Multistep sequential batch assembly of three-dimensional ferromagnetic microstructures with elastic hinges

In this paper, we have developed a process for multistep sequential batch assembly of complex three-dimensional (3-D) ferromagnetic microstructures. The process uses the magnetic torque generated by an external magnetic field perpendicular to the substrate to lift hinged structures. We found that a dimensionless factor that depends on the volume of the magnetic material and the stiffness of the hinges determines the sensitivity of the hinged microstructures to a magnetic field. This factor was used as a criterion in designing a process for sequential batch assembly, i.e., for setting appropriate differences in sensitivity. Using a dimensionless factor in the design of the sequential assembly simplified the assembly process, which requires only placing the structures on a permanent magnet, and which can be used to carry out multistep sequential batch assembly. We fabricated hinged microstructures, which consist of 4.5-/spl mu/m-thick electroplated Permalloy plates and 200-nm-thick nickel elastic hinges of various sizes. In an experiment, four plates (600 /spl mu/m/spl times/800 /spl mu/m) were lifted sequentially and out-of-plane microstructures were assembled in a four-step process. Assembly of more complex out-of-plane microstructures (e.g., regular tetrahedrons, 800 /spl mu/m long on one side) was also shown to be feasible using this method of sequential batch assembly. [1351].     

A micromechanical flow sensor for microfluidic applications

We fabricated a microfluidic flow meter and measured its response to fluid flow in a microfluidic channel. The flow meter consisted of a micromechanical plate, coupled to a laser deflection system to measure the deflection of the plate during fluid flow. The 100 /spl mu/m square plate was clamped on three sides and elevated 3 /spl mu/m above the bottom surface of the channel. The response of the flow meter was measured for flow rates, ranging from 2.1 to 41.7 /spl mu/L/min. Several fluids, with dynamic viscosities ranging from 0.8 to 4.5/spl times/10/sup -3/ N/m, were flowed through the channels. Flow was established in the microfluidic channel by means of a syringe pump, and the angular deflection of the plate monitored. The response of the plate to flow of a fluid with a viscosity of 4.5/spl times/10/sup -3/ N/m was linear for all flow rates, while the plate responded linearly to flow rates less than 4.2 /spl mu/L/min of solutions with lower dynamic viscosities. The sensitivity of the deflection of the plate to fluid flow was 12.5/spl plusmn/0.2 /spl mu/rad/(/spl mu/L/min), for a fluid with a viscosity of 4.5/spl times/10/sup -3/ N/m. The encapsulated plate provided local flow information along the length of a microfluidic channel.     

A water-powered micro drug delivery system

A plastic micro drug delivery system has been successfully demonstrated by utilizing the principle of osmosis without any electrical power consumption. The system has an osmotic microactuator (see Su, Lin, and Pisano, J. Microelectromech., vol. 11, pp. 736-7462, Dec. 2002) and a polydimethylsiloxane (PDMS) microfluidic cover compartment consisting of a reservoir, a microfluidic channel and a delivery port. The typical dimension of the microfluidic channel is 1 cm in length with a cross-sectional area of 30/spl times/100 /spl mu/m/sup 2/ to minimize the diffusive drug flow while pressure drop remains moderate. Using oxygen plasma to activate the surfaces of polymers for bonding, the osmotic actuator is bonded with the PDMS cover while liquid drug can be encapsulated during the bonding process. Employing the net water flow induced by osmosis, the prototype drug delivery system has a measured constant delivery rate at 0.2 /spl mu/L/h for 10 h with an accumulated delivery volume of 2 /spl mu/L. Both the delivery rate and volume could be altered by changing the design and process parameters for specific drug delivery applications up to a few years. Moreover, the induced osmotic pressure can be as high as 25 MPa to overcome possible blockages caused by cells or tissues during drug delivery operations.     

