微波法合成新型双酚A二苯醚型双马来酰亚胺研究

本文采用微波辐射方法,以顺丁烯二酸酐(MA)和2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)为原料,合成了2,2′-双[4-(马来酰亚胺基苯氧基)苯基]丙烷(BPA-BMI),并通过红外光谱、核磁共振、质谱等对产物结构进行表征.经过正交试验确定了微波法合成BPA-BMI的最佳工艺条件为n(MA):n(BAPP)=2.3:1,催化剂用量为10％(wt％),辐射功率为450W,辐射时间为30min,产率可达67.26％.结果表明:与传统制备双马来酰亚胺的方法相比,微波法不仅可行,并且具有反应时间大大缩短、效率高、操作简单、环境友好等特点.     

N,N′-双[3-(3′,5′-二叔丁基-4′-羟基苯基)丙酰]己二胺的合成新工艺

以 3- (3′,5′-二叔丁基 - 4′ -羟基苯基 )丙酸甲酯 (简称 3,5 -甲酯 )与己二胺为原料 ,有机锡为催化剂 ,二甲苯为溶剂合成了N ,N′ -双 [3- (3′,5′ -二叔丁基 - 4′ -羟基苯基 )丙酰 ]己二胺。通过实验考察了反应温度、催化剂及催化剂用量、反应时间及物料配比等因素对反应的影响。结果表明 ,最佳的反应条件是 :反应温度为 135～ 14 5℃ ,催化剂为有机锡 ,用量为 3,5 -甲酯的 2 % ,反应时间为 3.5h ,3,5 -甲酯与己二胺物质的量比为 2 .10 ∶1。在此条件下 ,收率在 97%以上 ,放大到 10 0 0mL ,收率在 99%以上 ,产品熔点为 16 1～ 16 2℃ ,产品纯度较高 ,通过元素分析、红外光谱分析、核磁氢谱对产品进行了结构表征     

2′-脱氧腺苷-5′-N-[(2S)-2-(3-苯甲酰苯基)-1-氧代丙基]甘氨酸酯的合成

以N-[(2S)-2-(3-苯甲酰苯基)-1-氧代丙基]甘氨酸和2′-脱氧腺苷为原料合成了标题化合物。产物结构经IR、1HNMR、13CNMR和MS确证。实验结果表明,2-(7-偶氮苯并三氮唑)-N,N,N′,N′-四甲基脲六氟磷酸酯(HATU)在该反应中是一种较好的缩合试剂。此外发现,N-[(2S)-2-(3-苯甲酰苯基)-1-氧代丙基]甘氨酸乙酯在皂化反应中会消旋。     

3-氯-2-硝基苯乙腈的合成研究

由2,6-二氯硝基苯与氰乙酸叔丁酯反应制备了2-氰基-2-(3′-氯-2′-硝基苯基)乙酸叔丁酯(1),在对甲苯磺酸催化作用下,由化合物(1)脱羧制备了3-氯-2-硝基苯乙腈。考查了不同反应时间、反应温度及摩尔比对目标产物产率的影响。较佳的合成条件为:n[2-氰基-2-(3′-氯-2′-硝基苯基)乙酸叔丁酯]∶n(对甲苯磺酸.H2O)=1∶0.075,反应时间2 h,反应温度100°C,产物收率可达89%以上。化合物结构经IR、1H NMR、MS进行了表征。     

4-(3′-氯苯氨基)-6-甲氧基喹唑啉类衍生物的合成、表征及抗癌活性研究

以N′-(5-(3-氯丙氧基))-2-氰基-4-甲氧苯基-N,N-二甲基甲脒为原料,经过成环、醚化,合成了4个4-(3′-氯苯氨基)-6-甲氧基喹唑啉类化合物：N-(3′-氯苯基)-6-甲氧基-7-(3-(4-硝基苯氧基)丙氧基)喹唑啉-4-胺、N-(3′-氯苯基)-6-甲氧基-7-(3-(3-硝基苯氧基)丙氧基)喹唑啉-4-胺、4-(3-(4-(3′-氯苯胺基)-6-甲氧基喹唑啉-7-基氧基)丙氧基)-3-甲氧基苯甲醛、3-(3-(4-(3′-氯苯胺基)-6-甲氧基喹唑啉-7-基氧基)丙氧基)-4-甲氧基苯甲醛,收率分别为51.3%、60.3%、85.4%、79.4%。产物的结构经红外光谱、核磁共振氢谱、核磁共振碳谱、质谱和元素分析表征。采用MTT法进行化合物抑制Bcap-37细胞的体外活性测试,结果表明：合成的化合物具有不同程度的抑制Bcap-37细胞的活性, 其中化合物Ιa在10 μmol?L-1浓度下对Bcap-37细胞的抑制率为83.4%。     

