激光波长对非晶硅薄膜晶化效果的影响

为研究波长对连续激光晶化非晶硅(a-Si) 薄膜过程的影响,利用连续Ar＋-Kr＋激光对a-Si薄膜晶 化,在5ms固定照射时间下,改变激光波长,采用拉曼光谱测试技术和场发射扫描电子显微 镜(SEM)研究在不同 激光功率密度下薄膜晶化后的特性。结果表明,a-Si薄膜的晶化阈值随着波长的 增大而增大,当波长为 458nm时薄膜晶化阈值为13.2kW/cm²,波长 为647nm时,晶化阈值为19.2kW/cm²;在激光功率密度范 围为0～27.1kW/cm²内,薄膜的最大晶化率受波长的影响相对较小 ,但总体也随着波长的增大而呈增大 趋势,当波长为647nm时,在激光功率密度26.5kW/cm²处,晶化率达到最大值75.85%。     

本征非晶硅薄膜的准分子激光晶化

为了减低非晶硅薄膜太阳能电池的光致衰减效应和提高其光电转换效率,用等离子体化学气相沉积系统制备了本征非晶硅薄膜,用波长为248nm的KrF准分子激光器激光晶化了非晶硅表层,用共焦显微喇曼测试技术研究了非晶硅薄膜在不同的激光能量密度和不同的频率下的晶化状态,并用扫描电子显微镜测试晶化前后薄膜的形貌。结果表明,随着激光能量密度的增大,薄膜晶化效果越来越好,能量密度达到268.54mJ/cm2时晶化效果最好,此时结晶比约为76.34%;最佳的激光能量密度范围是204.99mJ/cm2~268.54mJ/cm2,这时薄膜表面晶化良好;在1Hz~10Hz范围内,激光频率越大晶化效果越好;晶化后薄膜明显出现微晶和多晶颗粒,从而达到了良好的晶化效果。     

平顶绿光晶化制备多晶硅薄膜

利用倍频Nd∶YAG激光器使玻璃基底上沉积的非晶硅薄膜成功实现了晶化.YAG激光器的倍频绿光经蝇眼透镜阵列整形后得到一光强均匀分布的平顶光束,并用此光束对非晶硅薄膜进行扫描晶化处理.分别测量了激光晶化前后薄膜的拉曼谱和表面形貌.测量结果表明,非晶硅实现了到多晶硅的相变,且晶化处理后表面起伏度明显增大.根据拉曼谱的数据计算了不同激光能量密度下薄膜的粒度大小和结晶度.结果表明,在一定能量密度(400～850 mJcm2)范围内,结晶膜的晶粒粒度和结晶度随激光能量密度升高而增大.然而能量密度大于1000 mJ/cm2后,检测不到明显的多晶硅特征峰.激光能量密度在850 mJ/cm2左右可得到最佳晶化效果.     

非晶硅薄膜的准分子激光晶化研究

利用Kr准分子激光器晶化非晶硅薄膜, 研究了不同的激光能量密度和脉冲次数对非晶硅薄膜晶化效果的影响.利用X 射线衍射(XRD)和扫描电子显微镜(SEM)对晶化前后的样品的物相结构和表面形貌进行了表征和分析.实验结果表明, 在激光频率为1 Hz 的条件下, 能量密度约为180 mJ/cm2时,准分子激光退火处理实现了薄膜由非晶结构向多晶结构的转变;当大于晶化阈值180 mJ/cm2小于能量密度230 mJ/cm2时, 随着激光能量密度增大, 薄膜晶化效果越来越好;激光能量密度为230 mJ/cm2时, 晶化效果最好、晶粒尺寸最大, 约60 nm, 并且此时薄膜沿Si(111)面择优生长;脉冲次数50 次以后对晶化的影响不大.     

VO2薄膜材料的变温光学性质及1550 nm激光防护性能研究

具有半导体-金属态相变性质的二氧化钒材料可用于光电探测器的激光致盲防护。本文报道了基于磁控溅射法制备二氧化钒薄膜材料的结构、形貌特性,以及在不同温度下的光学性质。使用椭偏光谱法测量了下可见-近红外波段二氧化钒材料的椭偏参数,利用Gaussian、Lorentz模型获取了薄膜在相变前的光学性质,结合Drude模型拟合获取了材料在相变后的光学特性,获取了材料在300~1 700 nm之间的变温折射率和消光系数等参数。变功率下1 550 nm红外激光透射率的实验测试研究表明,VO₂薄膜样品的相变阈值功率为12 W/cm²,相变前后透射率由51%减小到15%~17%,开关率69%。     

