InGaN/GaN多量子阱纳米线发光二极管制备及研究

用SiO2纳米图形层作为模板在以蓝宝石为衬底的n-GaN单晶层上制备了InGaN/GaN多量子阱纳米线,并成功实现了其发光二极管器件(LED).场发射扫描电子显微镜(FESEM)的测量结果表明,InGaN/GaN多量子阱纳米线具有光滑的表面形貌和三角形的剖面结构.室温下阴极射线荧光谱(CL)的测试发现了位于461 nm...     

High detectivity InGaN-GaN multiquantum well p-n junction photodiodes

InGaN-GaN multiquantum well (MQW) p-n junction photodiodes with semi-transparent Ni-Au electrodes were fabricated and characterized. It was found that the fabricated InGaN-GaN p-n junction photodiodes exhibit a 20-V breakdown voltage and a photocurrent to dark current contrast ratio of /spl sim/10/sup 5/ when a 0.4-V reverse bias was applied. The peak responsivity at 380 nm was 1.28 and 1.76 A/W with a 0.1- and 3-V applied reverse bias, respectively. Furthermore, an internal gain was found from our InGaN-GaN MQW p-n junction photodiodes possibly due to the long-lifetime of GaN based materials. Also, it was found that the low frequency noise of our photodiodes was dominated by the 1/f type noise. For a given bandwidth of 500 Hz, the corresponding noise equivalent power and normalized detectivity D/sup */ were found to be 6.34/spl times/10/sup -13/ W and 4.45/spl times/10/sup 11/ cm/spl middot/Hz/sup 0.5/ W/sup -1/, respectively.     

High-Detectivity Nitride-Based MSM Photodetectors on InGaN–GaN Multiquantum Well With the Unactivated Mg-Doped GaN Layer

InGaN-GaN multiquantum-well (MQW) metal-semiconductor-metal (MSM) photodetectors (PDs) with the unactivated Mg-doped GaN cap layer were successfully fabricated. It was found that we could achieve a dark current by as much as six orders of magnitude smaller by inserting the unactivated Mg-doped GaN cap layer. For MSM photodetectors with the unactivated Mg-doped GaN cap layer, the responsivity at 380 nm was found to be 0.372 A/W when the device was biased at 5 V. The UV-to-visible rejection ratio was also estimated to be around 1.96 times 10³ for the photodetectors with the unactivated Mg-doped GaN cap layer. With a 5-V applied bias, we found that minimum noise equivalent power and normalized detectivity of our PDs were 4.09 times 10^-14 W and 1.18 times 10¹³ cmmiddotHz^0.5W^-1, respectively. Briefly, incorporating the unactivated Mg-doped GaN layer into the PDs beneficially brings about the suppression of dark current and a corresponding improvement in the device characteristics.     

InGaN/GaN multi-quantum-well-based light-emitting and photodetective dual-functional devices

In this study, we fabricated and characterized an InGaN/GaN multi-quantum-well (MQW)-based p-n junction photodetector (PD) for voltage-selective light-emitting and photo-detective applications. The photode-tector exhibits a cutoff wavelength at around 460nm which is close to its electroluminescence (EL) peak position. The rejection ratio was determined to be more than three orders of magnitude. Under zero bias, the responsivity of the device peaks at 371 nm, with a value of 0.068 A/W, corresponding to a 23% quantum efficiency.The overall responsivity gradually rises as a function of reverse bias, which is explained by the enhanced photocarrier collection efficiency.     

Numerical modeling of parasitic barrier formation at the SiGe/Si heterojunction due to p–n junction displacement

The formation and characteristics of a parasitic conduction band barrier located at a SiGe/Si heterojunction have been investigated using a commercial numerical simulator and a simple, three-region model of a heterojunction with a nearby p–n junction. The barrier’s formation is examined as a function of the displacement of the p–n junction from the heterojunction, but also found to depend on the germanium concentration, junction doping and the applied bias. The phenomenon is of interest for understanding the performance of SiGe/Si heterojunction bipolar transistors, where the p–n junction is intentionally displaced from the heterojunction at either the emitter or collector junctions or where boron outdiffusion from the base produces p–n junction displacement. The barrier is found to scale with the germanium mole fraction and to be significantly larger when the heterojunction is displaced into the p-side of the p–n junction. Beyond some minimum separation of the junctions, the barrier height rises with junction displacement and saturates. For a given displacement, the barrier’s height can be suppressed with reverse bias or enhanced by forward bias of the p–n junction. The results of the numerical simulations are compared with those from a simple analytical model as an aid in understanding the barrier’s formation and characteristics.     

