Gbit/s transmission via two-photon-absorption-inscribed optical waveguides on printed circuit boards

Optical waveguides were inscribed into a 300 mm-thick polymer layer applied onto standard printed circuit boards via two-photon-absorption. VCSELs and photodiodes embedded in this layer of ORMOCERw complemented optical interconnects for multi-Gbit/s data transmission at a wavelength of 850 nm.     

废旧印制电路板资源化处理现状

在大力倡导建设资源节约型和环境友好型社会的今天,加大对废旧印刷电路板的资源化研究,有着特别重大的意义。通过对废旧PCB的组成成分和废旧PCB中金属的含量分析,指出废旧PCB具有很大的可再生利用价值。着重综述了废旧PCB资源化的常规用法,主要包括热处理法、化学处理法、和物理机械处理法,并对这些方法做了的分析归纳。通过对各种方法的综述可以看出采用物理机械方法回收废旧电路板应该是今后的发展方向。     

Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards

In this paper, the effects of environmental stresses on the properties of polymeric optical waveguides were investigated. Optical multimode waveguides were embedded on printed circuit boards by employing commercial polymers. Three optical-PCB constructions varying in board structure and in optical build-up materials were compared. The guide systems were subjected to four different tests: damp heat-high humidity, isothermal annealing, thermal shock and environmental flowing multigas test. Isothermal annealing reduced the refractive index to greatest extent. The optical-PCB structure with optical surface build-up layer was observed to be more vulnerable under temperature shock when compared with the O-PCB with optical inner layer. The buffer layer beneath the optical build-up was found to improve the stability of the optical waveguides significantly. The results indicated of a wavelength dependence to the aging factor with a failure mechanism. The factors affecting the performance and reliability of polymer-based optical waveguides on PCBs were discussed.     

Design and fabrication of waveguide-based chip-to-chip optical interconnection network on printed circuit boards

A waveguide-based chip-to-chip optical interconnection network on printed circuit board (PCB) was designed and fabricated, and experiments confirmed that the data rate in each channel could reach above 3.125 Gbit/s and the bit error rate (BER) could be up to 1.27×10-18, which would be a good solution to solve the communication bottlenecks between high-speed very large scale integration chips. Besides, the whole design and fabrication of optical interconnection network on printed circuit board has the advantages of high reliable, low cost and ease of manufacture.     

Layer assignment for printed circuit boards and integrated circuits

The layer assignment problem arises in printed circuit board (PCB) and integrated circuit (IC) design. It involves the assignment of interconnect wiring to various planes of a PCB or to various layers of interconnect wires in an IC. This paper reviews basic techniques for layer assignment in both PCBs and ICs. Two types of layer assignment are considered: (1) constrained layer assignment in which routing of interconnections is given and the objective is to assign wires to specific layers, and (2) unconstrained, or topological, layer assignment, in which both the physical routing of interconnections and assignment of the wires to layers is sought. Various objective functions, such as via minimization and minimization of signal delays through interconnect lines are discussed     

Novel broad-band bit-synchronization circuit module for optical interconnections

A novel broad-band and ultrafast bit-synchronization circuit module is proposed and fabricated for optical interconnections. In optical packet switch fabric or optical interconnection between electric circuit boards, instantaneous bit synchronization is crucial to properly retime incoming packets with a random phase and reduce the number of preamble overhead bits. The developed bit-synchronization circuit module has a new clock selection circuit, which is configured with a phase comparator and an amplitude comparator. Since device-dependent delay circuits, such as buffer amplifiers or RC phasors, are not adopted, the newly developed clock selection circuit can operate under broad-band frequencies. The bit-synchronization circuit module was fabricated with a Si-bipolar gate array and it can operate at broad-band bit rates of up to 10.5 Gb/s. It also exhibits a power sensitivity penalty as low as 3 dB for 10-Gb/s input signals. The synchronization acquisition time of less than 9 b over the entire 360/spl deg/ phase range was confirmed by experiment.     

Power bus decoupling on multilayer printed circuit boards

Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus     

Micromechanical analysis of copper trace in printed circuit boards

Printed circuit boards (PCB) are designed and manufactured with a variety of polyamide materials such as solder mask, metallic material such as copper trace, composite materials such as prepreg and core material. Polyamide materials such as solder mask and composite materials such as prepreg play important factor on the total deformation of laminate package due to the large coefficient of thermal expansion (CTE). On the other hand, the patterning of the copper layers also exerts important influence to the thermal mechanical behavior of the substrate due to the consistent large Young’s modulus of copper at both room temperature and reflow temperature compared with the small Young’s modulus of polyamide materials. Some approximate methods based on rule of mixtures have been used for estimating material properties in layers of copper mixed with interlayer dielectric material, but few techniques include the effect of copper trace pattern. The detailed comparison of different approximate methods has been done in this paper and a modified homogenization method has been proposed to include the effect of copper trace pattern. A series of three point bending test are performed with the comparison of numerical prediction using the proposed homogenization method and the detailed copper trace pattern respectively. Finally, a micromechanical analysis is done for the copper trace crack problem in package-on-package (PoP).     

