Multiplexers and CMOS buffers within the array are used to make on-chip routing manageable, reduce the number of physical output leads, and drive the transducer cable. The array has been interfaced to a commercial imager as well as a set of custom transmit and receive electronics, and volumetric images of nylon fishing line targets have been produced.     

Low temperature fabrication of immersion capacitive micromachined ultrasonic transducers on silicon and dielectric substrates

A maximum processing temperature of 250/spl deg/C is used to fabricate capacitive micromachined ultrasonic transducers (CMUTs) on silicon and quartz substrates for immersion applications. Fabrication on silicon provides a means for electronics integration via post-complementary metal oxide semiconductor (CMOS) processing without sacrificing device performance. Fabrication on quartz reduces parasitic capacitance and allows the use of optical displacement detection methods for CMUTs. The simple, low-temperature process uses metals both as the sacrificial layer for improved dimensional control, and as the bottom electrode for good electrical conductivity and optical reflectivity. This, combined with local sealing of the vacuum cavity by plasma-enhanced chemical-vapor deposition of silicon nitride, provides excellent control of lateral and vertical dimensions of the CMUTs for optimal device performance. In this paper, the fabrication process is described in detail, including process recipes and material characterization results. The CMUTs fabricated for intravascular ultrasound (IVUS) imaging in the 10-20 MHz range and interdigital CMUTs for microfluidic applications in the 5-20 MHz range are presented as device examples. Intra-array and wafer-to-wafer process uniformity is evaluated via electrical impedance measurements on 64-element ring annular IVUS imaging arrays fabricated on silicon and quartz wafers. The resonance frequency in air and collapse voltage variations are measured to be within 1% and 5%, respectively, for both cases. Acoustic pressure and pulse echo measurements also have been performed on 128 /spl mu/m/spl times/32 /spl mu/m IVUS array elements in water, which reveal a performance suitable for forward-looking IVUS imaging at about 16 MHz.     

Simulation and experimental characterization of a 2-D capacitive micromachined ultrasonic transducer array element

In this letter, a 400-mumx400-mum 2-D capacitive micromachined ultrasonic transducer (cMUT) array element is experimentally characterised, and the results are found to be in good agreement with theoretical predictions. As a receiver, the transducer has a 1.8x10(-7) nm/ radical(Hz) displacement sensitivity, and, as a transmitter, it produces 16.4 kPa/V of output pressure at the transducer surface at 3 MHz. The transducer also has more than 100% fractional bandwidth around 3 MHz, which makes it suitable for ultrasound imaging.     

Dynamic analysis of capacitive micromachined ultrasonic transducers

Electrostatic transducers are usually operated under a DC bias below their collapse voltage. The same scheme has been adopted for capacitive micromachined ultrasonic transducers (cMUTs). DC bias deflects the cMUT membranes toward the substrate, so that their centers are free to move during both receive and transmit operations. In this paper, we present time-domain, finite element calculations for cMUTs using LS-DYNA, a commercially available finite element package. In addition to this DC bias mode, other new cMUT operations (collapse and collapse-snapback) have recently been demonstrated. Because cMUT membranes make contact with the substrate in these new operations, modeling of these cMUTs should include contact analysis. Our model was a cMUT transducer consisting of many hexagonal membranes; because it was symmetrical, we modeled only one-sixth of a hexagonal cell loaded with a fluid medium. The finite element results for both conventional and collapse modes were compared to measurements made by an optical interferometer; a good match was observed. Thus, the model is useful for designing cMUTs that operate in regimes where membranes make contact with the substrate.     