纳米硅量子点/氮化硅三明治结构的电致发光

采用等离子体化学气相沉积技术制备了两种不同非晶硅层厚度的氮化硅/氢化非晶硅/氮化硅三明治结构,研究了不同能量激光退火对薄膜晶化的影响。通过拉曼分析,发现在激光能量为320mJ时,样品开始晶化,随着能量的提高晶化程度增加,在340mJ时达到最大。根据拉曼晶化峰的偏移,计算得出硅量子点尺寸为2.8nm和4.7nm,表明三明治结构对形成的硅量子点的尺寸具有限制作用。设计并制备了基于该结构的电致发光器件,在偏压大于10V时,在室温下可观测到电致发光。发现不同激光能量下晶化后的样品的电致发光强度不同,发光峰位在680nm和720nm附近。分析表明电致发光来源可以归结为电子空穴对在硅量子点中的辐射复合发光。     

固体纳秒激光器应用于非晶硅薄膜结晶的研究

多晶硅薄膜比非晶硅薄膜具有更高的电子迁移率,在器件中表现出更优良的性能,脉冲激光结晶非晶硅薄膜制备多晶硅薄膜的方法具有热积存小、对衬底影响小、成本低等优点。使用532 nm固体纳秒激光器进行了非晶硅薄膜激光结晶实验,为了解决直接使用高斯光束结晶时因光斑能量分布带来的结晶效果不均匀,首先基于光束整型系统将圆形的高斯光束整型成为线性平顶光束,而后研究单脉冲能量密度、脉冲个数、非晶硅薄膜厚度对结晶效果的影响。结果表明,线性平顶光束用于非晶硅薄膜结晶具有更好的均匀性,对于100 nm非晶硅薄膜,随着能量密度的增加,晶粒逐渐变大,直到表面出现热损伤,最大晶粒尺寸约为1 μm×500 nm。随着脉冲个数的增加,表面粗糙度有减小的趋势,观察到的最小粗糙度约为2.38 nm。对于20 nm超薄非晶硅薄膜,只有当能量密度位于134 mJ/cm2和167 mJ/cm2之间、脉冲个数大于或等于八个时才能观察到明显的结晶效果。     

连续氩氪离子激光晶化非晶硅薄膜的研究

为了研究连续激光晶化非晶硅薄膜中激光功率密度对晶化效果的影响,利用磁控溅射法制备非晶硅薄膜,采用连续氩氪混合离子激光器对薄膜进行退火晶化,用显微喇曼光谱测试技术和场发射扫描电子显微镜研究了薄膜在5ms固定时间下不同激光功率密度对晶化效果的影响,并对比了普通玻璃片和石英玻璃两种衬底上薄膜晶化过程的差异。结果表明,在一定激光功率密度范围内(0kW/cm2~27.1kW/cm2),当激光功率密度大于15.1kW/cm2时,普通玻璃衬底沉积的非晶硅薄膜开始实现晶化;随着激光功率密度的增大,晶化效果先逐渐变好,之后变差;激光功率密度增大到24.9kW/cm2时,薄膜表面呈现大面积散落的苹果状多晶硅颗粒,晶粒截面尺寸高达478nm ;激光功率密度存在一个中间值,使得晶化效果达到最佳;石英衬底上沉积的非晶硅薄膜则呈现与前者不同的结晶生长过程,当激光功率密度为19.7kW/cm2时,薄膜表面呈现大晶粒尺寸的球形多晶硅颗粒,并且晶粒尺寸随着激光功率密度的增大而增大,在 27.1kW/cm2处晶粒尺寸达到最大5.38m。研究结果对用连续激光晶化法制备多晶硅薄膜的研究具有积极意义。     

308nm准分子激光剥离聚酰亚胺薄膜实验研究

为了研究聚酰亚胺薄膜在308nm准分子激光下的剥离效果, 采用实验研究的方法, 分别探究了激光能量密度、光斑重叠率、脉冲频率、衬底温度对激光剥离效果的影响, 并结合显微镜观察剥离后的衬底和薄膜形貌。结果表明, 激光剥离能量阈值约为160mJ/cm2, 在激光能量密度为180mJ/cm2~190mJ/cm2左右、光斑重叠率为68.33%时, 剥离效果较好; 提高衬底温度有利于激光剥离过程。该研究对聚酰亚胺薄膜在柔性电子领域的工业化应用具有一定意义。     

