书讯

该书主要介绍了电磁兼容(EMC)的基本概念和原理,各种电磁干扰产生的机理和模型,减少干扰及提高抗扰度的方法,电磁场的生物效应与人体暴露限值,系统的EMC和天线耦合的分析,电磁干扰(EMI)的预估技术和计算机电磁建模的方法,以及各种民用与军用EMC标准的限值要求和测试方法。全书共分12章,内容包括:电磁兼容;电场与磁场、近场与远场、辐射体、感受器、天线;典型的噪声源及其辐射和传导发射特性;PCB印制线、导线、电缆间的串扰和电磁耦合;元件减小发射的方法及抗扰度;电磁屏蔽;电缆屏蔽、电场和磁场产生的耦合、电缆发射;接地和搭接;EMI测量、控制要求和测试方法;系统EMC和天线耦合;印制电路板;EMI和EMC控制、案例研究、EMC预测技术和计算电磁建模。此外,该书还为读者提供了一些可供选用的EMI诊断技术和费效比优良的解决方案。     

EMC认证的检验项目

家用电器产品EMC认证进行的EMC检验项目包含电磁发射(EMI)和电磁抗扰度(EMS)两个方面。电磁发射(EMI)的检验项目有:①.连续干扰电压(150kHz～30MHz);②.断续干扰电压(150kHz、500kHz、1.4MHz和30MHz);③.干     

发射机的电磁兼容性设计

EMI（电磁干扰）问题的深入研究对提高所设计产品的可靠性有着较大的现实意义。文中阐述了EMC（电磁兼容性）在电路设计中的重要性和电子设备的EMC问题。就雷达发射机的EMC设计问题,根据发射机干扰信号的传播途径和耦合方式,针对经常出现的各种EMI问题,提出了接地、屏蔽、滤波、瞬态抑制等4种抑制EMI的方法。介绍了其他一些常用的提高设备EMC的方法,分别从PCB（印制电路板）设计、设备内的布线、软件抗干扰设计等方面进行了探讨。     

EMC的新挑战——系统内的电磁干扰和射频干扰

在过去的20年中,针对消费电子的电磁兼容(EMC)设计领域经历了一个重要进程,包括对耦合原理的理解,开发有效的测量和建模技术,以及工程设计导则等.随着数据率和电路密度持续增加,出现了一系列EMC方面的新挑战,特别是系统内电磁干扰(EMI),可能对现今的计算、信息和通信等各类应用中的高速电子元件和系统产生显著影响.     

电磁致热超声系统设计及基于小波阈值去噪方法的信号处理

 本文给出了一个电磁致热超声(EMITA)实验系统,针对实验信号的提取问题,首先研究了实验平台的改进方法,通过置入波导内容器截面的设计,增加微波透过率;对耦合液的选择研究,减小微波脉冲对超声波接收传感器的电磁冲击,从而提高系统在强电磁脉冲下的电磁兼容(EMC)能力;其次为了从低信噪比数据中有效提取EMITA超声信号,研究了应用小波分析方法和阈值去噪重构方法处理实验采集的EMITA信号.     

车载通信对抗系统的电磁兼容设计

车载通信对抗系统具有大功率干扰、高灵敏度接收、对抗设备与通信设备共存、设备集成度高等特点。为解决系统的电磁兼容(Electromagnetic Compatibility,EMC)问题,针对车载通信对抗系统电磁干扰(Electromagnetic Interfer-ence,EMI)的6种传播路径进行了分析。在系统EMC解决方案中,分别从接地设计、电缆屏蔽设计、整机屏蔽设计、电源滤波、电磁频谱规划和天线隔离等方面,通过理论分析及相应的计算方法,给出了具体的系统电磁兼容解决措施,这些措施在工程实践上得到验证,能够有效指导系统的电磁兼容设计。     

飞思卡尔Flexis AC微控制器系列针对大型家电市场进行优化

对于设计开发人员而言,由于众多电气组件的接近而造成的"噪声"环境,以及由此产生的电磁兼容性(EMC)和电磁干扰(EMI)是他们关心的主要问题.     

固态发射机功放组件的电磁兼容性设计

介绍了固态发射机功放组件中存在的电磁干扰(EMI)问题。讨论了在工程中如何通过精心设计来避免各种EMI的发生而使功放组件具有良好的电磁兼容性(EMC)。     

高速时钟电路的EMC设计

能产生射频范围内信号的设备都可能产生电磁干扰(EMI),在高速数字系统中,时钟电路是主要的电磁干扰源,时钟电路的EMC(电磁兼容性)设计好坏直接关系到系统辐射情况和系统的性能.本文讨论了时钟电路中电磁干扰的产生机理和危害,以及降低时钟电路电磁干扰的方法,并采用HYPERLYNX软件来对方法进行验证.     

飞思卡尔Flexis AC微控制器系列针对大型家电市场进行优化

对于设计开发人员而言,由于众多电气组件接近所造成的"噪声"环境,以及由此产生的电磁兼容性(EMC)和电磁干扰(EMI)是他们关心的主要问题.为了应对这一设计挑战,飞思卡尔半导体推出了可扩展微控制器(MCU)系列,帮助工程师降低大型家电和工业应用中的噪声.     