High-performance temperature-programmed microfabricated gas chromatography columns

This paper reports the first development of high-performance, silicon-glass micro-gas chromatography (/spl mu/GC) columns having integrated heaters and temperature sensors for temperature programming, and integrated pressure sensors for flow control. These 3-m long, 150-/spl mu/m wide and 250-/spl mu/m deep columns, integrated on a 3.3 cm square die, were fabricated using a silicon-on-glass dissolved wafer process. Demonstrating the contributions to heat dissipation from conduction, convection, and radiation with and without packaging, it is shown that using a 7.5-mm high atmospheric pressure package reduces power consumption to about 650 mW at 100/spl deg/C, while vacuum packaging reduces the steady-state power requirements to less than 100 mW. Under vacuum conditions, 600 mW is needed for a temperature-programming rate of 40/spl deg/C/min. The 2300 ppm//spl deg/C TCR of the temperature sensors and the 50 fF/kPa sensitivity of the pressure sensors satisfy the requirements needed to achieve reproducible separations in a /spl mu/GC system. Using these columns, highly resolved 20-component separations were obtained with analysis times that are a factor of two faster than isothermal responses.     

Piezoelectrically actuated dome-shaped diaphragm micropump

This paper describes a piezoelectric micropump built on a dome-shaped diaphragm with one-way parylene valves. The micropump uses piezoelectric ZnO film (less than 10 /spl mu/m thick) to actuate a parylene dome diaphragm, which is fabricated with an innovative, IC-compatible process on a silicon substrate. Piezoelectric ZnO film is sputter-deposited on a parylene dome diaphragm with its C-axis oriented perpendicular to the dome surface. Two one-way check valves (made of parylene) are integrated with a piezoelectrically actuated dome diaphragm to form a multi-chip micropump. The fabricated micropump (10/spl times/10/spl times/1.6 mm/sup 3/) consumes extremely low power (i.e., 3 mW to pump 3.2 /spl mu/L/min) and shows negligible leak up to 700 Pa static differential pressure.     

InP-based optical waveguide MEMS switches with evanescent coupling mechanism

An optical waveguide MEMS switch fabricated on an indium phosphide (InP) substrate for operation at 1550 nm wavelength is presented. Compared to other MEMS optical switches, which typically use relatively large mirrors or long end-coupled waveguides, our device uses a parallel switching mechanism. The device utilizes evanescent coupling between two closely-spaced waveguides fabricated side by side. Coupling is controlled by changing the gap and the coupling length between the two waveguides via electrostatic pull-in. This enables both optical switching and variable optical coupling at voltages below 10 V. Channel isolation as high as -47 dB and coupling efficiencies of up to 66% were obtained with switching losses of less than 0.5 dB. We also demonstrate voltage-controlled variable optical coupling over a 17.4 dB dynamic range. The devices are compact with 2 /spl mu/m/spl times/2 /spl mu/m core cross section and active area as small as 500 /spl mu/m/spl times/5 /spl mu/m. Due to the small travel range of the waveguides, fast operation is obtained with switching times as short as 4 /spl mu/s. Future devices can be scaled down to less than 1 /spl mu/m/spl times/1 /spl mu/m waveguide cross-sectional area and device length less than 100 /spl mu/m without significant change in device design.     

A monolithic three-axis micro-g micromachined silicon capacitive accelerometer

A monolithic three-axis micro-g resolution silicon capacitive accelerometer system utilizing a combined surface and bulk micromachining technology is demonstrated. The accelerometer system consists of three individual single-axis accelerometers fabricated in a single substrate using a common fabrication process. All three devices have 475-/spl mu/m-thick silicon proof-mass, large area polysilicon sense/drive electrodes, and small sensing gap (<1.5 /spl mu/m) formed by a2004 sacrificial oxide layer. The fabricated accelerometer is 7/spl times/9 mm/sup 2/ in size, has 100 Hz bandwidth, >/spl sim/5 pF/g measured sensitivity and calculated sub-/spl mu/g//spl radic/Hz mechanical noise floor for all three axes. The total measured noise floor of the hybrid accelerometer assembled with a CMOS interface circuit is 1.60 /spl mu/g//spl radic/Hz (>1.5 kHz) and 1.08 /spl mu/g//spl radic/Hz (>600 Hz) for in-plane and out-of-plane devices, respectively.     

