Very high density RF MIM capacitors (17 fF//spl mu/m/sup 2/) using high-/spl kappa/ Al/sub 2/O/sub 3/ doped Ta/sub 2/O/sub 5/ dielectrics

Using high-/spl kappa/ Al/sub 2/O/sub 3/ doped Ta/sub 2/O/sub 5/ dielectric, we have obtained record high MIM capacitance density of 17 fF//spl mu/m/sup 2/ at 100 kHz, small 5% capacitance reduction to RF frequency range, and low leakage current density of 8.9/spl times/10/sup -7/ A/cm/sup 2/. In combination of both high capacitor density and low leakage current density, a very low leakage current of 5.2/spl times/10/sup -12/ A is calculated for a typical large 10 pF capacitor used in RF IC that is even smaller than that of a deep sub-/spl mu/m MOSFET. This very high capacitance density with good MIM capacitor characteristics can significantly reduce the chip size of RF ICs.     

A novel program-erasable high-/spl kappa/ AlN-Si MIS capacitor

We demonstrate a programmable-erasable MIS capacitor with a single layer high-/spl kappa/ AlN dielectric on Si having a high capacitance density of /spl sim/5 fF//spl mu/m/sup 2/. It has low program and erase voltages of +4 and -4 V, respectively. Such an erase function is not available in other single layer Al/sub 2/O/sub 3/, AlON, or other known high-/spl kappa/ dielectric capacitors, where the threshold voltage (V/sub th/) shifts continuously with voltage. This device exhibits good data retention with a V/sub th/ change of only 0.06 V after 10 000 s.     

MIM capacitors using atomic-layer-deposited high-/spl kappa/ (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ dielectrics

Metal-insulator-metal (MIM) capacitors with (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ high-/spl kappa/ dielectric films were investigated for the first time. The results show that both the capacitance density and voltage/temperature coefficients of capacitance (VCC/TCC) values decrease with increasing Al/sub 2/O/sub 3/ mole fraction. It was demonstrated that the (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ MIM capacitor with an Al/sub 2/O/sub 3/ mole fraction of 0.14 is optimized. It provides a high capacitance density (3.5 fF//spl mu/m/sup 2/) and low VCC values (/spl sim/140 ppm/V/sup 2/) at the same time. In addition, small frequency dependence, low loss tangent, and low leakage current are obtained. Also, no electrical degradation was observed for (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ MIM capacitors after N/sub 2/ annealing at 400/spl deg/C. These results show that the (HfO/sub 2/)/sub 0.86/(Al/sub 2/O/sub 3/)/sub 0.14/ MIM capacitor is very suitable for capacitor applications within the thermal budget of the back end of line process.     

High-density MIM capacitors using AlTaO/sub x/ dielectrics

The authors have obtained good MIM capacitor integrity of high-capacitance density of 10 fF//spl mu/m/sup 2/ using high-/spl kappa/ AlTaO/sub x/ fabricated at 400/spl deg/C. In addition, small voltage dependence of capacitance of <600 ppm (quadratic voltage coefficient of only 130 ppm/V/sup 2/) is obtained at 1 GHz using their mathematical derivation from measured high-frequency S parameters. These good results ensure the high-/spl kappa/ AlTaO/sub x/ MIM capacitor technology is useful for high-precision circuits operated at the RF frequency regime.     

Metal-insulator-metal RF bypass capacitor using niobium oxide (Nb/sub 2/O/sub 5/) with HfO/sub 2//Al/sub 2/O/sub 3/ barriers

A high capacitance density (C/sub density/) metal-insulator-metal (MIM) capacitor with niobium pentoxide (Nb/sub 2/O/sub 5/) whose k value is higher than 40, is developed for integrated RF bypass or decoupling capacitor application. Nb/sub 2/O/sub 5/ MIM with HfO/sub 2//Al/sub 2/O/sub 3/ barriers delivers a high C/sub density/ of >17 fF//spl mu/m/sup 2/ with excellent RF properties, while maintaining comparable leakage current and reliability properties with other high-k dielectrics. The capacitance from the dielectric is shown to be stable up to 20 GHz, and resonant frequency of 4.2 GHz and Q of 50 (at 1 GHz) is demonstrated when the capacitor is integrated using Cu-BEOL process.     

