Self-aligned locally diffused emitter (SALDE) silicon solar cell

This paper presents, for the first time, a low-cost, high-throughput manufacturing approach for fabricating n-base dendritic web silicon solar cells with selectively doped emitters and self-aligned aluminum contacts using rapid thermal processing (RTP) and screen printing. The self-aligned locally diffused emitter (SALDE) structure is p⁺ nn⁺⁺ where aluminum is screen-printed on a boron-doped emitter and fired in a belt furnace to form a deep self-doped p⁺-layer and a self-aligned positive contact to the emitter according to the well-known aluminum-silicon (Al---Si) alloying process. The SALDE structure preserves the shallow emitter (20.2 μm) everywhere except directly beneath the emitter contact. There the junction depth is greater than 5 μm, as desired, in order to shield carriers in the bulk silicon from that part of the silicon surface covered by metal where the recombination rate is high. This structure is realized by using n-base (rather than p-base) substrates and by utilizing screen-printed aluminum (rather than silver) emitter contacts. Prototype dendritic web silicon (web) cells (25 cm² area) with efficiencies up to 13.2% have been produced.     

Large-area high efficiency single crystalline silicon solar cells

This paper reports on a 100 cm² single crystalline silicon solar cell with a conversion efficiency of 19.44% (J_sc = 37.65 mA/cm², V_oc = 638 mV, FF = 0.809). The cell structure is as simple as only applying the textured surface, oxide passivation, and back surface field by the screen printing method. The comparison between cell performances of the CZ (Czochralski) and FZ (Floating zone) silicon substrates was investigated. The higher efficiency cells were obtained for the FZ substrate rather than the CZ substrate. The influence of the phosphorus concentration of the emitter on the cell efficiency has also been investigated. A good result was obtained when the surface concentration of phosphorus was 3 × 10²⁰ cm⁻³ and the junction depth was about 0.6 μm.     

Another approach to form p+ emitter for rear junction n-type solar cells: Above 17.0% efficiency cells with CVD boron-doped epitaxial emitter

Epitaxial boron-doped emitters by CVD can provide a valuable alternative to the use of aluminum or diffused boron for the creation of p-type emitters. Compared to the traditional boron-diffused emitters for high-efficiency cells, epitaxial emitters need shorter process time, no boron skin removal step and have more opportunities to optimize the emitter doping profile. Our work proves that epitaxial emitters can be a good alternative for the p-type emitter. Very promising cell results with the highest cell efficiency of 17.0% on FZ material with LPCVD emitter and 16.7% on CZ material with APCVD emitter under 1 Sun have been achieved. Good fill factors have been obtained, which indicate good metal contacts are obtained on the epitaxial emitter. Cell results on n-type material are very encouraging and indicate a high potential of such epitaxial emitters for rear junction n-type solar cells.     

Screen printed boron emitters for solar cells

Screen printed (SP) boron emitters are presented as a useful option for the manufacturing of p-type emitters of solar cells. Details are provided on the diffusion process, including deposition, drying and firing steps, the latter performed in an infrared belt furnace. Besides their main dependences on the firing conditions, the sheet resistances and dopant profiles of the resulting emitters reveal the relevance of the drying step and the exhaustion limits of the doping source. A characterization of the recombination concludes that moderate emitter saturation currents (J_oe<0.5 pA/cm²) and acceptable bulk lifetimes (τ_B>40 μs) can be obtained on Czochralski silicon wafers. Finally, Cz n-type 0.7 Ω cm solar cells are presented, which once again prove the feasibility of SP boron emitters and point to issues regarding their metallization.     

High-efficiency PERL and PERT silicon solar cells on FZ and MCZ substrates

High-efficiency PERL (passivated emitter, rear locally diffused) and PERT (passivated emitter, rear totally diffused) silicon solar cells have been fabricated on FZ and MCZ (magnetically confined Czochralski) substrates at the University of New South Wales. One of the PERL cells on FZ substrates demonstrated 24.7% efficiency at Sandia National Laboratories under the standard global AM1.5 spectrum (100 mW/cm²) at 25°C. Another PERT cell on a MCZ substrate, supplied by SEH, Japan, demonstrated 24.5% efficiency at Sandia under the same test conditions. Both these efficiencies are the highest ever reported for FZ and MCZ silicon cells, respectively. The cells made on MCZ substrates also showed stable cell performance.     

