硅纳米线制成的纳米传感器

最新的研究表明:采用硅纳米线作为检测部件,利用其自身所特有的电学性质及高表面活性可制成有实用前途的纳米传感器。介绍了硅纳米线在合成纳米传感器方面的最新应用进展,对检测NH3气、水蒸汽、pH值、Ca2+及DNA等方面的应用做了较详细地阐述。     

Experimental evaluation of MEMS strain sensors embedded incomposites

Micromechanical in-plane strain sensors were fabricated and embedded in fiber-reinforced laminated composite plates. Three different strain sensor designs were evaluated: a piezoresistive filament fabricated directly on the wafer; a rectangular cantilever beam; and a curved cantilever beam. The cantilever beam designs were off surface structures, attached to the wafer at the root of the beam. The composite plate with embedded sensor was loaded in uniaxial tension and bending. Sensor designs were compared for repeatability, sensitivity and reliability. The effects of wafer geometry and composite plate stiffness were also studied. Typical sensor sensitivity to a uniaxial tensile strain of 0.001 (1000 με) ranged from 1.2 to 1.5% of the nominal resistance (dR/R). All sensors responded repeatably to uniaxial tension loading. However, for compressive bending loads imposed on a 2-3-mm-thick composite plate, sensor response varied significantly for all sensor designs. This additional sensitivity can be attributed to local buckling and subsequent out of plane motion in compressive loading. The curved cantilever design, constructed with a hoop geometry, showed the least variation in response to compressive bending loads. All devices survived and yielded repeatable responses to uniaxial tension loads applied over 10 000 cycles     

Simulation and fabrication of piezoresistive membrane type MEMS strain sensors

Two piezoresistive (n-polysilicon) strain sensors on a thin Si₃N₄/SiO₂ membrane with improved sensitivity were successfully fabricated by using MEMS technology. The primary difference between the two designs was the number of strips of the polysilicon patterns. For each design, a doped n-polysilicon sensing element was patterned over a thin 3 μm Si₃N₄/SiO₂ membrane. A 1000×1000 μm² window in the silicon wafer was etched to free the thin membrane from the silicon wafer. The intent of this design was to fabricate a flexible MEMS strain sensor similar in function to a commercial metal foil strain gage. A finite element model of this geometry indicates that strains in the membrane will be higher than strains in the surrounding silicon. The values of nominal resistance of the single strip sensor and the multi-strip sensor were 4.6 and 8.6 kΩ, respectively. To evaluate thermal stability and sensing characteristics, the temperature coefficient of resistance [TCR=(ΔR/R₀)/ΔT] and the gage factor [GF=(ΔR/R₀)/] for each design were evaluated. The sensors were heated on a hot plate to measure the TCR. The sensors were embedded in a vinyl ester epoxy plate to determine the sensor sensitivity. The TCR was 7.5×10⁻⁴ and 9.5×10⁻⁴/°C for the single strip and the multi-strip pattern sensors. The gage factor was as high as 15 (bending) and 13 (tension) for the single strip sensor, and 4 (bending) and 21 (tension) for the multi-strip sensor. The sensitivity of these MEMS sensors is much higher than the sensitivity of commercial metal foil strain gages and strain gage alloys.     

Multi-dofs MEMS displacement sensors based on the Stewart platform theory

This work proposes a new detection strategy suitable for MEMS sensors with up to 6 degrees of freedom. Parallel structures based on the Stewart theory are commonly adopted as actuators in many fields such as high precision manipulators, aircraft and vibration simulators and machine tools; the same configuration was used here to define the kinematics of a displacement sensor in the microscale based on the optical detection. The algorithm for the estimation of absolute positions and orientations of the platform is presented. The described sensing approach considerably simplifies the platform architecture and design and introduces a promising solution for many MEMS sensors and devices.     

Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology

High temperature co-fired ceramics (HTCCs) have wide applications with stable mechanical properties, but they have not yet been used to fabricate sensors. By introducing the wireless telemetric sensor system and ceramic structure embedding a pressure-deformable cavity, the designed sensors made from HTCC materials (zirconia and 96% alumina) are fabricated, and their capacities for the pressure measurement are tested using a wireless interrogation method. Using the fabricated sensor, a study is conducted to measure the atmospheric pressure in a sealed vessel. The experimental sensitivity of the device is 2 Hz/Pa of zirconia and 1.08 Hz/Pa of alumina below 0.5 MPa with a readout distance of 2.5 cm. The described sensor technology can be applied for monitoring of atmospheric pressure to evaluate important component parameters in harsh environments.     