Improvement of voltage linearity in high-/spl kappa/ MIM capacitors using HfO/sub 2/-SiO/sub 2/ stacked dielectric

It is demonstrated that the voltage coefficients of capacitance (VCC) in high-/spl kappa/ metal-insulator-metal (MIM) capacitors can be actively engineered and voltage linearity can be significantly improved maintaining high capacitance density, by using a stacked insulator structure of high-/spl kappa/ and SiO/sub 2/ dielectrics. A MIM capacitor with capacitance density of 6 fF/spl mu/m/sup 2/ and quadratic VCC of only 14 ppm/V/sup 2/ has been demonstrated together with excellent frequency and temperature dependence (temperature coefficients of capacitance of 54 ppm /spl deg/C) as well as low leakage current of less than 10 nA/cm/sup 2/ up to 4 V at 125 /spl deg/C.     

Very high-density (23 fF//spl mu/m/sup 2/) RF MIM capacitors using high-/spl kappa/ TaTiO as the dielectric

A very high density of 23 fF//spl mu/m/sup 2/ has been measured in RF metal-insulator-metal (MIM) capacitors which use high-/spl kappa/ TaTiO as the dielectric. In addition, the devices show a small reduction of 1.8% in the capacitance, from 100 kHz to 10 GHz. Together with these characteristics the MIM capacitors show low leakage currents and a small voltage-dependence of capacitance at 1 GHz. These TaTiO MIM capacitors should be useful for precision RF circuits.     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

Characterization of accumulation layer capacitance for extracting data on high-/spl kappa/ gate dielectrics

A new parameter extraction technique has been outlined for high-/spl kappa/ gate dielectrics that directly yields values of the dielectric capacitance C/sub di/, the accumulation layer surface potential quotient, /spl beta//sub acc/, the flat-band voltage, the surface potential /spl phi//sub s/, the dielectric voltage, the channel doping density and the interface charge density at flat-band. The parallel capacitance, C/sub p/(=C/sub sc/+C/sub it/), was found to be an exponential function of /spl phi//sub s/ in the strong accumulation regime, for seven different high-/spl kappa/ gate dielectrics. The slope of the experimental lnC/sub p/(/spl phi//sub s/) plot, i.e., |/spl beta//sub acc/|, was found to depend strongly on the physical properties of the high-/spl kappa/ dielectric, i.e., was inversely proportional to [(/spl phi//sub b/m/sup *//m)/sup 1/2/K/C/sub di/], where /spl phi//sub b/ is the band offset, and m/sup */ is the effective tunneling mass. Extraction of /spl beta//sub acc/ represented an experimental carrier confinement index for the accumulation layer and an experimental gate-dielectric direct-tunneling current index. /spl beta//sub acc/ may also be an effective tool for monitoring the effects of post-deposition annealing/processing.     

High mobility NMOSFET structure with high-/spl kappa/ dielectric

High-/spl kappa/ NMOSFET structures designed for enhancement mode operation have been fabricated with mobilities exceeding 6000 cm/sup 2//Vs. The NMOSFET structures which have been grown by molecular beam epitaxy on 3-in semi-insulating GaAs substrate comprise a 10 nm strained InGaAs channel layer and a high-/spl kappa/ dielectric layer (/spl kappa//spl cong/20). Electron mobilities of >6000 and 3822 cm/sup 2//Vs have been measured for sheet carrier concentrations n/sub s/ of 2-3/spl times/10/sup 12/ and /spl cong/5.85/spl times/10/sup 12/ cm/sup -2/, respectively. Sheet resistivities as low as 280 /spl Omega//sq. have been obtained.     

RF, DC, and reliability characteristics of ALD HfO/sub 2/-Al/sub 2/O/sub 3/ laminate MIM capacitors for Si RF IC applications

High-performance metal-insulator-metal capacitors using atomic layer-deposited HfO/sub 2/-Al/sub 2/O/sub 3/ laminate are fabricated and characterized for RF and mixed-signal applications. The laminate capacitor can offer high capacitance density (12.8 fF//spl mu/m/sup 2/) up to 20 GHz, low leakage current of 4.9/spl times/10/sup -8/ A/cm/sup 2/ at 2 V and 125/spl deg/C, and small linear voltage coefficient of capacitance of 211 ppm/V at 1 MHz, which can easily satisfy RF capacitor requirements for year 2007 according to the International Technology Roadmap for Semiconductors. In addition, effects of constant voltage stress and temperature on leakage current and voltage linearity are comprehensively investigated, and dependences of quadratic voltage coefficient of capacitance (/spl alpha/) on frequency and thickness are also demonstrated. Meanwhile, the underlying mechanisms are also discussed.     

