环氧树脂/玻璃布/BN导热复合材料的制备与性能研究

采用高温模压成型法制备环氧树脂(EP)/玻璃布/氮化硼(BN)导热复合材料。探讨了BN用量和偶联剂处理对复合材料力学性能、导热性能和介电性能等影响。结果表明:当w(BN)=15%时,复合材料的冲击强度较高;导热性能随着BN用量的增加而增大;当w(BN)=25%时,改性复合材料的热导率为0.901 2 W/(m.K),此时复合材料仍保持较低的介电常数和介电损耗。当BN用量相同时,偶联剂表面处理可有效改善复合材料的力学性能和导热性能。     

碳化硅/环氧树脂导热复合材料的制备与性能

采用浇铸成型法制备碳化硅/环氧树脂(SiC/EP)导热复合材料,研究了SiC种类、粒径、用量和表面改性方法对SiC/EP复合材料的导热性能、力学性能和热性能等影响。结果表明:SiC/EP复合材料的导热系数随纳米级SiC用量增加而增大,当φ(纳米级SiC)=17.80%时,导热系数为0.954 6 W/(m.K);SiC/EP复合材料的弯曲强度和冲击强度随纳米级SiC用量增加均呈先升后降态势,当φ(纳米级SiC)=3.50%时,两者均达到最大值。SiC经表面改性后可有效提高复合材料的导热性能和力学性能,并且改性SiC的加入可有效降低EP的玻璃化转变温度。     

The Preparation and Cure Kinetics Researches of Thermal Conductivity Epoxy/AlN Composites

The aluminum nitride (AlN) was employed to prepare epoxy/AlN composites by blending-casting moulding method, two different coupling agents were used to functionalize the surface of AlN. The thermal conductivity and mechanical properties of the composites were investigated. And the cure kinetics of the EP/AlN composites was studied by means of isothermal DSC. Results revealed that the thermal conductivity of EP improved remarkably with the addition of AlN, a higher thermal conductivity of 1.05 W/mK can be achieved with 42 vol% AlN, about 5 times higher than that of native epoxy resin. And the flexural and impact strength of the EP/AlN composites were optimal with 3.3 vol% AlN. The curing process of the EP/AlN composites contained autocatalytic mechanism, the whole process was according with the Kamal model. The presence of AlN did not change the cure reaction mechanism, and had little effecting on the activation energy, but decreased the rate constants k_l and k₂.     

Dispersion,Mechanical and Thermal Properties of Epoxy Resin Composites Filled with the Nanometer Carbon Black

The nanometer carbon black (CB) was employed to prepare epoxy resin/carbon black (EP/CB) composites by blending-casting method. The different modified methods of silicone coupling agent were used to improve the dispersion of CB in epoxy resin. The mechanical and thermal properties of EP/CB composites were investigated. Experimental results showed that the mechanical properties increased at first, but decreased with excessive addition of CB. When the mass fraction of CB was 2%, the mechanical properties were maximum. The use of modified CB significantly enhanced the mechanical properties of the composites. For given CB loading, the CB modified by pretreatment method displayed better dispersion in the epoxy resin than that of the direct mixing method. SEM observation revealed that the tensile fracture surface of the composite filled with 2 wt% modified CB held more microcracks than that of 5 wt% modified CB, and the formed microcracks could consume more energy of rupture, finally to have better tensile strength. DSC analysis showed that the glass transition temperature (Tg) of the composites increased with the increasing mass fraction of CB.     

One-step synthesis of improved silica/epoxy nanocomposites with inorganic-organic hybrid network

High performance silica/epoxy nanocomposites were prepared through mixing epoxy, tetraethyl orthosilicate (TEOS), γ-aminoproplytriethyoxy siliane(APTES), and triethyltrtramine (TETA) at 25 °C via sol-gel method on one-step. The effects of content of TEOS and coupling reagents on the mechanical and thermal properties of SiO₂/EP composites were studied. Microcosmic morphology and properties of the hybrid materials were characterized by FT-IR, TEM, FESEM, and DSC. Results revealed that SiO₂/EP composites achieve the optimal mechanical and thermal properties when the composites prepared with mass ratio of TEOS/APTES/epoxy for 3/2/100 without acetone. Compared with pristine epoxy, the tensile strength, elongation at break, impact strength and bend strength increased 67.6 %, 190 %, 82.1 % and 15.7 %, respectively. The further study was to investigate the content of TEOS and APTES effecting on mechanical properties and water sorption of fiber reinforced composites, which used the above compound as matrix resin.     

