基于变活化能模型的T800/环氧树脂预浸料固化反应动力学研究

为了深入了解某新型高温固化T800/环氧树脂预浸料的固化行为,借助差示扫描量热仪(DSC),采用非等温DSC法研究了T800/环氧树脂预浸料的固化反应过程。基于唯象模型,系统研究了该预浸料的固化反应特征温度及固化动力学参数,确定该预浸料中环氧树脂的固化反应动力学模型为自催化模型。采用等转化率法,分析了预浸料中环氧树脂的反应活化能随固化度的变化情况,结果表明在整个固化反应过程中,树脂固化反应活化能变化较大,传统模型法基于全固化过程活化能不变的假设无法准确描述该固化反应。采用变活化能自催化模型,利用粒子群全局优化算法,得到了T800/环氧树脂预浸料的固化动力学方程,结果表明该模型能较好地描述实验现象,可为进一步研究该预浸料的热力学性能及其成型过程中的质量控制提供理论基础。     

Comparison of the curing kinetic behavior for two epoxy resin systems containing EPIKOTE 828–EPIKURE 3090 and DURATEK KLM 606A–DURATEK KLM 606B

The aim of the study is to determine the optimum cure temperatures and kinetics for two different epoxy resin systems without using solvent. Two resin systems consist of EPIKOTE 828® epoxy resin–EPIKURE® 3090 polyamidoamine curing agent and DURATEK® KLM 606A epoxy resin–DURATEK® KLM 606B polyamide curing agent. The ratio of resin to curing agent was kept as 1:1 for both the systems. Curing temperatures of both the systems were determined and kinetic parameters were calculated with respect to the experimental results following nth‐order kinetics. Then, a series of isothermal temperatures was applied to the resin systems in order to assess the cure process in terms of conversion, time, and temperature by using differential scanning calorimeter (DSC). The test results of both systems show that the rate of degree of cure for EPIKOTE 828® epoxy resin–EPIKURE® 3090 polyamidoamine curing agent system is approximately 10 times higher than that of DURATEK® KLM 606A epoxy resin–DURATEK® KLM 606B polyamide curing agent system at 230°C. POLYM. COMPOS., 28:762–770, 2007. © 2007 Society of Plastics Engineers     

Studies on the curing behavior,thermal, and mechanical properties of epoxy resin-co-amine-functionalized lead phthalocyanine

A high performance copolymer was prepared by using epoxy (EP) resin as matrix and 3,10,17,24-tetra-aminoethoxy lead phthalocyanine (APbPc) as additive with dicyandiamide as curing agent. Fourier-transform infrared spectroscopy, dynamic mechanical analysis (DMA), differential scanning calorimetric analysis (DSC), and thermogravimetric analysis (TGA) were used to study the curing behavior, curing kinetics, dynamic mechanical properties, impact and tensile strength, and thermal stability of EP/APbPc blends. The experimental results show that APbPc, as a synergistic curing agent, can effectively reduce the curing temperature of epoxy resin. The curing kinetics of the copolymer was investigated by non-isothermal DSC to determine kinetic data and measurement of the activation energy. DMA, impact, and tensile strength tests proved that phthalocyanine can significantly improve the toughness and stiffness of epoxy resin. Highest values were seen on the 20 wt% loading of APbPc in the copolymers, energy storage modulus, and impact strength increased respectively 388.46 MPa and 3.6 kJ/m², T_g decreased 19.46°C. TGA curves indicated that the cured copolymers also exhibit excellent thermal properties.     