High work-function metal gate and high-/spl kappa/ dielectrics for charge trap flash memory device applications

We report the impact of high work-function (/spl Phi//sub M/) metal gate and high-/spl kappa/ dielectrics on memory properties of NAND-type charge trap Flash (CTF) memory devices. In this paper, theoretical and experimental studies show that high /spl Phi//sub M/ gate and high permittivity (high-/spl kappa/) dielectrics play a key role in eliminating electron back tunneling though the blocking dielectric during the erase operation. Techniques to improve erase efficiency of CTF memory devices with a fixed metal gate by employing various chemicals and structures are introduced and those mechanisms are discussed. Though process optimization of high /spl Phi//sub M/ gate and high-/spl kappa/ materials, enhanced CTF device characteristics such as high speed, large memory window, and good reliability characteristics of the CTF devices are obtained.     

A high-density MIM capacitor (13 fF//spl mu/m/sup 2/) using ALD HfO/sub 2/ dielectrics

Metal-insulator-metal (MIM) capacitors with different HfO/sub 2/ thickness have been investigated. The results show that both the capacitance density and voltage coefficients of capacitance (VCCs) increase with decreasing HfO/sub 2/ thickness. In addition, it is found that the VCCs decrease logarithmically with increasing thickness. Furthermore, the MIM capacitor with 10-nm HfO/sub 2/ shows a record high capacitance density of 13 fF//spl mu/m/sup 2/ and a VCC of 607 ppm/V, which can meet the requirement of the International Technology Roadmap for Semiconductors. It can also provide a low leakage current of 5.95 /spl times/ 10/sup -8/A/cm/sup 2/ at room temperature at 1 V, low tangent values below 0.05, and a small frequency dependence. These results indicate that the devices are suitable for use in silicon integrated circuit applications.     

Improved device performance and reliability in high /spl kappa/ HfTaTiO gate dielectric with TaN gate electrode

The device performance and reliability of higher-/spl kappa/ HfTaTiO gate dielectrics have been investigated in this letter. HfTaTiO dielectrics have been reported to have a high-/spl kappa/ value of 56 and acceptable barrier height relative to Si (1.0 eV). Through process optimization, an ultrathin equivalent oxide thickness (EOT) (/spl sim/9 /spl Aring/) has been achieved. HfTaTiO nMOSFET characteristics have been studied as well. The peak mobility of HfTaTiO is 50% higher than that of HfO/sub 2/ and its high field mobility is comparable to that of HfSiON with an intentionally grown SiO/sub 2/ interface, indicative of superior quality of the interface and bulk dielectric. In addition, HfTaTiO dielectric has a reduced stress-induced leakage current (SILC) and improved breakdown voltage compared to HfO/sub 2/ dielectric.     

Lanthanide (Tb)-doped HfO/sub 2/ for high-density MIM capacitors

A high-density metal-insulator-metal (MIM) capacitor with a lanthanide-doped HfO/sub 2/ dielectric prepared by physical vapor deposition (PVD) is presented for the first time. A significant improvement was shown in both the voltage coefficient of capacitance (VCC) and the leakage current density of MIM capacitor, yet the high capacitance density of HfO/sub 2/ dielectrics was maintained by achieving the doping of Tb with an optimum concentration in HfO/sub 2/. This technique allows utilizing thinner dielectric film in MIM capacitors and achieving a capacitance density as high as 13.3 fF//spl mu/m/sup 2/ with leakage current and VCC values that fully meet requirements from year 2005 for radio frequency (RF) bypass capacitors applications.     

RF Characteristics of a high-performance, 10-fF//spl mu/m/sup 2/ capacitor in a deep trench

We report the properties of a novel polysilicon-insulator-polysilicon trench capacitor with a 380-/spl Aring/ Si/sub 3/N/sub 4/ dielectric that is designed and fabricated for high-frequency bypass and decoupling applications. The capacitor has a specific capacitance as high as 10 fF//spl mu/m/sup 2/ normalized to its footprint area, and a breakdown voltage greater than 15 V at room temperature. The measured S-parameters are in excellent agreement with simulations of an equivalent circuit model that includes a shunt substrate resistance to ground (R/sub sub/). A geometric factor /spl mu/ is defined as the ratio of the imaginary parts of Y/sub 11/ and -Y/sub 21/ at low frequency. The values of /spl mu/ and, consequently, R/sub sub/ are extracted from fitting the measured S-parameter data, and the layout dependence of /spl mu/ and R/sub sub/ is also explained by the model.     