背照式AlGaN/GaN基PIN日盲型紫外探测器的研制

利用MOCVD方法在蓝宝石（0001）衬底上生长PIN型AlGaN/GaN外延材料,研制出背照式AlGaN基PIN日盲型紫外探测器,用紫外光谱测试系统和半导体参数测试仪分别测得了器件的光谱响应和I-V特性曲线。测试结果表明,器件的响应范围为260~280 nm,峰值响应出现在270 nm处,在2.5 V偏压下的最大响应...     

Reduction of dark current in AlGaN-GaN Schottky-barrier photodetectors with a low-temperature-grown GaN cap layer

AlGaN-GaN-based UV Schottky-barrier photodetectors with (i.e., sample A) and without (i.e., sample B) the low-temperature (LT) GaN cap layer were both fabricated. It was found that we could achieve a lower leakage current from sample A. Under reverse bias, it was found that sample A showed a dark current as low as 2/spl times/10/sup -11/ A at -5 V. In contrast, the dark current of sample B was at least one order of magnitude larger. With an incident light wavelength of 320 nm and a -1 V reverse bias, the measured responsivity was around 0.03 and 0.015 A/W for samples A and B, respectively.     

Low Dark Current GaN p-i-n Photodetectors With a Low-Temperature AlN Interlayer

GaN p-i-n ultraviolet (UV) photodetectors (PDs) with a low-temperature (LT)-AlN interlayer were proposed and fabricated. It was found that the dark current of such detectors is as small as 28pA even at a high reverse bias of 40 V. Although the high potential barrier at the AlN-GaN interface would slightly reduce the responsivity of PD under low reverse biases, the high UV-to-visible rejection ratio of the PD with an LT-AlN interlayer could be achieved under high reverse biases due to its very low dark current. The rejection ratio of the PD with the LT-AlN interlayer is as large as 735 at the reverse bias of 40 V.     

X波段大功率GaN HEMT的研制

在研制了AlGaN/GaN HEMT外延材料的基础上,采用标准工艺制作了2.5mm大栅宽AlGaN/GaNHEMT。直流测试中,Vg=0V时器件的最大饱和电流Ids可达2.4A,最大本征跨导Gmax为520mS,夹断电压Voff为-5V;通过采用带有绝缘层的材料结构及离子注入的隔离方式,减小了器件漏电,提高了击穿电压,栅源反向电压到-20V时,栅源漏电在10-6A数量级;单胞器件测试中,Vds=34V时,器件在8GHz下连续波输出功率为16W,功率增益为6.08dB,峰值功率附加效率为43.0%;2.5mm×4四胞器件,在8GHz下,连续波输出功率42W,功率增益8dB,峰值功率附加效率34%。     

The heterogenous integration of GaN thin-filmmetal-semiconductor-metal photodetectors onto silicon

The heterogeneous integration of GaN thin-film metal-semiconductor-metal (MSM) photodetectors onto a host substrate of SiO₂-Si is reported. Thin-film GaN photodetectors were separated from the lithium gallate (LiGaO₂) growth substrate using selective etching, and contact bonded onto a SiO₂-Si host substrate. The thin-film MSMs exhibited a dark current of 13.36 pA and an UV photoresponse at 308 nm of 0.11 A/W at a reverse bias voltage of 20 V. This first demonstration of GaN thin-film device integration onto SiO₂-Si using a low-temperature integration process, combined with the advances in GaN material quality on LiGaO₂ substrates, enables the integration of GaN devices with Si circuitry for heterogeneously integrated systems     

InGaN/GaN和InGaN/AlGaN多量子阱中应变对光致发光特性的影响

对蓝宝石衬底上的InGaN/GaN和InGaN/AlGaN多量子阱结构和经激光剥离去除衬底的InGaN/GaN和InGaN/AlGaN多量子阱结构薄膜样品,进行了光致发光谱、高分辨XRD和喇曼光谱测量.PL测量结果表明,相对于带有蓝宝石衬底的样品,InGaN/GaN多量子阱薄膜样品的PL谱峰值波长发生较小的蓝移,而InGaN/AlGaN多量子阱薄膜样品的PL谱峰值波长发生明显的红移;喇曼光谱的结果表明,激光剥离前后E2模的峰值从569.1减少到567.5cm-1.这说明激光剥离去除衬底使得外延层整体的压应力得到部分释放,但InGaN/GaN与InGaN/AlGaN多量子阱结构中阱层InGaN的应力发生了不同的变化.XRD的结果证实了这一结论.     

