体硅工艺静电致动微夹持器的试验研究

对一种梳状静电致动微夹持器的特性进行了测试.采用显微镜-CCD-微机测试方案,微夹持器的状态信息通过数据采集及图像处理获取,得到"电压-位移"特性曲线并建立了数学方程.对特性方程的分析表明理论设计与试验结果的一致性与合理性.并分析了从设计、加工到测试过程中引起理论设计与实际器件性能差异的主要因素,表明现有的微机械设计理论与加工水平存在一定的不足.由试验结果中获取了相关微机械器件的设计经验.     

复合式MEMS微夹持器的研制

为实现对亚毫米微小构件稳定夹取及可靠释放等操作,研制了一种复合式微夹持器.采用有限元软件分析了微夹持器的机构及动力特性.应用MEMS体硅工艺将静电梳齿驱动与气动吸放集成构成复合式驱动,气动吸放的引入改善了微夹持器的操作性能,S形柔性梁结构的设计将梳齿驱动的直线运动转化成末端夹爪的转动实现了夹持操作.两种不同尺寸的微夹持器,有效扩展了微夹持器的夹持范围.根据微夹持器的操作控制需求,设计了微夹持器静电驱动控制系统以及气压控制系统.在80 V的驱动电压下,微夹持器末端夹爪位移可达25 μm.针对100～200 μm的小球进行了微操作实验,实验结果表明,静电梳齿驱动结合真空吸附能够使夹取操作更加稳定,基于闭环控制的气路正压力能有效克服小球与夹爪之间的粘附力,实现可靠的释放操作.微夹持器基本满足100～200 μm微小构件的操作需求.     

新型空间大行程微夹持器的设计与分析

针对传统微夹持器夹持范围小、易对物体造成损伤等不足,基于桥式放大机构和杠杆原理设计了一种新型微夹持器.该微夹持器不仅能完成对不同尺寸大小微物体的微夹持操作,还能避免在微夹持操作过程中对微小物体造成损伤或脱落,以及适应不规则微小物体的夹持操作.阐明了夹持器的结构设计原理,根据微夹持臂的工作原理建立了数学模型,计算了微夹持臂的位移放大率.此外,使用有限元分析软件ANSYS Workbench进行了静力学和动力学仿真,并验证其夹持的有效范围.结果 表明微夹持臂有较大的位移输出,且其放大率的理论计算值与仿真分析值吻合良好.     

面向MEMS微装配的夹持器的设计和实验研究

介绍了一种由PZT（压电陶瓷）驱动的用于MEMS微装配的微夹持器的设计，计算了夹持器本体的放大倍数和刚度,并用ANSYS仿真验证了数学计算的准确性,采用了基于视觉的标定方法，标定了微夹持器刚度、张合量、夹持力以及夹持力和张合量的关系。实验表明：夹持器张合量达280μm，夹持力达0．1N，可精确操作200～2000μm的微齿轮，实现了微行星齿轮减速器的装配。     

磁致伸缩式柔性微夹钳的设计及实验

基于磁致伸缩材料的磁致伸缩效应,设计了一种以Galfenol材料为驱动元件,将Galfenol薄片直接粘贴于铍青铜夹片表面构建的复合悬臂梁式柔性微夹钳,装置结构简单,在增大夹持范围的同时可实现对目标物的柔性夹持。通过搭建实验测试平台,采用不同大小的电流信号对微夹钳进行驱动,测试结果表明,当驱动电流为1.6 A时,夹片夹口完全闭合,通过激光位移传感器测得两夹片的最大偏转位移分别为106.4μm和124.8μm,整体夹持范围可达231.2μm,为磁致伸缩微夹持器的设计和应用提供参考。     

