Enhanced Thermoelectric Properties of Antimony Telluride Thin Films with Preferred Orientation Prepared by Sputtering a Fan-Shaped Binary Composite Target

p-Type antimony telluride (Sb₂Te₃) thermoelectric thin films were deposited on BK7 glass substrates by ion beam sputter deposition using a fan-shaped binary composite target. The deposition temperature was varied from 100°C to 300°C in increments of 50°C. The influence of the deposition temperature on the microstructure, surface morphology, and thermoelectric properties of the thin films was systematically investigated. x-Ray diffraction results show that various alloy composition phases of the Sb₂Te₃ materials are grown when the deposition temperature is lower than 200°C. Preferred c-axis orientation of the Sb₂Te₃ thin film became obvious when the deposition temperature was above 200°C, and thin film with single-phase Sb₂Te₃ was obtained when the deposition temperature was 250°C. Scanning electron microscopy reveals that the average grain size of the films increases with increasing deposition temperature and that the thin film deposited at 250°C shows rhombohedral shape corresponding to the original Sb₂Te₃ structure. The room-temperature Seebeck coefficient and electrical conductivity range from 101 μV K^?1 to 161 μV K^?1 and 0.81 × 10³ S cm^?1 to 3.91 × 10³ S cm^?1, respectively, as the deposition temperature is increased from 100°C to 300°C. An optimal power factor of 6.12 × 10^?3 W m^?1 K^?2 is obtained for deposition temperature of 250°C. The thermoelectric properties of Sb₂Te₃ thin films have been found to be strongly enhanced when prepared using the fan-shaped binary composite target method with an appropriate substrate temperature.     

Enhancing the Thermoelectric Properties of Ca3Co4O9 Thin Films by the Addition of a Nanoscale NbN x Second Phase

High-quality Ca₃Co₄O₉ (CCO) thin films have been epitaxially grown on c-cut Al₂O₃ single crystal substrates using pulsed laser deposition (PLD). Different doses of Nb ions were injected into the films using an ion beam injection technique, and a nanoscale NbN _x second phase was generated in the films after annealing in pure N₂. The resistivity and Seebeck coefficient of the films were measured in the temperature range 175–375 K. The results demonstrated that the power factor of the films increases when injected with appropriate quantities of Nb. When the injected Nb concentration was 1.46 × 10²⁰/cm³, the power factor of the film reached 0.17 mW/m K² at room temperature, which is nearly twice as large as that for pure CCO film. A maximum value of 0.22 mW/m K² was obtained at 375 K.     

Effect of Annealing Ambient on the Electrical and Optical Properties of Aluminum-Doped ZnO Films Produced via a Sol–Gel Process

In this study, aluminum-doped ZnO (AZO) thin films were prepared by a sol–gel with spin coating process. The AZO films were annealed by a two-step process. The films were first annealed in air or nitrogen at 500°C for 3 h, followed by annealing in three types of ambient, i.e., vacuum (10^?3 Torr or 10^?6 Torr) or forming gas (10% H₂/90% N₂), at 500°C for 4 h. The effect of the annealing ambient on the microstructure, electrical and optical properties of the AZO films was explored by x-ray diffraction, field-emission scanning electron microscopy, four-point probe sheet resistivity measurements, Hall voltage measurements, and ultraviolet–visible spectroscopy. The results showed that the size of AZO particulates in the films was determined mainly by the first annealing step. The films annealed in air in the first step were composed of larger AZO particulates than those annealed in nitrogen. The conductivities of the AZO films were significantly increased by the second annealing step. Second annealing in a high-vacuum system (10^?6 Torr) led to the highest AZO film conductivity among the three ambients. Regardless of the various annealing processes, the films remained transparent under visible light and exhibited a sharp absorption edge in the ultraviolet region. The highest conductivity, i.e., 168 S cm^?1, was obtained from films annealed first in air and then in vacuum of 10^?6 Torr.     

