不同水辅助方法对高温合金飞秒激光逐层逐圈切孔质量的影响

主要研究了水基和水膜辅助这两种不同水辅助方式对飞秒激光高温合金逐层逐圈切孔质量的影响,对比分析了不同水辅助方式下激光脉冲重复频率变化对微孔出入口孔径、锥度、内壁形貌和内壁粗糙度的影响。实验结果表明:水基和水膜辅助均可以改善飞秒激光制造微孔的质量,微孔锥度减小,微孔内壁粗糙度减小,且水基辅助的改善效果更明显。当激光脉冲能量为80 μJ,脉冲重复频率在100 kHz左右时,水基辅助飞秒激光制孔可以获得较好的孔内壁质量,同时相比于空气中孔的锥度减少18.04%。随着激光脉冲重复频率的增加,两种水辅助条件下微孔的出入口孔径和锥度均先减小后增大,其中水基辅助下的微孔内壁粗糙度数值变化不大,水膜辅助下微孔内壁粗糙度数值不断增加。实验结果为优化水辅助飞秒激光制孔工艺提供了参考。     

CO/sub 2/ laser processing of alumina (Al/sub 2/O/sub 3/) printed circuit board substrates

We report the results of an investigation of the laser-material interaction processes involved in laser drilling of alumina, through the use of an enhanced peak power (2.5 kW) CO/sub 2/ laser and novel temporal pulse formats. Peak power was varied from 30 W to 2 kW for pulses of constant energy to observe the effect produced on scribe depth. High-speed videography of hole formation has been combined with microscopic analysis to investigate the key processes involved in laser processing of alumina. Plasma screening was observed for short, high peak power laser pulses, and optimal scribing was achieved in the weakly plasma absorbing regime. A new processing technique for scribing alumina has been developed, which exploits the fast response of the laser to produce novel temporal pulse shapes, which can be modified to generate cleaner holes. Scribe speeds of up to 280 mm/spl middot/s/sup -1/ were obtained for scribe holes >200 /spl mu/m deep and 150 /spl mu/m apart, with no material plugging the hole, in 0.635-mm-thick 96% alumina.     

飞秒激光制备表面微纳结构数值模拟与实验研究北大核心CSCD

微纳米尺度的表面结构在表面工程中有着许多特殊的性能和应用,为了研究飞秒激光制备不锈钢表面微纳结构的机理,基于经典双温模型理论对飞秒激光烧蚀304不锈钢的过程进行了数值模拟计算。经过计算得到了不同激光能量密度、不同烧蚀深度处电子与晶格系统温度的演化规律,确定了飞秒激光单脉冲作用下的烧蚀阈值,通过数值模拟得到飞秒激光烧蚀不锈钢只发生在材料的表面,对内部的材料影响很小。最后使用飞秒激光微纳加工系统在不锈钢表面制备了微纳结构,多边形微孔结构保持了高质量的边缘形貌,在孔的内壁出现了周期性结构。     

飞秒激光旋切不锈钢微孔实验研究

为了解决飞秒激光高脉冲能量冲击打孔中时存在微裂纹等问题,提出了飞秒激光旋切加工方法。本文利用脉宽为120 fs的飞秒激光,选择0.5 mm厚度的304不锈钢进行旋切打孔实验。实验研究了激光旋切加工中离焦量和光楔的相对偏转角对孔直径的影响,以及激光离焦量对微孔锥度的影响。结果表明,随着离焦量的增大,孔径增大,同时锥度会减小后增加,当离焦量为0时,锥度最小为3.5°;微孔直径随之双光楔相对转角的增大而增大。此外实验发现冲击打孔孔壁出现微裂纹而旋切微孔的孔壁出现了纳米周期性条纹。     

多脉冲飞秒激光烧蚀铝靶动态特性研究

利用时间分辨阴影图研究了脉冲能量在200微焦的多脉冲飞 秒激光烧蚀铝靶的动态过程、并使用 扫描电镜研究了靶材表面烧蚀区域的形貌特征。时间分辨阴影图的记录结果表明,在不同时 间延迟条件 下,飞秒激光烧蚀铝靶形成的冲击波体积和喷射物的空间分布均随着脉冲个数的增加而发生 不同程度的变 化,尤其是单脉冲烧蚀情况下在1ns延时阴影图中观察到的近同心圆条纹会随着脉冲数目增 加逐渐变得模 糊乃至消失。烧蚀区的电子扫描显微镜图像清楚地揭示出烧蚀过程中伴随有液态铝的产生, 其溅射凝固后 在靶材表面形成小球和细丝状微纳结构。实验结果进一步证实了由前序脉冲烧蚀导致的铝靶 表面结构的改 变会对后继脉冲的烧蚀产生显著影响,从而使多脉冲烧蚀表现出明显不同于单脉冲烧蚀的特 性。这些结果 对飞秒激光脉冲沉积薄膜、直写生成表面微结构等应用的工艺参数优化具有很好的指导意义 。     

