Mg对Al-Zn-Sn阳极合金组织与电化学性能的影响

为提高Al-7Zn-0.1Sn(质量分数,%)牺牲阳极的电化学性能,采用扫描电镜(SEM)、透射电镜(TEM)、动电位极化、电化学阻抗等方法,研究了不同含量的Mg对Al-7Zn-0.1Sn合金微观组织和电化学性能的影响。结果表明:Mg可使Al-7Zn-0.1Sn合金从粗大枝状晶向等轴晶转变;适量Mg可改善Al-7Zn-0.1Sn合金的电化学性能;随着Mg含量增加,合金电位负移、电流效率逐步提高;当Mg含量为2%时,合金具有最好的综合电化学性能。     

Ce对Al-Zn-Sn牺牲阳极合金性能的影响

采用扫描电镜(SEM)、X射线衍射(XRD)、动电位极化、电化学阻抗等方法研究了Ce含量对Al-7Zn-0.1Sn(质量分数,%)合金显微组织和电化学性能的影响。结果表明:Ce可明显细化晶粒,使Al-7Zn-0.1Sn合金从粗大枝状晶向细小等轴晶转变;适量的Ce可有效改善Al-7Zn-0.1Sn合金的电化学性能;随着Ce含量增加,合金电位负移、电流效率逐步提高;当Ce含量(质量分数)为0.5%时,合金具有最好的电化学性能,其电流效率相比Al-7Zn-0.1Sn合金的提高10%。     

Ga对Al-Zn-Sn系阳极合金电化学性能的影响

在三元Al-Zn-Sn系铝基合金中添加了一定量的Ga(0.01%～0.02%),采用恒电流法测定了Ga加入前后的合金电化学性能变化,通过金相显微镜和扫描电镜(SEM)观察阳极合金的微观组织特征.结果表明:合金中添加Ga能使开路电位、工作电位负移,电流效率提高;Ga加入量为0.015%时电流效率达到97.4%,腐蚀形貌均匀,表现出优良的综合电化学性能.通过极化曲线和电化学阻抗谱(EIS)手段,对Ga活化前后的Al-Zn-Sn系合金的活化过程进行了初步分析.     

定向凝固Zn-Al合金先共晶组织及电化学性能的研究

利用水平Bridgman定向凝固装置,在直流稳恒磁场下,对Zn-35Al-2.4Cu合金进行定向凝固试验。通过组织分析、二次枝晶臂间距测试、电化学性能测试,研究了磁场对Zn-Al合金先共晶组织和电化学性能的影响。结果表明,随着凝固速率增加,Zn-Al合金先共晶组织的二次枝晶臂间距逐渐减小,组织细化。在电流为80A、凝固速率为1K·s-1时,Zn-35Al-2.4Cu合金先共晶组织的二次枝晶臂间距最小,为24.294μm,在3.5%的NaCl溶液中腐蚀电流密度最小,为11.62μA/cm2,耐电化学腐蚀性能最优。     

元素Bi及稀土La、Nd对Zn-10Al-5Cu钎料性能的影响

研究了Bi及稀土添加对Zn-10Al-5Cu(mass%)基体合金的润湿性能、显微组织、力学性能的影响。结果表明:钎料合金铺展面积随Bi添加量的增加而增大;铜铝接头抗剪强度随Bi添加量的增加而先增加后降低,得到的Zn-10Al-5Cu-2Bi(mass%)是性能较为优良的钎料。在Zn-10Al-5Cu-2Bi(mass%)钎料中添加稀土La、Nd,钎料的润湿性得到改善,当稀土元素添加量为0.15%时,钎料的润湿性能最佳。随着稀土元素的添加,钎料中大块的黑色共析组织逐渐变小,基体组织得到细化;当稀土元素含量为0.1%时,基体组织最为均匀、细密,晶粒也达到最大程度的细化,铜铝钎焊接头的抗剪强度达到最大。因此稀土La、Nd元素在Zn-10Al-5Cu-2Bi(mass%)中的最佳添加量为0.1%左右。     

Er对Al-Zn-In合金组织和电化学性能的影响

采用SEM、EDS和XRD等方法,研究了不同Er含量对Al-Zn-In阳极合金组织的影响;在3.5%(质量分数)Na Cl溶液中测试了不同Er含量的Al-5Zn-0.03In-Er合金的极化曲线和电化学阻抗(EIS)。结果表明:随着Er含量的增加,铝合金阳极枝晶得到细化,枝晶间析出相增多,合金腐蚀电位正移,EIS谱中阻抗弧半径增大,腐蚀速度减缓。4种合金中,Al-5Zn-0.03In-1Er合金枝晶得到一定程度细化、析出相数量适中,点蚀坑较为独立,呈现均匀腐蚀的特征,可作为阳极合金材料。     