Optimisation of NaOH texturisation process of silicon wafers for heterojunction solar-cells applications

The formation of a pyramidal structure on the surface of 〈1 0 0〉-oriented monocrystalline-silicon wafers is an effective and well known method to reduce reflection losses from the front surface of both silicon solar cells and silicon-heterojunction solar cells (SHJs). The consequence of this texturisation is an important optical gain, with a subsequent increase of the short-circuit current density (J_sc) and thus of the conversion efficiency of the devices. On the other hand, silicon-heterojunction solar cells are critically affected by the surface quality of the c-Si substrates, so the right combination of optimum texturisation- and cleaning steps previous to emitter (a-Si:H) deposition are indispensable in the fabrication process. The main goal of this work has been to perform a systematic and comprehensive analysis aimed at optimising the texturisation process based on the use of alkali solutions of NaOH with de-ionised water (DIW) and isopropyl alcohol (IPA) in different types of monocrystalline-silicon wafers for silicon-heterojunction solar-cell (a-Si:H/c-Si) applications. Three types of 〈1 0 0〉 silicon substrates have been used: polished float-zone (FZ) wafers and rough- (as-cut) and polished Czochralski (CZ) wafers. The texturisation process has been evaluated from images obtained by Scanning Electron Microscopy (SEM) and from hemispherical-reflectance spectra. Different etching times, temperatures and NaOH concentrations of the solutions as well as cleaning treatments of the wafers prior to the texturisation process have been analysed. Results show different conditions of the optimum texturisation process for each type of silicon wafers. An effective texturisation of FZ and CZ substrates has been achieved. Finally, SHJ solar cells have been obtained from FZ and CZ silicon wafers textured by the chemical processes optimised in this work.     

Comparison of the properties of porous silicon films with different back contacts (Ag, Al) for possible photovoltaic applications

In this work, porous silicon (PS) films were prepared by anodization on polished substrates of (1 0 0) Si for a fixed current density (I_d)20 mA cm⁻² and for a fixed anodization time of 30 min using different screen-printed (SP) back contacts, namely Ag and Al. The properties of PS formed using Ag as the back contact were found to be superior compared to the corresponding film using Al as the back contact. The PS formed with Ag-back contact exhibits higher porosity, negligible photoluminescence (PL) decay, better adherence to the substrate and smooth surface morphology compared to that formed with Al as the back contact for the same current density and time of anodization. Fourier transform infrared (FTIR) studies indicated significant presence of Si–O related features at 1050–1150 cm⁻¹ for PS films formed with Al as back contact, which could be responsible for traps and interface (PS–Si) defect densities as compared to corresponding PS films with Ag as the back contact. Measurements of capacitance–voltage (C–V) and current–voltage (I–V) were used for the investigation of the electrical properties of PS films with different back contacts. The frequency-dependent C–V characteristics were analysed to understand the effects of interface states and traps on the properties of PS films. The results have been analysed in terms of eutectic temperature and back surface field (BSF) across the metal–silicon interface.     

A new back surface passivation stack for thin crystalline silicon solar cells with screen-printed back contacts

In order to manufacture high-efficiency Si solar cells with a passivated rear surface and local contacts, it is necessary to develop both an excellent rear-passivation scheme compatible with screen-printing technology and a robust patterning technique for local contact formation. In this work, we have fabricated Si solar cells on ∼130 μm thick substrates using manufacturable processing, where rear side was passivated with a plasma-enhanced chemical vapor deposited SiO_x/SiN_x/SiO_xN_y stack and local back contacts using laser. As a result of both the rear surface passivation stack and the laser-fired local contacts, cell efficiencies of up to 17.6% on a 148.6 cm² Float-zone Si wafer and 17.2% for a 156.8 cm² multicrystalline Si wafer were achieved. PC-1D calculations revealed that the cells had a back surface recombination velocity (BSRV) of ∼400 cm/s and a back surface reflectance (BSR) of over 90%, as opposed to standard full Al-BSF cells having a BSRV of ∼800 cm/s and a 70% BSR. This result clearly indicates that the new technique of the passivation scheme and the patterning using laser developed in this study are promising for manufacturing high-efficiency PERC-type thin Si solar cells.     

