共查询到19条相似文献,搜索用时 125 毫秒
1.
2.
3.
宽禁带半导体材料技术 总被引:1,自引:0,他引:1
李宝珠 《电子工业专用设备》2010,39(8):5-10,56
宽禁带半导体材料是一种新型材料,具有禁带宽度大、击穿电场高、热导率高等特点,非常适合于制作抗辐射、高频、大功率和高密度集成电子器件;利用其特有的禁带宽度,还可以制作蓝光、绿光、紫外光器件和光探测器件,能够适应更为苛刻的生存和工作环境。在宽禁带半导体材料中,具有代表性的是碳化硅(SiC)、氮化镓(GaN)、氮化铝(AlN)、金刚石以及氧化锌(ZnO),综合叙述了这些材料的特性、发展现状和趋势;并介绍了SiC、GaN、ZnO材料的应用情况和代表性器件的研究进展。 相似文献
4.
SiC半导体材料和工艺的发展状况 总被引:1,自引:0,他引:1
崔晓英 《电子产品可靠性与环境试验》2007,25(4):58-62
碳化硅(SiC)是一种宽禁带半导体材料,适用于制作高压、高功率和高温器件,并可以工作在直流到微波频率范围.阐述了SiC材料的性质,详细介绍了SiC器件工艺(掺杂、刻蚀、氧化及金属半导体接触)的最新进展,并指出了存在的问题及发展趋势. 相似文献
5.
4 宽禁带半导体功率器件的发展背景 宽禁带半导体功率器件的发展是在宽禁带半导体材料发展的基础上发展起来的,其迅速发展的主要原因之一是源于美国军方的兴趣,尤其是2002年美国国防先进研究计划局(DARPA)通过并实施了宽禁带半导体技术计划(WBGSTI),该计划极大地推动了宽禁带半导体技术的发展. 相似文献
6.
以SiC和GaN为代表的宽禁带半导体材料的突破给发展新一代电力电子带来希望。SiC材料具有比Si材料更高的击穿场强、更高的载流子饱和速度和更高的热导率,使SiC电力电子器件比Si的同类器件具有关断电压高、导通电阻小、开关频率高、效率高和高温性能好的特点。SiC电力电子器件将成为兆瓦电子学和绿色能源发展的重要基础之一。综述了SiC新一代电力电子器件的发展历程、现状、关键技术突破和应用研究。所评估的器件包含SiC SBD、SiC pin二极管、SiC JBS二极管、SiC MOFET、SiC IGBT、SiC GTO晶闸管、SiC JFET和SiC BJT。器件的评估重点是外延材料的结构、器件结构优化、器件性能、可靠性和应用特点。最后总结了新世纪以来SiC新一代电力电子器件的技术进步的亮点并展望了其技术未来发展的趋势。 相似文献
7.
SiC和GaN电子材料和器件的几个科学问题 总被引:3,自引:0,他引:3
扼要地叙述了宽禁带半导体SiC和GaN电子材料和器件的发展状况,介绍了SiC多形体、AlGaN/GaN异质结极化效应、GaN器件的电流塌陷效应和陷阱效应、SiC和GaN器件的特征工艺问题(离子注入、金属化等)以及温度升高时SiC载流子的冻析效应等。 相似文献
8.
9.
半导体材料Ga2O3是继宽禁带半导体材料SiC/GaN之后新兴的直接带隙超宽禁带氧化物半导体,其禁带宽度为4.5~4.9eV,击穿电场强度高达8MV/cm(是SiC及GaN的2倍以上),物理化学稳定性高,在发展下一代电力电子学和固态微波功率电子学领域具有较大的潜力。自2012年第一只Ga2O3场效应晶体管诞生以来,Ga2O3微电子学的研究呈现快速发展态势。本文综述了β-Ga2O3单晶材料和外延生长技术以及β-Ga2O3二极管和β-Ga2O3场效应管等方面的研究进展,介绍了β-Ga2O3材料和器件的新工艺、新器件结构以及性能测试结果,分析了相关技术难点和创新思路,展望了Ga2O3微电子学未来的发展趋势。 相似文献
10.
11.