Preparation and mechanical properties researches of silane coupling reagent modified β-silicon carbide filled epoxy composites

The β-silicon carbide (β-SiC) micro particles modified by silane coupling reagent of γ-glycidoxy propyl trimethoxy silane (KH-560) were employed to prepare β-silicon carbide/epoxy resin (SiC/EP) by blending-casting moulding method to acquire polymer composites with high mechanical properties. Mechanical tests demonstrate that, both the flexural and impact strength of the composites increased firstly with the increasing content of SiC, but decreased with excessive addition of SiC. When the mass fraction of SiC was 10%, the mechanical properties of SiC/EP composites were maximum. Meantime, the use of SiC particles modified by KH-560 significantly enhanced mechanical properties of SiC/EP composites. The surface performance of SiC was characterized and analyzed by XPS, FTIR and TGA. The results indicated that a chemical bonding formed between KH-560 and SiC, and a layer of organic single molecule membrane formed on the surface of SiC. And the maximum mass fraction of KH-560 coated on the surface of SiC was about 2.62%.     

环氧树脂／碳化硅晶须导热复合材料的制备研究

用共混复合-浇注成型法制备环氧树脂／碳化硅晶须（EP／SiCw）导热复合材料,研究了导热填料种类、形状、用量和表面处理对复合材料的导热性能、力学性能和热性能的影响。结果表明,SiCw较SiCp更易改善材料的导热性能,热导率随SiCw用量的增加而增大,当SiCw体积分数为42．1％时,复合材料热导率为0．9611W／（m·K）;力学性能随SiCw用量的增加先增加后降低。表面处理有利于提高复合材料的导热性能和力学性能。SiCw的加入使环氧树脂的耐热性提高、Tg降低。     

有机累托石/环氧树脂(OREC/EP)复合材料的制备和性能研究

用单体原位插层技术制备了有机累托石/环氧树脂(OREC/EP)复合材料,考察了OREC的加入及其含量对复合材料OREC/EP体系的力学性能、耐介质性能和耐紫外线性能的影响。研究发现:OREC是一种良好的环氧树脂增韧改性剂,OREC的加入可改善复合材料的综合性能。当OREC质量分数为3%时,冲击强度和弯曲强度提高幅度最大,分别为6.25%和8.39%,耐海水性能效果最好;在添加质量分数为1%~7%时,复合材料体系的耐酸(碱)和耐紫外线性能均随OREC含量的增加而上升。     

环氧树脂基介电复合材料的制备和性能研究

以环氧树脂(EP)为基体树脂、经硅烷偶联剂改性后的压电陶瓷钛酸钡(BaTiO3)为增强填料,采用浇铸法制备了有机/无机介电复合材料。研究了填料用量对复合材料介电性能、力学性能和热性能的影响。实验结果表明,BaTiO3能显著提高材料的介电常数,当w(BaTiO3)=60%时,复合材料的介电常数为23.6,比纯EP的介电常数(4.0)提高了近6倍,而且复合材料的介电常数受频率影响较小,具有较好的频率稳定性;随着BaTiO3含量的增加,材料的弯曲强度和冲击强度都呈先增后减的趋势,最大弯曲强度和冲击强度分别为123.8 MPa和26.3 kJ/m2;材料的热稳定性研究表明,材料的起始热分解温度随着BaTiO3含量的增加而提高,材料的耐热性能得到改善。     

超支化液晶/Al_2O_3/环氧树脂复合材料电性能研究

采用机械共混及模压成型工艺将Al2O3粉体,含H20哑铃状液晶化合物(HLCP)与环氧树脂(E-51)共混制备了HLCP/EP/Al2O3复合材料。研究了Al2O3含量对材料热稳定性、导电性能、导热性能及热膨胀的影响。结果表明:材料的导热系数、介电常数及热稳定性随Al2O3含量的增加而增大,当Al2O3粉体质量分数达到70%时,材料导热系数是纯环氧树脂的1.7倍;介电损耗、线膨胀系数随Al2O3含量的增加而减小,当Al2O3粉体质量分数为60%时,介电常数为3.71。同时,由于HLCP网格的存在,降低了材料的内耗,提高了复合材料的玻璃化转变温度,增强了电性能。     

环氧树脂/碳纤维/BN导热复合材料制备及研究

采用高温模压成型法制备环氧树脂/碳纤/BN导热复合材料.探讨了BN用量对复合材料导热性能和力学性能的影响.结果表明,当BN用量为6%(wt)时,复合材料的弯曲强度和剪切强度较佳,BN用量对复合材料的冲击强度影响不大;导热性能随BN用量的增加而增加,当BN用量为20%(wt)时,导热系数为0.8438W/m·K.     