不同In含量Al-Zn-In-Mg-Ti合金组织与电化学性能分析

考察了合金元素In含量对Al-Zn-In-Mg-Ti合金组织和电化学性能的影响、并探讨了其在人造海水中的腐蚀行为.结果表明:随着In含量的减少,Al-Zn-In-Mg-Ti合金的组织变得更加均匀,析出相减少,枝晶数量减少,电化学性能也随之改善.当In含量为0.02%时,Al-5Zn-0.02In-1Mg-0.05Ti合金的电流效率达86.3%,实际电容量为2407.3A.h/kg.在人造海水中腐蚀后,Al-5Zn-0.02In-1Mg-0.05Ti合金腐蚀产物易脱落,表面均匀平整.     

热处理对Al-Zn-Sn-Ga合金组织及电化学性能的影响

针对Al-7Zn-0.1Sn-0.015Ga(质量分数,%)牺牲阳极的腐蚀均匀性有待进一步提高的问题,采用扫描电镜(SEM)、恒电流极化、动电位极化等方法,研究了退火和固溶处理对其微观组织、电流效率和腐蚀形貌等的影响。结果显示:热处理工艺可减小合金元素的偏析程度,改善合金组织的不均匀性;退火处理使合金的电位正移,自腐蚀电流密度和析氢腐蚀速率升高,且电流效率大大降低,溶解形貌虽有改善但仍不均匀;固溶处理可降低该合金的电位,抑制析氢腐蚀,电流效率虽稍降低但能明显改善合金的腐蚀形貌。经固溶处理后该阳极的电流效率达94.6%,工作电位负而稳定,腐蚀形貌均匀,具有较好的综合电化学性能。     

In对Al-Mg-Ga-Sn-(In)铝合金阳极组织及电化学性能的影响

在Al基体中添加Mg、Ga、Sn、In合金元素,通过正交试验设计了9组铝-空气电池阳极材料。采用动电位极化试验、析氢试验和恒电流放电试验对铝合金阳极的电化学性能进行优化,通过扫描电镜和能谱测试仪观察了合金的显微组织及成分。结果表明,没有添加In元素的1号合金(Al-0.5Mg-0.05Sn-0.05Ga)、5号合金(Al-Mg-0.1Sn-0.2Ga)和9号合金(Al-2Mg-0.2Sn-0.1Ga)铝阳极具有较差的放电性能和较高的自腐蚀速率,而添加0.05wt% In元素的7号铝阳极(Al-2Mg-0.05Sn-0.2Ga-0.05In)具有最好的放电电压(平均电位-1.968 V)和抗腐蚀性能 (自腐蚀速率0.193 mL·cm^-2·min^-1)。对比去腐蚀产物后的合金表面形貌,发现5号合金的腐蚀表面布满较深的腐蚀坑,这增加了铝合金的自腐蚀,而7号合金的表面具有较浅的腐蚀坑,这减缓了电解液中离子传递和自腐蚀速率。 因此,7号铝合金适合用作铝-空气电池阳极材料。     

Sc、Er元素在Al-Zn-Mg合金中的作用机理研究

采用直冷半连续铸造法制备了三种不同成分的Al-Zn-Mg-(Sc)-(Er)合金材料。利用金相显微镜、扫描电镜和透射电镜进行微观组织观察,采用差热分析仪测试相变转变温度,测试了硬度、拉伸性能并利用扫描电镜进行断口分析。结果表明:Al-8.5Zn-1.5Mg-0.1Zr合金中添加0.1%Sc+0.1%Er的晶粒细化效果最好,室温拉伸性能最佳,抗拉强度、屈服强度和伸长率分别可达585 MPa、566 MPa和8.3%;添加0.2%Er元素(0.1%Er等量替代0.1%Sc)的合金的晶粒细化效果和室温拉伸性能均明显差于Al-8.5Zn-1.5Mg-0.1Zr-0.1Sc-0.1Er合金;而添加0.4%Er元素(0.3%Er过量替代0.1%Sc)与添加0.1%Sc+0.1%Er元素对于Al-8.5Zn-1.5Mg-0.1Zr合金在晶粒细化和室温拉伸性能方面带来的增益效果较为接近,但较高含量的Er元素添加容易在合金内部形成偏聚的现象。     

Hg和Ga元素对Mg阳极材料组织和电化学腐蚀性能的影响(英文)