A micromachining process for die-scale pattern transfer in ceramics and its application to bulk piezoelectric actuators

This paper reports on a batch mode planar pattern transfer process for bulk ceramics, glass, and other hard, brittle, nonconductive materials suitable for micromachined transducers and packages. The process is named LEEDUS, as it combines lithography, electroplating, batch mode micro electro-discharge machining (/spl mu/EDM) and batch mode micro ultrasonic machining (/spl mu/USM). An electroplating mold is first created on a silicon or metal wafer using standard lithography, then using the electroplated pattern as an electrode to /spl mu/EDM a hard metal (stainless steel or WC/Co) tool, which is finally used in the /spl mu/USM of the ceramic substrate. A related process (SEDUS) uses serial /spl mu/EDM and omits lithography for rapid prototyping of simple patterns. Feature sizes of 25 /spl mu/m within a 4.5/spl times/4.5 mm/sup 2/ die have been micromachined on glass-mica (Macor) ceramic plates with 34 /spl mu/m depth. The ultrasonic step achieves 18 /spl mu/m/min. machining rate, with a tool wear ratio of less than 6% for the stainless steel microtool. Other process characteristics are also described. As a demonstration, octagonal and circular spiral shaped in-plane actuators were fabricated from bulk lead zirconate titanate (PZT) plate using the LEEDUS/SEDUS process. A device of 20 /spl mu/m thickness and 450 /spl mu/m/spl times/420 /spl mu/m footprint produces a displacement of /spl ap/2/spl mu/m at 40 V.     

VHF single crystal silicon capacitive elliptic bulk-mode disk resonators-part II: implementation and characterization

This work, the second of two parts, reports on the implementation and characterization of high-quality factor (Q) side-supported single crystal silicon (SCS) disk resonators. The resonators are fabricated on SOI substrates using a HARPSS-based fabrication process and are 3 to 18 /spl mu/m thick. They consist of a single crystal silicon resonant disk structure and trench-refilled polysilicon drive and sense electrodes. The fabricated resonators have self-aligned, ultra-narrow capacitive gaps in the order of 100 nm. Quality factors of up to 46 000 in 100 mTorr vacuum and 26000 at atmospheric pressure are exhibited by 18 /spl mu/m thick SCS disk resonators of 30 /spl mu/m in diameter, operating in their elliptical bulk-mode at /spl sim/150 MHz. Motional resistance as low as 43.3 k/spl Omega/ was measured for an 18-/spl mu/m-thick resonator with 160 nm capacitive gaps at 149.3 MHz. The measured electrostatic frequency tuning of a 3-/spl mu/m-thick device with 120 nm capacitive gaps shows a tuning slope of -2.6 ppm/V. The temperature coefficient of frequency for this resonator is also measured to be -26 ppm//spl deg/C in the temperature range from 20 to 150/spl deg/C. The measurement results coincide with the electromechanical modeling presented in Part I.     

Surface micromachined metallic microneedles

In this paper, a method for fabricating surface micromachined, hollow, metallic microneedles is described. Single microneedle and multiple microneedle arrays with process enabled features such as complex tip geometries, micro barbs, mechanical penetration stops and multiple fluid output ports were fabricated, packaged and characterized. The microneedles were fabricated using electroplated metals including palladium, palladium-cobalt alloys and nickel as structural materials. The microneedles were 200 mm-2.0 cm in length with a cross-section of 70-200 /spl mu/m in width and 75-120 /spl mu/m in height, with a wall thickness of 30-35 /spl mu/m. The microneedle arrays were typically 9.0 mm in width and 3.0 mm in height with between 3 and 17 needles per array. Using water as the fluid medium, the average inlet pressure was found to be 30.0 KPa for a flow rate of 1000 /spl mu/L/h and 106 KPa for a flow rate 4000 /spl mu/L/h.     