Micromachined silicon resonant strain gauges fabricated using SOIwafer technology

The optimum mode of double-ended tuning-fork-style resonators is a lateral vibration in the plane of the wafer. Lateral vibrations are typically excited using the comb drive approach, but this requires modification to the resonator structure. This paper reports a simple method for exciting and detecting lateral vibrations without modifying the resonator, thereby enabling the optimum dynamically balanced structure to be used. This approach uses plane electrodes positioned parallel to the resonator's tines to excite the vibrations while the change in resistance along the length of the resonator enables the vibrations to be detected. Test devices have been fabricated in single-crystal silicon using the buried oxide in silicon-on-insulator wafers as a sacrificial layer. The resonators are 340-μm long, 3-μm thick with tines 2-μm wide. The gap between the tines and the electrode is 2 μm. Visual inspection in a scanning electron microscope and electrical tests have confirmed the validity of this approach     

纤毛式MEMS传感器技术研究

首次综合国内外纤毛式MEMS传感器的研究成果,分别介绍了基于纤毛仿生原理的三维微触觉传感器、三维微力传感器、微声传感器、水流传感器、微几何测量传感器以及矢量水声传感器等。该类型传感器充分地将仿生学和MEMS技术结合起来,具有结构新颖精巧、体积小、功耗低、响应快、温漂小、精度高等优点,为开发具有自主知识产权的新型器件提供了新的思路。     

Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages

This work presents the modeling of gold microbeams for characterizing Micro-electro-mechanical systems (MEMS) packages in terms of both strains induced to the MEMS devices and hermetic sealing capability. The proposed test structures are based on arrays of rectangular-shaped clamped-free and clamped–clamped beams, to be realized with a film of electroplated gold by surface micromachining technology. The resonant frequency of the microbeams is modeled by FEM simulations as a function of substrate deformations, which could be induced by the package. Clamped–clamped bridges show a linear change of the square of the resonant frequency in case of in-plane deformations, in fairly good agreement with an approximate analytical model. Cantilever beams are modeled as variable capacitors to detect out-of-plane deformations. Finally, an analytical model to study cantilever beams as resonators for detecting pressure changes is discussed and compared with preliminary experimental results, showing an impact on the quality factor in a range from 10^?2 mbar to 1?bar.     

MEMS氮化钛谐振式压力传感器研究

提出了一种基于TiN双谐振梁结构的MEMS谐振式压力传感器,利用TiN谐振梁的谐振频率与被测压力的关系进行压力测量。针对传感器的敏感结构建立了数学模型,通过理论分析和ANSYS有限元软件的模拟,得出了谐振梁长度的变化范围和谐振梁的结构参数,并确定了TiN谐振梁在矩形压力膜上方的最佳位置。这对传感器的结构设计具有重要的指导意义。     

MEMS传感器的标准化现状与发展对策

随着MEMS传感器在各个领域的广泛应用,传感器领域的标准化工作思路和技术路线发生了变化。论述了目前国内外MEMS传感器标准的现状,并就国内外MEMS传感器标准体系的发展过程、特点、标准体系存在的问题、与现有半导体标准的关系进行了分析探讨,同时,对我国MEMS传感器标准的发展对策提出了建议。     

MEMS加速度传感器的自动校准平台

介绍了一种基于MEMS加速度传感器的自动校准平台的设计方案.从数学模型入手,推导了倾角测量算法并设计了调平控制方案.在电机控制环节加入改进后的PID算法,解决了输出突变导致系统性能下降的问题.快慢档的设定使系统在缩短调平时间的同时兼顾精度的要求.实验结果表明,该系统工作稳定,可用于一般调平场合.     

MEMS光声气体传感器光声腔的研究

光声气体传感器在微量气体探测方面具有许多优势,光声气体传感器的MEMS化可降低成本,提高传感器性能,具有重要的实际意义.依据光声传感器的原理,结合MEMS加工技术,研究制作了一种光声腔,同时,进行了一定的理论模拟,为实现光声气体传感器的MEMS化打下重要基础.     

