MOVPE生长Hg1—xdCdxdTe薄膜的实验研究

采用金属有机化合物汽相外延法（MOVPE）和多层膜互扩散生长工艺（IMP）在不同的生长条件下生长了许多Hg1-xCdxTe/GaAs(211）薄膜样品，并对样品进行了傅利红外透射（FTIR）和范德堡Hall测量，通过对许多实验数据进行系统的对比分析，总结了薄膜的生长规律，并对这些生长规律作出了理论分析，阐释了薄膜的微观生长机制。     

过渡层对Ge衬底GaAs外延层晶体质量的影响

利用低压金属有机化学汽相淀积(MOCVD)设备在Ge衬底上生长GaAs外延层.通过改变GaAs过渡层的生长温度对GaAs外延层进行了表征,利用扫描电镜(SEM)和X射线衍射仪研究了表面形貌和晶体质量,优化出满足高效太阳能电池要求的高质量GaAs单晶层生长条件.     

基于低温In_xGa_(1-x)P组分渐变缓冲层的InP/GaAs异质外延

采用低温GaAs与低温组分渐变InxGa1-xP作为缓冲层,利用低压金属有机化学气相外延(LP-MOCVD)技术,在GaAs(001)衬底上进行了InP/GaAs异质外延实验。实验中,InxGa1-xP缓冲层选用组分线性渐变生长模式(xIn0.49→1)。通过对InP/GaAs异质外延样品进行双晶X射线衍射(DCXRD)测试,并比较1.2μm厚InP外延层(004)晶面ω扫描及ω-2θ扫描的半高全宽(FWHM),确定了InxGa1-xP组分渐变缓冲层的最佳生长温度为450℃、渐变时间为500s。由透射电子显微镜(TEM)测试可知,InxGa1-xP组分渐变缓冲层的生长厚度约为250nm。在最佳生长条件下的InP/GaAs外延层中插入生长厚度为48nm的In0.53Ga0.47As,并对所得样品进行了室温光致发光(PL)谱测试,测试结果表明,中心波长为1643nm,FWHM为60meV。     

基于MOCVD的InP/GaAs异质外延生长

使用金属有机物气相沉积方法(MOCVD),在GaAs衬底上生长InP外延层.先在GaAs衬底上生长一层低温InP缓冲层,然后再生长InP外延层.通过比较不同缓冲层生长条件下的外延层晶体质量,发现在生长温度为450℃,厚度约15nm的缓冲层上外延所得到的晶体质量最理想;此外,外延层厚度的增加对其晶体质量有明显改善作用.实验在优化生长条件的同时,也考虑了热退火等辅助工艺,最后所获得的外延层的双晶X射线衍射(DCXRD)的ω/2θ扫描外延峰半高全宽(FWHM)值为238.5".     

基于MOCVD的InP/GaAs异质外延生长

使用金属有机物气相沉积方法(MOCVD),在GaAs衬底上生长InP外延层.先在GaAs衬底上生长一层低温InP缓冲层,然后再生长InP外延层.通过比较不同缓冲层生长条件下的外延层晶体质量,发现在生长温度为450℃,厚度约15nm的缓冲层上外延所得到的晶体质量最理想;此外,外延层厚度的增加对其晶体质量有明显改善作用.实验在优化生长条件的同时,也考虑了热退火等辅助工艺,最后所获得的外延层的双晶X射线衍射(DCXRD)的ω/2θ扫描外延峰半高全宽(FWHM)值为238.5".     

生长温度对于Ge衬底上分子束外延生长的InGaAs/GaAs量子阱结构质量的影响

本文研究了斜切割（100）Ge衬底上InxGa1-xAs/GaAs量子阱结构的分子束外延生长（In组分为0.17或者0.3）。所生长的样品用原子力显微镜、光致发光光谱和高分辨率透射电子显微镜进行了测量和表征。结果发现,为了生长没有反相畴的GaAs缓冲层,必须对Ge衬底进行高温退火。在GaAs外延层和InxGa1-xAs/GaAs量子阱结构的生长过程中,生长温度是一个至关重要的参数。文中讨论了温度对于外延材料质量的影响机理。通过优化生长温度,Ge衬底上的InxGa1-xAs/GaAs量子阱结构的光致发光谱具有很高的强度、很窄的线宽,样品的表面光滑平整。这些研究表面Ge 衬底上的III-V族化合物半导体材料有很大的器件应用前景。     

用原子层外延技术生长异质结器件

原子层外延(ALE)是金属有机化合物气相外延生长的一种方式。用这种方法并用单层沉积工艺实现了自限单层超薄外延层的均匀生长。本文介绍了用ALE生长GaAs、AlAs单晶及GaAs/AlGaAs异质结和器件。得到的数据证明了ALE生长超薄膜层的单层均匀性。还讨论了生长速率对反应物流量和温度的依赖关系。对ALE外延层厚度进行解理角(Cleaved corner)透射电镜(TEM)分析,证明沉积过程具有“数字式”特性。ALE法生长的GaAs量子阱的低温光致发光(FL)呈窄线本征发光,其线宽可与用常规MOCVD法生长器件的最佳值相媲美。具有ALE生长有源区的量子阱激光器的阈值电流低至400A/cm~2     