Fabrication of a Flexible Bismuth Telluride Power Generation Module Using Microporous Polyimide Films as Substrates

In this study, we investigated the effect of the structure of microporous p-type (Bi_0.4Te₃Sb_1.6) and n-type (Bi_2.0Te_2.7Se_0.3) BiTe-based thin films on their thermoelectric performance. High-aspect-ratio porous thin films with pore depth greater than 1 μm and pore diameter ranging from 300 nm to 500 nm were prepared by oxygen plasma etching of polyimide (PI) layers capped with a heat-resistant block copolymer, which acted as the template. The cross-plane thermal conductivities of the porous p- and n-type thin films were 0.4 W m^?1 K^?1 and 0.42 W m^?1 K^?1, respectively, and the dimensionless figures of merit, ZT, of the p- and n-type BiTe films were estimated as 1.0 and 1.0, respectively, at room temperature. A prototype thermoelectric module consisting of 20 pairs of p- and n-type strips over an area of 3 cm × 5 cm was fabricated on the porous PI substrate. This module produced an output power of 0.1 mW and an output voltage of 0.6 V for a temperature difference of 130°C. The output power of the submicrostructured module was 1.5 times greater than that of a module based on smooth BiTe-based thin films. Thus, the thermoelectric performance of the thin films was improved owing to their submicroscale structure.     

Determination of the Origin of Crystal Orientation for Nanocrystalline Bismuth Telluride-Based Thin Films Prepared by Use of the Flash Evaporation Method

We have investigated the origin of crystal orientation for nanocrystalline bismuth telluride-based thin films. Thin films of p-type bismuth telluride antimony (Bi–Te–Sb) and n-type bismuth telluride selenide (Bi–Te–Se) were fabricated by a flash evaporation method, with exactly the same deposition conditions except for the elemental composition of the starting powders. For p-type Bi–Te–Sb thin films the main x-ray diffraction (XRD) peaks were from the c-axis (Σ{00l}/Σ{hkl} = 0.88) whereas n-type Bi–Te–Se thin films were randomly oriented (Σ{00l}/Σ{hkl} = 0.40). Crystal orientation, crystallinity, and crystallite size were improved for both types of thin film by sintering. For p-type Bi–Te–Sb thin films, especially, high-quality structures were obtained compared with those of n-type Bi–Te–Se thin films. We also estimated the thermoelectric properties of the as-grown and sintered thin films. The power factor was enhanced by sintering; maximum values were 34.9 μW/cm K² for p-type Bi–Te–Sb thin films at a sintering temperature of 300°C and 23.9 μW/cm K² for n-type Bi–Te–Se thin films at a sintering temperature of 350°C. The exact mechanisms of film growth are not yet clear but we deduce the crystal orientation originates from the size of nano-clusters generated on the tungsten boat during flash evaporation.     

Sequential Evaporation of Bi-Te Thin Films with Controllable Composition and Their Thermoelectric Transport Properties

We report a simplified sequential evaporation route that can deposit compositionally controllable Bi-Te thermoelectric (TE) thin films without the need for a highly controlled facility. Te and Bi granules were used as starting materials, with their ratio being adjusted to obtain Bi-Te films with different compositions and thicknesses. The as-evaporated and annealed films were subjected to structural and morphological analysis, and their transport properties were measured. X-Ray diffraction data revealed multiple phases for most films. Energy-dispersive x-ray spectroscopy showed that the film composition was Te-enriched due to the large vapor pressure difference of Te and Bi. A Bi₂Te₃ single phase was obtained in the annealed films, having nominal composition of BiTe_1.2. The existence of impurity phases, such as Bi₄Te₃ or elemental Te, was found in all the as-evaporated films and in the annealed films with other nominal Te/Bi ratios, which degraded the TE properties of the films by increasing their electrical conductivity and reducing their Seebeck coefficient. A pure Bi₂Te₃ film with nominal Te/Bi ratio of 1.2 exhibited a maximum power factor of 7.9 × 10^?4 W m^?1 K² after annealing at 200°C. This work demonstrated a simple, undemanding, reliable method to deposit Bi-Te-based TE thin films that can be utilized to fabricate low-cost TE microgenerators.     

Properties of ZnO Thin Films Codoped with Lithium and Phosphorus

The properties of ZnO thin films codoped with lithium and phosphorus have been characterized. The films were deposited from high-purity ZnO and Li₃PO₄ solid targets onto c-plane sapphire substrates by radiofrequency (RF) magnetron sputtering. A substrate temperature of 900°C was determined as optimum for depositing undoped ZnO films with background electron concentration of 9.9 × 10¹⁵ cm^?3 as the buffer layer on the sapphire substrate. Postdeposition annealing was carried out using rapid thermal processing in O₂ at temperatures ranging from 500°C to 1000°C for 3 min. Analyses performed using low-temperature photoluminescence spectroscopy measurements revealed luminescence peaks at 3.356 eV, 3.307 eV, 3.248 eV, and 3.203 eV at 12 K for the codoped samples. X-ray diffraction 2θ-scans showed a single peak at about 34.4° with full-width at half-maximum of about 0.09°. Hall-effect measurements revealed initial p-type conductivities, but these were unstable and toggled between p-type and n-type over time with Hall concentrations that varied between 2.05 × 10¹³ cm^?3 and 2.89 × 10¹⁵ cm^?3. The fluctuation in the carrier type could be due to lateral inhomogeneity in the hole concentration caused by stacking faults in the films. An additional cause could be the small Hall voltages in the measurements, which could be significantly impacted by even small spikes in signal noise inherent in the measurements.     