Finite-element analysis of capacitive micromachined ultrasonic transducers

In this paper, we present the results of finite-element analysis performed to investigate capacitive micromachined ultrasonic transducers (CMUTs). Both three-dimensional (3-D) and 2-D models were developed using a commercially available finite-element modeling (FEM) software. Depending on the dimensionality of the model, the membranes were constructed using plane or shell elements. The electrostatic gap was modeled using many parallel plate transducers. An axisymmetric model for a single membrane was built; the electrical input impedance of the device then was calculated in vacuum to investigate series and parallel resonant frequencies, where the input impedance has a minimum and a maximum, respectively. A method for decomposing the membrane capacitance into parasitic and active parts was demonstrated, and it was shown that the parallel resonant frequency shifted down with increased biased voltage. Calculations then were performed for immersion transducers. Acoustic wave propagation was simulated in the immersion medium, using appropriate elements in a 3-D model. Absorbing boundaries were implemented to avoid the reflections at the end of the medium mesh. One row of an array element, modeled with appropriate boundary conditions, was used to calculate the output pressure. The results were compared with a simpler model: a single membrane in immersion, with symmetry boundary conditions on the sidewalls that cause the calculations to reflect the properties of an infinitely large array. A 2-D model then was developed to demonstrate the effect of membrane dimensions on the output pressure and bandwidth. Our calculations revealed that the small signal transmit pressure was inversely proportional to the square root of gap height. We also compared FEM results with analytical and experimental results.     

Deep-collapse operation of capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (CMUTs) have been introduced as a promising technology for ultrasound imaging and therapeutic ultrasound applications which require high transmitted pressures for increased penetration, high signal-to-noise ratio, and fast heating. However, output power limitation of CMUTs compared with piezoelectrics has been a major drawback. In this work, we show that the output pressure of CMUTs can be significantly increased by deep-collapse operation, which utilizes an electrical pulse excitation much higher than the collapse voltage. We extend the analyses made for CMUTs working in the conventional (uncollapsed) region to the collapsed region and experimentally verify the findings. The static deflection profile of a collapsed membrane is calculated by an analytical approach within 0.6% error when compared with static, electromechanical finite element method (FEM) simulations. The electrical and mechanical restoring forces acting on a collapsed membrane are calculated. It is demonstrated that the stored mechanical energy and the electrical energy increase nonlinearly with increasing pulse amplitude if the membrane has a full-coverage top electrode. Utilizing higher restoring and electrical forces in the deep-collapsed region, we measure 3.5 MPa peak-to-peak pressure centered at 6.8 MHz with a 106% fractional bandwidth at the surface of the transducer with a collapse voltage of 35 V, when the pulse amplitude is 160 V. The experimental results are verified using transient FEM simulations.     

Radiation impedance of collapsed capacitive micromachined ultrasonic transducers

The radiation impedance of a capacitive micromachined ultrasonic transducer (CMUT) array is a critical parameter to achieve high performance. In this paper, we present a calculation of the radiation impedance of collapsed, clamped, circular CMUTs both analytically and using finite element method (FEM) simulations. First, we model the radiation impedance of a single collapsed CMUT cell analytically by expressing its velocity profile as a linear combination of special functions for which the generated pressures are known. For an array of collapsed CMUT cells, the mutual impedance between the cells is also taken into account. The radiation impedances for arrays of 7, 19, 37, and 61 circular collapsed CMUT cells for different contact radii are calculated both analytically and by FEM simulations. The radiation resistance of an array reaches a plateau and maintains this level for a wide frequency range. The variation of radiation reactance with respect to frequency indicates an inductance-like behavior in the same frequency range. We find that the peak radiation resistance value is reached at higher kd values in the collapsed case as compared with the uncollapsed case, where k is the wavenumber and d is the center-to-center distance between two neighboring CMUT cells.     