复合式MEMS微夹持器研制

研制了一种针对亚毫米微小构件实施稳定夹取及可靠释放的微夹持器,应用MEMS体硅工艺将静电梳齿驱动与真空驱动集成构成复合式驱动,设计了微夹持器静电驱动控制系统以及真空控制系统。在80V的驱动电压下,微夹持器末端夹爪位移25μm。设计了两种尺寸的微夹持器,一种张合量为100µm～150µm,另一种为150µm～200µm。针对100～200µm的小球进行了微操作实验,实验结果证明静电梳齿驱动结合真空吸附能够使夹取操作更加稳定,基于闭环控制的正压气流能有效克服小球与夹爪之间的粘附力,实现了可靠的释放操作。     

热致动硅微夹钳实验研究

利用集成的多晶硅电热微致动器,在可控电压下实现了对薄膜型硅微夹钳夹持动作的在线操作.电热微致动器所需要的工作电压低、输出力大、响应时间长,适用于硅微夹钳夹持动作的缓冲及精确控制.根据所建电热微致动器理论模型,通过分别测试微致动器在空载和驱动工况下的输出位移大小,提出了一种通过公式换算间接确定硅微夹钳驱动力的方法.实验结果表明,电热致动器驱动的硅微夹钳具有很好的电压可控性,最高工作电压可达25V.硅微夹钳的开合位移依热致动器的规格不同在0.7～4μm之间.     

基于体硅工艺的定位平台制作工艺分析研究

介绍了一种基于体硅工艺的大尺寸、大深宽比的纳米级定位平台的制作工艺。对定位平台的制作中的关键工艺进行的分析，总结了导致器件失效的主要原因，探讨了减少失效的方法。同时介绍了一种可行的面内侧面压阻的加工方法。通过对深度反应离子刻蚀（DRIE）工艺参数的调整成功了刻蚀出了大尺寸、大深宽比的结构释放窗口，释放了最小线宽为2.5μm，厚度为50微米的梳齿结构。研制了一种良好性能的集成位移检测的纳米级定位平台。     

基于MEMS机构装配的微夹持器研究

微夹持器作为末端执行装置,直接决定了微装配的效率。MEMS机构中包含许多微小的活动部件和功能元件,为实现这些微小器件的稳定夹取和自动装配,设计了一种采用压电陶瓷驱动、基于柔性铰链的二级放大微夹持器结构。对该微夹持器的节点应力、刚度及最大张合量等进行了分析计算,并对微夹持器进行了试制。实验与分析结果表明,该夹持器最大张合量是245μm,放大倍数约为12.3倍,满足MEMS机构的装配要求。在此基础上,重点对张合量与夹持力进行了系统测试,通过对测试数据的非线性回归,推导出99.99%可靠度的驱动电压计算公式,实现了微夹持的精确控制。     

柔性并联微夹取器的动力学分析及试验研究

针对一种具有毫米级操作空间和纳米级位移分辨率的、由直线超声电机驱动的柔性并联微夹持器,进行了动力学建模分析和实验研究。基于筷子夹取物体的操作原理,该微夹持器采用并联双层的结构形式。利用单位向量法,基于万向柔性铰链两端面始终平行的假设建立了微夹持器的运动学模型,表明了电机输入与操作末端输出之间的关系。采用ADAMS软件构建了微夹持器的刚柔耦合动力学仿真模型,由反向动力学仿真分析得到了微夹持器运行过程中几个重要的特征参数;由向前动力学仿真分析得到了操作末端,即探针尖端在给定输入函数下的位移、速度和加速度响应参数。对微夹持器的性能测试和夹取实验结果表明,该微夹持器的运行范围为2332μm×2109μm×20000μm,位移分辨率达到0.1μm,能够实现对微小物体的夹取操作。     