RF MEMS switches fabricated on microwave-laminate printed circuit boards

A novel fabrication process has been developed for directly constructing radio frequency microelectrical mechanical systems (RF MEMS) capacitive switches on microwave-laminate printed circuit boards (PCBs). The integrated process uses metal wet etching to form the metal lines for coplanar waveguides, compressive molding planarization (COMP) to planarize uneven surface heights for switch membrane formation, and high-density, inductively coupled plasma chemical vapor deposition (HDICP-CVD) for low-temperature silicon nitride deposition. This technology promises the potential of further monolithic integration with antennas on the same PCBs to form reconfigurable antennas without the concerns of mismatching among components.     

Bounding relations for natural convection heat transfer from vertical printed circuit boards

The simplicity and convenience of direct cooling with freely circulating air, as well as the ubiquity of such systems in the marketplace, make this the technique of choice for many thermal packaging tasks. While standard heat transfer correlations are generally unsuitable for determining the detailed thermal behavior of individual components, the maximum surface temperature of integrated circuit packages mounted on PCBs can often be shown to lie between two analytical bounds: an upper, "asymmetric isoflux," bound based on heat transfer from just one side of the PCB and a lower, "symmetric isoflux," bound based on identical thermal transport from both sides of each PCB. Following a brief review of the development and validation of the theoretical symmetric and asymmetric isoflux relations for smooth-plate channels, this study focuses on the application of the proposed bounding relations to widely and closely spaced component-carrying PCBs. Successful comparison with much of the available data demonstrates the acceptable accuracy of these analytical expressions, for all except the narrowest spacings, and their utility to the thermal designer of air-cooled PCBs.     

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Multi-layered printed circuit boards (PCBs) contain a multi-layered structure that is suitable for high-speed and high-frequency applications. Hence, they are used extensively in electronic packaging assemblies for high-density applications. However, numerous composite parts and complex material properties of multi-layer PCBs complicate the reliability simulation of PCB model. This paper deals with a finite element analysis intended to describe numerically the behavior of multi-layered multi-materials PCB model (combination of metallic and composite plies) in the drop-impact performance. Through the comparison of physical drop test results, the fully multi-layered model illustrates higher accuracy if compared with that of the traditional simplified isotropic model and orthotropic model. The effects of material properties for the multi-layer PCB under drop-impact shock have also been investigated.     

浅谈印制电路板信号损耗测试技术

在印制电路板设计、生产等过程中,传输线的信号损耗是板材应用性能的重要参数。信号损耗测试是印制电路板的信号完整性的重要表征手段之一。本文介绍了目前业界使用的几种PCB传输线信号损耗测量方法的原理和相关应用,并分析了其优势和限制。     

Power bus isolation using power islands in printed circuit boards

Power islands are often employed in printed circuit board (PCB) designs to alleviate the problem of power bus noise coupling between circuits. Good isolation can be obtained over a wide frequency band due to the large series impedance provided by the gap between the power islands. However, power bus resonances may degrade the isolation at high frequencies. The amount of isolation also depends on the type of connection between power islands and the components on the board. This paper experimentally investigates the effectiveness of several power island structures up to 3.0 GHz     

Solder connections for high frequency applications between flexible and rigid printed circuit boards

This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.     

印制电路板高频介电常数测试技术现状分析

在印制电路板的设计、生产等过程中,板材的介电常数和介质损耗角正切都是影响板材应用性能的重要参数,因此,介电常数的测量准确性十分重要。本文介绍了目前使用的几种高频介电常数测量方法的原理、标准和相关产品,并分析了其优势和不足,以及测量技术的发展趋势。     

一种PCB表观检查机的无阴影高均匀照明方法

印刷电路板(PCB)表观检查机的检测算法,对亮度不均的阴影条纹的原始图像难以处理,最终影响PCB的检测性能。本文基于实验图像阴影条纹的形成机理,提出一种无阴影高均匀的PCB表观检查机照明方法。本方法采用4个荧光灯组成,其中两个光源与物面的镜面方向对称,用于高反射照明;另外两个光源用于漫反射照明。仿真和实验表明,本方法可以消除高反射曲面引起的图像阴影条纹,在PCB表观检查机系统中达到均匀照明效果且增强缺陷和背景的对比度。本方法也可应用于类似的高反射曲面的自动表观检查系统,如铝带缺陷检查,塑料薄膜缺陷检查等。     

An accurate experimental method for characterizing transmission lines embedded in multilayer printed circuit boards

We have developed an accurate method for measuring the complex propagation constant and characteristic impedance of transmission lines embedded in multilayer printed circuit boards. It is based on mathematical error-removal schemes using two different length transmission lines and an advanced via-hole structure that minimizes coupling. Consequently, associated errors, due to discontinuities and interference can be effectively eliminated, and the frequency dependencies of the transmission line parameters can be clarified in wide frequency bandwidths. We verified the validity of this method in frequency ranges up to at least 18 GHz, by comparing the determined values with the theory derived from transverse electromagnetic (TEM) approximations.