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以木薯淀粉为原料,甘油为增塑剂,马来酸酐(MA)为酯化剂,通过密炼机熔融反应共混制备木薯淀粉马来酸酯。研究了密炼时间、温度、转速及马来酸酐加入量对淀粉酯取代度(DS)的影响,并采用FTIR对淀粉酯的结构进行表征。实验结果表明,取代度随着密炼温度的升高和密炼时间的延长而增大,当密炼温度为130℃或密炼时间为12.5min时取代度变化变得比较平缓;随着密炼转速的增大,取代度先增大后减小,转速为70r·min-1时达到最大值;随马来酸酐含量的增加取代度近似呈线性增长。FTIR结果表明马来酸酐成功接枝到淀粉链上。 相似文献
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玄武岩纤维(BF)未经改性处理和经硅烷偶联剂(KH–550和KH–570)进行处理后,添加到高密度聚乙烯(PE–HD)基体树脂中,增强PE–HD的力学性能,用傅立叶变换红外光谱和扫描电子显微镜对硅烷偶联剂处理的BF进行表征,同时,用SEM观察BF增强PE–HD复合材料的拉伸断面。结果表明,随着未经改性处理BF添加量增加,PE–HD复合材料的拉伸强度、弯曲强度逐渐提高,当添加量达到30%时,拉伸强度达到45.5 MPa,提升79.1%;弯曲强度达到41.3 MPa,提升118.9%。经KH–550和KH–570处理的BF添加量达到20%时,PE–HD复合材料的拉伸强度均达到45 MPa以上,其后随着BF添加量继续增加,拉伸强度变化不大,而弯曲强度随BF添加量的增加逐渐增大。当BF添加量达到30%时,BF改性与否对PE–HD复合材料的力学性能的影响不大。当改性BF添加量为5%~15%时,KH–550改性的PE–HD复合材料的力学性能较KH–570改性的高;当改性BF添加量为20%,25%时,KH–570改性的PE–HD复合材料的力学性能较KH–550改性的高。 相似文献
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铈元素对热浸锌–铝–镁合金镀层显微组织及耐蚀性的影响 总被引:1,自引:0,他引:1
在Zn–Al–Mg镀液中添加不同量的稀土Ce以提高热浸镀Zn–Al–Mg合金层性能。通过分析合金镀层的表面形貌和截面形貌以及中性盐雾试验,系统地研究了镀液中Ce添加量对合金镀层显微组织结构和耐蚀性的影响。当铈的添加量≤0.05%(质量分数)时,随铈添加量增大,热浸镀Zn–Al–Mg合金层的晶粒逐渐细化,尺寸逐渐均匀;δ相层的厚度变化不大,而ζ相层略微减薄。当铈添加量0.05%时,随铈添加量增大,镀层合金相厚度骤减。中性盐雾试验表明,镀液中添加Ce有利于提高Zn–Al–Mg合金镀层的耐蚀性,但其添加量不宜超过0.05%。 相似文献
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研究了Mn含量对(Ti_(0.28)Cr_(0.50)V_(0.22))_(1-x)Mn_x(x=0,0.06,0.1,0.14)合金储氢性能的影响,结果表明:合金中Mn含量低于6%(atom)时,合金为单一的体心立方固溶体,随Mn量增加,合金放氢压力平台升高,PCT曲线斜率减小,但储氢容量变化不明显;当合金中Mn含量超过6%(atom)时,合金由固溶体和TiMn两相组成,合金的放氢平台压力虽然随Mn量增加而升高,但储氢容量却明显降低。(Ti_(0.28)Cr_(0.50)V_(0.22))_(1-x)Mn_x合金储氢性能变化原因,与合金中添加Mn元素改变了固溶体相的晶格常数和晶胞体积有关。 相似文献
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《塑料》2020,(4)
以乙烯-醋酸乙烯共聚物(EVA)作为基体树脂,制备短切碳纤维(SCF)含量为10%的EVA/SCF导热复合材料,并对工艺条件进行优化以提升制品的导热性能。分别研究了在密炼过程中,密炼转速和密炼温度对复合材料导热性能的影响。实验结果表明,当密炼转速和密炼温度分别为30 r/min和130℃时,材料的热导率为2.39 W/(m·K)。复合材料内大部分碳纤维的长度较长,在聚合物基体中分布不均,仅能在局部区域形成网络。随着密炼转速的增加,纤维长度逐渐变短,易于在复合材料内的大部分区域形成导热网络。当密炼转速为40 r/min时,制品热导率可达到2.47 W/(m·K)。虽然,继续提升密炼转速能够使碳纤维在聚合物中的分布更加均匀,但由于纤维长度过短不利于导热网络的形成,反而会导致制品热导率下降。经过进一步对密炼温度进行研究发现,在40 r/min的密炼转速下,更高的密炼温度能够有效改善SCF与基体EVA的界面结合效果,使制品的热导率由密炼温度80℃时的1.65 W/(m·K)大幅提升至密炼温度140℃时的2.48 W/(m·K)。 相似文献
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研究了石墨烯含量对储氢合金物相组成和电化学性能的影响。结果表明,不同石墨烯含量储氢合金都主要由La3Ni13B2、LaNi5和(Fe,Ni)相组成,La3Ni13B2和(Fe,Ni)相晶胞体积会随着石墨烯含量增加而增大,LaNi5相晶胞体积会随着石墨烯含量增加而减小。当石墨烯质量分数从0%增加至6%时,储氢合金的最大放电容量先增加后减小,在石墨烯质量分数为4%时取得储氢合金放电容量最大值(288.5 mA·h/g),且当循环周期为100次时,石墨烯质量分数为4%和6%的储氢合金的放电容量仍然高于未添加石墨烯的储氢合金。相同温度下,添加石墨烯的储氢合金的放电容量都高于未添加石墨烯的储氢合金,且石墨烯质量分数为4%的储氢合金具有最大放电容量。随着石墨烯质量分数从0%增加至6%,储氢合金的电荷转移电阻先减小后增大、电流密度和扩散系数先增大后减小,在石墨烯质量分数为4%时取得电荷转移电阻最小值、电流密度和扩散系数最大值,适宜的石墨烯添加量为4%。 相似文献