Effect of Temperature Cycling on Conduction Mechanisms in CdTe Thin Films

CdTe thin films of 500 Å thickness prepared by thermal evaporation technique were analyzed for leakage current and conduction mechanisms. Metal–insulator–metal (MIM) capacitors were fabricated using these films as a dielectric. These films have many possible applications, such as passivation for infrared diodes that operate at low temperatures (80 K). Direct-current (DC) current–voltage (I–V) and capacitance–voltage (C–V) measurements were performed on these films. Furthermore, the films were subjected to thermal cycling from 300 K to 80 K and back to 300 K. Typical minimum leakage currents near zero bias at room temperature varied between 0.9 nA and 0.1 μA, while low-temperature leakage currents were in the range of 9.5 pA to 0.5 nA, corresponding to resistivity values on the order of 10⁸ Ω-cm and 10¹⁰ Ω-cm, respectively. Well-known conduction mechanisms from the literature were utilized for fitting of measured I–V data. Our analysis indicates that the conduction mechanism in general is Ohmic for low fields <5 × 10⁴ V cm^?1, while the conduction mechanism for fields >6 × 10⁴ V cm^?1 is modified Poole–Frenkel (MPF) and Fowler–Nordheim (FN) tunneling at room temperature. At 80 K, Schottky-type conduction dominates. A significant observation is that the film did not show any appreciable degradation in leakage current characteristics due to the thermal cycling.     

Effects of Growth Temperature and Annealing on Properties of Zn3Sn2O7 Thin Films and Application in TFTs

The effects of growth temperature and annealing on the physical properties of Zn₃Sn₂O₇ thin films were investigated in this work. The Zn₃Sn₂O₇ thin films were deposited on glass substrates by radio frequency (rf) magnetron sputtering. It is found that the films are amorphous regardless of the growth temperature. The film grown at room temperature shows the highest mobility of 8.1 cm² V^?1 s^?1 and the lowest carrier concentration of 2.0 × 10¹⁵ cm^?3. The highest carrier concentration of 1.6 × 10¹⁹ cm^?3 is obtained at the growth temperature of 250°C. Annealing treatment of the Zn₃Sn₂O₇ thin films resulted in increases of carrier concentration and mobility. The average transmittance of the as-deposited and annealed films reaches 80%. By using a Zn₃Sn₂O₇ thin film as the channel and a Ta₂O₅ thin film as the insulating layer, we fabricated transparent Zn₃Sn₂O₇ thin-film transistors with field-effect mobility of 21.2 cm² V^?1 s^?1, on/off current ratio of 10⁵, threshold voltage of 0.8 V, and subthreshold swing of 0.8 V/decade.     

Effect of Annealing Temperature on Flowerlike Cu<Subscript>3</Subscript>BiS<Subscript>3</Subscript> Thin Films Grown by Chemical Bath Deposition

For widespread application of thin-film photovoltaic solar cells, synthesis of inexpensive absorber material is essential. In this work, deposition of ternary Cu₃BiS₃ absorber material, which contains abundant and environmentally benign elements, was carried out on glass substrate. Flowerlike Cu₃BiS₃ thin films with nanoflakes as building block were formed on glass substrate by chemical bath deposition. These films were annealed at 573 K and 673 K in sulfur ambient for structural improvement. Their structure was characterized using Raman spectroscopy, as well as their surface morphological and optical properties. The x-ray diffraction profile of as-deposited Cu₃BiS₃ thin film revealed amorphous structure, which transformed to orthorhombic phase after annealing. The Raman spectrum exhibited a characteristic peak at 290 cm^?1. Scanning electron microscopy of as-deposited Cu₃BiS₃ film confirmed formation of nanoflowers with diameter of around 1052 nm. Wettability testing of as-deposited Cu₃BiS₃ thin film demonstrated hydrophobic nature, which became hydrophilic after annealing. The measured ultraviolet–visible (UV–Vis) absorption spectra of the Cu₃BiS₃ thin films gave an absorption coefficient of 10⁵ cm^?1 and direct optical bandgap of about 1.42 eV after annealing treatment. Based on all these results, such Cu₃BiS₃ material may have potential applications in the photovoltaic field as an absorber layer.     