直升机中电磁耦合薄弱路径的确定方法

直升机结构复杂、空间狭小、设备繁多,从而导致全机电磁环境异常复杂。为了快速定位全机电磁干扰耦合的通道,该文提出一种电磁干扰耦合薄弱路径的确定方法。它通过将复杂电磁干扰耦合网络转换成电磁干扰耦合有向图,以电磁能量衰减量最小为基础,在指定频点处使用Dijkstra算法寻找出干扰源和敏感点之间的最短路径,从而确定电子系统的薄弱环节。使用该方法对直升机某处理机和电台系统进行了仿真分析,并成功地寻找出敏感设备受扰的主要耦合通道。仿真和分析表明该方法可有效地寻找出系统电磁耦合的薄弱环节,并为系统的电磁兼容问题提供支撑。     

平流层空中信息平台中电机电磁干扰研究

研究平流层空中信息平台的电磁兼容问题具有十分重要的意义.以平台中的伺服电机发生火花放电时对外造成的电磁辐射为主要干扰源,建立了电磁干扰的物理模型,并通过仿真计算分析了平流层空中信息平台的电磁干扰分布及其对平台上所用通讯天线阵的影响.为平流层空中信息平台的系统设计提供了有效的指导.     

Electromagnetic interference (EMI) of system-on-package (SOP)

Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration.     

Field-Line-Circuit Coupling Based Method for Predicting Radiated Electromagnetic Emission of IGBT-PMSM Drive System

Electric drive system with Insulated gate bipolar transistor (IGBT) power device is widely used in Electric vehicle (EV), which consists of inverter, cables and Permanent magnet synchronous motor (PMSM). Due to the fast switching in di/dt and dv/dt of IGBT device, the system produces serious radiated Electromagnetic interference (EMI) through the interconnection cables. Thus, modeling of EMI source, propagation path and load PMSM is the key to accurately evaluate the system's radiation level. In addition, the system's radiated EMI involves the integrated calculation of circuit, cable and electromagnetic field, which cannot be solved by using a single circuit or electromagnetic calculation method. Therefore, this paper develops an effective field-linecircuit coupling based method to investigate the radiated EMI problems for IGBT-PMSM drive system, which is validated by experimental measurement. Besides, the impact of power cable parameters on radiated EMI is discussed. The proposed approach has guiding significance for electromagnetic compatibility design of EV.     

反激式开关电源共模传导干扰抑制研究

本文以反激式开关电源为研究对象,通过分析其共模传导干扰耦合路径,提出了抑制其共模传导干扰的具体方案,并利用Pspice软件进行仿真,仿真结果印证了设计方法的正确性。     

北斗船用接收机电磁兼容电路设计与研究

随着我国北斗二代卫星导航系统的运行,北斗船载接收机的研究也取得了丰硕的成果.对船用接收机的性能要求也提出了更高的要求,尤其是电磁兼容性能.首先介绍了抗电磁干扰的接收机总体设计原理,分析了船上电磁干扰源以及如何对北斗接收机造成干扰;提出了船载北斗导航接收机在系统设计时的电磁干扰优化措施;从系统关键电路原理设计、PCB设计的源头上应用电磁兼容理论降低各种干扰;在电源端口处采用串接前级抑制干扰滤波元件抑制噪声对系统电源的干扰.通过分析导线阻抗、传输信号的反射干扰、线间干扰、辐射干扰等来指导PCB的设计,并给出了PCB设计样图.以上的各种举措可以提高北斗船载接收机的电磁兼容性能.     

基于TMS320C6201实时图像处理系统的EMC设计

结合THS320C6201DSP在实时图像处理系统设计中的经验,介绍了DSP系统的EMI来源及对策,分析了系统软件的抗干扰方法,针对PCB制作中的电磁兼容问题,提出了防止和抑制方法以及一些提高PCB板电磁兼容性的具体措施;在工程实践中证明这些方法和措施有效可靠。     

高速DSP系统的电路板级电磁兼容性设计

针对实际应用DSP系统时常见的电源干扰、传输线效应和强电干扰等问题,对电子产品电磁环境进行分析,根据电磁干扰产生的机理和影响,对DSP系统提出了电磁兼容性设计要求。从元器件的布置,地线和电源线的布置,信号线的布置三个方面给出电路板的设计方法,从而有效降低DSP系统的干扰,提高电磁兼容性能。这些技术从设计层次上保证了高速DSP系统的有效性和可靠性。     

Electromagnetic energy propagation in power electronic converters:toward future electromagnetic integration

Historically, it came about that the analysis and design of the power electronic converter center around currents and voltages in the circuits. During the last decade, the electromagnetic character of power electronic converters became more important due to the noise that the switches generate, and electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards have been put in place to control the electromagnetic noise levels. In this contribution, it is argued that coming to grips with the electromagnetic operation of switch-mode power conversion presents a barrier of knowledge that will have to be crossed in order to achieve future meaningful innovation in switch-mode power conversion. Rigorous electromagnetic analysis using realistic parameters are used to indicate important issues relating fundamental limits and technological paths for future generations of power electronic converters. Electromagnetic integration in three dimensions creates new possibilities to increase power densities     

FDTD and experimental investigation of EMI from stacked-card PCBconfigurations

Stacked-card and modules-on-backplane printed circuit-board geometries are advantageous for conserving real-estate in many designs. Unfortunately, at high frequencies, electromagnetic magnetic interference (EMI) resulting from the nonnegligible impedance of the signal return at the connector may occur. This effective EMI coupling path results in the daughtercard being driven against the motherboard and attached cables, resulting in common-mode radiation. The connector geometry can be modified to minimize the EMI coupling path when high frequencies are routed between the motherboard and daughtercard. Current speeds and printed circuit board (PCB) sizes result in geometries that are of significant dimensions in terms of a wavelength at the upper frequency end of the signal spectrum. The PCB geometries are then of sufficient electrical extent to be effective EMI antennas. The resonant lengths of the EMI antennas may, however, be quite removed from the typical half-wavelength dipole resonances. The finite difference time-domain method can be used to numerically analyze the printed circuit board geometries, determine antenna resonances, and investigate EMI coupling paths. EMI resulting from the stacked-card configuration has been investigated experimentally and numerically to ascertain the EMI coupling path at the bus connector, and EMI antennas