基于ADSP2181的实时语音采集与处理板的原理与组成

把ＰＣ机接口技术与ＤＳＰ芯片技术相结合,设计了一块实时语音采集与处理板。由于采用了具有３０ｎｓ指令周期的ＡＤＳＰ２１８１芯片及专用的Ａ／Ｄ,Ｄ／Ａ芯片,本板能够对多种语音算法如Ｇ７２８,Ｇ７２９,Ｇ７２３,ＭＰＥＧ音频等算法实现实时编解码处理。由于这块板对外具有灵活方便的数字接口,它也可用于其他高速数字信号采集与处理应用的场合。     

普通RAM芯片与高速A／D及计算机接口技术

本文提出一种使用普通ＲＡＭ芯片与高速Ａ／Ｄ采集芯片、计算机接口完成高速数据采集的技术与实现。     

多年合作成果初显DBM与泰克合作开发出Siqe芯片

泰克(Tektronix)与IBM自1996年就建立的合作关系最近开始结出了令人瞩目的成果，双方已经成功地研制出新一代面向高速测试和测量设备的SiGe(硅锗)芯片。     

16位A／D转换器ADS7805与80C196单片机的接口

本文介绍了１６位的高速Ａ／Ｄ转换器ＡＤＳ７８０５芯片，并从硬件连接和软件设计两个方面讨论了该芯片与１６位单片机８０Ｃ１９６的接口方法。     

高性能语音芯片TC8830AF的应用一例

该文比较详细地介绍了语音芯片ＴＣ８８３０ＡＦ的性能，提出卫种利用ＴＣ８８３０ＡＦ主意芯片的主意录放卡。     

一种基于FIFO芯片PCI总线插卡的设计方法

ＦＩＦＯ芯片在众多的数据处理领域得到了广泛的应用。它在ＰＣＩ总线插卡设计中的应用,进一步提高了数据的传输速度与效率。基于ＦＩＦＯ芯片实现ＰＣＩ插卡。从硬件上解决了数据高速交换中频繁调用系统中断的问题,对ＰＣＩ接口的应用与推广大有益处。     

基于Neuron芯片的远程数据采集装置的设计

介绍了Ｎｅｕｒｏｎ和ＭＡＸ１８６芯片后，分析了ＭＡＸ１８６的数据采集过程，叙述了基于Ｎｅｕｒｏｎ芯片的远程数据采集装置的设计原理和实现细节。     

单片机与DSP结合的dsPIC芯片

介绍一款结合16位单片机控制特点和DSP高速运算优点的新型芯片——dsPIC，对比分析它与PIC16F87X系列单片机之间结构功能的差异。     

外加FIFO与PCI总线控制器S5933接口的实现

介绍了外加FIFO芯片在基于PCI总线的高速数据采集系统中的应用，实现了外加FIFO与PCI总线接口芯片S5933的接口，并给出了详细的电路设计示例和程序设计概要。     

一种基于FIFO芯片PCI总线插卡的设计方法

FIFO芯片在众多的数据处理领域得到了广泛的应用。它在PCI总线插卡设计中的应用 ,进一步提高了数据的传输速度与效率。基于FIFO芯片来实现PCI插卡 ,从硬件上解决了数据高速交换中频繁调用系统中断的问题 ,对PCI接口的应用与推广大有益处。     

高速雷达数据采集系统的FPGA设计

高速雷达数据采集系统的设计方法。该系统由FPGA芯片完成各芯片之间的逻辑控制,具有设计灵活、结构简单、实时性高、可靠性高等优点。     

应用于工业长距离实时控制的高速接口设计

工业实时控制中大量的数据传输和远端控制对数据传输速度提出了极高的要求,本文提出了一种以高速串／并转换器件ＩＭＳ Ｃ０１１为核心的可满足工业实时控制的高速接口电路,数据传输速率在使用光缆时可达２０Ｍｂｉｔｓ／Ｓｅｃ,本文以此接口电路为依据,实现了工业两相流测量过程层析成象系统（电阻层析成象系统和电磁层析成象系统）的连续控制和数据采集,获得较高的数据采集速率。     

PCI Express(下一代内部互联技术)在嵌入式系统中的应用

本文从目前应用的需要出发,阐明了PCIExpress连接技术出现的必要分析了;PCIExpress连接技术的特性;并把它与PCI总线技术进行比较,给出其在嵌入式系统中的应用拓扑结构图。最后描述了目前各芯片厂商针对PCIExpress连接技术提供的不同芯片。     

A high speed multi-level-parallel array processor for vision chips

This paper proposes a high speed multi-level-parallel array processor for programmable vision chips.This processor includes 2-D pixel-parallel processing element(PE)array and 1-D row-parallel row processor(RP)array.The two arrays both operate in a single-instruction multiple-data(SIMD)fashion and share a common instruction decoder.The sizes of the arrays are scalable according to dedicated applications.In PE array,each PE can communicate not only with its nearest neighbor PEs,but also with the next near neighbor PEs in diagonal directions.This connection can help to speed up local operations in low-level image processing.On the other hand,global operations in mid-level processing are accelerated by the skipping chain and binary boosters in RP array.The array processor was implemented on an FPGA device,and was successfully tested for various algorithms,including real-time face detection based on PPED algorithm.The results show that the image processing speed of proposed processor is much higher than that of the state-of-the-arts digital vision chips.     

