硫代硫酸盐无氰脉冲镀银工艺研究

对无氰镀银工艺进行了优选,找到一种无氰光亮镀银添加剂的配方,并对其工艺参数进行优选,得出最佳脉冲参数为：脉宽1ms,占空比为10％,电流密度为0．6A／dm^2。在最佳工艺参数下得到的银镀层镜面光亮,与直流镀银相比,抗变色性和耐蚀性均显著提高,并通过扫描电镜观察了镀层的表面形貌。     

以DMDMH为配位剂的无氰镀银工艺

研究了DMDMH(1,3-二羟甲基-5,5-二甲基乙内酰脲)为配位剂的无氰镀银工艺.在讨论镀液组成及工艺条件对镀层外观质量影响的基础上,确定了最佳电镀工艺.阴极电流效率,分散能力、覆盖能力、结合强度等测试表明,DMDMH无氰镀银工艺基本达到了氰化物镀银工艺的性能,有望成为氰化物镀银的替代工艺.     

5,5-二甲基乙内酰脲无氰镀银工艺的研究

研究了5,5-二甲基乙内酰脲为配位剂的无氰镀银工艺.在讨论镀液组成及工艺条件对镀层外观质量影响的基础上,确定了最佳电镀工艺.阴极电流效率、分散能力、覆盖能力、结合强度等性能的测试表明,5,5-二甲基乙内酰脲无氰镀银工艺在某些方面达到甚至优于氰化物镀银工艺,具有推广应用价值.     

以蛋氨酸为配位剂的无氰镀银工艺研究

研究了以蛋氨酸为配位剂的无氰镀银工艺.采用正交实验结合单因素实验优化了最佳工艺条件.选用扫描电镜和XRD对镀层形貌和结构进行了表征;阴极电流效率、分散能力、覆盖能力、结合强度以及镀速等性能的测试表明:新型的无氰镀银工艺基本达到了氰化物镀银工艺的性能,有望替代氰化物镀银工艺.     

无氰镀银新工艺的研究

介绍了一种可以产业化应用的无氰镀银新工艺。采用多种测试及表征方法,对镀液稳定性、分散能力及深镀能力等性能进行了测定;对无氰银镀层的外观质量、微观形貌、结合力、可焊性、抗变色性能及导电性等性能与氰化镀银层进行了对比分析。结果表明,无氰镀银新工艺的镀液与镀层性能接近或优于氰化镀银层。     

铜基无氰电刷镀银研究

探讨了铜基无氰电刷镀银的基本原理和施镀工艺。详细介绍了电刷镀银设备、特点、应用以及手工除油、化学除油、电净、活化、浸银、刷镀银液的配制等前处理,防银变色处理、电解钝化、镀层性能检验、退镀、补镀、注意事项等后处理工艺。     

5,5-二甲基乙内酰脲无氰脉冲镀银工艺的研究

研究了5,5-二甲基乙内酰脲(DMH)无氰脉冲镀银工艺.结果表明:导通时间、关断时间、平均电流密度对镀层的外观有很大的影响.在最佳工艺参数下得到的脉冲镀层比直流镀层的结晶更致密,择优取向更明显.     

辅助络合剂对无氰电镀银镀层的影响

甲基磺酸盐电镀银工艺是现代无氰电镀银研究的一种重要方法。主要研究了以甲基磺酸和硝酸银为主盐的体系时,添加辅助络合剂对镀层物相的影响。结果表明:加入辅助络合剂可以有效地提高电流效率,且镀层表面无杂相,在该体系中最佳电流密度0.2 A/dm~2,Ag~+浓度为0.18 mol/L。     

黄铜基材无氰镀银预处理浸银工艺的优化

通过单因素实验研究了黄铜基材无氰镀银预处理浸银液的硝酸银浓度、硫脲浓度、p H等工艺参数对镀银层性能的影响,优化了浸银工艺。结果表明,在100~180 g/L硫脲,20~25 g/L硝酸银,p H为1.0~2.0,室温,90~120 s的条件下浸银后,沉积的银层结合力强,且经300℃保温1 h除氢处理,镀层无起皮、脱落及起泡现象。     

无氰镀银清洁生产技术

氰化镀银有害环境及健康,已被限制使用并逐渐淘汰,本文在硫代硫酸盐镀银工艺的基础上,通过加入辅助剂及光亮剂,获得了较为理想的无氰镀层,从而开发出一种无氰镀银清洁生产技术。介绍了该无氰镀银的基本原理、工艺规范、前后处理以及镀层的保护方法,并指出了该项技术存在的问题、测定了厚度为10～15μm的该无氰镀银层的结合力、焊接性能、电阻、防腐蚀性能及耐高温性能,并与相同厚度的氰化镀银层进行了比较结果表明,该无氰镀银层质量不亚于氰化镀银层。     

Antibacterial activity of silver photodeposited nepheline thin film coatings

Antibacterial characteristic of silver makes this material very appealing for surface coating on various substrates. In this study, we investigated different silver containing powder for this purpose. Specifically we examined the antibacterial activity of Ag/nepheline compared with Ag/TiO₂ and Ag/SiO₂. Our analysis suggested “Ag/nepheline” composite thin film is an appropriate coating for production of antibacterial ceramic tiles in large scale. In our investigation, FactSage software was used for the thermodynamic analysis. Nano-silver was obtained from silver nitrate solution by ultraviolet illumination of distilled water. In this process, silver was doped on micronized TiO₂, SiO₂, or nepheline. The silver composites and monolithic silver were sprayed with water on raw tiles and sintered in a furnace. Exploring the results suggested the best component for achieving antibacterial tile is Ag/nepheline.     