具有三层结构的SU-8胶V形微电热驱动器

为解决SU-8胶微电热驱动器在工作过程中存在平面外运动的问题,提出了一种具有铜-SU-8胶-铜三层对称结构的新型SU-8胶V形微电热驱动器.采用刚度矩阵方法建立了包含被驱动结构刚度的微电热驱动器力学模型,并针对一种柔性微夹钳,利用该模型对微电热驱动器进行了几何参数设计.利用Ansys仿真软件对所设计微驱动器进行了分析,仿真结果验证了所建模型的合理性.提出了一种新的MEMS加工工艺来制作三层结构微电热驱动器,并测试了它的性能.结果表明,实验结果与仿真结果相差不大,在150mV驱动电压下,所设计微驱动器温度仅升高约32.93℃,并对微夹钳产生约2.5 μm的输入位移,使微夹钳产生126μm的钳口距离改变量.微驱动器仅消耗大约30.35 mW的功率,钳口的平面外运动小于500 nm.最后,利用微电热驱动器驱动的微夹钳成功地对一个长1.2 mm,宽135μm,厚50μm的SU-8胶材料微型零件进行了微操作实验,实验证明了微驱动器实际性能基本满足设计要求.     

Computational parametric analysis and experimental investigations of a compact flexure-based microgripper

This paper presents a flexure-based piezoelectric actuated microgripper for high precision grasping/releasing tasks. The design of the microgripper consists of a three-stage amplification and transmission mechanism, and the parallel grasping technique. A bridge-type mechanism and two sequential lever-type mechanisms are symmetrically connected to amplify the output displacement of the embedded piezoelectric actuator. The parallelogram mechanisms assist in linearizing the output displacement of both jaws of the microgripper. The computational analysis is conducted to investigate the effect of the dimensional parameters on the characteristics of the microgripper. A computational parametric optimization methodology is established to achieve the required attributes of the microgripper. The design optimization resulted in a compact design, a high displacement amplification ratio, and a large output displacement of the microgripper. The experimental studies are conducted to investigate the key characteristics of the microgripper such as the displacement amplification ratio, the output displacement, tracking performance. Further, the parasitic motion, input-end and output-end motion resolution of the microgripper are identified. The experimental results indicate that the compact microgripper can achieve a high displacement amplification ratio and large output displacement with a high positioning accuracy.     

A novel driving principle by means of the parasitic motion of the microgripper and its preliminary application in the design of the linear actuator

This paper presents a novel driving principle by means of the parasitic motion of the microgripper. Actuators based on this principle can realize the large displacement range and high speed easily. Also the structure can be simple. A parasitic motion principle linear actuator mainly consisting of two piezoelectric stacks, two microgrippers and a mover was designed. Experimental results indicate that at a low driving frequency of 5 Hz, large velocity over 40 μm/s is obtained with the driving voltage of 100 V. Backward motion was observed and analyzed. Experimental results verify the feasibility of the new principle and it can be used to design new linear or rotary actuators.     

应用双埋层SOI工艺制备低g值微惯性开关

采用双埋层SOI( Silicon-On- Insulator)材料,结合KOH腐蚀工艺、电感耦合等离子体(ICP)刻蚀工艺、阳极键合以及喷雾式涂胶工艺,研制了一种基于平面矩形螺旋梁的低g值微惯性开关.利用二氧化硅KOH腐蚀/ICP刻蚀自停止的特点,平面矩形螺旋梁厚度的精度为±0.46 μm.分析了双埋层SO1材料的电学特性,采用等电位技术,实现了双埋层SOI与上下两层硼硅玻璃的阳极键合.采用玻璃无掩模湿法腐蚀技术,在玻璃封盖底部设计制作了大小为200 μm×200μm的防粘连凸台,解决了芯片在清洗干燥过程中的粘连问题.采用ICP刻蚀用硅衬片方法,解决了ICP刻蚀工艺中高温导致的金硅共晶合金问题.实验验证显示,提出的方法效果较好,芯片成品率得到较大提高,为大批量地研制低g值微惯性开关提供了可靠的工艺基础.     