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通过高分子合金化,以L-S相转化法制备了PVC/PMMA非对称型合金微滤膜,考察了铸膜液结构对微滤膜结构与性能的影响.结果表明:随聚合物浓度、铸膜液温度升高合金膜水通量降低,平均孔径减小;增大PMMA含量,水通量上升,平均孔径增大;随添加剂量的增加,合金膜水通量上升,平均孔径减小. 相似文献
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在1550℃下将CaO-SiO2-Al2O3三元渣与Sn-Si合金混合精炼,降温熔析去除工业硅中的杂质B,考察了渣系光学碱度及合金组成对B去除的影响及作用机理. 结果表明,渣系光学碱度增大,BO1.5的活度系数降低明显,增加了B的分配系数,即增强了精炼效果. Sn-Si合金中Sn比例从0增至70%时,B在渣相与合金相间的分配系数从3.16提高至13.8,硅中B含量最低为0.89′10-6,最高除硼率为93.3%;当Sn比例大于30%时,合金粘度大幅降低,B的分配系数提高;当Sn比例为70%、合金粘度为0.61 mPa×s时,渣系CaO-SiO2-20%Al2O3与CaO-SiO2-40%Al2O3精炼工业硅所得最大B分配系数分别为10.1和12.3. 相似文献
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Duanzhi Duan Feng Han Jianjun Ding Qijing Lin Changsheng Li Chenying Wang Zhuangde Jiang 《Ceramics International》2021,47(16):22854-22863
This study aims to improve the hardness of solidified Cu–Sn–Ti solder alloys and reduce the erosion of diamonds caused by these solder alloys during brazing. To achieve this aim, a new type of multilayer graphene-modified Cu–Sn–Ti composite solder alloy was proposed for brazing diamonds. The brazed diamond specimens were subjected to morphological observation, characterization of the interfacial microstructures. The static compressive strength and impact toughness of brazed diamond grits were measured. The Vickers microhardness of the solidified solder alloy was quantified, and the microstructure of the solidified solder alloy was also analysed. The results show that brazed diamond specimens fabricated with the No. 2 composite alloy containing 1 wt% multilayer graphene exhibited the best morphology. Addition of excess multilayer graphene reduced the flow properties of the molten Cu–Sn–Ti composite solder alloy. The dominant phases in the solidified Cu–Sn–Ti solder alloys were α-(Cu), Sn3Ti5, and CuSn3Ti5. Cu, Sn, and Ti were adsorbed by the multilayer graphene, forming C-rich and TiC-dominant phases. Consequently, erosion of the diamonds was reduced during brazing, and TiC was formed in the solidified solder alloy. Thus, increasing the content of multilayer graphene enhanced the static compressive strength and impact toughness of the brazed diamond grits, and increased the hardness of the solidified Cu–Sn–Ti solder alloy. 相似文献
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R. Jušk?nas Z. Mockus S. Kanapeckait? G. Stalnionis A. Survila 《Electrochimica acta》2006,52(3):928-935
