营养治疗对门诊血液透析患者的作用

利用中频磁控反应溅射技术在玻璃衬底上制备氮化铝(AlN)薄膜,并经退火处理.利用X-衍射和原子力显微镜分析了AlN薄膜的结构及表面形貌.结果表明,衬底温度和退火工艺对AlN薄膜的结构和表面形貌有重要影响.研究表明,衬底温度为230 ℃时,AlN薄膜的表面粗糙度最小,退火能减小AlN薄膜表面粗糙度.     

AlN缓冲层厚度对脉冲激光沉积技术生长的GaN薄膜性能的影响

在蓝宝石(Al2O3)衬底上应用脉冲激光沉积技术(PLD)生长不同厚度的AlN缓冲层后进行GaN薄膜外延生长。采用高分辨X射线衍射仪(HRXRD)和扫描电子显微镜(SEM)对外延生长所得GaN薄膜的晶体质量和表面形貌进行了表征。测试结果表明: 相比直接在Al2O3衬底上生长的GaN薄膜, 通过生长AlN缓冲层的GaN薄膜虽然晶体质量较差, 但表面较平整; 而且随着AlN缓冲层厚度的增加, GaN薄膜的晶体质量和表面平整度均逐渐提高。可见, AlN缓冲层厚度对在Al2O3衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响。     

AlN缓冲层厚度对脉冲激光沉积技术生长的GaN薄膜性能的影响

在蓝宝石(Al2O3)衬底上应用脉冲激光沉积技术(PLD)生长不同厚度的AlN缓冲层后进行GaN薄膜外延生长。采用高分辨X射线衍射仪(HRXRD)和扫描电子显微镜(SEM)对外延生长所得GaN薄膜的晶体质量和表面形貌进行了表征。测试结果表明:相比直接在Al2O3衬底上生长的GaN薄膜,通过生长AlN缓冲层的GaN薄膜虽然晶体质量较差,但表面较平整;而且随着AlN缓冲层厚度的增加,GaN薄膜的晶体质量和表面平整度均逐渐提高。可见,AlN缓冲层厚度对在Al2O3衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响。     

低温下磁控溅射AlN薄膜择优取向研究

研究了衬底温度从-20~20 ℃下射频磁控溅射AlN薄膜的择优取向程度。利用X线衍射（XRD）、原子力显微镜（AFM）和场发射电子显微镜（FESEM）对AlN薄膜的晶体结构、粗糙度及表面和断面形貌进行了分析。研究结果表明,当衬底温度低于0 ℃时,AlN薄膜中的（100）衍射峰消失,AlN薄膜以（002）面择优取向生长。当衬底温度降低时,AlN薄膜的晶粒大小和表面粗糙度减小。AlN薄膜在0 ℃下沉积具有最佳的择优取向程度和较低的表面粗糙度。     

衬底温度对反应磁控溅射制备AlN压电薄膜的影响

采用反应磁控溅射法在Si(111)衬底上沉积了AlN薄膜。XRD分析表明,在5种温度下,AlN均以(100)面取向,衬底温度的提高有利于薄膜结晶性的改善,在600℃以上时AlN中Al—N0键断裂,仅出现(100)衍射峰。AFM分析显示,在600℃时平均晶粒尺寸90nm,Z轴最高突起仅为23nm。     

氮氩体积流量比对AlN薄膜生长取向、晶体质量及沉积速率的影响及机理分析

采用反应磁控溅射法,在溅射气压、溅射功率和衬底温度恒定的条件下,通过调控氮氩体积流量比,在单晶Si衬底上制备AlN薄膜。利用X射线衍射仪(XRD)、原子力显微镜(AFM)和场发射扫描电子显微镜(FESEM)研究氮氩体积流量比对AlN薄膜的生长取向、晶体质量及沉积速率的影响规律并分析其机理。结果显示,提高氮氩体积流量比有利于AlN薄膜(002)择优取向的生长,但过高的氮氩体积流量比会降低薄膜的沉积速率。在溅射气压为5 mTorr(1 Torr=133.3 Pa)、溅射功率为500 W、衬底温度为200℃、氮氩体积流量(cm³/min)比为14∶6时,在单晶Si衬底上可以制备出质量较好的,具有良好(002)择优取向的AlN薄膜。研究结果可为反应磁控溅射制备高质量AlN薄膜提供工艺参数设置规律指导。     

AlN薄膜制备技术研究

采用磁控溅射法制备了AlN薄膜并研究了射频(RF)等离子清洗对AlN薄膜结晶取向度的影响,实验表明,RF等离子清洗基片3min后AlN薄膜c轴取向摇摆曲线半峰宽达到1.3°;通过Mo薄膜衬底对AlN薄膜结晶取向度的影响发现,取向度好的Mo薄膜衬底有利于c轴取向AlN薄膜的生长;Ar气体流量对AlN薄膜应力的影响使AlN薄膜应力从-390(压应力)~73 MPa(张应力)可调。     

c轴择优取向AlN薄膜的制备研究

采用MOCVD法在蓝宝石(0001)单晶衬底上生长AlN压电薄膜。用XRD和原子力显微(AFM)技术表征薄膜的微观结构。研究了衬底温度、TMA和NH3流量、反应室气压对AlN薄膜织构特性的影响,并对薄膜生长的工艺参数进行了相应优化。结果表明:在优化条件下制备的AlN薄膜高度c轴择优取向,(0002)峰摇摆曲线半高宽仅为0.10°,且薄膜表面平整,椭圆偏振法测出其折射率为2.0～2.4。     