无掩模Si圆柱纳米图形衬底上GaAs的异变外延生长

采用金属有机化学气相沉积方法在无掩模的直径为400nm的圆柱Si(100)图形衬底上外延生长了GaAs薄膜。图形衬底采用纳米压印技术及反应离子刻蚀技术制作而成。运用两步法生长工艺在此图形衬底上制备了厚度为1.8μm的GaAs外延层。GaAs的晶体质量通过腐蚀坑密度和透射电镜表征。图形衬底上的GaAs外延层表面腐蚀坑密度约1×107 cm-2,比平面衬底上降低了两个数量级。透射电镜观测显示大部分产生于GaAs/Si异质界面的穿透位错被阻挡在圆柱顶部附近。     

MBE InGaAs/GaAs外延层晶胞弛豫直接测量的X射线双晶衍射方法

本文采用了以解理面为衍射基面，直接测量水平弛豫的方法测量了InxGa1-xAs（衬底为GaAs，x～0．1）外延层的应变及其弛豫状态．在以解理面为衍射基面的衍射曲线上清楚地观测到了衬底峰与外延峰的分裂．表明当InGaAs层厚度较厚（～2μm）时，InGaAs外延层与衬底GaAs已处于非共格生长状态，同时发现大失配的InGaAs晶胞并没有完全弛豫恢复到自由状态．其平行于表面法线的晶格参数略大于垂直方向上的晶格参数（△a／a～10-3）．并且晶胞在弛豫过程中产生了切向应变．在考虑了切向应变的基础上准确地确定出了InGaAs层的In组分x．     

利用全固态分子束外延方法在Ge(100)衬底上异质外延GaAs薄膜及相关特性表征

利用全固态分子束外延(MBE)方法在Ge(100)衬底上异质外延GaAs薄膜,并通过高能电子衍射(RHEED)、高分辨X射线衍射(XRD),原子力显微镜等手段研究了不同生长参数对外延层的影响.RHEED显示在较高的生长温度或较低的生长速率下,低温GaAs成核层呈现层状生长模式.同时降低生长温度和生长速率会使GaAs薄膜的XRD摇摆曲线半高宽(FWHM)减小,并降低外延层表面的粗糙度,这主要是由于衬底和外延薄膜之间的晶格失配度减小的结果.     

⟨110⟩-oriented GaAs MESFETs

GaAs metal semiconductor field-effect transistors (MESFETs) have been successfully fabricated on molecular-beam epitaxial (MBE) films grown on the off-axis (110) GaAs substrate. The (110) substrates were tilted 6° toward the (111) Ga face in order to produce device quality two-dimensional MBE growth. Following the growth of a 0.4-μm undoped GaAs buffer, a 0.18-μm GaAs channel with a doping density of 3.4×10¹⁷ cm^-3 and a 0.12-μm contact layer with a doping density of 2×10¹⁸ cm^-3, both doped with Si, were grown. MESFET devices fabricated on this material show very low-gate leakage current, low output conductance, and an extrinsic transconductance of 200 mS/mm. A unity-current-gain cutoff frequency of 23 GHz and a maximum frequency of oscillation of 56 GHz have been achieved. These (110) GaAs MESFETs have demonstrated their potential for high-speed digital circuits as well as microwave power FET applications     

Fabrication of depletion-mode GaAs MOSFET with a selectiveoxidation process by using metal as the mask

The n-channel depletion-mode GaAs MOSFETs with a selective liquid phase chemical-enhanced oxidation method at low temperature by using metal as the mask (M-SLPCEO) are demonstrated. The proposed process can simplify one mask to fabricate GaAs MOSFET and grow reliable gate oxide films as well as side-wall passivation layers at the same time. The 1 μm gate-length MOSFET with a gate oxide thickness of 35 nm shows a transconductance of 90 mS/mm and a maximum drain current density larger than 350 mA/mm. In addition, a short-circuit current gain cutoff frequency f_T of 6.5 GHz and a maximum oscillation frequency f _max of 18.3 GHz have been achieved from the 1 μm×100 μm GaAs MOSFET     

Optimization of selective area growth of GaAs by low pressure organometallic vapor phase epitaxy for monolithic integrated circuits

GaAs MESFET device structures have been grown on silicon nitride or silicon dioxide masked 50 and 76 mm GaAs substrates by low pressure organometallic vapor phase epitaxy. Very smooth, featureless morphology and 100 percent selectivity of GaAs islands have been achieved over a range of growth conditions. Optimization of the GaAs p-buffer of the field effect transistor structure has led to improved device performance, including increased breakdown voltage. Device characteristics of the 0.5 μm gate low noise metal semiconductor field-effect transistors fabricated on these islands show good performance and wafer to wafer reproducibility on the second device lot.     