镀银层在氯化钠和硫化钠溶液中的耐蚀性研究

通过盐雾腐蚀试验、电化学腐蚀试验和硫化钠腐蚀试验,考察了镀银层在氯化钠和硫化钠溶液中的耐蚀性。结果表明:镀银层盐雾腐蚀前后的微观形貌没有明显的差别,而紫铜盐雾腐蚀前后的微观形貌发生了很大的变化;镀银层的自腐蚀电位为-0.205 V,较紫铜的自腐蚀电位正移了约18 mV;镀银层的自腐蚀电流密度为1.42×10^-7 A/cm²,较紫铜的自腐蚀电流密度降低了一个数量级;镀银层在硫化钠溶液中也具有良好的抗腐蚀能力。     

Effects of nanoparticulate silver on the corrosion protection performance of polyurethane coatings on mild steel in sodium chloride solution

Waterborne polyurethane (WPU) and high solid polyurethane (HPU) coatings containing nanoparticulate silver were coated on mild steel and compared to the corresponding coatings without nanoparticulate silver in NaCl solution using electrochemical impedance spectroscopy (EIS). The EIS results showed WPU coating degradation in the presence of nanoparticulate silver, while inclusion of nanoparticulate silver in HPU coating revealed no significant effect on the coating resistance. The WPU and HPU coatings morphology was investigated by SEM cross-section, which showed loss of WPU coating integrity in the presence of nanoparticulate silver, while no significant effect was observed for the HPU coating. The dual behavior of nanoparticulate silver in WPU and HPU coatings was connected to their different chemical structures confirmed by FTIR spectroscopy.     

电接触件用T2紫铜表面功能性镀银层的制备与表征

在电接触件用T2紫铜表面制备了功能性镀银层。参照相关标准并使用扫描电镜、表面粗糙度测量仪、回路电阻测试仪和盐雾试验机,对镀银层进行了表征。结果表明:镀银层具有银白色金属光泽,与基体的结合力较好;镀银层表面非常平整,表面粗糙度约为0.16μm;镀银使T2紫铜试样的表面粗糙度和接触电阻分别降低了12%和11%;镀银后的T2紫铜试样表现出较好的耐盐雾腐蚀性。     

Preparation and characterization of silver nanocomposite textile

Nanostructured silver films of different thicknesses were deposited on surfaces of polypropylene nonwovens by magnetron sputter coating to obtain antibacterial and electrical conductive properties. The surface morphology of nanostructured silver films was investigated by atomic force microscopy (AFM). The antibacterial properties of the nonwovens coated with relatively thinner films were evaluated using the shake flask test. The conductivity of the nonwovens coated with relatively thicker films was examined using an ohm-meter. The results of the antibacterial test revealed that the antibacterial performance improved gradually as the film thickness increased from 0.5 to 3 nm. It is believed that the total amount of silver ions released from the coating was increased along with the increase in film thickness. As sputtering time prolonged, the grain sizes of the silver particles were increased and the coating became more compact. The results of the electrical conductivity test showed that the increased film thickness led to the improved electrical conductivity when the film was relatively thicker. The AFM images clearly revealed the change in surface morphology formed by sputter coating. The growth and coverage of the coating layer contributed to the improvement in its antibacterial and conductive properties.     

空心玻璃微珠无钯活化化学镀银的研究

基于银镜反应原理,不经过粗化和活化直接对空心玻璃微珠进行化学镀银。采用单因素分析法,研究了硝酸银、葡萄糖、装载量、氢氧化钠和无水乙醇对银的利用率以及镀层的增重率、导电性能和结合强度等的影响,并借助扫描电镜和X射线衍射仪对镀层的表面形貌和结构进行了分析。结果表明:与胶体钯活化工艺相比,无钯活化化学镀银工艺的银的利用率高,镀层均匀、致密,导电性好,结合强度高。     

电流密度对5,5-二甲基乙内酰脲体系电镀银的影响

采用5,5-二甲基乙内酰脲体系在黄铜及不锈钢基体上沉积厚度为6μm左右的银镀层,镀液组成和工艺条件为:硝酸银25 g/L,5,5-二甲基乙内酰脲80 g/L,烟酰胺60 g/L,碳酸钾40 g/L,复合光亮剂(包含2-巯基苯骈噻唑、1,4-丁炔二醇和十二烷基硫酸钠)2 mL/L,pH 10.5,温度60°C,电流密度0...     

PET表面金属银涂层的制备与性能

以聚对苯二甲酸乙二酯(PET)为基体,基于化学刻蚀和敏化处理的表面改性,采用双组分喷涂法在改性基体表面制备了高性能的银涂层.改变喷涂过程中银氨溶液和还原溶液的浓度以及喷涂次数,研究它们对银涂层的微观形貌、宏观形貌、沉积量和光学常数的影响,考察了最佳喷涂条件下所得银涂层的成分和性能.结果表明:化学刻蚀后表面产生大量凹坑,...     

Electrical characterization of individual metal‐coated polymer spheres used in isotropic conductive adhesives

Isotropic conductive adhesives (ICAs) filled with metal‐coated polymer spheres (MPS) have been proposed to improve the mechanical reliability compared to conventional ICAs filled with silver flakes. The electrical properties of MPS play an important role in the electrical performance of macroscopic MPS‐based ICAs. This article deals with the electrical characterization of individual MPS using a nanoindentation‐based flat punch method, in which the resistance and the deformation of single MPS were monitored simultaneously. Four groups of silver‐coated polymer spheres (AgPS) with identical polymer cores but different silver coating thicknesses were tested. The resistance of AgPS decreases gradually with increasing deformation degree of particles, and increases when the deformation of particles is reduced. In addition, the resistance of individual AgPS is dependent on the physical properties of the silver coating, such as thickness, uniformity, and porosity. The thicker the silver coating is, the lower and more stable the resistance of AgPS is. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43764.