碳纤维预浸料用中温固化环氧树脂体系

针对碳纤维预浸料常用环氧树脂体系的一些基本特点,以常温下为固体状态的环氧树脂混合物为基体,采用双氰胺为中温固化剂的固化体系,研究了双氰胺固化剂用量对环氧树脂体系黏度、力学性能、热学性能、溶胀性能的影响,对碳纤维预浸料用环氧树脂体系的研发及应用具有一定参考意义。     

Cure characterization of Cycom 977‐2A carbon/epoxy composites for quickstep processing

In this effort, Quickstep, a relatively a new technique, have been employed for manufacturing of composite materials. The cure schedule provided by a prepreg manufacturer is usually designed for autoclave or other traditional processing techniques and thermosetting resin systems are formulated for ramp rate curing 2–3 K min^?1. While in case of Quickstep processing, ramp rates of 15 K min^?1 can be achieved, thus changing the chemorheology of resin. The cure process of 977‐2A carbon/epoxy composites was evaluated for Quickstep processing using differential scanning calorimetry (DSC), dynamic mechanical and thermal analysis, and Fourier transformed infrared and results were compared with cure cycle employed for autoclave curing. Optimum hold time for Quickstep processing at upper curing temperature (180°C) was determined using DSC. The hold time of 120 min at 180°C was found to be suitable for Quickstep cure cycle, producing a panel of similar degree of cure to that achieved through autoclave processing schedule. Final degree of cure was dependent on time spent at upper cure temperature and slightly on initial steps of the cure cycle which was used to control the resin flow, fiber wetting, and void removal. Quickstep processed samples exhibited higher T_g and crosslink density and similar molecular network structure to the autoclave cured samples. POLYM. ENG. SCI., 54:887–898, 2014. © 2013 Society of Plastics Engineers     

Equivalent processing time analysis of glass transition development in epoxy/carbon fiber composite systems

The cure kinetics and glass transition development of a commercially available epoxy/carbon fiber prepreg system, DMS 2224 (Hexel F584), was investigated by isothermal and dynamic‐heating experiments. The curing kinetics of the model prepreg system exhibited a limited degree of cure as a function of isothermal curing temperatures seemingly due to the rate‐determining diffusion of growing polymer chains. Incorporating the obtained maximum degree of cure to the kinetic model development, the developed kinetic equation accurately described both isothermal and dynamic‐heating behavior of the model prepreg system. The glass transition temperature was also described by a modified DiBeneditto equation as a function of degree of cure. Finally, the equivalent processing time (EPT) was used to investigate the development of glass transition temperature for various curing conditions envisioning the internal stress buildup during curing and cooling stages of epoxy‐based composite processing. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 144–154, 2002; DOI 10.1002/app.10282     

Reaction kinetics,thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with p‐phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest T_g and thermal degradation temperature. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

碳纤维缠绕气瓶用环氧树脂体系的固化工艺研究

目前国内外对环氧树脂固化工艺研究较多,但针对LY564环氧树脂体系在高压气瓶特殊应用环境中的研究却较少。本文对该树脂体系进行了不同升温速率的DSC分析,用流变仪对该树脂体系的等温粘度和动态粘度进行了测试,并且用DMA对该树脂体系的玻璃化转变温度进行测定,实验结果表明了LY564环氧树脂体系应用于碳纤维缠绕气瓶的适用性,并确定了该树脂体系的理论固化工艺。     

碳纤维/环氧预浸料的热固化工艺研究

以先进拉挤(Advanced Pultrution)[1]ADP成型技术为研究背景,借助差示扫描量热法(DSC)对USN12500碳纤维/环氧预浸料固化所涉及的温度和时间进行了研究与分析。以弯曲强度作为考察指标设计正交试验,优选了模拟的拉挤成型固化工艺参数。试验结果表明,①后固化温度下的保温时间对制品的力学性能影响最大,预处理温度下的保温时间影响最小;②预处理温度80℃下处理25min、热压温度130℃下保温保压25min以及后固化温度150℃下保温1.5h为本组试验的优方案。     

Cure Kinetics and Thermal Property of Bisphenol-S Epoxy Resin and Phthalic Anhydride

Abstract

The cure kinetics of bisphenol-S epoxy resin (BPSER) and curing agent phthalic anhydride, with N,N-dimethyl phenzylamine as an accelerator, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure. The autocatalytic behavior was well described by the model proposed by Kamal including two rate constants, k1 and k2, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2～3. The activation energies for k1 and k2 were 111.69 and 80.47 KJ/mol, respectively. Diffusion control was incorporated to describe the cure in the latter stages. The glass transition temperatures (T_gS) of the BPSER/anhydride samples isothermally cured partially were determined by means of torsional braid analysis (TBA). and the results showed that the reaction rate increased with increasing T_g in terms of the rate constant, but decreased with increasing conversion. The T_g of completely cured BPSER/anhydride system is about 40 K higher than that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of the BPSER/phthalic anhydride has n-order reaction kinetics.     

