Controlled material removal mode and depth of micro cracks in precision grinding of fused silica – A theoretical model and experimental verification

A critical function for crack propagation for the single grit scratching of fused silica is developed based on the fracture mechanics. The effects of original crack density on the surface, strain rate and grinding coolant are considered in the function. A theoretical model for controlled material removal mode and depth of micro cracks precision grinding is presented based on the critical function for crack propagation. It can be predicted by the model that the material removal mode in the grinding of fused silica with original cracks damage will change from a ductile mode to a semi-brittle mode, a full-brittle mode and a semi-brittle mode in sequence with the increasing single grit scratching depth. It was found that the micro crack damage depth of fused silica does not increase with the single grit scratching depth after a full brittle mode grinding and it is always smaller than that after a semi brittle mode grinding even with a smaller single grit scratching depth. These interesting results are explained by the fracture mechanics. The ductile mode grinding is a recognized desirable process of fabricating fused silica while the full-brittle grinding is also a feasible process for its shallow subsurface damage, high efficiency, low grinding force and energy consumption. Therefore, the depth of micro cracks after grinding can be controlled by choosing suitable grinding parameters. Grinding experiments are conducted on fused silica. The undeformed chip thickness of randomly distributed effective grits is simulated based on 3D reconstruction of wheel topography to reveal the relationship between the grinding parameters and the single grit scratching depth. Ground surface roughness, sub-surface damage (SSD) depth and grinding force are measured and discussed. It is shown that the model predictions correlate well with the experimental trend of grinding modes.     

Study on the subsurface damage mechanism of optical quartz glass during single grain scratching

The single grain scratching SPH simulation model was established to study the subsurface damage of optical quartz glass. Based on the analysis of the stress, strain and scratching force during scratching, the generation and propagation of subsurface cracks were studied by combining with the scratch elastic stress field model. The simulation results show that the cracks generate firstly at the elastic-plastic deformation boundary in front of the grain (φ = 28°) due to the influence of the maximum principal tensile stress. During the scratching process, the median crack closes to form the subsurface damage by extending downward, the lateral crack promotes the brittle removal of the material by extending upward to the free surface, and microcracks remain in the elastic-plastic boundary at the bottom of the scratch after scratching. The depth of subsurface crack and plastic deformation increases with rising scratching depth. The increase of scratching speed leads to the greater dynamic fracture toughness, accompanied by a significant decrease of the maximum depth of subsurface crack and the number of subsurface cracks. The subsurface residual stress is concentrated at the bottom of the scratch, and the residual stress on both sides of the scratch surface would generate and propogate the Hertz crack. When the scratching depth is less than 1.5 μm or the scratching speed is greater than 75 m/s, the residual stress value and the depth of residual stress are relatively small. Finally, the scratching experiment was carried out. The simulation analysis is verified to be correct, as the generation and propagation of the cracks in the scratching experiment are consistent with the simulation analysis and the experimental scratching force indicates the same variation tendency with the simulation scratching force. The research results in this paper could help to restrain the subsurface damage in grinding process.     

Modifications of carbon for polymer composites and nanocomposites

The various forms of carbon used in composite preparation include mainly carbon-black, carbon nanotubes and nanofibers, graphite and fullerenes. This review presents a detailed literature survey on the various modifications of the carbon nanostructures for nanocomposite preparation focusing upon the works published in the last decade. The modifications of each form of carbon are considered, with a compilation of structure-property relationships of carbon-based polymer nanocomposites. Modifications in both bulk and surface modifications have been reviewed, with comparison of their mechanical, thermal, electrical and barrier properties. A synopsis of the applications of these advanced materials is presented, pointing out gaps to motivate potential research in this field.