衬底温度对AlN/ZnO复合薄膜结构形貌的影响

采用直流反应磁控溅射法在ZnO/Si基片上制备了良好(002)(c轴)取向的AlN薄膜,利用XRD、AFM对不同衬底温度下制备的AlN薄膜的结构、形貌进行了分析表征.结果表明,在一定湿度范围内(450～650℃),随着衬底温度的升高,晶粒逐渐长大,沉积速率增大,表面粗糙度先减小后增大;AlN(002)择优取向呈改善趋势,取向度先增大后减小,600℃时达到最佳.     

射频磁控溅射生长C轴择优取向AIN压电薄膜

采用射频磁控反应溅射工艺，在Si（400）衬底上制备了高c轴取向的AlN薄膜。用X射线衍射仪（XRD）分析了薄膜特征。研究了不同的Ar／N2比、衬底偏压、工作压强对AlN薄膜c轴择优取向的影响。研究了AlN薄膜在以氮终止的硅衬底和纯净硅衬底两种表面状态的生长机制，发现在以氮终止的硅衬底表面生长的AlN薄膜非常容易得到c轴择优取向的AlN薄膜。     

脉冲激光沉积制备TiN/AlN多层薄膜及其工艺研究

本文采用脉冲激光沉积（PLD）法,在单晶硅试样表面上沉积制备了TiN/AlN多层硬质薄膜;研究了激光能量、靶衬距离和基体温度等工艺参数对薄膜性能的影响。采用X射线衍射（XRD）、扫描电子显微镜（SEM）和显微硬度仪方法研究了薄膜的性能。结果表明：薄膜由TiN和立方AlN细晶和无定型的非晶TiN、AlN组成,薄膜的调制周期尺寸均在λ=（50-200）nm范围内,多层结构界面清晰;当多层薄膜调制周期在100nm以下时,薄膜的显微硬度明显高于TiN和AlN的混合硬度值。     

反应淀积氮化铝薄膜及其性质的研究

实验使用脉冲激光熔蚀金属铝靶,使溅射的物质粒子和真空室中的氮气反应以淀积氮化铝（ＡｌＮ）薄膜,淀积时引入氮气直流放电以促使Ａｌ和Ｎ发生完全反应制备高质量符合化学计量比的ＡｌＮ薄膜。讨论了脉冲能量密度、基底温度、气体放电对所沉积薄膜组织结构的影响。实验结果表明,当ＤＥ＝１．０Ｊ·ｃｍ－２,ＰＮ２＝１３．３３３ｋＰａ,Ｔｓｕｂ＝２００℃,Ｖ＝６５０Ｖ,ｆ＝５Ｈｚ,ｄＳ－Ｔ＝４ｃｍ时,高质量的ＡｌＮ薄膜被成功地沉积于Ｓｉ（１００）基片上。分析表明薄膜是具有高取向性的ＡｌＮ（１００）多晶膜,薄膜的能带间隙约为６．２ｅＶ,其电阻率和击穿电场分别为２×１０１３Ω·ｃｍ和３×１０６Ｖ·ｃｍ－１。     

氮气流量对磁控溅射AlN薄膜光学性能的影响

AlN薄膜因其具有优异的物理化学性能而有着广阔的应用前景,采用反应磁控溅射法在低温条件下制备AlN薄膜是近些年科研工作的热点.采用直流磁控溅射法,于室温下通入不同流量的氮气在p型硅(100)和载玻片衬底上沉积了AlN薄膜.利用傅里叶变换红外(FTIR)光谱仪、X射线衍射仪(XRD)、扫描电子显微镜(SEM)和分光光度计等分析薄膜的组分、结构、形貌和光学性能.结果表明随着氮气流量的增加,AIN薄膜质量变好,N2流量为8 cma/min时制备的AlN薄膜为六方纤锌矿结构,在680 cm-1处具有明显的FTIR吸收峰,进一步说明成功制备了AlN薄膜.在300～ 900 nm的波长范围内,薄膜透过率最高可达94％;薄膜带隙随着氮气流量的增加而增大,最大带隙约为4.04 eV.     