Elasser A. Chow T.P. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2002,90(6):969-986
Silicon offers multiple advantages to power circuit designers, but at the same time suffers from limitations that are inherent to silicon material properties, such as low bandgap energy, low thermal conductivity, and switching frequency limitations. Wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), provide larger bandgaps, higher breakdown electric field, and higher thermal conductivity. Power semiconductor devices made with SiC and GaN are capable of higher blocking voltages, higher switching frequencies, and higher junction temperatures than silicon devices. SiC is by far the most advanced material and, hence, is the subject of attention from power electronics and systems designers. This paper looks at the benefits of using SiC in power electronics applications, reviews the current state of the art, and shows how SiC can be a strong and viable candidate for future power electronics and systems applications. 相似文献
12.
13.
由于硅材料本身的限制,传统硅电力电子器件性能已经接近其极限,碳化硅(SiC)器件的高功率、高效率、耐高温、抗辐照等优势逐渐突显,成为电力电子器件一个新的发展方向.综述了SiC材料、SiC电力电子器件、SiC模块及关键工艺的研究现状,重点从材料、器件结构、制备工艺等方面阐述了SiC二极管、金属氧化物半导体场效应晶体管(MOSFET)、结晶型场效应晶体管(JFET)、双极结型晶体管(BJT)、绝缘栅双极晶体管(IGBT)及模块的研究进展.概述了SiC材料、SiC电力电子器件及模块的商品化情况,最后对SiC材料及器件的发展趋势进行了展望. 相似文献
14.
15.
WANGQiang LIYu--guo SHILi--wei SHUNHai--bo XUECheng--shan 《半导体光子学与技术》2003,9(3):182-188
Silicon carbide (SiC) is an excellent microelectronic material used to fabricate high frequency, high temperature, high power and non--volatile memory devices. But due to its indirect band gap, SiC based LED can‘t emit light so efficiently as GaN based LED, so people are eager to seek effective means to improve its luminescence efficiency. Amorphous SiC, porous crystalline SiC, nanometer SiC produced by CVD methods and porous SiC formed by ion implantation are investigated, and great progresses have been gained during the latest few years, which make SiC a promising material for developing OEIC. 相似文献
16.
17.
宽禁带SiC材料被认为是高性能电力电子器件的理想材料,比较了Si和SiC材料的电力电子器件在击穿电场强度、稳定性和开关速度等方面的区别,着重分析了以SiC器件为功率开关的电力电子装置对电力系统中柔性交流输电系统(FACTS)、高压直流输电(HVDC)装置、新能源技术和微电网技术领域的影响。分析表明,SiC电力电子器件具有耐高压、耐高温、开关频率高、损耗小、动态性能优良等特点,在较高电压等级(高于3 kV)或对电力电子装置性能有更高要求的场合,具有良好的应用前景。 相似文献
18.
J.B Casady A.K Agarwal S Seshadri R.R Siergiej L.B Rowland M.F MacMillan D.C Sheridan P.A Sanger C.D Brandt 《Solid-state electronics》1998,42(12):2165-2176
Silicon carbide (SiC) is an emerging semiconductor material which has been widely predicted to be superior to both Si and GaAs in the area of power electronic switching devices. This paper presents an overview of SiC power devices and concludes that the MOS turn-off thyristor (MTO™), comprising of a hybrid connection of SiC gate turn-off thyristor (GTO) and MOSFET, is one of the most promising near term SiC switching device given its high power potential, ease of turn-off, 500°C operation and resulting reduction in cooling requirements. The use of a SiC and an anti-parallel diode are primary active components which can then be used to construct an inverter module for high-temperature, high-power direct current (d.c.) motor control. 相似文献
19.
It has been suggested that once silicon carbide (SiC) technology overcomes some crystal growth obstacles, superior SiC semiconductor devices would supplant silicon in many high-power applications. However, the property of positive temperature coefficient of breakdown voltage, a behavior crucial to realizing excellent power device reliability, has not been observed in 4H-SiC, which is presently the best-suited SiC polytype for power device implementation. This paper reports the first experimental measurements of stable positive temperature coefficient behavior observed in 4H-SiC pn junction rectifiers. This research indicates that robust 4H-SiC power devices with high breakdown reliability should be achievable after SiC foundries reduce material defects such as micropipes, dislocations, and deep level impurities 相似文献