Effect of Initial Bulk Material Composition on Thermoelectric Properties of Bi2Te3 Thin Films

V₂VI₃ compounds and solid solutions based on them are known to be the best low-temperature thermoelectric (TE) materials. The predicted possibility of enhancement of the TE figure of merit in two-dimensional (2D) structures has stimulated studies of the properties of these materials in the thin-film state. The goal of the present work is to study the dependences of the Seebeck coefficient S, electrical conductivity σ, Hall coefficient R _H, charge carrier mobility μ _H, and TE power factor P = S ² σ of Bi₂Te₃ thin films on the composition of the initial bulk material used for preparing them. Thin films with thickness d = 200 nm to 250 nm were grown by thermal evaporation in vacuum of stoichiometric Bi₂Te₃ crystals (60.0 at.% Te) and of crystals with 62.8 at.% Te onto glass substrates at temperatures T _S of 320 K to 500 K. It was established that the conductivity type of the initial material is reproduced in films fairly well. For both materials, an increase in T _S leads to an increase in the thin-film structural perfection, better correspondence between the film composition and that of the initial material, and increase in S, R _H, μ _H, σ, and P. The room-temperature maximum values of P for the films grown from crystals with 60.0 at.% and 62.8 at.% Te are P = 7.5 × 10^?4 W/K² m and 35 × 10^?4 W/K² m, respectively. Thus, by using Bi₂Te₃ crystals with different stoichiometry as initial materials, one can control the conductivity type and TE parameters of the films, applying a simple and low-cost method of thermal evaporation from a single source.     

Development of 3.7 % Efficient Cu2ZnSnSe4 Solar Cells by Selenizing Cu-Zn-Sn Films Deposited by DC Sputtering on TiN-Protected Mo/Glass Substrates

Cu₂ZnSnSe₄ (CZTSe) films for solar cell devices were fabricated by sputtering of a Cu-Zn-Sn target followed by post-selenization at 500–600 °C for 1 h in the presence of single or double compensation discs to supply Se vapor. The optimized selenization conditions avoided the Se deficiency and enhanced the grain growth of CZTSe films. The 600 °C-selenized CZTSe films adjacent with double discs obtained the large grains of 2–5 μm and had a [Cu]/([Zn]+[Sn]) ratio of 0.94 and a [Zn]/[Sn] ratio of 1.34. In order to fabricate the device on Mo-coated glass substrates, a TiN reaction barrier layer was coated before the Cu-Zn-Sn sputtering coating. The TiN-CZTSe device had 3.7 % efficiency (η), as compared to 0.58 % for the TiN-free one. The efficient device had the CZTSe layer with hole concentration (n _p) of 3.4 × 10¹⁷ cm^?3, Hall mobility (μ) of 54 cm² V^?1 s^?1, and electrical conductivity (σ) of 2.9 Ω^?1 cm^?1.     

Vertically Aligned Nanocomposite Thin Films as a Cathode/Electrolyte Interface Layer for Thin‐Film Solid Oxide Fuel Cells

A thin layer of a vertically aligned nanocomposite (VAN) structure is deposited between the electrolyte, Ce_0.9Gd_0.1O_1.95 (CGO), and the thin‐film cathode layer, La_0.5Sr_0.5CoO₃ (LSCO), of a thin‐film solid‐oxide fuel cell (TFSOFC). The self‐assembled VAN nanostructure contains highly ordered alternating vertical columns of CGO and LSCO formed through a one‐step thin‐film deposition process that uses pulsed laser deposition. The VAN structure significantly improves the overall performance of the TFSOFC by increasing the interfacial area between the electrolyte and cathode. Low cathode polarization resistances of 9 × 10^?4 and 2.39 Ω were measured for the cells with the VAN interlayer at 600 and 400 °C, respectively. Furthermore, anode‐supported single cells with LSCO/CGO VAN interlayer demonstrate maximum power densities of 329, 546, 718, and 812 mW cm^?2 at 550, 600, 650, and 700 °C, respectively, with an open‐circuit voltage (OCV) of 1.13 V at 550 °C. The cells with the interlayer triple the overall power output at 650 °C compared to that achieved with the cells without an interlayer. The binary VAN interlayer could also act as a transition layer that improves adhesion and relieves both thermal stress and lattice strain between the cathode and the electrolyte.     