Preparation of Oriented Aluminum Nitride Thin Films on Polyimide Films and Piezoelectric Response with High Thermal Stability and Flexibility

c‐Axis oriented aluminum nitride (AlN) thin films are successfully prepared on amorphous polyimide films by radiofrequency magnetron reactive sputtering at room temperature. Structural analysis shows that the AlN films have a wurtzite structure and consist of c‐axis oriented columnar grains about 100 nm wide. The full width at half maximum of the X‐ray diffraction rocking curves and piezoelectric coefficient d₃₃ of the AlN films are 8.3° and 0.56 pC N^–1, respectively. The AlN films exhibit a piezoelectric response over a wide temperature range, from –196 to 300 °C, and can measure pressure within a wide range, from pulse waves of hundreds of pascals to 40 MPa. Moreover, the sensitivity of the AlN films increases with the number of times it was folded, suggesting that we can control the sensitivity of the AlN films by changing the geometric form. These results were achieved by a combination of preparing the oriented AlN thin films on polyimide films, and sandwiching the AlN and polymer films between top and bottom electrodes, such as Pt/AlN/polyimide/Pt. They are thin (less than 10 μm), self powered, adaptable to complex contours, and available in a variety of configurations. Although AlN is a piezoelectric ceramic, the AlN films are flexible and excellent in mechanical shock resistance.     

脉冲准分子激光沉积AlN薄膜的研究

采用ArF脉冲准分子激光沉积法并结合退火后处理工艺,在Si（111）衬底上成功地制备了AIN晶态薄膜。X射线衍射、扩展电阻与原子力显微镜等测试结果表明：薄膜具有（101）取向,平均晶粒大小为200nm;薄膜介电性能优异,扩展电阻在108Ω以上。     

Photolytic deposition of aluminum nitride and oxy-nitride films at temperatures ≤ 350k

Aluminum nitride and oxy-nitride thin films have been deposited on Si(100) substrates at temperatures of 300-350K by gas-phase excimer laser photolysis at 193 nm. The precursors used for this deposition process are trimethylamine alane and ammonia. The properties of these laser-deposited films were studied using scanning electron microscopy, energy dispersive x-ray analysis, and x-ray diffraction. X-ray photoelectron spectroscopy has been extensively used to provide information regarding the chemical compositions on the surface and in the bulk of these laser deposited films, as well as on the chemical states of the components of the films. Well-adhering, smooth, amorphous films of AlN are obtained at a substrate temperature of 350K using this technique.     

The properties of annealed AlN films deposited by pulsed laser deposition

AlN films deposited on SiC or sapphire substrates by pulsed laser deposition were annealed at 1200°C, 1400°C, and 1600°C for 30 min in an inert atmosphere to examine how their structure, surface morphology, and substrate-film interface are altered during high temperature thermal processing. Shifts in the x-ray rocking curve peaks suggest that annealing increases the film density or relaxes the films and reduces the c-axis Poisson compression. Scanning electron micrographs show that the AlN begins to noticeably evaporate at 1600°C, and the evaporation rate is higher for the films grown on sapphire because the as-deposited film contained more pinholes. Rutherford backscattering spectroscopy shows that the interface between the film and substrate improves with annealing temperature for SiC substrates, but the interface quality for the 1600°C anneal is poorer than it is for the 1400°C anneal when the substrate is sapphire. Transmission electron micrographs show that the as-deposited films on SiC contain many stacking faults, while those annealed at 1600°C have a columnar structure with slightly misoriented grains. The as-deposited films on sapphire have an incoherent interface, and voids are formed at the interface when the samples are annealed at 1600°C. Auger electron spectroscopy shows that virtually no intermixing occurs across the interface, and that the annealed films contain less oxygen than the as-grown films.     

Control of the structure and surface morphology of gallium nitride and aluminum nitride thin films by nitrogen background pressure in pulsed laser deposition

Thin films of AlN and GaN were grown by pulsed laser deposition on c-plane sapphire substrates. It is demonstrated that the structure and surface morphology of layers can actively be controlled by adjusting the nitrogen partial pressure during the growth. The observed trends in the structural quality of the thin films can be attributed to the changes in the surface diffusion of adatoms. It is argued that the surface diffusion of adatoms can be influenced by the collisions between the nitrogen gas molecules and the activated atoms which can reduce the kinetic energy of activated atoms and increase the rate of formation of immobile surface dimers. Through these nitrogen pressure related effects, thin films with microstructure ranging from crystalline to amorphous can be produced. The observed similar impact of nitrogen pressure on the growth of GaN and AlN thin films indicates that a pressure assisted growth procedure is generally applicable to design the surface morphology of group III-nitride thin films. A minimal surface root mean square roughness of 0.7 nm for amorphous AlN is obtained which compares well with the substrate roughness of 0.5 nm. Rutherford backscattering spectroscopy of thin films of GaN and AlN showed a large incorporation of oxygen which was found to reduce the lattice constants of GaN and AlN.     

使用椭偏光谱研究氮化铝薄膜在不同温度下的光学性质

通过椭偏仪对生长在蓝宝石上的不同厚度氮化铝薄膜的变温光学性质进行了研究, 并采用托克-洛伦兹模型对椭偏实验数据进行了拟合分析, 精确得到了氮化铝薄膜的厚度和光学常数(折射率n, 消光系数k)等.研究的结果表明: 相比薄的氮化铝薄膜, 厚的氮化铝薄膜的折射率较大.随着温度的升高, 氮化铝的折射率、消光系数和带隙会向低能端单调地移动(红移);厚度对带隙随温度改变的影响较小, 对折射率则有一定的影响.