采用动电位极化、恒电流和交流阻抗测试方法研究了Hg和Ga元素对Mg2%Hg,Mg2%Ga和Mg2%Hg2%Ga合金电化学腐蚀性能的影响,并用扫描电镜、X射线衍射和能谱分析了上述合金的显微组织和腐蚀表面形貌。结果表明:Mg2%Ga合金是固溶体,Mg-2%Hg和Mg-2%Hg2%Ga合金的晶界有白色第二相。Mg-2%Ga合金的平均电位为1.48V,腐蚀电流密度为0.15mA/cm2,电化学活性差,耐腐蚀性能好。Mg-2%Hg-2%Ga合金的平均电位1.848V,腐蚀电流密度为2.136mA/cm2,电化学活性好,耐腐蚀性能差。MgHgGa合金的活化机制是Hg和Ga原子的溶解沉积。     

Influence of Ga and Hg on microstructure and electrochemical corrosion behavior of Mg alloy anode materials

The effects of Hg and Ga on the electrochemical corrosion behavior of Mg-5%Hg （molar fraction） alloys were investigated by the measurement of polarization curves and galvanostatic test. The microstructure of the alloys and the corroded surface of the specimens were investigated by scanning electron microscopy, X-ray diffractometry and emission spectrum analysis. It can be concluded that the addition of l%Ga （molar fraction） reduces corrosion current density from 26.98 mA/cm^2 to 2.34 mA/cm^2; while the addition of l%Hg （molar fraction） increases corrosion current density. The addition of Ga and Hg both promotes the electrochemical activity of the alloys and the influence of Ga is more effective than Hg. Mg-5%Hg-l%Ga alloy has the best electrochemical activity, showing mean potential of-1.992 V. The activation mechanism of the magnesium alloy produced by Hg and Ga was put forward. Magnesium atoms are dissolved in liquid Hg and Ga to form amalgam and undergo severe oxidation at the amalgam/electrolyte interface.     

合金元素Ga和In对Mg阳极组织和电化学性能的影响

采用动电位极化和恒电流曲线测试合金元素Ga和In对Mg阳极材料电化学性能的影响。采用扫描电镜法分析Mg?In?Ga合金的显微组织和腐蚀表面,并用X射线衍射法检测Mg?0.8%In合金和Mg?0.8%Ga?0.3%In 合金的腐蚀产物。结果表明：Mg?xIn (x=0?0.8%)合金中没有第二相出现,Mg?0.8%In?xGa (x=0?0.8%)合金中存在富含Ga和In元素的晶间化合物。合金元素In和0.05%?0.5%Ga的添加提高了镁阳极的耐腐蚀性能,Ga元素的添加更促进了Mg?In合金的电化学活性。Mg?0.8%In?0.8%Ga合金的平均电位最负,为?1.682 V,此电位比AZ91D合金的?1.406 V更负。Mg?In?Ga合金的腐蚀类型是全面腐蚀,其腐蚀产物是Mg(OH)2。     

Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint

Sn-Bi-X solders are widely used in electronic packaging industry. However, thermomigration (TM) behaviors of Sn-Bi-X solder joints and the orientations change of Bi grains under the temperature gradient are rarely reported. In this study, Sn-Bi57-Ag0.7/Cu solder joints were used to conduct a TM test under a temperature gradient of 625 °C/cm for 400 h, and an isothermal aging test at 85 °C was also conducted for comparison. The microstructural evolution of Sn-Bi-X solder joints after reflow, TM and isothermal aging were analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and electron probe microanalysis (EPMA). The results indicated that the Sn/Bi areal ratio after TM did not change significantly whether at the hot end (from 46.78%/52.12% to 50.90%/48.78%) or at the cold end (from 50.25%/49.64% to 48.71%/51.16%) compared with that of as-reflowed samples due to the insufficient thermal energy. The thickness of intermetallic compound (IMC) after TM at hot end (2.49 μm) was very close to that of the IMC at cold end (2.52 μm), which was also close to that of the aged samples. In addition, the preferred orientations of Sn and Bi grains in different Sn-Bi-Ag solder joints resulting from different conditions (reflow, TM and isothermal aging) were characterized by electron backscatter diffraction (EBSD). The obtained results demonstrated that both Sn and Bi grains had no preferred orientation whether after reflow or isothermal aging, while the orientation of Bi grains of the sample after TM changed from random direction to c-axis ([0001] direction) parallel to the heat flow. Ag₃Sn could hinder the change of orientation of Bi grains under the temperature gradient, and the corresponding mechanism was also systematically illuminated. This study firstly revealed the orientation change of Bi grains under the temperature gradient, which would have a profound guiding significance for enhancing the reliabilities of Sn-Bi-Ag solder joints.     