Ribbon Si solar cells with efficiencies over 18% by hydrogenation of defects

We have fabricated 4 cm² solar cells on String Ribbon Si wafers and edge-defined film-fed grown (EFG) Si wafers with using a combination of laboratory and industrial processes. The highest efficiency on String Ribbon Si wafer is 17.8% with an open circuit voltage (V_oc) of 620 mV, a short circuit current density (J_sc) of 36.8 mA/cm² and a fill factor (FF) of 0.78. The maximum efficiency on EFG Si is 18.2% with a V_oc of 620 mV, a J_sc of 37.5 mA/cm² and a FF of 0.78. These are the most efficient ribbon Si devices made to date, demonstrating the high quality of the processed Si ribbon and its potential for industrial cells. Co-firing of SiN_x and Al by rapid thermal processing was used to boost the minority carrier lifetime of bulk Si from 3–5 μs to 70–100 μs. Photolithography-defined front contacts were used to achieve low shading losses and low contact resistance with a good blue response. The effects of firing temperature and time were studied to understand the trade-off between hydrogen retention and Al-doped back surface field (Al-BSF) formation. Excellent bulk defect hydrogenation and high-quality thick Al-BSF formation was achieved in a very short time (1 s) at firing temperatures of 740–750 °C. It was found that the bulk lifetime decreases at annealing temperatures above 750 °C or annealing time above 1 s due to dissociation of hydrogenated defects.     

The influence of porous silicon coating on silicon solar cells with different emitter thicknesses

The influence of the emitter thickness on the photovoltaic properties of monocrystalline silicon solar cells with porous silicon was investigated. The measurements were carried out on n⁺p silicon junction whose emitter depth was varied between 0.5 and 2.2 μm. A thin porous silicon layer (PSL), less than 100 nm, was formed on the n⁺ emitter. The electrical properties of the samples with PS were improved with decrease of the n⁺p junction depth. Our results demonstrate short-circuit current values of about 35–37 mA/cm² using n⁺ region with 0.5 μm depth. The observed increase of the short-circuit current for samples with PS and thin emitter could be explained not only by the reduction of the reflection loss and surface recombination but also by the additional photogenerated carriers within the PSL. This assumption was confirmed by numerical modeling. The spectral response measurements were performed at a wavelength range of 0.4–1.1 μm. The relative spectral response showed a significant increase in the quantum efficiency of shorter wavelengths of 400–500 nm as a result of the PS coating. The obtained results point out that it would be possible to prepare a solar cell with 19–20% efficiency by the proposed simple technology.     

Excellent thermal stability of remote plasma-enhanced chemical vapour deposited silicon nitride films for the rear of screen-printed bifacial silicon solar cells

In this work the thermal stability of the electronic surface passivation of remote plasma-enhanced chemical vapour deposited (RPECVD) silicon nitride (SiN) films is investigated with the aim to establish a cost-effective screen-printing and firing-through-the-SiN process for bifacial silicon (Si) solar cells. As a key result, RPECVD SiN films provide an excellently thermally stable surface passivation quality if they feature a refractive index in the range between 2.0 and 2.2. After a short anneal above 850°C the surface recombination velocity on 1.5 Ωcm p-type float-zone (FZ) Si remains at a very low level of about 20 cm/s. First bifacial silicon solar cells with screen-printed rear contacts on 1.5 Ωcm p-type FZ Si yield a very promising rear efficiency of 13.4%.     