Self-focusing during femtosecond micromachining of silicate glasses

Many recent investigations of micromachining with lasers, in vacuum and in ambient air environments, have demonstrated the improvements possible when using femtosecond-duration laser pulses compared with long laser pulses. There are obvious practical advantages for rapid micromachining in ambient air conditions. However, the maximum laser intensity and repetition rate are then eventually limited by the avalanche breakdown and nonlinear effects in the air through which the focused laser beam must propagate both outside the work piece and within the structure that is being machined. This paper investigates these limits in femtosecond deep hole drilling at high laser intensities in silicate glasses. In particular, it shows how nonlinear optical effects, particularly self-focusing, can dramatically affect hole shape and the rate of penetration during deep hole drilling. The experiments described here demonstrate how nonlinear Kerr focusing of femtosecond laser pulses occurs during propagation of intense femtosecond laser pulses through the atmosphere within the machined channel at powers levels significantly below the critical power for self-focusing in ambient air.     

飞秒激光制备阵列孔金属微滤膜

选用不锈钢、铜和铝三种金属薄膜作为实验材料,厚度10~50μm.对不锈钢、铜和铝三种金属薄膜进行飞秒激光加工,研究了所形成的微纳米孔直径与飞秒激光加工参数的关系.结果表明,飞秒激光加工的微孔直径随单脉冲能量和脉冲数的平方根的增大而增大.不锈钢薄膜适于飞秒激光制作金属微孔膜,在25μm厚的不锈钢薄膜上制备了大面积阵列微孔,孔直径为2.5~10μm,孔间距为10~50μm.与传统烧结金属微孔过滤膜比较,飞秒激光制备阵列微孔金属膜具有膜孔尺寸均匀一致、直通孔形、膜孔尺寸和间距可控等特点,可获得较高的孔隙率,有利于提高透过水通量.     

Comparison of laser-wavelength operation for drilling of via holes in AlGaN/GaN HEMTs on SiC substrates

By using a frequency-tripled Nd:YVO₄ laser source (355 nm) for drilling through-wafer via holes in SiC substrates, we can reduce the surface contamination and achieve better smoothness inside the via holes compared to use of the more common 1064-nm Nd:YVO₄ laser. The sheet and contact resistance of AlGaN/GaN HEMT layers grown on SiC substrates were similar after formation of vias by 355-nm laser drilling to those of the undrilled reference sample. By sharp contrast, 1064-nm laser drilling produces significant redeposition of ablated material around the via and degrades the electrical properties of the HEMT layers.     

AlN陶瓷的飞秒激光表面加工及制孔应用

采用飞秒激光对AlN陶瓷进行表面加工实验,分析了激光能量密度和扫描速度对加工表面形貌和尺寸的影响,优选出兼顾加工质量与效率的工艺参数区间,即能量密度10～14 J/cm2,扫描速度20～30 mm/s.基于此,以螺旋扫描轨迹于AlN陶瓷上进行制孔应用,成功实现了无崩边及微裂纹等缺陷的圆孔、方孔及跑道孔加工.该研究验证了飞秒激光加工高质量多孔型的可行性,推动了硬脆材料激光制孔技术在半导体功率器件领域的应用.     

