N面GaN材料及器件的研究进展

N面GaN材料及器件是宽禁带半导体技术中的重要研究内容.对N面GaN材料及器件的概念、优势、研究现状以及存在的问题进行了系统的分析.在此基础上,论述了N面GaN材料及器件未来的发展趋势.     

Synthesis and characterization of a wide bandgap polymer based on a weak donor-weak acceptor structure for dual applications in organic solar cells and organic photodetectors

We synthesized a novel wide bandgap polymer, PDTFBT, forming a weak donor (WD)-weak acceptor (WA) structure for use in organic photodetectors (OPDs) and organic solar cells (OSCs). The fluorination in the D unit and the alkoxy substitution in the A unit induced WD and WA properties, respectively. The WD-WA structure of PDTFBT effectively broadened the bandgap compared to typical D-A structures, and the S-F and S-O dipole-dipole interactions induces a highly planar backbone structure with excellent π-π stacking in the vertical direction. In OPDs, conformationally less disordered PDTFBT polymer retained the constant responsivity and significantly improved the detectivity of PDTFBT:PC₇₁BM devices even with a thick active layer of 470 nm, contrary to the variation in the responsivity of P3HT:PC₆₁BM devices depending on the thickness. In OSCs, the deep HOMO energy level (−5.57 eV) of PDTFBT led to high Voc of 0.92 V in PDTFBT:PC₇₁BM devices, which was 0.3 eV higher than that of P3HT:PC₆₁BM devices (0.62 V), resulting in 1.8-fold enhanced power conversion efficiency. We demonstrated that the WD-WA structure with S-F and S-O interactions is highly promising strategy to make wide bandgap polymers for organic photodetectors and for the bottom cell of tandem architecture.     

仿真技术在半导体和集成电路生产流程优化中的应用

半导体和集成电路制造是一个流程高度复杂,资金高度密集的加工过程。集成电路制造的特殊性表现在产品工序的繁多,对设备的高利用率要求,和“再进入”(Re-entry)的流程特点。这种特殊的工艺流程特点决定了半导体集成电路工序中的排队优化选择策略比其他制造行业更为复杂,对生产效率和制造周期有更直接的影响。本文通过EXTEND仿真软件对英特尔的一个微型晶圆试验台进行初步研究,来说明计算机仿真手段在半导体集成电路生产流程优化中的作用。     

Megasonic cleaning: A new cleaning and drying system for use in semiconductor processing

A compact system for cleaning wafers in all stages of device manufacture has been developed which uses high frequency (0.8 to 1 MHZ) ultrasonic energy (hence, the term “Megasonic”) and a standard chemical solution which is not heated. The patented process effectively removes particles down to approximately 0.3 ym diameter simultaneously from the front and back surfaces, thin organic films, and many ionic impurities. After a brief water rinse, the wafers are dried in a hot air stream. The total cycle time is approximately 15 minutes, and at least 100 wafers can be cleaned in quartz or plastic carriers at the same time and without the need for loading or unloading. Megasonic cleaning has been applied to silicon wafers, ceramics, and photomasks, and has been used for photo- Paper presented at 20th Annual Electronic Materials Conference, University of California at Santa Barbara, CA, June 30, 1978.     

小功率半导体激光二极管的稳定控制及其在原子实验中的应用

介绍一种高稳定的半导体激光二极管恒温、稳流控制方式。使用该方式电路，室温下半导体激光二极管注入电流波动为10^-5，温度波动优于10^-4。并介绍高稳定半导体二极管激光在原子超精细跃迁线形吸收谱和塞曼相干共振谱观测中的应用。     

科技传播创新发展中科技期刊编辑面对的挑战及对策

科学技术进步和创新,推动着科技期刊传播的创新,科技期刊编辑人员的综合素质直接影响科技期刊的质量。通过对现在科技期刊编辑现状进行分析,面对凸显的差距和挑战,提出了相应的对策,并提倡充分利用科技手段加强科技信息传播和发展。