Characterization of surface micromachined metallic microneedles

The purpose of the paper is to provide quantitative characterization of metallic microneedles. Mechanical and fluid flow experiments were performed to evaluate the buckling force, the penetration force, and the pressure versus flow rate characteristics of the microneedles. The microneedle design variations characterized included varying the shaft lengths, varying the tip taper angles/geometries, and the inclusion of micromechanical barbs. The penetration force was found to range from 7.8 gF for a microneedle of shaft length 500 /spl mu/m, to 9.4 gF for a length of 1500 /spl mu/m, both with a tip taper angle of 30/spl deg/. Microneedles with a linear tip taper angle of 30/spl deg/ penetrated 95 +% of the time without failure. The microneedles with a 15/spl deg/ and 20/spl deg/ linear tip taper penetrated 10% and 25% of the time, respectively. The buckling force was found to be 98.4 gF for a 500 /spl mu/m long microneedle shaft, 72.3 gF for a needle of shaft length 1000 /spl mu/m, and 51.6 gF for a 1500 /spl mu/m long shaft. The results demonstrate that the penetration force was 7.9% of the buckling force for 500 /spl mu/m long shafts, 11.6% for a 1000 /spl mu/m long shaft, and 18.2% for a 1500 /spl mu/m long microneedle shafts. The microneedle fluid flow characteristics were studied. An inlet pressure of 49.0 Pa was required for a flow rate of 1000 /spl mu/L/h and 243.0 Pa for a flow rate of 4000 /spl mu/L/h using air as the fluid medium. For water, an average pressure of 30.0 kPa was required for a flow rate of 1000 /spl mu/L/h and 106.0 kPa for a flow rate of 4000 /spl mu/L/h.     

Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding

In this paper, we present CMOS compatible fabrication of monocrystalline silicon micromirror arrays using membrane transfer bonding. To fabricate the micromirrors, a thin monocrystalline silicon device layer is transferred from a standard silicon-on-insulator (SOI) wafer to a target wafer (e.g., a CMOS wafer) using low-temperature adhesive wafer bonding. In this way, very flat, uniform and low-stress micromirror membranes made of monocrystalline silicon can be directly fabricated on top of CMOS circuits. The mirror fabrication does not contain any bond alignment between the wafers, thus, the mirror dimensions and alignment accuracies are only limited by the photolithographic steps. Micromirror arrays with 4/spl times/4 pixels and a pitch size of 16 /spl mu/m/spl times/16 /spl mu/m have been fabricated. The monocrystalline silicon micromirrors are 0.34 /spl mu/m thick and have feature sizes as small as 0.6 /spl mu/m. The distance between the addressing electrodes and the mirror membranes is 0.8 /spl mu/m. Torsional micromirror arrays are used as spatial light modulators, and have potential applications in projection display systems, pattern generators for maskless lithography systems, optical spectroscopy, and optical communication systems. In principle, the membrane transfer bonding technique can be applied for integration of CMOS circuits with any type of transducer that consists of membranes and that benefits from the use of high temperature annealed or monocrystalline materials. These types of devices include thermal infrared detectors, RF-MEMS devices, tuneable vertical cavity surface emitting lasers (VCSEL) and other optical transducers.     

High-resolution electrostatic analog tunable grating with a single-mask fabrication process

We present the design, modeling, fabrication, and characterization of the microelectromechanical systems (MEMS) analog tunable diffraction grating with the concept of transverse actuation. In contrast to the vertically actuated "digital" tunable grating, our prototype design trades angular tunable range for tuning resolution. The prototype shows an angular tunable range of 250 /spl mu/rad with 1-/spl mu/rad resolution at 10 V. Grating pitch changes corresponding to the full range and resolution are 57 nm and 2.28 /spl Aring/, respectively confirmed by experimental measurement and theoretical calculation. Simulation shows that subradian tunable range is feasible with better lithographic design rules or higher actuation voltage. The single-mask fabrication process offers several advantages: 1) Excellent optical flatness; 2) ease of fabrication; and 3) great flexibility of device integration with existing on-chip circuitry. Tunable gratings such as the one presented here can be used for controlling dispersion in optical telecommunications, sensing, etc., applications.     