Effects of Nb Content on the Ferroelectric and Dielectric Properties of Nb/Nd-Co-doped Bi<Subscript>4</Subscript>Ti<Subscript>3</Subscript>O<Subscript>12</Subscript> Thin Films

Nd/Nb-co-substituted Bi_3.15Nd_0.85Ti_3?x Nb _x O₁₂ (BNTN _x , x = 0.01, 0.03, 0.05 and 0.07) thin films were grown on Pt/Ti/SiO₂/Si (100) substrates by chemical solution deposition. The effects of Nb content on the micro-structural, dielectric, ferroelectric, leakage current and capacitive properties of the BNTN _x thin films were investigated. A low-concentration substitution with Nb ions in BNTN _x can greatly enhance its remanent polarization (2P _r) and reduce the coercive field (2E _c) compared with those of Bi₄Ti₃O₁₂ (BIT) thin film. The highest 2P _r (71.4 μC/cm²) was observed in the BNTN_0.03 thin film when the 2E _c was 202 kV/cm. Leakage currents of all the films were on the order of 10^?6 to 10^?5 A/cm², and the BNTN_0.03 thin film has a minimum leakage current (2.1 × 10^?6 A/cm²) under the high electric field (267 kV/cm). Besides, the C–V curve of the BNTN_0.03 thin film is the most symmetrical, and the maximum tunability (21.0%) was also observed in this film. The BNTN_0.03 thin film shows the largest dielectric constant and the lowest dielectric loss and its maximum Curie temperature is 410 ± 5°C.     

Sb2Te3 and Bi2Te3 Thin Films Grown by Room-Temperature MBE

Sb₂Te₃ and Bi₂Te₃ thin films were grown on SiO₂ and BaF₂ substrates at room temperature using molecular beam epitaxy. Metallic layers with thicknesses of 0.2?nm were alternately deposited at room temperature, and the films were subsequently annealed at 250°C for 2?h. x-Ray diffraction and energy-filtered transmission electron microscopy (TEM) combined with high-accuracy energy-dispersive x-ray spectrometry revealed stoichiometric films, grain sizes of less than 500?nm, and a texture. High-quality in-plane thermoelectric properties were obtained for Sb₂Te₃ films at room temperature, i.e., low charge carrier density (2.6?×?10¹⁹?cm^?3), large thermopower (130???V?K^?1), large charge carrier mobility (402?cm²?V^?1?s^?1), and resulting large power factor (29???W?cm^?1?K^?2). Bi₂Te₃ films also showed low charge carrier density (2.7?×?10¹⁹?cm^?3), moderate thermopower (?153???V?K^?1), but very low charge carrier mobility (80?cm²?V^?1?s^?1), yielding low power factor (8???W?cm^?1?K^?2). The low mobilities were attributed to Bi-rich grain boundary phases identified by analytical energy-filtered TEM.     

Thermopower Enhancement of Bi2Te3 Films by Doping I Ions

The thermoelectric properties of I-doped Bi₂Te₃ films grown by metal-organic chemical vapor deposition have been studied. I-doped epitaxial (00l) Bi₂Te₃ films were successfully grown on 4° tilted GaAs (001) substrates at 360 °C. I concentration in the Bi₂Te₃ films was easily controlled by the variation in a flow rate of H₂ carrier gas for the delivery of an isopropyliodide precursor. As I ions in the as-grown Bi₂Te₃ films were not fully activated, they did not influence the carrier concentration and thermoelectric properties. However, a post-annealing process at 400 °C activated I ions as a donor, accompanied with an increase in the carrier concentration. Interestingly, the I-doped Bi₂Te₃ films after the post-annealing process also exhibited enhancement of the Seebeck coefficient at the same electron concentration compared to un-doped Bi₂Te₃ films. Through doping I ions into Bi₂Te₃, the thermopower was also enhanced in Bi₂Te₃, and a high power factor of 5 × 10^?3 W K^?2 m^?1 was achieved.     