Nitride-based near-ultraviolet multiple-quantum well light-emitting diodes with AlGaN barrier layers

The In_0.05Ga_0.95N/GaN, In_0.05Ga_0.95N/Al_0.1Ga_0.9N, and In_0.05Ga_0.95N/Al_0.18Ga_0.82N multiple-quantum well (MQW) light-emitting diodes (LEDs) were prepared by metal-organic chemical-vapor deposition. (MOCVD). It was found that the 20-mA electroluminescence (EL) intensity of the InGaN/Al_0.1Ga_0.9N MQW LED was two times larger than that of the InGaN/GaN MQW LED. The larger maximum-output intensity and the fact that maximum-output intensity occurred at a larger injection current suggest that Al_0.1Ga_0.9N-barrier layers can provide a better carrier confinement and effectively reduce leakage current. In contrast, the EL intensity of the InGaN/Al_0.18Ga_0.82N MQW LED was smaller because of the relaxation that occurred in the MQW active region of the sample.     

预应变InGaN/GaN多量子阱发光特性调控研究

为了减弱InGaN/GaN量子阱内的压电极化场,在蓝紫光InGaN/GaN多量子阱激光器结构中采用了预应变InGaN插入层,通过变温电致发光和高分辨X射线衍射测量研究了预应变插入层对量子阱晶体质量和发光特性的影响。实验结果显示,常温下有预应变层的量子阱电致发光谱积分强度显著提高。模拟计算进一步表明,预应变层对量子阱内压电极化场有调制效果,有利于量子阱中的应力弛豫,可以有效减弱量子限制斯塔克效应,有助于提高量子阱的发光效率。     

GaN MSM photodetectors with photo-CVD annealed Ni/Au electrodes

Thin Ni/Au (3/6 nm) bi-layer metal films annealed by photo-chemical vapor deposition (photo-CVD) were investigated. With proper annealing in oxygen by the photo-CVD systems, it was found that the transmittance of the deposited Ni/Au increased from 67 to 85% in the region between 350 and 450 nm. GaN metal-semiconductor-metal (MSM) ultraviolet (UV) photodetectors with photo-CVD annealed Ni/Au contact electrodes were also fabricated. It was found that dark current of the detector became significantly smaller after annealing. With a 1 V applied bias, it was found that we can achieve a photocurrent to dark current contrast ratio of 2.54×10³ from the photodetectors with 600 °C photo-CVD annealed Ni/Au contacts.     

4H-SiC metal–semiconductor–metal ultraviolet photodetectors with Ni/ITO electrodes

Indium–tin-oxide (ITO), Ni/ITO and Ni layers were deposited onto glass and/or SiC substrates by DC sputtering under different deposition conditions. SiC-based metal–semiconductor–metal (MSM) ultraviolet (UV) photodetectors were also fabricated using these materials as contract electrodes. It was found that ITO film deposited without oxygen gas could provide us a better optical property and a better electrical property. It was also found that the dark current of the ITO/SiC MSM UV photodetector was extremely large. Furthermore, it was found that the insertion of a 10 nm Ni layer could significantly reduce the dark current. It was also found that the photo-current to dark current contrast was more than 3 orders of magnitude with a 5 V applied bias for the SiC MSM UV photodetector with 10 nm Ni/90 nm ITO contact electrodes. With an even larger 40 V applied bias, the photo-current to dark current contrast could almost reach 4 orders of magnitude.     