Curing kinetics study of an epoxy resin system for T800 carbon fiber filament wound composites by dynamic and isothermal DSC

Curing kinetics of DGEAC/DDM/DETDA/DGEB epoxy resin system was studied using dynamic and isothermal differential scanning calorimetry (DSC) for the preparation of T800 carbon fiber filament wound composites. In dynamic experiment, four kinds of epoxy resin systems were studied. Curing characteristics, such as curing range and curing temperatures of the epoxy resin system with mixed hardeners (DGEAC/DDM/DETDA), were found lying within those of the two epoxy resin systems with a single hardener (DGEAC/DDM, DGEAC/DETDA). The addition of reactive diluter (DGEB) caused increase in curing range and exothermic heat. In addition, the activation energies calculated by the isoconversional method of all four resin systems decreased to the minimum value in the early stage due to the autocatalytic role of hydroxyl groups in the curing reaction and then increased due to the increased viscosity and crosslink of epoxy systems. The addition of reactive diluter led to the decrease in activation energies on the initial stage (conversion = 0.1–0.3). In isothermal experiment, a series of isothermal DSC runs provided information about the curing kinetics of the DGEAC/DDM/DETDA/DGEB system over a wide temperature range. The results showed that the isothermal kinetic reaction of the epoxy resin followed an autocatalytic kinetic mechanism. The autocatalytic kinetic expression chosen in this work was suitable to analyze the curing kinetics of this system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Chemorheology of thermosetting resins. IV. The chemorheology and curing kinetics of vinyl ester resin

The rheological properties and curing kinetics of a vinyl ester resin have been determined during isothermal cure. Both steady and oscillatory shearing flow properties were determined using a cone-and-plate rheometer, and the curing kinetics were determined using a differential scanning calorimeter (DSC). Also determined were the rheological properties and curing kinetics of the resin when it had been thickened using magnesium oxide (MgO), in the presence of calcium carbonate (CaCO₃) as filler and polyvinyl acetate (PVAc) as low-profile additive. The steady shearing flow behavior observed with the vinyl ester resin was found to be very similar to that observed with a general-purpose polyester resin, reported in Paper I of this series [C. D. Han and K. W. Lem, J. Appl. Polym. Sci., 28 , 3155 (1983)]. However, a significant difference in the oscillatory shearing flow behavior was found between the two resins. We have concluded that dynamic measurement is much more sensitive to variations in resin chemistry than steady shearing flow measurement. DSC measurement has permitted us to determine the degree of cure as a function of cure time. By combining the rheological and DSC measurements, we have constructed plots describing how the viscosity increases with the degree of cure, at various isothermal curing temperatures.     

Cure kinetics of T700/BMI prepreg used for advanced thermoset composite

A new isothermally based, cure kinetic model for the prepreg was presented using an industrially supplied prepreg rather than pure resin. The matrix resin was bismaleimide (BMI) resins, and the reinforcement was carbon fiber T700–12S. The BMI prepreg was measured from 170 to 220°C by isothermal DSC. The isothermal cure reaction heat increases with the increment of cure temperature. The DSC data were analyzed by the proposed nth‐order reaction model. An increase in reaction rate was observed at higher temperature in both neat and prepreg. After reaching the peak value, the reaction rate dropped off faster in prepreg, resulting in a lower average value of the ultimate heat of reaction. It was suggested the presence of carbon fiber had an effect on the cure kinetics as a heat sink. The carbon fibers imposed restrictions on the molecular mobility of the reactive species and did not change the cure mechanism. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 2238–2241, 2005     