Development of RTP for industrial solar cell processing

Rapid Thermal Processing (RTP), originally developed for processing microelectronic devices has been investigated in the recent decade for its potential in the production of Si solar cells. This paper will discuss the use of RTP for industrial Si solar cells with screen-printed contacts. Printed metal contacts require adapted emitters when good fill factors should be achieved. Multi-crystalline Si substrates require to adapt the temperature ramps of RTP to avoid minority carrier lifetime degradation from activated defect centres. Finally, industrial processing requires high throughput that cannot be achieved with conventional RTP equipment. This paper will present an advanced selective emitter process and a recently developed continuous RTP system that meet for the first time the requirements to make RTP compatible with industrial solar cell processing. The limits of industrial RTP solar cell processing will be discussed.     

高效单晶硅太阳电池的研制

简述了高效单晶硅太阳电池的初步研制结果。对电阻率不同的ＣＺ和ＦＺ材料和不同的电池结构进行了实验。为了提高效率，对发射区钝化工艺、分区轻（ｎ＾＋）重（ｎ＾＋＋）扩散、背场、表面织构化技术和氯清洗等工艺进行试验研究。目前制备的最好电池，其效率为１８．６３％。     

Fundamental understanding and implementation of Al-enhanced PECVD SiNx hydrogenation in silicon ribbons

A low-cost, manufacturable defect gettering and passivation treatment, involving simultaneous anneal of a PECVD SiN_x film and a screen-printed Al layer, is found to improve the lifetime in Si ribbon materials from 1–10 μs to over 20 μs. Our results indicate that the optimum anneal temperature for SiN_x-induced hydrogenation is 700°C for EFG and increases to 825°C when Al is present on the back of the sample. This not only improves the degree of hydrogenation, but also forms an effective back surface field. We propose a three-step physical model, based on our results, in which defect passivation is governed by the release of hydrogen from the SiN_x film due to annealing, the generation of vacancies during Al–Si alloying, and the retention of hydrogen at defect sites due to rapid cooling. Controlled rapid cooling was implemented after the hydrogenation anneal to improve the retention of hydrogen at defect sites by incorporating an RTP contact firing scheme. RTP contact firing improved the performance of ribbon solar cells by 1.3–1.5% absolute when compared to slow, belt furnace contact firing. This enhancement was due to improved back surface recombination velocity, fill factor, and bulk lifetime. Enhanced hydrogenation and rapid heating and cooling resulted in screen-printed Si ribbon cell efficiencies approaching 15%.     

Optimization of thermal processing and device design for high-efficiency c-Si solar cells

To improve the cell performance of single-crystal silicon solar cells, the process conditions have been optimized by monitoring the bulk lifetime after each thermal step in the cell fabrication process. The emitter geometry, i.e., front and rear contact size and pitch were optimized, and the cells were fabricated through a set of environmentally considered processes, especially for surface treatment, oxidation, diffusion, and electrode fabrication. Conversion efficiency of 22.3% in a 4 cm² cell, and 22.6% in a 1 cm² cell, was attained, respectively, with structural features of SiO₂ single-AR, “inverted-pyramid” fron texture, point-contact with line-emitter for front electrodes, and locally diffused BSF for rear contacts.     

Analysis of thin silicon solar cells for high efficiency

A comprehensive theoretical analysis taking into account the contribution from both the emitter and base regions having finite surface recombination velocity has been developed for computing short-circuit current, open-circuit voltage, and efficiency of thin AR coated thin silicon solar cells with textured front surface. The dependence of efficiency on the front surface and back surface recombination velocities and on the cell parameters have been investigated in details for varying cell thickness considering the effects of bandgap narrowing and Auger recombination in the material. It is shown that efficiency exceeding 24% can be attained with silicon solar cells having thickness as low as 25 μm provided both front and back surfaces are well passivated (S < 10³cm/s) and the doping concentration in the base and emitter are in the range of 5 × 10¹⁶ to 10¹⁷cm⁻³ and 10¹⁸ to 5 × 10¹⁸cm⁻³, respectively. It is also shown that an efficiency of about 23% can be obtained for thin cells of 25 μm thickness with a much inferior quality materials having diffusion length of about 40 μm.     

