共查询到18条相似文献,搜索用时 93 毫秒
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带质量块硅悬臂梁加速度传感器的特殊工艺 总被引:2,自引:0,他引:2
对带质量块的悬臂梁加速度传感器的特殊工艺:硅梁及形状控制的各向异性腐蚀,梁厚的精确控制、双面光刻、有孔硅片匀胶等技术进行了研究,为批量生产克服了工艺障碍。 相似文献
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针对铂湿法刻蚀工艺,提出了间断性腐蚀法,并与边腐蚀边搅拌法和静止法进行了对比,结果显示该方法腐蚀铂曲线光滑、效果好。之后,以普通硅片作为衬底材料,二氧化硅作为隔热层,采用上述微机电(MEMS)工艺加工制作了铂热敏传感器。经热敏性能测试,其电阻温度系数在20℃~80℃时为1571.2×10-6/℃;同一批次电阻阻值均匀性为0.35%;非线性度为0.57%;热时间常数为1.1μs;在0.5 h的稳定性测试中其变化幅值为0.005Ω,即精度为0.01%。该热敏传感器制作工艺简单,性能优异,可用于温度敏感、气体传感等热敏传感。 相似文献
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以膜厚为250 μm的Al2O3膜为微结构基板、95#Al2O3瓷板为微壳结构体,设计并采用激光微加工技术制作了具有Φ0.2 mm微孔通道的微结构传感器.阐述了CuCl杂化修饰CuPc的工艺过程,并通过真空镀膜形成气敏膜.实现了主动吸气的检测模式,提高了响应时间和气敏性.通过SEM分析得到了良好的表面形貌和膜尺寸,用做电极和加热器Pt膜厚为500nm,敏感膜厚为150 nm,微壳深度为150~200μm.测试结果表明对Cl2具有较好的敏感响应,灵敏度为0.01%浓度下0.25倍,并呈现P型半导体的变化规律.研究了通气状态和加热电压对传感器响应和气敏性的影响. 相似文献
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硅各向异性腐蚀过程复杂,采用元胞自动机模拟硅各向异性腐蚀非常耗时。为了加速腐蚀模拟过程,研究了基于图形处理器(GPU)进行硅的各向异性腐蚀模拟。针对串行算法直接并行化方法存在加速效率低等问题,提出了一个改进的并行模拟方法。该方法增加了并行部分的负载,减少了内存管理的开销,从而提高了加速性能。实验证明该方法能够获得较理想的加速比。 相似文献
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Irena ZubelAuthor Vitae Krzysztof RolaAuthor VitaeMa?gorzata KramkowskaAuthor Vitae 《Sensors and actuators. A, Physical》2011,171(2):436-445
In this paper the process of silicon anisotropic etching in KOH solutions containing isopropyl alcohol in a wide concentration range is extensively studied. Though the alcohol does not take part in the etching process itself, it strongly affects the etching results. Both etch rates and the roughness of etched surfaces depend on the alcohol concentration in the etching solution, which is connected with the adsorption phenomena on the etched surface. The surface coverage with alcohol depends on the level of saturation of the etching solution and crystallographic orientation of an etched surface. It was observed that the best morphology of (1 1 0) surface was achieved just below saturation level with IPA whereas the (1 0 0) surfaces were improving above the saturation. A model, which explains these phenomena, was proposed. Based on this model, a simple way of selection of the composition of KOH solutions with alcohol additives, assuring optimization of etching results was suggested. The method is restricted to surface tension measurements and allows one to avoid elaborated etching experiments. 相似文献