生长条件对InGaN/GaN多量子阱表面v型缺陷的影响

我们研究了生长温度、TMIn/TEGa和Ⅴ/Ⅲ比对 InGaN/GaN多量子阱表面v型缺陷的影响。当TMIn的流量从180sccm增加到200sccm,v型缺陷的密度也从2.7210¹⁸/cm² 增加到了5.2410¹⁸ /cm², v型缺陷的深度和宽度也随着TMIn流量的增加而增加。当生长温度从748℃增加到758℃, v型缺陷的密度分别是2.0510⁸/cm², 2.7210⁸/cm² 和 4.2310⁸/cm²,V型缺陷的密度随着生长温度的增加而增加。当NH3的流量从5000sccm增加到8000sccm, v型缺陷的密度分别为 6.3410¹⁸/cm², 2.7210¹⁸/cm², 4.1310¹⁸/cm²。我们在753℃, TMIn 流量为180sccm, NH3 流量为6600sccm时,得到了晶体质量最好的InGaN/GaN 多量子阱,表面平整,v型缺陷的密度也比较少。V型缺陷的深度从10nm到30nm,宽度从100nm到200nm,为了抑制v型缺陷对GaN基LEDs反向电流(IR)和静电放电 (ESD) 的影响,我们需要生长更厚的p-GaN来填充这些v型缺陷。     

Selected area laser-crystallized polycrystalline silicon thin films by a pulsed Nd:YAG laser with 355 nm wavelength

Selected area laser-crystallized polycrystalline silicon(p-Si) thin films were prepared by the third harmonics (355 nm wavelength) generated by a solid-state pulsed Nd:YAG laser.Surface morphologies of 400 nm thick films after laser irradiation were analyzed.Raman spectra show that film crystallinity is improved with increase of laser energy.The optimum laser energy density is sensitive to the film thickness.The laser energy density for efficiently crystallizing amorphous silicon films is between 440-634 mJ/cm2 for 300 nm thick films and between 777-993 mJ/cm~2 for 400 nm thick films.The optimized laser energy density is 634,975 and 1571 mJ/cm~2 for 300,400 and 500 nm thick films,respectively.     

GaN基外延膜的激光剥离和InGaN LD外延膜的解理

利用波长为248nm的KrF准分子激光器进行了蓝宝石衬底GaN外延层剥离。对极薄的MOCVD生长的单层GaN外延膜(3μm)和InGaNLD外延膜(5μm)实现了大面积剥离。对剥离蓝宝石衬底背面抛光和未抛光外延片的不同特点作了比较,激光剥离所需的能量密度阈值分别约为200mJ/cm2和300mJ/cm2,优化结果表明,能量密度分别在400mJ/cm2和600mJ/cm2可实现稳定的剥离。同时对剥离后的InGaN多量子阱LD结构薄膜进行了解理,SEM观察显示获得的InGaNLD腔面平整光滑。基于这种技术可以获得无蓝宝石衬底的GaN基光电子和电子器件。     

Crystallization and ablation in annealing of amorphous-Si thin film on glass and crystalline-Si substrates irradiated by third harmonics of Nd:YAG laser

In the present research, an approach of converting amorphous-silicon (a-Si) thin films into polycrystalline thin films using the third harmonics of an all-solid-state pulsed Nd³⁺:YAG laser (355 nm) is studied. Two different samples of a-Si thin films on alkali-free glass (a-Si/glass) substrates and a-Si thin film on crystalline-Si substrates (a-Si/c-Si) are laser treated at different laser fluences ranging from 170 to 960 mJ/cm². The amount of heat incident on the surface has been analyzed theoretically by solving the one-dimensional heat-equation model. The ablation threshold, the region of crystallization and the depth of crystallization have been investigated theoretically. The influence of laser irradiation, ablation and crystallinity has been experimentally analyzed through in-situ reflectivity measurements, scanning electron microscopy (SEM) and Raman spectroscopy studies. In the case of a-Si/c-Si, the extent of crystallinity and the influence of structural characteristics on electronic properties are studied using the Hall-effect technique. The ablation threshold and the range of crystallization regime are in good agreement with the theoretical results. Laser fluence between 300 and 500 mJ/cm² is required for crystallization and the ablation threshold is estimated to be above 500 mJ/cm² for a-Si thin film with a thickness up to 400 nm.     