Improved LDSE processing for the avoidance of overplating yielding 19.2% efficiency on commercial grade crystalline Si solar cell

A record in laser doped selective emitter (LDSE) solar cells with an efficiency η=19.2% is reported. In this study, we investigate the effect of SiN_x films for laser doped selective emitter solar cells with plated front contacts. It is observed that the condition of processes such as silicon nitride and laser doping (LD) is of critical importance prior to light induced plating. If these processes are not performed optimally, localized shunts may form during the light induced plating (LIP) process that then inhibit plating in the surrounding areas. In the previous work an efficiency of 18.3% has been achieved, even though the fill factor was only 74.2% and the cell suffered from additional shunting and shading losses due to overplating. However, in this work, we demonstrate that with the optimization of the PECVD SiN_x and metallization processes, cells have reached efficiencies of more than 19% on commercial grade p-type CZ Si substrates.     

The infrared processing in multicrystalline silicon solar cell low-cost technology

New directions in photovoltaics depend very often on financial possibilities and new equipment. In this paper, we present the modification of a standard screen-printing technology by using an infrared (IR) furnace for forming a n⁺/p structure with phosphorus-doped silica paste on 100 cm² multicrystalline silicon wafers. The solar cells were fabricated on 300 μm thick 1 Ω cm p-type multicrystalline Bayer silicon. The average results for 100 cm² multicrystalline silicon solar cells are: I_sc=2589 mA, V_oc=599 mV, FF=0.74, E_ff=11.5%. The cross-sections of the contacts metallized in the IR furnace, as determined by scanning electron microscopy, and the phosphorus profile measured by an electrochemical profiler are shown. IR processing offers many advantages, such as a small overall thermal budget, low power and time consumption, in terms of a cost-effective technology for the continuous preparation of solar cells.     

Improved efficiency of Al0.36Ga0.64As solar cells with a ppnn structure

Improvement of efficiency of Al_0.36Ga_0.64As solar cells is advanced in two aspects of minority-carrier lifetime: reduction of majority-carrier concentration in the emitter and base layers, and reduction of deep levels in the back-surface-field (BSF) layer. A pp⁻n⁻n structure is proposed to optimize the use of the effect of reduced majority-carrier concentration, and its effectiveness verified in a preparatory experiment on Al_0.3Ga_0.7As solar cells. A very poor photoluminescence (PL) decay time (below 0.3 ns) of a BSF layer heavily doped with Si becomes 14-fold longer when Se is applied to the dopant instead of Si, resulting in an improvement of the external quantum efficiency near the absorption edge. These two aspects of this study lead to the realization of 16.6% efficiency under 1-sun, AM 1.5 global conditions with an Al_0.36Ga_0.64As solar cell.     

Optimization of lead- and cadmium-free front contact silver paste formulation to achieve high fill factors for industrial screen-printed Si solar cells

Screen-printed n⁺–p–p⁺ solar cells were fabricated on Cz single crystalline Si material, with a 45 Ω/sq emitter and PECVD SiNx antireflective coating with a thickness of 700 Å, using different Ag pastes and commercial leaded reference paste (CN33-462, Ferro Corp.). Ag and Al contacts were co-fired using a mass-production line equipped with mesh belt conveyer furnace systems (Centrotherm thermal solution GmbH & Co. KG). The average results for single crystalline Si solar cells (156 cm²) are: I_sc=5.043 A, V_oc=0.621 V, R_s=0.0087 Ω, R_sh=15.3 Ω, FF=0.773, and E_ff=16.45%. R_sh and fill factor values of fabricated cells were slightly higher when compared with the commercial leaded Ag paste, although cells were fabricated by metallizing the lead-free silver pastes. For the lead-free Ag paste used in this study, the line pattern continuity is retained with improved edge definition in sharp contrast to that of reference Ag paste. Average value of R_s was also equivalent approximately to that of the leaded Ag paste.