硅熔体钠系造渣除硼

造渣精炼法作为除硼的重要手段之一具有发展潜力。本文以Na2CO3–SiO2为造渣剂对冶金硅料进行精炼除硼研究,探讨了钠系造渣剂的除B机理,并研究了Al2O3的添加量对钠系造渣剂除B效果的影响,结果表明,添加适量的Al2O3可提高造渣剂的热稳定性,维持造渣剂的碱度,达到提高除B效率的目的。     

Growth of CsLiB6O10 thin films on Si substrate by pulsed laser deposition using SiO2 and CaF2 as buffer layers

CsLiB₆O₁₀ (CLBO) thin films are grown on Si (100) and (111) substrates using lower index SiO₂ and CaF₂ as buffer layers by pulsed KrF (248 nm) excimer laser ablation of stoichiometric CLBO targets over a temperature range of 425 to 725°C. A CaF₂ buffer layer is grown on Si by laser ablation while SiO₂ is prepared by standard thermal oxidation. From extended x-ray analysis, it is determined that CaF₂ is growth with preferred orientation on Si (100) at temperatures lower than 525°C while on Si (111) substrate, CaF₂ is grown epitaxially over the temperature range; this agrees well with observed reflection high energy electron diffraction patterns. X-ray 2θ-scans indicate that crystalline CLBO are grown on SiO₂/Si and CaF₂/Si (100). Analysis of reflectance spectra from CLBO/SiO₂/Si yields the absorption edge at 182 nm. Surface roughness of the CaF₂ and CLBO/CaF₂/Si film are 19 and 15 nm, respectively. This relatively rough surface caused by the ablation of wide bandgap CaF₂ and CLBO limits the application of CLBO for waveguiding measurement.     

Laser Drilling of Copper Foils for Electronics Applications

Single pulse drilling of copper foils and copper-coated dielectric circuit board materials, relevant to applications in micro-electronics packaging, has been investigated here using an enhanced peak power CO ₂-laser. The plasma generated during copper laser ablation, under these conditions, has been found to be self-extinguishing once the copper has been punched through, and does not materially impact the process. The analysis of the undercut formation in the copper coated laminates illustrated a direct link with the energy delivered to the dielectric after the copper has been laser ablated. Holes with zero undercut were obtained by the use of an acousto-optic modulator, used as a pulse shutter, to control the energy delivered to the dielectric. For unmodulated laser pulses, holes with zero undercut were obtained when drilling copper foils 35-mum thick. In general, when drilling copper-coated dielectrics with unmodulated pulses, holes with low undercut were obtained for peak powers <1.2 kW. However, the stochastic nature of copper drilling dominates the process in this regime. At higher peak powers (up to 1.8kW), a yield of 100% holes in copper is obtained, but this also results in significant undercut     

Rapid consolidation of Ba0.6K0.4BiO3 into superconducting shapes

A rapid consolidation method is described for the superconducting compound Ba_0.6K_0.4BiO₃(BKBO). The starting material consists of phase pure BKBO powder that is cold pressed into the desired shape and sintered at 450°C in oxygen. A one step, quasi-isostatic consolidation is then used to densify the preform to approximately 90% theoretical density. The preform is oxygen annealed after consolidation. The resulting BKBO shape is phase pure and superconducting. This method is ideal for the production of superconducting shapes that can be used for sputtering and laser ablation targets.     

超快激光辐照诱导金属钛的变化

为实现对超快激光诱导金属钛改变趋势的定性控制及材料改变范围的定量控制, 开展了飞秒和皮秒脉冲激光分别与金属钛烧蚀的对比实验研究。随后使用激光扫描共聚焦显微镜、X射线光电子能谱和透射电子显微镜分别就激光脉冲时间宽度变化对被烧蚀金属钛的表面形貌与烧蚀深度、化学成分、微结构状态的影响规律进行了分析。研究发现: 随着激光脉冲时间宽度从飞秒增加到皮秒量级, 被烧蚀金属钛的表面形貌质量逐渐变差, 最终烧蚀产物的化学成分愈加复杂, 微结构状态的无定形化程度也随之增加。最终认为伴随激光脉冲时间宽度增加, 金属钛中热累积效应的增强而造成被烧蚀材料内部更为严重的热与机械损伤是导致上述实验现象产生的主要原因。     

氮气或氧气气氛退火的氧化铪材料电荷泄漏情况研究

本文中, 使用开尔文探针显微镜,研究了不同退火气氛(氧气或氮气)情况下氧化铪材料的电子和空穴的电荷保持特性。与氮气退火器件相比,氧气退火可以使保持性能变好。横向扩散和纵向泄露在电荷泄露机制中都起了重要的作用。 并且,保持性能的改善与陷阱能级深度有关。氮气和氧气退火情况下,氧化铪存储结构的的电子分别为0.44 eV, 0.49 eV,空穴能级分别为0.34 eV, 0.36 eV。 最后得到,不同退火气氛存储器件的电学性能也与KFM结果一致。对于氧化铪作为存储层的存储器件而言,对存储特性的定性和定量分析,陷阱能级,还有泄漏机制研究是十分有意义的。     