基于MEMS工艺的声表面波化学毒剂传感器

阐述了声表面波(SAW)传感器的结构与工作原理;介绍了采用MEMS技术加工传感器芯片和敏感膜固定化的关键工艺;给出并分析了传感器的主要特性。试验和测试结果表明:传感器具有灵敏度高、响应速度快、抗汽油干扰等特点。     

小量程MEMS电容式压力传感器的研究与发展

介绍了电容式传感器在小量程压力测量领域的优势和目前研制小量程MEMS电容式压力传感器的技术难点。从实现MEMS电容式传感器小量程压力测量的不同方法出发,详细论述了国内外的研究成果、关键技术及应用情况。最后分析总结了小量程MEMS电容式压力传感器的发展方向与挑战。     

现代军用MEMS惯性传感器技术进展

现代化军事需求小型惯性传感器。技术已成熟的惯性导航和制导系统包括机械陀螺、环形激光陀螺(RLGs)、光纤陀螺(FOGs)以及半球共振陀螺(HRGs)。现在主要用于军事的还有微机电系统(MEMS)陀螺仪和加速计。采用光子晶体光纤(PCFs)的干涉光纤陀螺(IFOGs),即PC—IFOGs。重点阐述MEMS/集成光(IO)波导惯性传感器技术进展。分析小型陀螺仪和加速计技术发展前景及在未来快速反应,精确打击中的作用。     

基于MEMS传感器群的人体运动捕获

通过附在人身上的微型传感器对人体运动进行实时捕获.使用MEMS数字传感器和计算、通信设备搭建一种运动捕获系统,将导航和机器人机构学算法进行裁剪整合,权衡并且优化了计算量和精度,得出一种能用于人体运动捕获的算法并植入运动捕获系统.理想情况实验表明:系统的捕获误差为±2°,能迅速跟踪运动.系统的整体实验发现:系统捕获精度可以达到专业运动捕获的70％,对系统的误差进行了分析.本系统在保证运动捕获精度和速度的情况下,使用廉价设备,不需要高通量的数据计算,兼具轻便,对人体运动干扰小.     

FBG位移传感器的标定与不确定度分析

为了提高光纤Bragg光栅(FBG)位移传感器标定精度和实现自动标定,设计一种量程为18 cm的FBG位移传感器校准装置对FBG位移传感器进行在线校准.通过对FBG解调仪测量的波长量和计算得出的位移量进行最小二乘法拟合得到FBG传感器的静态标定系数,并对标定装置和传感器进行不确定度评定.实验结果表明:FBG位移传感器标定平台标定得到FBG位移传感器的灵敏度为0.0145 nm/mm,线性度为99.87％,重复性误差为0.082％,校准装置的测量不确定度为0.11 mm.     

Fibre-optical MEMS switches based on bulk silicon micromachining

 Fibre-optical micro-electro-mechanical systems (MEMS) switches for optical communication systems require high-precision mechanical subassemblies due to the sensitivity of single-mode fibre coupling against misalignments. The fibre diameter of 125 μm also demands for actuators with at least ±62.5-μm travel range. Bulk micromachining based on wet anisotropic etching of crystalline silicon allows fabricating actuators and alignment structures with the required accuracy. Two concepts for lensless moving-fibre switches with thermo-mechanical and electrostatic Si-micromachined actuators with large displacements are demonstrated. Received: 14 January 2002/Accepted: 1 February 2002 This paper was presented at the Workshop “Optical MEMS and Integrated Optics” in June 2001.     

一种基于MEMS传感器的无人飞艇航姿测量系统

提出了一种基于微机电系统(MEMS)惯性传感器的航姿测量系统。分析了一些传统姿态解算算法融合过程中的不足,提出一种高效的融合算法,利用梯度法将加速度计和磁力计对地球重力场和磁场矢量的观测量去修正陀螺给出的姿态信息。针对实际测量系统中振动对姿态的干扰问题,提出切比雪夫II型低通数字滤波器进行传感器数据预处理,并结合运动状态修正融合算法从而进一步抑制振动。通过实验表明:该系统的算法具有较低的计算负荷,能有效地估计出姿态,抑制振动有害加速度对姿态估计的影响,测量动态误差小于2°,静态误差小于0.8°。