Studies of the phase and chemical compositions as well as of the surface morphology of Cu-Sn alloys electrodeposited in the sulphate solution containing laprol were carried out using the XRD, SEM, and EDX techniques. The multiphase composition—pure copper, the α-CuSn phase and the intermediate hcp phase were determined to be present in the deposits obtained at cathode potentials positive to that of the reversible of the Sn/Sn2+electrode. When the content of Sn in the deposit was higher than 12-13 at.%, the β and/or δ phases were determined to be present along with that mentioned above. The deposit obtained at the potentials negative to that of the reversible of the Sn/Sn2+ electrode presented the δ phase with low quantities of the pure Cu and α-CuSn phases. The grain size of deposits increased with the cathode potential until it was positive to that of the reversible of the Sn/Sn2+ electrode. The presence of Br− ions in the solution hindered the granular electrocrystallization and reduced the Sn proportion in the alloy. It was assumed that underpotential deposition (UPD) of Sn on copper could be responsible for the formation of the multiphase composition and the intermediate hcp phase. It was concluded that the brightness of the studied Cu-Sn coatings was conditioned by the surface morphology. 相似文献
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通过赫尔槽试验与直流电解试验,研究了添加剂在焦磷酸盐溶液体系无氰电镀铜-锡合金(低锡)工艺中的作用。该体系镀液组成与工艺条件为:Cu2P2O7·3H2O25g/L,Sn2P2O71.0g/L,K4P2O7·3H2O250g/L,K2HPO4·3H2O60g/L,温度25℃,pH8.5,电流密度1.0A/dm2。采用扫描电镜(SEM)、X射线衍射(XRD)、能谱(EDS)、中性盐雾试验等方法研究了添加剂对镀层组成结构、外观、耐腐蚀性能及微观形貌的影响。结果表明,焦磷酸盐溶液体系无氰电镀铜-锡合金(低锡)时使用有机胺类添加剂可抑制Sn的析出,使合金镀层致密均匀,耐蚀性能好。镀层结晶主要为Cu13.7Sn结构,镀层中Sn含量为9%~11%。镀液中添加剂的使用量增加,则合金镀层中的Sn含量降低。 相似文献
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Sn–Pb alloy‐loaded polystyrene (PS) composites were processed by powder mixing and hot pressing. For the composites hot‐pressed at the temperatures below the melting point of the alloy, the resistivity dropped sharply if the alloy volume fraction reached 20 vol %. When the composites were processed at temperatures above the melting point, such phenomenon disappeared. According to the SEM and energy dispersive analysis X‐ray (EDAX) analyses, the size and dispersion of Sn–Pb alloy particles in composites changed when the hot‐pressing temperature reached the melting point of the alloy, which resulted in the different forms of resistivity–filler volume fraction curves. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 1044–1050, 2000 相似文献