Polymer-based cantilevers with integrated electrodes

An innovative release method of polymer cantilevers with embedded integrated metal electrodes is presented. The fabrication is based on the lithographic patterning of the electrode layout on a wafer surface, covered by two layers of SU-8 polymer: a 10-/spl mu/m-thick photo-structured layer for the cantilever, and a 200-/spl mu/m-thick layer for the chip body. The releasing method is based on dry etching of a 2-/spl mu/m-thick sacrificial polysilicon layer. Devices with complex electrode layout embedded in free-standing 500-/spl mu/m-long and 100-/spl mu/m-wide SU-8 cantilever were fabricated and tested. We have optimized major fabrication steps such as the optimization of the SU-8 chip geometry for reduced residual stress and for enhanced underetching, and by defining multiple metal layers [titanium (Ti), aluminum (Al), bismuth (Bi)] for improved adhesion between metallic electrodes and polymer. The process was validated for a miniature 2/spl times/2 /spl mu/m/sup 2/ Hall-sensor integrated at the apex of a polymer microcantilever for scanning magnetic field sensing. The cantilever has a spring constant of /spl cong/1 N/m and a resonance frequency of /spl cong/17 kHz. Galvanometric characterization of the Hall sensor showed an input/output resistance of 200/spl Omega/, a device sensitivity of 0.05 V/AT and a minimum detectable magnetic flux density of 9 /spl mu/T/Hz/sup 1/2/ at frequencies above 1 kHz at room temperature. Quantitative magnetic field measurements of a microcoil were performed. The generic method allows for a stable integration of electrodes into polymers MEMS and it can readily be used for other types of microsensors where conducting metal electrodes are integrated in cantilevers for advanced scanning probe sensing applications.     

Piston-motion micromirror based on electrowetting of liquid metals

This paper reports a new actuating method of a micromirror with piston motion by the electrowetting effect. Liquid metals drops (LMD), gallium and mercury, instead of conventional electrolyte solution, are used in the electrowetting experiments to reduce the vapor pressure and to increase the conductivity. An approximate formula of LMD height changes versus actuated voltage is deduced and the electrowetting setup is improved for actuating the mirror. The actuating performance of the LMD as a pivot is investigated. The hysteresis of contact angle is effectively minimized with argon sputtering the surface of the insulating layer, which makes the deformation of the LMD highly repeatable. The frequency response (0.01 Hz-3 kHz) and 6 vibration modes of the mercury drop are observed. The maximum acceleration of the drop during the actuation is 300 g (g=9/spl middot/8 m/s/sup 2/). We fabricated a 1000 /spl mu/m/spl times/1000 /spl mu/m/spl times/20 /spl mu/m, 50 /spl mu/g micromirror and an actuating circuit based on the electrowetting of liquid metal. With the LMD confine spot, a mercury drop of 500 /spl mu/m in diameter is placed between the mirror and the actuating electrodes. A 440-Hz sinusoidal voltage of 75 V actuates the micromirror, with a maximum of 60 /spl mu/m displacement.     

An in-plane high-sensitivity, low-noise micro-g silicon accelerometer with CMOS readout circuitry

A high-sensitivity, low-noise in-plane (lateral) capacitive silicon microaccelerometer utilizing a combined surface and bulk micromachining technology is reported. The accelerometer utilizes a 0.5-mm-thick, 2.4/spl times/1.0 mm/sup 2/ proof-mass and high aspect-ratio vertical polysilicon sensing electrodes fabricated using a trench refill process. The electrodes are separated from the proof-mass by a 1.1-/spl mu/m sensing gap formed using a sacrificial oxide layer. The measured device sensitivity is 5.6 pF/g. A CMOS readout circuit utilizing a switched-capacitor front-end /spl Sigma/-/spl Delta/ modulator operating at 1 MHz with chopper stabilization and correlated double sampling technique, can resolve a capacitance of 10 aF over a dynamic range of 120 dB in a 1 Hz BW. The measured input referred noise floor of the accelerometer-CMOS interface circuit is 1.6/spl mu/g//spl radic/Hz in atmosphere.     

Testing of "Venetian-Blind" silicon microstructures with optical methods

In this paper, we illustrate the design and testing of new silicon microstructures, fabricated by means of a conventional planar process. These "Venetian-blind" structures consist of arrays of narrow, rectangular suspended masses (width =31 /spl mu/m, length =400 /spl mu/m, thickness =15 /spl mu/m), which can be tilted using electrostatic actuation. Characterization of their static and dynamic behavior was performed with optical methods. The diffraction patterns in monochromatic light were analyzed and vibration measurements were performed by means of semiconductor laser feedback interferometry: experimental data on the tilt angle as a function of the applied voltage and on the resonance frequencies are reported. A maximum tilt angle of approximately 1.9/spl deg/ was obtained with a driving voltage in the range of 70-95 V. All the tested devices showed resonance frequencies higher than 80 kHz, which is fast enough (i.e., switching time in the millisecond range) for future use in optical interconnections. Numerical analyses were performed to evaluate the coupled electromechanical behavior of the microstructures, confirming the observed experimental behavior.     