环氧树脂/镀银纳米石墨微片导热复合材料的制备与性能

以膨胀石墨为原料,采用超声分散法和化学镀法制得镀银纳米石墨微片,然后将其填充在环氧树脂基体中制备环氧树脂/镀银纳米石墨微片复合材料。结果表明,银粒子均匀镀覆在纳米石墨微片上,银层厚度为100 nm,有利于在环氧树脂基体中形成导热通路;与环氧树脂相比,环氧树脂/镀银纳米石墨微片复合材料的力学性能和热导率能都得到提高;当镀银纳米石墨微片含量为3 %时,复合材料的热导率为1.827 W/(m·K),比纯环氧树脂热导率提高了近5倍。     

增韧导热环氧树脂/氮化硼复合材料的制备与表征

采用种子乳液聚合方法制备了聚（丙烯酸正丁酯/甲基丙烯酸甲酯-co-甲基丙烯酸缩水甘油酯）核壳增韧剂（PBMG）,并用湿法球磨与超声辅助相结合的方法对六方氮化硼（h-BN）进行改性,制备的改性氮化硼（MBN）可提高环氧树脂（EP）的热导率。最后采用机械共混方法制备了环氧树脂/增韧剂/改性氮化硼（EP/PBMG/MBN）复合材料。通过透射电子显微镜（TEM）、扫描电子显微镜（SEM）、X射线衍射（XRD）、动态激光光散射（DLS）、热导率和力学性能等测试对核壳增韧剂的粒子形成、改性氮化硼和复合材料进行了表征。结果发现：最终制备的聚丙烯酸酯乳胶粒子呈现明显的核壳结构,且粒度分布很窄。当聚丙烯酸酯增韧剂添加量为5%、改性氮化硼为8.99%时,环氧树脂/增韧剂/改性氮化硼复合材料的冲击强度和热导率比纯环氧树脂（EP）的分别提高了133%和171%。随着未来的基板材料要求有效的热耗散,这种复合材料有望用于微电子工业上。     

High thermal conductive m‐xylylenediamine functionalized multiwall carbon nanotubes/epoxy resin composites

In this study, multiwall carbon nanotubes (MWNTs) functionalized by m‐xylylenediamine is used as thermal conductive fillers to improve their dispersibility in epoxy resin and the thermal conductivity of the MWNTs/bisphenol‐A glycidol ether epoxy resin composites. Functionalization with amine groups of MWNTs is achieved after such steps as carboxylation, acylation and amidation. The thermal conductivity, impact strength, flexural strength, and fracture surfaces of MWNTs/epoxy composites are investigated with different MWNTs. The results show that m‐xylylenediamine is successfully grafted onto the surface of the MWNTs and the mass fraction of the organic molecules grafted onto MWNTs is about 20 wt %. The thermal conductivity of MWNTs/epoxy composites is further enhanced to 1.236 W/mK with 2 wt % m‐MWNTs. When the content of m‐MWNTs is 1.5 wt %, the impact strength and flexural strength of the composites are 25.85 KJ/m², 128.1 MPa, respectively. Scanning electron microscope (SEM) results show that the fracture pattern of composites is changed from brittle fracture to ductile fracture. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41255.     

蒙脱土改性环氧树脂及其复合材料性能研究

以蒙脱土(MMT)作为EP(环氧树脂)的改性剂制备EP/MMT纳米复合材料。考察了MMT含量对EP/MMT体系的凝胶时间、黏度和力学性能等影响。结果表明:MMT的加入明显缩短了EP体系的凝胶时间,并显著缩短了EP体系达到高黏度的时间;当w(MMT)=4%时,EP/MMT纳米复合材料的力学性能相对最好,其浇铸体的拉伸强度、弯曲强度和冲击强度分别为85 MPa、140 MPa和35 kJ/m2,其复合材料的拉伸强度和弯曲强度分别为160 MPa和200 MPa。     