Laser-induced desorption of atomic and molecular fragments from a tin dioxide surface modified by a thin organic covering of copper phthalocyanine

The systematic features of laser-induced desorption from an SnO₂ surface exposed to 10-ns pulsed neodymium laser radiation are studied at the photon energy 2.34 eV, in the range of pulse energy densities 1 to 50 mJ/cm². As the threshold pulse energy 28 mJ/cm² is achieved, molecular oxygen O₂ is detected in the desorption mass spectra from the SnO₂ surface; as the threshold pulse energy 42 mJ/cm² is reached, tin Sn, and SnO and (SnO)₂ particle desorption is observed. The laser desorption mass spectra from the SnO₂ surface coated with an organic copper phthalocyanine (CuPc) film 50 nm thick are measured. It is shown that laser irradiation causes the fragmentation of CuPc molecules and the desorption of molecular fragments in the laser pulse energy density range 6 to 10 mJ/cm². Along with the desorption of molecular fragments, a weak desorption signal of the substrate components O₂, Sn, SnO, and (SnO)₂ is observed in the same energy range. Desorption energy thresholds of substrate atomic components from the organic film surface are approximately five times lower than thresholds of their desorption from the atomically clean SnO₂ surface, which indicates the diffusion of atomic components of the SnO₂ substrate to the bulk of the deposited organic film.     

Characterization and simulation analysis of laser-induced crystallization of amorphous silicon thin films

The effect of laser energy density on the crystallization of hydrogenated amorphous silicon (a-Si:H) thin films was studied theoretically and experimentally. The thin films were irritated with a frequency-doubled (λ=532 nm) Nd:YAG pulsed nanosecond laser. An effective finite element model was built to predict the melting threshold and the optimized laser energy density for crystallization of intrinsic amorphous silicon. Simulation analysis revealed variations in the temperature distribution with time and melting depth. The highest crystalline fraction measured by Raman spectroscopy (84.5%) agrees well with the optimized laser energy density (1000 mJ/cm²) in the transient-state simulation. The surface morphology of the thin films observed by optical microscopy is in fairly good agreement with the temperature distribution in the steady-state simulation.     

GaN/metal/Si heterostructure fabricated by metal bonding and laser lift-off

A process methodology has been adopted to transfer GaN thin films grown on sapphire substrates to Si substrates using metal bonding and laser lift-off techniques. After bonding, a single KrF (248 nm) excimer laser pulse was directed through the transparent sapphire substrates followed by low-temperature heat treatment to remove the substrates. The influence of bonding temperature and energy density of the excimer laser on the structure and optical properties of GaN films were investigated systemically. Atomic force microscopy, X-ray diffraction and photolumi-nescence measurements showed that (1) the quality of the GaN film was higher at a lower bonding temperature and lower energy density; (2) the threshold of the energy density of the excimer laser lift-off GaN was 300 mJ/cm~2. The root-mean-square roughness of the transferred GaN surface was about 50 nm at a bonding temperature of 400 ℃.     

脉冲激光扫描淀积类金刚石薄膜

采用能量密度为1.178×109W/cm2的XeCl准分子激光直接辐照高纯度的石墨靶,并同时采用辅助放电,在1×10-5Torr的真空环境中,于温度为80℃的Si(100)的基片上淀积出类金刚石薄膜,Raman光谱显示在1330cm-1处出现较强的散射峰值;对薄膜红外光谱进行测试,其光谱在2900cm-1处有吸收峰,表明所淀积的类金刚石薄膜含有C-H键,其H元素与C元素的比为45%.薄膜的电阻率为1.89×106Ω/cm,通过光吸收测得的该薄膜的能隙为1.55eV.     

Formation of silicon nanocrystals with preferred (100) orientation in amorphous Si:H films grown on glass substrates and exposed to nanosecond pulses of ultraviolet radiation

Using Raman scattering, it was ascertained that silicon nanocrystals with sizes exceeding 2 nm are formed in amorphous silicon films exposed to nanosecond ultraviolet laser radiation with energy densities ranging from 75 to 150 mJ/cm²; it is shown that these nanocrystals have sizes no smaller than 2 nm and have preferred (100) orientation along the normal to the film surface. In a system of mutually oriented Si nanocrystals, anisotropic behavior of the Raman scattering intensity was experimentally detected in various polarization configurations, which made it possible to determine the volume fraction of oriented nanocrystals. The orientational effect is presumably caused by both the macroscopic fields of elastic stresses in the film and the local fields of elastic stresses around the nanocrystals.