Influence of Mg21Ga5Hg3 compound on electrochemical properties of Mg-5%Hg-5%Ga alloy

The Mg-Hg-Ga alloys are widely used in high power the seawater batteries. Mg-5%Hg-5%Ga alloy was melted and heat treatments at 573-773 K were performed for different times. The electrochemical and corrosion behaviors of the Mg-5%Hg-5%Ga alloy were studied by means of potentiodynamic, galvanostatic and electrochemical impedance spectroscopy(EIS). Scanning electron microscopy(SEM), energy dispersive spectrometry(EDS) and X-ray diffractometry(XRD) were employed to characterize the microstructures of the alloy. The results demonstrate that the best electrochemical activity occurs in the Mg-5%Hg-5%Ga alloy with homogeneously dispersed Mg21Ga5Hg3 compound in α-Mg matrix. The most negative mean potential at 100 mA/cm2 polarization current density can reach -1.928 V. The largest corrosion current density 19.37 mA/cm2 of the Mg-5%Hg-5%Ga alloy appears in the Mg-5%Hg-5%Ga alloy with intergranular eutectic α-Mg and Mg21Ga5Hg3.     

Bi含量对Al-Zn-Ga-Si-Bi合金电化学性能和腐蚀形貌影响

通过在Al-Zn-Ga-Si低电位牺牲阳极材料中添加Bi来改善阳极的性能，以不同Bi含量制备了5种牺牲阳极材料。通过电化学性能测试、极化曲线以及电化学阻抗谱测试来分析Bi对阳极电化学性能的影响；采用三维视频和宏观表征来分析Bi对阳极腐蚀形貌的影响。结果表明，添加适量Bi可以有效破坏铝合金阳极表面的氧化膜，提高阳极活化性能，并减少晶界腐蚀的作用，改善阳极的溶解形貌，但Bi含量过高时反而降低阳极的均匀活化性能，当Bi含量为0.05%(质量分数) 时阳极综合性能良好，可用作高强钢的阴极保护。     

Electrochemical behaviors of Bi (Ⅲ) in dimethylsulfoxide

Cyclic voltammetry, chronoamperometry and chronopotentiometry were used to investigate the electrochemical behaviors of Bi(b!) in Bi(NO3)3-LiClO4-DMSO (dimethylsulfoxide) system on Pt and Cu electrodes. Experimental results indicated that the electroreducation of Bi(b!) to Bi(0) was irreversible on Pt and Cu electrodes. The diffusion coefficient and electron transfer coefficient of Bi(b!) in 0.01 mol     

Corrosion behaviour of Ti–Ta–Sn alloy systems in 0.9% NaCl solution

Two alloys of varying contents of tantalum (Ta) and tin (Sn) were prepared and homogenized to evaluate their microstructural and electrochemical characteristics. The microstructural features were revealed through optical microscopy and X‐ray diffraction methods. The formation and stability of passive film was studied by open circuit potential, potentiodynamic polarization and electrochemical scratch tests. The electrochemical impedance spectroscopy results simulated with equivalent electrical circuit suggested bilayer structure of outer porous and inner barrier oxide films. The quantitative data showed thick inner barrier oxide film retarded electrochemical reactions at low ‘Ta’ and ‘Sn’ concentration. The increased percentage of ‘Ta’ and ‘Sn’ deteriorated barrier properties by agglomeration of Ta₂Sn₃ and Ta_0.15Ti_0.85 precipitates within grains and at the grain boundaries.     

新型锂离子电池负极材料Li1.1V0.9O2的制备及其电化学性能

通过固相合法制备了新型锂离子电池负极材料Li1.1V0.9O2,考察不同合成工艺对其结构、形貌及电化学性能的影响。采用X射线衍射、扫描电子显微镜和恒电流充放电法研究了试样的结构、形貌和电化学性能。实验结果表明:采用两段烧结法合成的试样结构更完整、粒径分布更均匀、电化学性能更优良。在1 C倍率下,充电容量高达275 mAh/g,经过50次循环后,充电容量保持率高达96.73%。     

退火温度对Incoloy800合金晶间腐蚀敏感性的影响

用草酸腐刻、双环动电位电化学再活化(DL-EPR)及电化学阻抗谱(EIS)3种方法评价了不同温度(550～800℃)退火处理4 h后Incoloy800合金的晶间腐蚀敏感性,研究了退火温度对Incoloy800合金晶间腐蚀敏感性的影响。分别用光学显微镜(OPM)和扫描电子显微镜(SEM)观察了敏化样品经草酸腐刻后的微观结构和DL-EPR测试后的表面形貌。结果表明3种方法评价结果一致,随着退火温度升高,Incoloy800合金的敏化度先增大后减小,在650和700℃下退火4 h后高度敏化,再活化率Ra均大于30%,而在800℃退火4 h后未被敏化。