A surface micromachined electrostatic ultrasonic air transducer

Airborne ultrasound has many applications such as, ranging, nondestructive evaluation, gas flow measurement, and acoustic microscopy. This paper investigates the generation and detection of ultrasound in air at a few MHz. Conventional plane piston lead zirconium titanate (PZT) based transducers perform poorly for this application due to the lack of proper matching layer materials. Electrostatic, or capacitive, transducers promise higher efficiency and broader bandwidth performance. The device structure in this work consists of a capacitor where one plate is a circular silicon nitride membrane coated with gold and the other is a rigid silicon substrate. By applying a voltage between the membrane and the silicon substrate, an electrostatic force is exerted on the membrane which sets it in motion, thus generating a sound wave in air. Presented here is an electrical equivalent circuit model for electrostatic transducers which is based on the early work of Mason (1942). The electrostatic transducers were designed and constructed for operation at 1.8 and 4.6 MHz. The transducers were fabricated using standard micromachining techniques. An optical interferometer was used to measure the peak displacement of the 1.8 MHz electrostatic transducer at 230 Å/V. A transmit-receive system was built using two electrostatic transducers. The system had a signal to noise ratio of 34 dB at a transducer separation of 1 cm. Each transducer had a 3-dB bandwidth of 20%, and a one-way insertion loss of 26 dB. There is excellent agreement between the measured device performance and theoretical predictions     

An accurate model for capacitive micromachined ultrasonic transducers

Modeling of capacitive micromachined ultrasonic transducers (cMUTs) is based on a two-port network with an electrical and a mechanical side. To obtain a distributed model, a solution of the differential equation of motion of the diaphragm for each element of the transducer has to be found. Previous works omit the mechanical load of the cavity behind the diaphragm, i.e., the effect of the gas inside. In this paper, we propose a distributed model for cMUTs that takes this effect into account. A closed-form solution of the mechanical impedance of the membranes has been obtained, including the effect of the restoring forces because of the stiffness of the membrane and because of the compression of the air in the cavity. Simulation results based on the presented model are compared with the experimental data for two types of cMUTs reported in the recent literature. It is demonstrated that the compression of the air has a significant effect on the fundamental frequency of the air transducer, with a deviation of about 22% from the prediction of a model that does not consider the interaction between the vibrating diaphragm and the air cushion     

A new regime for operating capacitive micromachined ultrasonic transducers

We report on a new operation regime for capacitive micromachined ultrasonic transducers (cMUTs). Traditionally, cMUTs are operated at a bias voltage lower than the collapse voltage of their membranes. In the new proposed operation regime, first the cMUT is biased past the collapse voltage. Second, the bias voltage applied to the collapsed membrane is reduced without releasing the membrane. Third, the cMUT is excited with an ac signal at the bias point, keeping the total applied voltage between the collapse and snapback voltages. In this operation regime, the center of the membrane is always in contact with the substrate. Our finite element methods (FEM) calculations reveal that a cMUT operating in this new regime, between collapse and snapback voltages, possesses a coupling efficiency (k/sub T//sup 2/) higher than a cMUT operating in the conventional regime below its collapse voltage. This paper compares the simulation results of the coupling efficiencies of cMUTs operating in conventional and new operation regimes.     

A new detection method for capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (cMUT) have become an alternative to piezoelectric transducers in the past few years. They consist of many small circular membranes that are connected in parallel. In this work, we report a new detection method for cMUTs. We model the membranes as capacitors and the interconnections between the membranes as inductors. This kind of LC network is called an artificial transmission line. The vibrations of the membranes modulate the electrical length of the transmission line, which is proportional to the frequency of the signal through it. By measuring the electrical length of the artificial line at a high RF frequency (in the gigahertz range), the vibrations of the membranes can be detected in a very sensitive manner. For the devices we measured, we calculated the minimum detectable displacement to be in the order of 10^-5 Å/√Hz with a possible improvement to 10^-7 Å/√Hz     

Optimization of the gain-bandwidth product of capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (cMUT) have large bandwidths, but they typically have low conversion efficiencies. This paper defines a performance measure in the form of a gain-bandwidth product and investigates the conditions in which this performance measure is maximized. A Mason model corrected with finite-element simulations is used for the purpose of optimizing parameters. There are different performance measures for transducers operating in transmit, receive, or pulse-echo modes. Basic parameters of the transducer are optimized for those operating modes. Optimized values for a cMUT with silicon nitride membrane and immersed in water are given. The effect of including an electrical matching network is considered. In particular, the effect of a shunt inductor in the gain-bandwidth product is investigated. Design tools are introduced, which are used to determine optimal dimensions of cMUTs with the specified frequency or gain response.     