Linux的DMA高速串口驱动的设计

基于现有的Linux普通方式传输的串口驱动,提出了通过利用DMA的高速串口驱动,根据传输时的实时数据量,利用DMA方式和普通方式相结合的方式进行数据传输,大大提高了传输速率,同时降低了系统的开销,减少了CPU的使用。在双核移动终端中进行验证,两芯片通过串口进行芯片间通信,实验结果证明了设计的高速串口驱动具有较好的可靠性和可行性。     

汽车电子自动限速系统的设计

文中介绍了以MSP430F149为控制器,以NRF2401为无线收发芯片的汽车自动限速系统。该系统能根据道路状况、天气、车型三种参数综合设定限速值,行车进入不同的路段,自动地改变限速值,司机无法更改。通过检测当前车速,并与限速值进行比较,当超速30S时,发出超速语言报警提示,并控制汽车油路,使车速保持在限速值附近,从而达到自动限制汽车行驶速度的目的。这将大大减少交通事故的发生。     

Shear localization sensitivity analysis for Johnson–Cook constitutive parameters on serrated chips in high speed machining of Ti6Al4V

This research aims to investigate the influence of material constitutive parameters on the serrated chip formation during high speed machining (HSM) of Ti6Al4V alloys with finite element simulations and cutting experiments. The Johnson–Cook (JC) constitutive model and JC fracture model with an energy-based ductile failure criterion are adopted to simulate the HSM process. Five JC constitutive model parameters such as initial yield stress, hardening modulus, strain hardening coefficient, strain rate dependency coefficient, and thermal softening coefficient are included in this research. Shear localization sensitivity is novelly proposed to describe variations of serrated chips under different JC constitutive model parameters. Shear localization sensitivity is subdivided into chip serration sensitivity and chip bending sensitivity. The research finds that the influences of initial yield stress and thermal softening coefficient parameters on the chip serration and bending are much more prominent than those of the rest three JC constitutive model parameters. With initial yield stress or hardening modulus in JC constitutive model increasing, the chip serration sensitivity increases and the chip bending sensitivity decreases. However, the influences of the rest three parameters on chip serration sensitivity are opposite. High speed orthogonal cutting experiments of Ti6Al4V are carried out to validate the simulation results under different cutting speeds ranging from 50 m/min to 3000 m/min and fixed uncut chip thickness with 0.1 mm. The results show that the serrated degree of chips increases with the cutting speed increasing until the chips become completely fragmented. The cutting speed break point of chip morphology from serrated to fragmented ones for Ti6Al4V is about 2500 m/min. The average cutting force decreases with the cutting speed increasing, which is a prominent advantage for HSM. This paper can help to get deeper insights into the serrated chip formation mechanism in HSM.     

电源驱动芯片UCD9222的数字电源设计

数字脉宽调制信号可以实现电源的数字控制。数字电源具有软件配置、自动电压/电流控制以及集群控制等优点。UCD系列芯片可以提供全套的数字电源实现方案,该系列芯片包括数字脉宽波形控制芯片、电源驱动转换芯片以及复位和时延控制芯片。本文基于以上套片研制出数字电源系统,给出了硬件设计图和软件配置方法,最后给出系统运行图。该系统可以应用于嵌入式高性能电子设备中。     

寄存器传输级低功耗设计方法

随着移动设备需求量的不断增大和芯片工作速度的不断提高，芯片的功耗已经成为电路设计者必须考虑的问题，对于芯片整体性能的评估已经由原来的面积和速度的权衡变成面积、时序、可测性和功耗的综合考虑，并且功耗所占的权重会越来越大。本文主要讲述在RTL设计中如何实现低功耗设计。     

The effect of injection molding PMMA microfluidic chips thickness uniformity on the thermal bonding ratio of chips

Injection molding PMMA microfluidic chips can significantly improve the efficiency of chips forming. However, due to the coexistence of macro and micro effects in the injection molding process, the thickness uniformity of molding substrates is poor, which will seriously affect the thermal bonding quality of chips. In this paper, the effect of injection molding PMMA microfluidic chips thickness uniformity on the thermal bonding ratio and the quality of micro-channels was studied by experiments and simulations. The results show that when the following three conditions were satisfied during injection molding process, chips bonding ratio reaches to 93.9?% and the distortions of micro-channels caused by thermal bonding were acceptable. Firstly, the cover plates flatness error is smaller than 50–60?μm and substrates flatness error is smaller than 80–90?μm. Secondly, the maximum thickness difference of stack chips (cover plate stack with substrate) is smaller than 70–80?μm. Thirdly, chips thickness of the middle is larger than that of the two ends along their length direction and chips thickness distribute evenly along their width direction. These conclusions can be used for the parameters selection and moulds design during injection molding process of PMMA microfluidic chips.