Super-crosslinked ionic liquid-intercalated montmorillonite/epoxy nanocomposites: Cure kinetics,viscoelastic behavior and thermal degradation mechanism

Super-crosslinked epoxy nanocomposites containing N-octadecyl-N′-octadecyl imidazolium iodide (IM)-functionalized montmorillonite (MMT-IM) nanoplatelets were developed and examined for cure kinetics, viscoelastic behavior and thermal degradation kinetics. The structure and morphology of MMT-IM were characterized by FTIR, XRD, TEM, and TGA. Synthesized MMT-IM revealed synergistic effects on the network formation, the glass transition temperature (T_g) and thermal stability of epoxy. Cure and viscoelastic behaviors of epoxy nanocomposites containing 0.1 wt% MMT and MMT-IM were compared based on DSC and DMA, respectively. Activation energy profile as a function of the extent of cure was obtained. DMA results indicated a strong interface between imidazole groups of MMT-IM and epoxy, which caused a significant improvement in storage modulus and the T_g of epoxy. Network degradation kinetics of epoxy containing 0.5, 2.0, and 5.0 wt% MMT and MMT-IM were compared by using Friedman, Kissinger-Akahira-Sunose (KAS), Flynn-Wall-Ozawa (FWO) and the modified Coats-Redfern methods. Although addition of MMT to epoxy was detrimental to the T_g value, as featured by a fall from 94.1°C to 89.7°C detected by DMA method, and from 103.3°C to 97.9°C by DSC method, respectively. By contrast, meaningful increase in such values were observed in the same order from 94.1°C to 94.7°C and from 103.3°C to 104.7°C for super-crosslinked epoxy/MMT-IM systems.     

Fabrication and characterization of the mechanical properties of multi-walled carbon nanotube-reinforced epoxy resins by e-beam irradiation

In this study, the multi-walled carbon nanotubes (MWNT) were reinforced to epoxy resin as fabrication of epoxy/MWNT nanocomposites by electron beam (e-beam) curing. An attempt is made to disperse MWNT into diglycidyl ether of bisphenol A (DGEBA) as epoxy resins, using triarylsulfonium hexafluoroantimonate (TASHFA) as an initiator. E-beam irradiation effect on the curing of the epoxy resin was investigated in oxygen and nitrogen atmospheres at room temperature. The flexural modulus was measured by a universal testing machine (UTM). Here, the flexural modulus factor exhibits an upper limit at 0.3 wt% MWNT. The dynamic mechanical and thermal properties of the irradiated epoxy resins were characterized using DMA, DSC and TGA machines. DMA curves of the storage modulus revealed an increase with an increasing MWNT content and radiation dose. However, the T_g curve decreased as a function of the increasing MWNT content and radiation dose. The thermal properties of the TGA and DSC data were improved by increasing the content of the MWNT and the radiation dose. Likewise, the thermal properties were stabilized by increasing the amount of initiator and irradiating the resins in a nitrogen atmosphere.     

Cure kinetics modeling and cure shrinkage behavior of a thermosetting composite

In this work, the cure kinetics and through‐the‐thickness cure shrinkage upon curing of a carbon fiber‐epoxy composite (AS4/8552) were studied. The study is composed of two major parts. Firstly, dynamic and isothermal Differential Scanning Calorimeter (DSC) scans were performed to develop a new cure kinetics model. The most appropriate kinetic model that produces a nearly perfect fit of all data sets corresponds to a process with two single‐step parallel autocatalytic reactions with diffusion control. Multivariate kinetic analysis was used to evaluate the parameters. In the second part of the study, the coefficients of thermal expansion (CTEs), the glass transition temperatures (T_g), and the through‐the‐thickness cure shrinkage strain values of the partially cured unidirectional and cross‐ply composite samples were measured by using a dynamic mechanical analyzer (DMA). Cure strains were measured throughout the Manufacturer's Recommended Cure Cycle (MRCC) with the same method. Results indicate that glass transition temperatures of partially cured samples can be measured very closely by the two methods (DSC and DMA). The methods proposed were proved to be very reliable to predict the degree of cure and to measure the through‐the‐thickness strains during the cure cycle. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers     