3’-[辛基(2-甲基苯基)胺基]-6’-(2-甲基苯基)胺基-螺[异苯并呋喃-1(3H),9’-[9H]呫吨-3-酮的合成

以荧光素为原料经氯化、氨解、烷基化反应合成了性能优良的热敏品染料3’-[辛基(2-甲基苯基)胺基]-6’-(2-甲基苯基)胺基-螺[异苯并呋喃-1 (3H),9’-[9H]呫吨-3-酮,确定了最佳的合成路线,最终产品含量≥97％,在波长550nm处吸收值≤0.1.     

一种新型联苯型多苯氧基聚酰亚胺的合成及其表征

以2,2-双(3-苯基-4-羟基苯基)丙烷(双OPP-A)、对硝基氯苯、无水碳酸钾为基本原料,在冠醚作为相转移催化剂的作用下缩合制得2,2-双[3-苯基-4(4-硝基苯氧基)苯基]丙烷(BPNPOPP);在此基础上,采用水合肼还原得到2,2-双[3-苯基-4(4-氨基苯氧基)苯基]丙烷(BPAPOPP)单体.将其与均苯四甲酸二酐(PMDA)通过缩聚反应、热环化制备了一种联苯型多苯氧基聚酰亚胺.结果表明:缩合制备BPNPOPP,收率达到97.8%以上.还原制备BPAPOPP单体,熔点160.6～161.3℃.此种单体制备的聚酰亚胺玻璃化转变温度为233.2℃,易于加工;热分解温度(质量损失率10%)为503.8℃,具有很好的耐热性能;拉伸强度达到111.8 MPa,断裂伸长率为6.68%,薄膜的热膨胀系数为49.7×10-6K-1,是一种性能优良的材料.     

均苯型共聚聚酰亚胺薄膜的制备及其性能

以2,2′-双[3-苯基-4(4-氨基苯氧基)苯基]丙烷(BPAPOPP)、4,4′-二胺基二苯醚和均苯四甲酸酐为原料,采用两步法共缩聚制备了一系列共聚聚酰亚胺薄膜.采用红外光谱仪、差示扫描量热仪等分析了薄膜的结构,利用静态热机械分析仪分析了薄膜的性能.结果表明:制备的聚酰亚胺薄膜具有较低的玻璃化转变温度;随着BPAP...     

三甘醇双[3-(3′,5′-二叔丁基-4′-羟基苯基)丙酸]酯的合成与表征

以3—(3′,5′—二叔丁基—4′—羟基苯基)丙酸甲酯和三甘醇为原料,有机锡为催化剂,通过酯交换法在甲苯作溶剂的条件下合成了三甘醇双[3—(3′,5′—二叔丁基—4′—羟基苯基)丙酸]酯：通过实验考察了反应温度、催化剂及催化剂用量、反应时间及物料配比等因素对反应的影响。结果表明,最佳反应条件为：反应温度120～125℃,催化剂为有机锡,催化剂用量0．25g,反应时间3．5h,3—(3′,5′—二叔丁基—4′—羟基苯基)丙酸甲酯与三甘醇物质的量比为2．10：1,在此条件下,产物收率在94％以上,产品熔点为106-107℃,通过元素分析、红外光谱分析、核磁氢谱对产品结构进行了表征。     

柠檬黄合成新工艺

以苯肼-4-磺酸和顺丁烯二酸二甲酯为原料,经缩合、水解和空气氧化得到中间体1-(4′-磺酸基苯基)-3-羧基-5-吡唑啉酮,然后与对氨基苯磺酸的重氮盐偶合而得柠檬黄.对合成的1-(4 ′-磺酸基苯基)-3-羧基-5-吡唑啉酮结构进行了表征,对反应机理进行了讨论.产品柠檬黄经检测符合GB 4481.1-2010要求.     