Electron-beam fabrication of GaAs low-noise MESFET's using a new trilayer resist technique

A LO/HI/LO resist system has been developed to produce sub-half-micrometer T-shaped cross section metal lines using e-beam lithography. The system provides T-shaped resist cavities with undercut profiles. T-shaped metal lines as narrow as 0.15 µm have been produced. GaAs MESFET's with 0.25-µm T-shaped Ti/Pt/Au gates have also been fabricated on MBE wafers using this resist technique. Measured end-to, end 0.25-µm gate resistance was 80 ω/mm, dc transconductance gmas high as 300 mS/mm was observed. At 18 GHz, a noise figure as low as 1.4 dB with an associated gain of 7.9 dB has also been measured. This is the lowest noise figure ever reported for conventional GaAs MESFET's at this frequency. These superior results are mainly attributed to the high-quality MBE material and the advanced T-gate fabrication technique employing e-beam lithography.     

Low resistance pd/ge ohmic contacts to epitaxially lifted-off n-type GaAs film

A low resistance PdGe nonalloyed ohmic contact has been successfully formed to epitaxially lifted-off n-type GaAs films. The contact is made by lifting off partially metallized n-type GaAs films using the epitaxial lift-off method and bonding them to metallized Si substrates by natural intermolecular Van Der Waals forces. Low temperature sintering (200°C) of this contact results in metallurgical bonding and formation of the ohmic contact. We have measured specific contact resistances of 5 × 10⁻⁵ Ω-cm₂ which is almost half the value obtained for pure Pd contacts. Germanium forms a degenerately doped heterojunction interfacial layer to GaAs. Our experimental results show that germanium diffuses to the interface and acts as a dopant layer to n-GaAs film surface. Therefore, for epitaxially lifted-off n-type GaAs films, PdGe is a low resistance ohmic metal contact to use.     

A molybdenium source,gate and drain metallization system for GaAs MESFET layers grown by molecular beam epitaxy

Molecular beam epitaxy has been used in a continuous growth procedure to form GeGaAs epitaxial structures that were suitable for MESFET fabrication. Near surface doping profiles were engineered such that low resistance ohmic contacts to the GaAs layer were obtained by subsequently depositing a metal overlayer on the Ge surface. Evaporated Au overlayers yielded specific contact resistances of the order of 10^?6ω cm² without heat treatment. Because the conventional alloying procedure now appeared superfluous, metallurgically non-reactive systems were investigated with a view to constructing GaAs MESFETs with entirely refractory metallizations. Sputtered molybdenum has been evaluated for both the formation of ohmic contacts to the Ge/GaAs layers and rectifying contacts to the GaAs layer. Damage introduced as a result of the sputtering deposition process is the probable cause of non-ideality in the as-prepared Schottky barriers. However, forward bias current-voltage ideality factors of n = 1.07 have been obtained after annealing.     

High-performance GaAs metal insulator semiconductor transistor

Proton bombardment techniques have been used to fabricate GaAs metal insulator semiconductor transistors (MIST's) with good thermal stability and radiation hardened performance. Highly stable insulator layers have been obtained using both single-species (H1+) and multiple-species (H1+, H2+, O+, and OH+) beams. The device processing is compatible with fabrication of GaAs FET devices in monolithic circuits.     

Influence of deep states on CdTe and GaAs metal interface formation

Luminescence and soft x-ray photoemission measurements of clean metal interfaces with (110) surfaces of CdTe from several sources as well as (100) MBE vs (110) LEC GaAs reveal that the quality of the semiconductor can have a major effect on the interface Fermi level stabilization. Crystals with low optical emission from bulk deep levels show reduced state formation at their metal interfaces and improved adherence to the work function model of barrier height. Furthermore, atomic-scale interface chemistry can inhibit the formation of deep traps due to interdiffusion, thereby improving control over barrier formation.     

Design and Performance of X-Band Oscillators with GaAs Schottky-Gate Field-Effect Transistors

The circuit construction and design of an X-band oscillator with a GaAs Schottky-gate FET have been studied. The oscillation characteristics including stability and noise performance have been examined in order to clarify the position of a GaAs FET as a microwave solid-state oscillator device. The experiments have revealed that 1) the GaAs FET simultaneously possesses the most desirable features of both Gunn and IMPATT oscillators, i.e., low bias voltage operation and fairly high efficiency, and 2) it is situated between Gunn and GaAs IMPATT oscillators with respect to noise properties. The results indicate that the GaAs FET oscillator will soon be joining the family of microwave solid-state oscillators as a promising new member.     

Fabrication of GaAs quantum wire structure using metal organic molecular beam epitaxy

GaAs quantum wires (100*20 nm/sup 2/) buried in AlAs layers have been successfully fabricated using metal organic molecular beam epitaxy (MOMBE) for the first time. The underlying growth mechanism is that, under appropriate As/sub 4/ pressure in MOMBE, GaAs preferentially grows only on the sidewalls of the patterned