A new edge-detected lift force flow sensor

A lift force gas flow sensor which uses the force normal to the fluid flow to measure the flow velocity has recently been introduced. Two thin plates mounted at an angle are deflected when they are subjected to fluid flow. For most mechanical flow sensors the flow sensitivity is closely connected to the time response. A weaker structure gives higher flow sensitivity but a lower natural frequency, i.e., a slower response time. The lift force sensor is designed for measurements of respiratory gas flow in ventilators, where, in addition to low flow restriction, both high sensitivity and fast response are required. A new type of suspension has now been realized for the lift force flow sensor. The detection is separated from the suspension of the airfoil plate with the strain gauges placed on separate detector beams. This leads to separate parameters for optimization of the lift force concept with "independent" control of flow sensitivity and natural frequency. This paper presents an analytical model, simulations and measurements on the new structure. The new edge-detected sensor has been experimentally evaluated for different lengths (100-600 /spl mu/m), widths (20-100 /spl mu/m) and thicknesses (8-20 /spl mu/m) of the detector beams. In accordance with the theory, the measurements show that the new structure has approximately three times the natural frequency of the old, center detected structure and similar or improved flow sensitivity. The evaluation has also resulted in a design scheme for optimal performance. A flow sensitivity of 0.65 /spl mu/V/V/(l/min)/sup 2/ has been obtained for the best edge-detected sensor with a natural frequency of 3.2 kHz.     

A low-temperature thin-film electroplated metal vacuum package

This paper presents a packaging technology that employs an electroplated nickel film to vacuum seal a MEMS structure at the wafer level. The package is fabricated in a low-temperature (<250/spl deg/C) 3-mask process by electroplating a 40-/spl mu/m-thick nickel film over an 8-/spl mu/m sacrificial photoresist that is removed prior to package sealing. A large fluidic access port enables an 800/spl times/800 /spl mu/m package to be released in less than three hours. MEMS device release is performed after the formation of the first level package. The maximum fabrication temperature of 250/spl deg/C represents the lowest temperature ever reported for thin film packages (previous low /spl sim/400/spl deg/C). Implementation of electrical feedthroughs in this process requires no planarization. Several mechanisms, based upon localized melting and Pb/Sn solder bumping, for sealing low fluidic resistance feedthroughs have been investigated. This package has been fabricated with an integrated Pirani gauge to further characterize the different sealing technologies. These gauges have been used to establish the hermeticity of the different sealing technologies and have measured a sealing pressure of /spl sim/1.5 torr. Short-term (/spl sim/several weeks) reliability data is also presented.     

Microplastic lens array fabricated by a hot intrusion process

A microplastic lens array has been successfully constructed on top of a 500-/spl mu/m-thick PC (Polycarbonate film) by using a micro hot intrusion process. A single-layer LIGA process is used to fabricate the high-aspect-ratio nickel mold insert that has circular hole patterns of 80 /spl mu/m in diameter and 200 /spl mu/m in depth. Under the hot intrusion process, plastic material can be intruded into these circular-shape holes and stopped at desired depth under elevated temperature and pressure to fabricate microlenses. By adjusting the embossing load, temperature and time, the curvature and height of the lens are controllable when the same mold insert is used. The optical properties of these microlenses have been characterized and the average radius of curvature is found as 41.4 /spl mu/m with a standard deviation of 1.05 /spl mu/m. Experimental characterization and theoretical model are conducted and developed for the micro-intrusion process in terms of the radius of curvature and height of the lenses and they correspond well with experimental data within 5% of variations. The focusing capability of the lenses is demonstrated by comparing the images of laser light with and without using the lenses. When the projection screen is placed 200 /spl mu/m away from the lens, the full-width at half-maximum (FWHM) for the lens is 110 /spl mu/m while the original FWHM of the optical fiber is 300 /spl mu/m.