苯并噁嗪/含磷环氧/含氮酚醛共混体系结构与性能的研究

针对双酚A型苯并噁嗪无法满足较高阻燃要求的缺陷,在双酚A型苯并噁嗪中引入含磷环氧、含氮酚醛,制备了三元共混浇铸体,通过测定凝胶化时间、差示扫描量热仪(DSC)、动态热机械分析(DMA)、热失重分析(TGA)、垂直燃烧、锥形量热等测试手段研究了共混体系固化反应及结构与性能间的关系。研究表明:在共混体系中,随着环氧树脂含量的增加,固化产物的初始储能模量和玻璃化转变温度均减小,同时还有效地发挥了固相、气相阻燃的作用;含氮酚醛的引入,除有效催化固化反应和降低固化反应温度外,还发挥了气相阻燃的作用。含磷环氧和含氮酚醛均能有效提高热稳定性和阻燃性能;含氮酚醛中的氮源比苯并噁嗪中的氮源对阻燃、提高热稳定性等性能所发挥的作用更明显。     

含芳醚芴二胺/环氧树脂固化反应动力学及性能研究

以9,9-双[4-4-氨基苯氧基苯基]芴(BAOFL)作为固化剂,采用非等温DSC技术,研究了BAOFL/环氧树脂(E-51、TDE-85和芴基环氧树脂)体系的固化反应动力学,利用动态热机械分析仪(DMA)和热重分析仪(TGA)测试了固化树脂的力学性能和热稳定性。结果表明,固化反应活化能与环氧树脂和固化剂的结构密切相关,芳醚的引入提高了氨基与环氧基的反应性,固化树脂呈现出优良的热性能和力学性能,其玻璃化转变温度(T)达到206~248℃,贮能模量为2.54~2.94 GPa,初始热分解温度312~375℃,700℃g时的残炭率达到15.2%~31.7%。()     

Cure behavior of epoxy/MWCNT nanocomposites: The effect of nanotube surface modification

The effect of carboxyl and fluorine modified multi-wall carbon nanotubes (MWCNTs) on the curing behavior of diglycidyl ether of bisphenol A (DGEBA) epoxy resin was studied using differential scanning calorimetry (DSC), rheology and infrared spectroscopy (IR). Activation energy (E_a) and rate constants (k) obtained from isothermal DSC were the same for the neat resin and fluorinated MWCNT system (47.7 and 47.5 kJ/mol, respectively) whereas samples containing carboxylated MWCNTs exhibited a higher activation energy (61.7 kJ/mol) and lower rate constant. Comparison of the activation energies, rate constants, gelation behavior and vitrification times for all of the samples suggests that the cure mechanisms of the neat resin and fluorinated sample are similar but different from the carboxylated sample. This can be explained by the difference in how the fluorinated nanotubes react with the epoxy resin compared to the carboxylated nanotubes. Although the two systems have different reaction mechanisms, both systems have similar degrees of conversion as calculated from the infrared spectroscopic data, glass transition temperature (T_g), and predictions based on DSC data. This difference in reaction mechanism may be attributed to differences in nanotube dispersion; the fluorinated MWCNT system is more uniformly dispersed in the matrix whereas the more heterogeneously dispersed carboxylated MWCNTs can hinder mobility of the reactive species and disrupt the reaction stoichiometry on the local scale.     

不同固化体系对环氧粉末涂料性能的影响

通过非等温示差扫描量热分析(DSC),热重分析(TGA)及物理力学性能测试研究了分别以双氰胺、二氨基二苯基砜、线形酚醛树脂为固化剂,2-甲基咪唑为固化促进剂的环氧树脂体系的固化行为,热稳定性及其粉末涂料性能,并利用外推法求出不同固化体系的理论固化温度。结果表明:双氰胺/2-甲基咪唑体系的综合性能最好,其理论固化温度为142℃,热失重起始分解温度为410℃,冲击强度为50 cm,60°光泽为83,表面电阻为1.33×1012Ω。