Vibration maps of capacitive micromachined ultrasonic transducers by laser interferometry

A 1.8-mm × 1.8-mm capacitive micromachined ultrasonic transducer (CMUT) element is experimentally characterized by means of optical measurements. Optical displacement measurements provide information on the resonant behavior of the single membranes and also allow us to investigate the dispersion in the frequency spectrum of adjacent membranes. In addition, higher order mode shapes are observed, showing that either symmetrical or asymmetrical modes are excited in CMUT membranes. Laser interferometry vibration maps, combined with quantitative displacement measurements, provide information about the quality and repeatability of the fabrication process, which is a basic requirement for 2D array fabrication for ultrasound imaging     

Capacitive micromachined ultrasonic transducer design for high power transmission

Capacitive micromachined ultrasonic transducers (cMUTs) were developed to meet the demands of the ultrasonic industry. To achieve maximum efficiency, the conventional operation of the cMUT requires a bias voltage close to the collapse voltage. Total acoustic output pressure is limited by the efficiency of the cMUT and the maximum-allowed pulse voltage on the membrane. In this paper, we propose the collapse-snapback operation of the cMUT: the membrane is collapsed onto the substrate in the collapsing cycle, and released in the snapback cycle. The collapse-snapback operation overcomes the above-mentioned limitations of the conventional operation. The collapse-snapback operation utilizes a larger range of membrane deflection profiles (both collapsed and released profiles) and generates higher acoustic output pressures. The static finite element calculations were performed to design cMUTs with specific collapse and snapback voltages by changing the electrode parameters (radius (re), position (de), and thickness (te)). These designs were refined for optimum average displacement per cycle. An electrode radius greater than 60% of the membrane radius significantly improved the displacement per volt. Moderately thick membranes (te approximately 0.2 microm) were preferred, as thicker membranes reduced the displacement per volt. Under proper bias conditions, the collapse-snapback operation, designed for high-power transmission, allowed the application of pulse voltages larger than the difference of collapse and snapback voltages. Dynamic finite element calculations of an infinite cMUT array on the substrate loaded with acoustic fluid medium were performed to determine the dynamic response of the cMUT. Commercially available FEM packages ANSYS and LS-DYNA were used for static and dynamic calculations, respectively. The cMUTs were fabricated for optimal performance in the collapse-snapback operation. The transmit experiments were performed on a 2-D cMUT array using a calibrated hydrophone. Taking into account the attenuation and diffraction losses, the pressure on the cMUT surface was extracted. The cMUT generated 0.47 MPa (6 kPa/V) and 1.04 MPa (11 kPa/V) in the conventional and collapse-snapback operations, respectively. Therefore, collapse-snapback operation of the cMUTs was superior for high-power transmission.     

An FPGA-based ultrasound imaging system using capacitive micromachined ultrasonic transducers

We report the design and experimental results of a field-programmable gate array (FPGA)-based real-time ultrasound imaging system that uses a 16-element phased-array capacitive micromachined ultrasonic transducer fabricated using a fusion bonding process. The imaging system consists of the transducer, discrete analog components situated on a custom-made circuit board, the FPGA, and a monitor. The FPGA program consists of five functional blocks: a main counter, transmit and receive beamformer, receive signal pre-processing, envelope detection, and display. No dedicated digital signal processor or personal computer is required for the imaging system. An experiment is carried out to obtain the sector B-scan of a 4-wire target. The ultrasound imaging system demonstrates the possibility of an integrated system-in-a-package solution.