A positive‐working photosensitive polyimide based on thermal cross‐linking and acidolytic cleavage

A novel positive‐working photosensitive polyimide (PSPI) based on a poly(hydroxyimide) (PHI), a crosslinking agent having vinyl ether groups, and a photoacid generator (PAG) was prepared. The PHI as a base resin of the three‐component PSPI was synthesized from 4,4′‐oxydiphthalic anhydride and 2,2′‐bis(3‐amino‐4‐hydroxyphenyl)hexafluoropropane through ring‐opening polymerization and subsequent thermal cyclization. 2,2′‐bis(4‐(2‐(vinyloxy)ethoxy)phenyl)propane (BPA‐DEVE) was used as a vinylether compound and diphenyliodonium 5‐hydroxynaphthalene‐1‐sulfonate was used as a PAG. The phenolic hydroxyl groups of the PHI and the vinyl ether groups of BPA‐DEVE are thermally crosslinked with acetal structures during prebake step, and the crosslinked PHI becomes completely insoluble in an aqueous basic solution. Upon exposure to UV light (365 nm) and subsequent postexposure bake (PEB), a strong acid generated from the PAG cleaves the crosslinked structures, and the exposed area is effectively solubilized in the alkaline developer. The dissolution behavior of the PSPI containing each 11.5 wt % of BPA‐DEVE and of the PAG was studied after UV exposure (365 nm) and PEB. It was found that the difference in dissolution rates between exposed and unexposed areas was enough to get high resolution. A fine positive pattern with a resolution of 5 μm in a 3.7‐μm‐thick film was obtained from the three‐component PSPI. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites

A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m⁻¹ K⁻¹ for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μm were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass‐transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Novel positive‐type photosensitive polyimide with low dielectric constant

A novel positive‐type photosensitive polyimide (PSPI) with a low dielectric constant was developed. The PSPI system was composed of soluble block PI (Bco‐PI) with a hydroxy group and diazonaphthoquinone as a photoreactive compound. The base Bco‐PI was prepared by a direct one‐pot polycondensation of 2,2‐bis(3‐amino‐4‐hydroxy‐phenylhexafluoropropane), 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane, and cyclohexanetetracarboxylic dianhydride in the presence of a γ‐valerolactone and pyridine catalyst system using N‐methyl‐2‐pyrrolidone as the solvent. The film of Bco‐PI was colorless and transparent, both important factors for a PSPI. Photosensitive soluble block PI (Bco‐PI), containing 20 wt % ester of 2,3,4‐trihydroxybenzophenone with 1,2‐naphthoquinone‐(2)‐diazide‐5‐sulfonic acid (NT200), showed a sensitivity of 350 mJ/cm² and a contrast of 1.20 when it was exposed to UV light, followed by development with 5% tetramethylammonium hydroxide aqueous solution at room temperature. The estimated optical dielectric constants of the PIs with and without NT200 were 2.68 and 2.75, respectively. These values were significantly lower than those of conventional aromatic PIs, such as Kapton film (50EN). © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 15–21, 2005     

Effects of UV exposure and thermal history on properties of a preimidized photosensitive polyimide

The structure and properties of a preimidized photosensitive polyimide (Probimide PSPI, a copolyimide of benzophenonetetracarboxylic dianhydride with alkyl groups substituted aromatic diamines) were studied with variations of UV exposure energy and bake temperature by means of wide angle X-ray diffraction, dynamic mechanical thermal analysis, stress-strain analysis, and residual stress analysis. The X-ray diffraction patterns patterns indicate that the PSPI is amorphous in the solid state. The T_g was 378°C ～ 410°C, depending upon the thermal history over the range of 350°C ～ 400°C. At the glass transition region, the dynamic storage modulus E′ was very sensitive to both i-line exposure energy and thermal history. However, the mechanical stress-strain behavior at room temperature was primarily dependent on the thermal history. The mechanical properties were 2.6 GPa ～ 2.9 GPa Young's modulus, 131 MPa ～ 168 MPa tensile strength, 10% ～ 12% yield strain, and 16% ～ 74% elongation at break, depending upon the baking or annealing. These dynamic and static mechanical properties indicate that on the PSPI backbone, crosslinks are formed thermally as well as photochemically. The thermal crosslinks might be formed through thermal liberation of the labile alkyl groups of aromatic diamine moieties and subsequent coupling of the radicals. The thermal degradation was also evidenced in the mechanical properties degraded by baking above 375°C or annealing above 350°C. In addition, during baking and cooling, the residual stress was dynamically measured on Si wafers as a function of temperature. The stress at room temperature was 48 MPa ～ 52 MPa for the PSPI films baked at 350°C or 400°C, regardless of i-line exposure.     

Effects of reactive end-capper on mechanical properties of chemical amplified photosensitive polyimide

Photosensitive polyimide (PSPI) was synthesized and characterized to replace the conventional polyimide buffer layer because direct patterning with PSPI could reduce the processing procedure to the half. Since PSPI should be dissolved in alkaline aqueous solution and have good mechanical properties after imidization, low molecular weight of PSPI was synthesized with reactive end-capper, which could extend the chain length of PSPI during imidization. Therefore norbornene end-capped PSPI precursor was synthesized with various 5-norbornene-2,3-dicarboxylic anhydride (NDA) content.Although molecular weight of PSPI decrease with increasing NDA content, the elongation at break and the glass transition temperature (T_g) of PSPI films imidized at 300 °C increased with increasing NDA content. On the other hand, elongation at break of PSPI films imidized at 350 °C decreased but T_g of those increased with increasing NDA content. Above T_g, thermal expansion coefficient decreased dramatically by introducing NDA end-capper. From mechanical and thermal properties of PSPI, it appears that low molecular weight of PSPI can be chain-extended and crosslinked during imidization.     