Development of a microgripping system for handling of microcomponents

This paper reports the development of a semi-automatic microgripping system that consists of a microgripper and an x, y, z positioning system. The microgripper has two 1DOF fingers fabricated by an amorphous, soft magnetic material and is actuated electromagnetically. The microgripper is embedded in the 3DOF positioning system with the help of a stainless steel holder under an angle, which is manually adjusted, in respect to the working field. The position of the microgripper is observed optically and by three digital indicators¹ from Mitutoyo, which offer easy reading and continuous position tracking. All axes are actuated by step motors which allow precise positioning of the microparticles under manipulation. The microgripping system was tested in pick and place cases, under an optical microscope in atmospheric conditions. Optical fibres (125 μm in diameter) and bonding wires (50 μm in diameter) were handled. The temperature on the actuator, on the microgripper fingers and on the microgripper tips during manipulation was measured using K type (Ni/CrNi) thermocouples. The gripping force was evaluated as well.     

毫米级微型机器人操作手的研制和操作特性

采用单晶片型压电悬臂梁制作了一种双悬臂梁结构的微型夹持器,用作毫米级微型机器人的微操作手.该微夹持器整体尺寸为15mm×2mm×2mm,重量为100mg.在分析该悬臂梁操作原理的基础上,选用PbNi_1/3Nb_2/3-PbZrO₃-PbTiO₃三元系压电陶瓷准同型相界的配方作为悬臂梁压电驱动材料,这种压电陶瓷具有高压电常数 (d₃₁) 和机电耦合系数 (K_p).进一步研究了压电微夹持器的操作特性.结果表明:50V电场下,其最大张口距离可以达到40μm,最大夹持力为25.7×10^-3N.     

图形化蓝宝石衬底干法刻蚀工艺研究

为了缩短刻蚀时间以及提高发光二极管（LEDs）的发光性能,针对添加刻蚀辅助气体三氟甲烷（CHF3）的干法刻蚀工艺进行了研究。采用感应耦合等离子（ICP）干法刻蚀技术并通过正交试验研究了偏压功率、CHF3流量、自动压力控制蝶阀开合度（APC）对刻蚀速率和选择比的影响。试验结果表明：当偏压功率、CHF3流量和APC分别为350W、15 sccm和55%时,制程工艺有着更大的刻蚀选择比和蓝宝石刻蚀速率。使用最佳工艺参数制备出了大尺寸、高占空比、小弧度图形化蓝宝石衬底（PSS）,与常规PSS相比,优化后的工艺参数制得的PSS高度增加了5.6%、占空比提高了4.6%。     

Evaluation of gap formation at the composite resin‐tooth interface after using universal adhesives: In vitro SEM study using the replica technique

The aim of this study was to evaluate gap formation after using two universal adhesives, Peak Universal Bond (P), which contains chlorhexidine and Adhese Universal (A), which contains 10‐MDP monomer, and to compare them with two gold standard adhesives. The adhesives were tested in different etching modes, etch‐and‐rinse (ER) or self‐etch (SE), and under thermomechanical loading (TML). Two identical Class V cavities were prepared in each of 30 human third molar teeth, and resin‐composite restorations were made. Before and after TML, replicas of the restorations were prepared. Gap formation and their frequency according to the modified classification of Blunck and Zaslansky and the width of the maximum marginal gap (MG) were separately evaluated in enamel and dentin. Gap frequency did not differ significantly only in the enamel before TML, despite the use of different adhesives or etching modes. At both timepoints, the highest MG values were obtained with the Peak Universal Bond self‐etch (PSE) group in enamel (6.2 μm before TML, 12.2 μm after TML) and the Peak Universal Bond etch‐and‐rinse (PER) group in dentine (21.3 μm before TML, 35.5 μm after TML). After TML, there was a significant increase of gap frequency for Adhese universal self‐etch (ASE) group and MG values for PER, PSE, ASE groups at the resin‐enamel interface, and gap frequency and MG values for all groups at the resin‐dentin interface. Universal adhesive with 10‐MDP monomer have beneficial effect on the resin‐dentin interface, while chlorhexidine may reduce the resistance of the universal adhesive system to oral cavity conditions.