紫外光激光加工盲孔的工艺研究

紫外光(UV)激光因波长短、能量大、加工精度高等优点,被越来越多地应用到PCB微孔制作工艺中。文章研究了UV激光加工φ200μm的盲孔,通过正交试验分析了激光功率、加工速度、激光频率和Z轴高度等各因素与钻孔深度之间的关系,且获得了UV激光制作一阶与二阶盲孔的最佳工艺参数和方法。研究结果表明,钻孔深度随着激光功率和加工速度的增大而增大,而激光频率的增加使钻孔深度减小。     

晶体硅片上激光打孔的研究

背面接触太阳电池越来越多地被人们关注,这种电池增加了使用激光器在硅片上打孔工艺。选用了半导体激光器作为光源在晶体硅片上进行打孔实验。通过调节激光器的功率、离焦量、脉冲重复频率等参数并分析其对打孔的影响。在激光打孔后,对硅片使用显微镜测试来分析打孔大小、形貌和损伤区,并优化打孔的参数。通过实验证实孔的入孔直径和出孔直径都随激光能量的增大而增大。随着离焦量的增大,出孔直径先增大后减小,且出孔直径越大时孔附近的破坏区域越小。脉冲重复频率的变化由于影响激光能量而影响孔径。另外,脉冲重复频率过大时,激光能量仍然比较大,但却打不穿硅片。     

超快激光制孔辅助吹气优化的仿真与实验研究

同轴吹气结构辅助吹气对飞秒激光深孔加工效率有着重要影响,但在加工过程中存在排渣效果较差等情况。为了提升排渣能力,采用ANSYS CFD软件分别仿真了同轴吹气、旁轴吹气以及双路吹气的流场分布,并设计双路辅助吹气实验平台,进行了理论分析和实验验证,取得了微孔内部及周围的动态流场和流速矢量分布,以及同轴、旁轴和双路吹气结构辅助下微孔加工后孔口形貌。结果表明,双路辅助吹气不但可以提升加工效率,同时也有助于工件表面洁净度的提升,对飞秒激光高效深孔加工的实现有着重要意义。     

飞秒激光加工SiC/SiC复合材料厚板的孔型特征研究

为了探究飞秒激光加工SiC/SiC复合材料厚板的孔型特征, 采用光束同心圆填充扫描方式对厚度为4mm的SiC/SiC复合材料进行制孔实验, 分析了飞秒激光加工参数对入口直径、孔深、锥度等孔型特征的影响规律和影响机理。结果表明, 脉冲能量、重复频率、线重合度以及扫描速率对小孔入口直径影响较小, 但对孔深和锥度影响较大; 上述实验参数与光束扫描面积内的能量密度密切相关, 小孔锥度随能量密度增大而减小, 小孔深度则反之; 当采用最大脉冲能量130μJ、最大重复频率100kHz、最小扫描速率100mm/s、最大线重合度77%以及最小进给量0.1mm时, 小孔锥度达到最小值12.38°; 上层材料对光束的遮挡以及排屑困难导致深孔加工锥度不易控制。该研究可以为今后SiC/SiC超快激光制孔应用提供参考。     

高频飞秒激光对铜片烧蚀过程热弛豫现象研究

研究了铜片在不同能量密度的单脉冲飞秒激光下烧蚀的结果。 将飞秒激光烧蚀实验的结果结合双温模型在有限差分法下模拟出的数据图,从而研究不同激光能量密度与烧蚀间的联系。飞秒激光的烧蚀过程属于非平衡烧蚀,按照模拟出的数据,对铜片烧蚀过程中表面电子温度及晶格温度有了直观的认识,进而进行研究,得出整个激光烧蚀中热弛豫规律。 在不同能量密度的飞秒激光烧蚀下对电声相互作用的研究,其模拟结果有利于找出能量密度与飞秒激光烧蚀的关联,而实验图进一步表明了提升飞秒激光能量密度与加工铜材料的加工效率以及加工质量之间的意义。综合以上分析,能够得出随着飞秒激光能量密度的增加,飞秒激光烧蚀期间材料的热弛豫过程加长,烧蚀强度有所增加,材料加工后得出形貌质量提高,其对于飞秒激光烧蚀材料的研究具有很大意义。