0D surface modification and 3D silicon carbide network construction for improving the thermal conductivity of epoxy resins

With rapid advances in electronic device miniaturization and increasing power density, high thermal conductivity polymer composites with excellent properties are becoming increasingly significant for the progress of next-generation electronic apparatuses. In this work, a new type of three-dimensional (3D) network silicon carbide (SiC) frame and core-shell SiC@SiO₂ (SiC@SiO₂) were successfully prepared. The effects of different filler forms (dispersed particle filler and three-dimensional continuous filler network) on the thermal conductivity of the composites were compared. The composites based on the three-dimensional filler network exhibited evidently better thermal conductivity improvement rates, compared to their traditional counterparts. The thermal conductivity of the epoxy/SiC@SiO₂ composite having a total filler content of 17.0 vol% was 0.857 W/m/K, 328.5% higher than that of pure epoxy resin. Similarly, the thermal conductivity of the EP/3D-SiC composite having a total filler content of 13.8 vol% was 1.032 W/m/K, 416.0% higher than that of pure epoxy resin. The abovementioned stats were proven via molecular simulations. We estimated the interfacial thermal resistance (ITR) of the EP/3D-SiC composite to be 5.98 × 10^?8 m² K/W, which was an order of magnitude lower than that of the epoxy composites without a 3D network. Simultaneously, computerized molecular simulation technology was used to verify the feasibility of the experiment, which provided new ideas for the preparation of other highly thermally conductive materials.     

聚丙烯/马来酸酐接枝聚丙烯/环氧树脂/玻璃纤维复合材料的制备及其性能研究

通过双螺杆挤出机制备了聚丙烯/马来酸酐接枝聚丙烯/环氧树脂/玻璃纤维（PP/PP-g-MAH/EP/GF）复合材料,并研究了PP-g-MAH含量、EP含量及固化剂对复合材料力学性能的影响。结果表明,PP-g-MAH含量为10份,含有固化剂EP的含量为3份时,复合材料的综合力学性能最佳;与不加EP的复合材料相比,其拉伸强度、弯曲强度、冲击强度分别提高了41 %、47 %、86 %。扫描电子显微镜分析表明,EP的加入明显改善了GF和PP基体的黏结强度。     

碳纤维三维网络体增强环氧树脂复合材料的性能

以酚醛树脂粘结短切碳纤维(SCF)并炭化制得碳纤维三维网络增强体(CFNR),再采用真空袋成型法浸入环氧树脂(EP)制得新型EP/CFNR复合材料。通过显微镜观察CFNR和复合材料的微观结构,采用万能试验机测试力学性能,以及用电阻仪测定导电性能等方法对复合材料进行了评价。结果表明,炭化后的酚醛树脂将SCF粘结成连续的三维网络结构,EP/CFNR复合材料中SCF间有明显可见的炭质粘结点;当SCF质量分数为7.3%时,EP/CFNR复合材料较纯EP,EP/SCF复合材料的弯曲强度分别提高33%,29%,压缩强度分别提高23%,10%,同时,其体积电阻率是EP/SCF复合材料的1/45。     

高韧性绝缘环氧基复合材料的研制

采用聚砜改性环氧树脂为基体,通过高温模压成型法制备环氧树脂/玻纤/BN复合材料.探讨了BN用量对复合材料力学性能、电性能和热性能的影响.结果表明,当BN用量为10wt％时,复合材料的力学性能较佳.电阻率随着BN用量增加,呈下降趋势.通过DSC和TGA综合分析表明,聚砜的加入提高了树脂基体的热稳定性能,随BN用量增加,复...     

超支化聚合物接枝纳米TiO_2/环氧树脂复合材料的制备与表征

利用偶联剂KH-550和超支化聚(胺-酯)(HBP)对纳米TiO2进行改性,并制备了纳米TiO2/环氧树脂(EP)复合材料。对复合材料的结构、力学性能、加工性能以及热性能进行了研究。研究结果表明,HBP接枝改性纳米TiO2(TiO2-g-HBP)的引入可明显提高复合材料的力学性能、热性能及加工性能;当w(TiO2-g-HBP)=1%时,复合材料的力学性能最好,其冲击强度和弯曲强度比纯EP分别提高了135.51%和22.98%;扫描电镜(SEM)结果显示,TiO2-g-HBP/EP复合材料由脆性断裂转变为韧性断裂。