Comparison of GaN and 6H-SiC p-i-n photodetectors with excellentultraviolet sensitivity and selectivity

We fabricated GaN and 6H-SiC p-i-n photodetectors and compared their electrical and optical characteristics. The GaN diodes suffered from significant leakage current of 37 μA/mm² at -5 V, while the SiC diode leakage current was below the noise level at 10 pA/mm² at -20 V. The built-in potentials and the unintentional “i-layer” doping densities were obtained from capacitance-voltage (C-V) measurements. The SiC detectors exhibited a broad spectral response in contrast to the abrupt cutoff observed in the GaN detectors. The peak responsivities of the GaN and SiC photodetectors corresponded to internal quantum efficiencies of 57% at 3.42 eV and 82% at 4.49 eV, respectively. Furthermore, both detectors exhibited excellent visible rejection ratios which is needed for solar-blind applications. The response times at zero bias were 18 and 102 ns for the GaN and SiC detectors, respectively     

Long-wavelength multiple-quantum-well voltage-controlled bistablelaser diodes

We have investigated static and dynamic characteristics of a multiple-quantum-well (MQW) voltage-controlled bistable laser diode at 1.5 μm. Using the quantum confined Stark effect, the absorption coefficient and the absorption band edge of the saturable absorption region are controlled by applied voltage, resulting in easy change of the hysteresis width and the threshold current. Applied voltage from below the current injection regime to the saturable absorption region, typically the reverse bias voltage, allows faster turn-off switching speed due to the carrier sweep-out by the applied electric field, MQW bistable lasers with InGaAs-InP, InGaAs-InGaAsP and InGaAs-InAlAs systems and several kinds of well numbers were fabricated and their threshold current and switching characteristics are compared. A hysteresis width change of about 20 mA was obtained by changing the applied voltage of about 1 V in each case, Less than 100 ps turn-on switching time with injection light of 1-mW peak intensity was obtained. The device can be switched-on by injection light with about 50 nm bandwidth, and the minimum input light switching intensity of less than 10 μW is achieved around the absorption peak wavelength of the saturable absorber. The InGaAs-InAIAs system has the advantage of low voltage bias at the saturable absorber, because the absorption edge is sharper than other materials due to its high conduction band offset. It has a turn-off switching time of less than 100 ps at the applied voltage height of 2.0 V. And also, memory operation with the repetition rate of 2 GHz has been achieved using input light and the applied voltage     

Determination of the direction of piezoelectric field in InGaN/GaN multiple quantum-well structures grown by metal-organic chemical vapor deposition

The direction of the piezoelectric field in InGaN/GaN multiple quantum-well (MQW) structures grown by metal-organic vapor deposition (MOCVD) was determined using excitation-power-density variable photoluminescence (PL). By comparing the excitation-power-density dependence of the shift of the PL peak and the change of the full-width at half-maximum (FWHM) of the peak from an InGaN/GaN MQW structure and an InGaN MQW-based light-emitting diode (LED), the piezoelectric field in the InGaN/GaN MQW structures was unambiguously determined to be pointing toward the substrate. This result helps to identify the surface polarity of the LED wafer as Ga-faced.     

Low-operation voltage of InGaN-GaN light-emitting diodes withSi-doped In0.3Ga0.7N/GaN short-period superlatticetunneling contact layer

InGaN/GaN multiple-quantum-well light-emitting diode (LED) structures including a Si-doped In_0.23Ga_0.77N/GaN short-period superlattice (SPS) tunneling contact were grown by metalorganic vapor phase epitaxy. In_0.23Ga_0.77N/GaN(n⁺)-GaN(p) tunneling junction, the low-resistivity n⁺-In_0.3Ga_0.77 N/GaN SPS instead of high-resistivity p-type GaN as a top contact layer, allows the reverse-biased tunnel junction to form an “ohmic” contact. In this structure, the sheet electron concentration of Si-doped In_0.23Ga_0.77N/GaN SPS is around 1×10¹⁴/cm², leading to an averaged electron concentration of around 1×10²⁰/cm³. This high-conductivity SPS would lead to a low-resistivity ohmic contact (Au/Ni/SPS) of LED. Experimental results indicate that the LEDs can achieve a lower operation voltage of around 2.95 V, i.e., smaller than conventional devices which have an operation voltage of about 3.8 V     

Luminescence properties of blue and green dual wavelength InGaN/GaN multi-quantum well light-emitting diode

Blue and green dual wavelength InGaN/GaN multi-quantum well (MQW) light-emitting diode (LED) has wide applications in full color display, monolithic white LED and solid state lighting, etc. Blue and green dual wavelength LEDs, which consist of InGaN strain-reduction layer, green InGaN/GaN MQW and blue InGaN/ GaN MQW, were grown by metal-organic chemical vapor deposition (MOCVD), and the luminescence properties of dual wavelength LEDs with different well arrangements were studied by photoluminescence and electrolumines-cence. The experimental results indicated that well position played an important role on the luminescence evolvement from photoluminescence to electroluminescence.