Physically based quantum-mechanical compact model of MOS devices substrate-injected tunneling current through ultrathin (EOT /spl sim/ 1 nm) SiO/sub 2/ and high-/spl kappa/ gate stacks

Building on a previously presented compact gate capacitance (C/sub g/-V/sub g/) model, a computationally efficient and accurate physically based compact model of gate substrate-injected tunneling current (I/sub g/-V/sub g/) is provided for both ultrathin SiO/sub 2/ and high-dielectric constant (high-/spl kappa/) gate stacks of equivalent oxide thickness (EOT) down to /spl sim/ 1 nm. Direct and Fowler-Nordheim tunneling from multiple discrete subbands in the strong inversion layer are addressed. Subband energies in the presence of wave function penetration into the gate dielectric, charge distributions among the subbands subject to Fermi-Dirac statistics, and the barrier potential are provided from the compact C/sub g/-V/sub g/ model. A modified version of the conventional Wentzel-Kramer-Brillouin approximation allows for the effects of the abrupt material interfaces and nonparabolicities in complex band structures of the individual dielectrics on the tunneling current. This compact model produces simulation results comparable to those obtained via computationally intense self-consistent Poisson-Schro/spl uml/dinger simulators with the same MOS devices structures and material parameters for 1-nm EOTs of SiO/sub 2/ and high-/spl kappa//SiO/sub 2/ gate stacks on (100) Si, respectively. Comparisons to experimental data for MOS devices with metal and polysilicon gates, ultrathin dielectrics of SiO/sub 2/, Si/sub 3/N/sub 4/, and high-/spl kappa/ (e.g., HfO/sub 2/) gate stacks on (100) Si with EOTs down to /spl sim/ 1-nm show excellent agreement.     

High performance quantum dot lasers on GaAs substrates operating in 1.5 /spl mu/m range

Stacked InAs/InGaAs quantum dots are used as an active media of metamorphic InGaAs-InGaAlAs lasers grown on GaAs substrates by molecular beam epitaxy. High quantum efficiency (/spl eta//sub i/>60%) and low internal losses (/spl alpha/<3-4 cm/sup -1/) are realised. The transparency current density per single QD layer is estimated as /spl sim/70 A/cm/sup 2/ and the characteristic temperature is 60 K (20-85/spl deg/C). The emission wavelength exceeds 1.51 /spl mu/m at temperatures above 60/spl deg/C.     

Si interlayer passivation on germanium MOS capacitors with high-/spl kappa/ dielectric and metal gate

We have demonstrated the advantages of silicon interlayer passivation on germanium MOS devices, with CVD HfO/sub 2/ as the high-/spl kappa/ dielectric and PVD TaN as the gate electrode. A silicon interlayer between a germanium substrate and a high-/spl kappa/ dielectric, deposited using SiH/sub 4/ gas at 580/spl deg/C, significantly improved the electrical characteristics of germanium devices in terms of low D/sub it/ (7/spl times/10/sup 10//cm/sup 2/-eV), less C- V hysteresis and frequency dispersion. Low leakage current density of 5/spl times/10/sup -7/ A/cm/sup 2/ at 1 V bias with EOT of 12.4 /spl Aring/ was achieved. Post-metallization annealing caused continuing V/sub fb/ positive shift and J/sub g/ increase with increased annealing temperature, which was possibly attributed to Ge diffusion into the dielectric during annealing.     

High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates

For the first time, transferring the prefabricated capacitors on a silicon wafer onto FR-4 has been used to realize high-density metal-insulator-metal (MIM) capacitors on an organic substrate. A high capacitance density /spl sim/85 nF/cm/sup 2/ was achieved on FR-4 substrate with PECVD silicon nitride as the dielectric layer. Excellent voltage coefficient (/spl sim/2.2 ppm/V/sup 2/) and temperature coefficient (/spl sim/38 ppm//spl deg/C) were obtained for capacitors on FR-4. Dielectric leakage and breakdown characteristics have been assessed, and the results demonstrated acceptable performance. Thus, this technology provides a new method to embed/integrate high-density capacitors on organic substrates for the system-in-package applications.