喹啉盐与吡啶盐花青染料分子酸致变色行为的研究

花青染料结构上的特点是共轭链上带有吸电子和给电子基团,色泽大多呈红、橙红色且摩尔吸光度大。由于吸电子和给电子基团均含有氮原子,对质子很是敏感,具有很好的酸致变色特性。当外来物种的侵入改变吸、供电子基团的电子结构后,往往改变了这种吸收光能的性质从而达到光开关的作用。本文分别研究了吡啶盐花青染料与喹啉盐花青染料分子以及在βˉ环糊精包络后酸致变色行为的变化。结果表明这类分子经βˉ环糊精包络前、后均具有较好的酸致变色性能。     

Modification of negative auto‐photosensitive polyimide

This article describes the preparation of a kind of auto‐photosensitive polyimide (PSPI) that contains organo‐silicone moiety in its main chain. A group of novel auto‐photosensitive polyimides were prepared based on the aromatic diamine monomers and 3,3′,5,5′‐benzophenontetracarboxylic dianhydride (BTDA) by the method of solution polycondensation at room temperature and imidized at a high temperature. The properties of PSPIs, such as ultraviolet (UV) absorption, electric and adhesion properties, and moisture absorption, were characterized by UV analysis, a dielectric constant detector, and so on. The relationship between the structure and properties of PSPIs is discussed. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 943–947, 2000     

Synthesis and characterization of novel negative-working aqueous base developable photosensitive polyimide precursors

Through molecular designing, three poly(amic esters) (PAEs) have been synthesized from pyromellitic dianhydride (PMDA), 2,2′-bis-(3-amino-4-hydroxyphenyl) hexafluoropropane (BisAPAF), 4,4′-diaminodiphenyl ether (4,4′-ODA) and 2-hydroxyethyl methacrylate (HEMA). Due to the introduction of photosensitive acrylate groups and aqueous base soluble phenolic hydroxyl groups in the backbone, these poly(amic esters) can be used as the precursors of negative-working, aqueous base developable photosensitive polyimides (PSPIs). These poly(amic esters) were prepared by direct polymerization by using phenyl phosphonic dichloride (PPD) as an activator. The inherent viscosities of these polymers were 0.20 (dL/g). Their structures were characterized by Fourier transform infrared spectroscopy (FTIR) and ¹H NMR. In order to improve the photolithographic performance of these PSPIs, different photosensitizers, photoinitiators and a crosslinker have been added in the PSPI formulations. Among them, the Michler's ketone (MK)/tribromomethyl phenyl sulfone (TBPS) system gave the best results. Using a 2.38 wt% aqueous TMAH solution as a developer, patterns with a resolution of 10 μm were obtained from these PSPI formulations. In addition, the effects of the molecular structure of the precursors and the concentration of developer on the photosensitivity of the PSPI formulations were also discussed.     

Main-chain photosensitive polyamic acids using alkaline aqueous solution as developer

In order to develop photosensitive polyimides (PSPIs) imaged in alkaline aqueous solution, a photosensitive diamine and relevant polymer containing conjugated double bonds in the main chain have been synthesized. The photosensitive characteristics and thermal stability of the polymers were investigated. These polymers possess good thermal stability and sensitivity to UV irradiation, and could be used to form a PSPI resist using alkaline aqueous solution as developer. © 1999 Society of Chemical Industry     

紫外光对PP蠕变行为的影响

通过对聚丙烯(PP)施加紫外光的方法研究了紫外光对其蠕变行为的影响,利用蠕变性能测试、GPC、XPS、PALS、SEM等手段考察了紫外光作用下的PP蠕变行为及其失效机理。实验结果表明:紫外光能加速PP的蠕变失效,其失效机理与辐照强度有关;短时间失效主要是由紫外光引起的分子链段的活性变化所致,长时间作用下的失效,主要是紫外光引起的老化导致材料强度的削弱所致;另外,对不同种类的PP,在相同的外部条件(下温度、应力和紫外光,)其失效速率与结构和分子量无关,只与该温度下材料的屈服强度有关,屈服强度越高抗,蠕变能力越好。