Post-annealing Effect on Microstructures and Thermoelectric Properties of Bi0.45Sb1.55Te3 Thin Films Deposited by Co-sputtering

p-Type Bi_0.45Sb_1.55Te₃ thermoelectric (TE) thin films have been prepared at room temperature by a magnetron cosputtering process. The effect of postannealing on the microstructure and TE properties of Bi_0.45Sb_1.55Te₃ films has been investigated in the temperature range from room temperature to 350°C. x-Ray diffraction analysis shows that the annealed films have polycrystalline rhombohedral crystal structure, and the average grain size increases from 36?nm to 64?nm with increasing annealing temperature from room temperature to 350°C. Electron probe microanalysis shows that annealing above 250°C can cause Te reevaporation, which induces porous thin films and dramatically affects electrical transport properties of the thin films. TE properties of the films have been investigated at room temperature. The hole concentration shows a trend from descent to ascent and has a minimum value at the annealing temperature of 200°C, while the Seebeck coefficient shows an opposite trend and a maximum value of 245?μV?K^?1. The electrical resistivity monotonically decreases from 19.8?mΩ?cm to 1.4?mΩ?cm with increasing annealing temperature. Correspondingly, a maximum value of power factor, 27.4?μW?K^?2?cm^?1, was obtained at the annealing temperature of 250°C.     

Structural and Electrical Properties of Ag/<Emphasis Type="Italic">n</Emphasis>-TiO<Subscript>2</Subscript>/<Emphasis Type="Italic">p</Emphasis>-Si/Al Heterostructure Fabricated by Pulsed Laser Deposition Technique

We have investigated the structural and electrical characteristics of the Ag/n-TiO₂/p-Si/Al heterostructure. Thin films of pure TiO₂ were deposited on p-type silicon (100) by optimized pulsed laser ablation with a KrF-excimer laser in an oxygen-controlled environment. X-ray diffraction analysis showed the formation of crystalline TiO₂ film having a tetragonal texture with a strong (210) plane as the preferred direction. High purity aluminium and silver metals were deposited to obtain ohmic contacts on p-Si and n-TiO₂, respectively. The current–voltage (I–V) characteristics of the fabricated heterostructure were studied by using thermionic emission diffusion mechanism over the temperature range of 80–300 K. Parameters such as barrier height and ideality factor were derived from the measured I–V data of the heterostructure. The detailed analysis of I–V measurements revealed good rectifying behavior in the inhomogeneous Ag/n-TiO₂/p-Si(100)/Al heterostructure. The variations of barrier height and ideality factor with temperature and the non-linearity of the activation energy plot confirmed that barrier heights at the interface follow Gaussian distributions. The value of Richardson’s constant was found to be 6.73 × 10⁵ Am^?2 K^?2, which is of the order of the theoretical value 3.2 × 10⁵ Am^?2 K^?2. The capacitance–voltage (C–V) measurements of the heterostructure were investigated as a function of temperature. The frequency dependence (Mott–Schottky plot) of the C–V characteristics was also studied. These measurements indicate the occurrence of a built-in barrier and impurity concentration in TiO₂ film. The optical studies were also performed using a UV–Vis spectrophotometer. The optical band gap energy of TiO₂ films was found to be 3.60 eV.     

Improved Thermoelectric Performance of Free-Standing PEDOT:PSS/Bi2Te3 Films with Low Thermal Conductivity

Free-standing poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT: PSS)/Bi₂Te₃ thermoelectric (TE) composite films have been successfully prepared by a simple physical mixing method with different contents of Bi₂Te₃. x-Ray diffraction (XRD) and scanning electron microscopy were used to analyze the phase composition and microstructure of the composite films. Their TE performance from 100 K to 300 K was systematically investigated. The maximum electrical conductivity of the composite polymer film reached up to 421 S/cm when the film contained 10 wt.% Bi₂Te₃, corresponding to the highest power factor of 9.9 μW/m/K², while their Seebeck coefficient fluctuated smoothly in a tiny range (14.2 μV/K to 18.6 μV/K). In addition, a relatively low thermal conductivity of 0.07 ± 0.02 W/m/K has been obtained. The maximum figure of merit of the composite reached up to 0.04 at room temperature, which is a relatively high value in the organic TE field.     

Effects of NiO Layer on Anisotropic Magnetoresistance and Sensitivity of Ni81Fe19 Films

Magnetic thin films of Ta/NiO/Ni₈₁Fe₁₉/NiO/Ta were fabricated by a magnetron sputtering method. The effects of NiO layer thickness and substrate temperature on the anisotropic magnetoresistance (AMR) and the magnetic field sensitivity of these Ni₈₁Fe₁₉ films have been investigated. The results show that the AMR of 20-nm Ni₈₁Fe₁₉ film with 4-nm NiO achieves 5.02% at 450°C, while the magnetic field sensitivity achieves 9.00% × 10^?3 m A^?1 at the same conditions. These enhanced 40% and 230% comparing with the film without NiO layer, respectively.