Field emission from nanostructured AlN/GaN films on Si substrate prepared by pulsed laser deposition

Nanostructured AIN/GaN films with different thickness are synthesized on Si substrates by pulsed laser deposition (PLD). GaN and AIN single-layer films are also deposited for comparison. It is found that the turn-on field of the nanostructured AIN/GaN films is considerably decreased 2 orders of magnitude than that of single-layer films. The improvement of field emission (FE) characteristics is attributed to the quantum structure effects, which supplies a favorable location of electron emission and enhances tunneling ability. We show that by tuning the thickness of AIN/GaN, various FE characteristics can be obtained. It indicates that the optimal thickness of the nanostructured AIN/GaN films exists for their best field emission performance.     

Surface morphology of Al0.3Ga0.7N/Al2O3-high electron mobility transistor structure

We present surface properties of buffer films (AIN and GaN) and Al0.3Gao.zN/Al2O3-High Electron Mobility Transistor (HEMT) structures with/without AIN interlayer grown on High Temperature (HT)-AIN buffer/Al2O3 substrate and Al2O3 substrate. We have found that the GaN surface morphology is step-flow in character and the density of dislocations was about 10(8)-10(9) cm(-2). The AFM measurements also exhibited that the presence of atomic steps with large lateral step dimension and the surface of samples was smooth. The lateral step sizes are in the range of 100-250 nm. The typical rms values of HEMT structures were found as 0.27, 0.30, and 0.70 nm. HT-AIN buffer layer can have a significant impact on the surface morphology of Al0.3Ga0.7N/Al2O3-HEMT structures.     

Preparation and optimization of freestanding GaN using low-temperature GaN layer

In this work, a method to acquire freestanding GaN by using low temperature (LT)-GaN layer was put forward. To obtain porous structure and increase the crystallinity, LT-GaN layers were annealed at high temperature. The morphology of LT-GaN layers with different thickness and annealing temperature before and after annealing was analyzed. Comparison of GaN films using different LT-GaN layers was made to acquire optimal LT-GaN process. According to HRXRD and Raman results, GaN grown on 800 nm LT-GaN layer which was annealed at 1090 °C has good crystal quality and small stress. The GaN film was successfully separated from the substrate after cooling down. The self-separation mechanism of this method was discussed. Cross-sectional EBSD mapping measurements were carried out to investigate the effect of LT-buffer layer on improvement of crystal quality and stress relief. The optical property of the obtained freestanding GaN film was also determined by PL measurement.     

Spiral growth and formation of stacking faults and vacancy islands during molecular beam epitaxy of InN on GaN(0001)

The surface morphology and atomic structure of InN grown on the Ga-rich GaN(0001)-pseudo (1 × 1) structure is studied by scanning tunneling microscopy. Spirals are formed as a result of screw dislocations emerging at the surface to relieve the strain from the lattice mismatch. Two additional types of strain relaxation mechanisms are also found, both due to the incorporation of excess Ga atoms from the starting pseudo (1 × 1) surface into the growing films. For films below 8 nm where the Ga concentration is larger than 7%, the formation of stacking faults at the InN/GaN interface produces a triangular network on the surface. The density of the stacking faults is found to decrease with film thickness and with the gradual consumption of the Ga atoms, and the network is therefore no longer observable above a critical thickness that varies from 8 to 10 nm. Instead, vacancy islands, one atomic layer deep, are formed to relieve the stain near the surface region. These results provide atomic scale insights into the interplay between the surface morphology and strain relaxation during the epitaxial growth of highly lattice mismatched InN/GaN heterostructures.     

Oxidation behaviour of Ti2AIN films composed mainly of nanolaminated MAX phase

In this paper, we reported the oxidation behaviour of Ti2AIN films on polycrystalline Al2O3 substrates. The Ti2AIN films composed mainly of nanolaminated MAX phase was obtained by first depositing Ti-Al-N films using reactive sputtering of two elemental Ti and Al targets in Ar/N2 atmosphere and subsequent vacuum annealing at 800 degrees C for 1 h. The Ti2AIN films exhibited excellent oxidation resistance and thermal stability at 600-900 degrees C in air. Very low mass gain was observed. At low temperature (600 degrees C), no oxide crystals were observed on film surface. Blade-like Theta-Al2O3 fine crystals formed on film surfaces at 700-800 degrees C. At high temperature (900 degrees C), firstly Theta-Al2O3 formed on film surface and then transformed into alpha-Al2O3. At 700-900 degrees C, a continuous Al2O3 layer formed on Ti2AIN films surface, acting as diffusion barrier preventing further oxidation attack. The mechanism of the excellent oxidation resistance of Ti2AIN films was discussed based on the experimental results.     

Effect of high temperature AlGaN buffer thickness on GaN Epilayer grown on Si(111) substrates

Crack-free GaN epitaxial layer was obtained through inserting 80 nm graded AlGaN buffer layer between GaN epilayer and high temperature AlN buffer on 2-in Si(111) substrates by metal organic chemical vapor deposition. This paper investigated the influence of AlGaN buffer thickness on the structural properties of the GaN epilayer. It was confirmed from the optical microscopy and scanning electronic microscopy that the graded AlGaN buffer with optimized thickness had a remarkable effect on introducing relative compressive strain to the top GaN layer and preventing the formation of cracks. X-ray diffraction and atomic force microscopy analysis showed that AlGaN buffer with proper thickness could improve the crystal quality and surface morphology of the GaN film. Transmission electron microscopy analysis revealed that a significant reduction in threading dislocations was achieved in GaN epilayer by the insertion of graded AlGaN buffer.     

Deposition of GaN films on (1 1 1) Si substrates by alternate supply of TMG and NH3

GaN films were grown on (1 1 1) Si substrates at 1000 °C by separate admittances of trimethylgallium (TMG) and ammonia (NH₃). To achieve high quality GaN films, the optimization in growth temperature and layer thickness of AlN buffer layer between GaN film and Si substrate is required. Cross-sectional transmission electron microscopic observations of the GaN/(1 1 1)Si samples show a nearly parallel orientation relationship between the (0 0 0 1) planes of GaN film and the (1 1 1) planes of Si substrate. Room temperature photoluminescence spectra of high quality GaN films show a strong near band edge emission and a weak yellow luminescence. The achievement of high quality GaN films on (1 1 1) Si substrates is believed to be attributed to enhancement in surface mobilities of the adsorbed surface species and adequate accommodation of lattice mismatch between high temperature AlN buffer layer and Si substrate.     

Employing Al buffer layer with Al droplets-distributed surface to obtain high-quality and stress-free GaN epitaxial films on Si substrates

Al buffer layers with Al droplets-distributed surface have been employed to grow high-quality and stress-free GaN epitaxial films on Si substrates. The Al droplets are proved to efficiently improve the quality of as-grown GaN. On the one hand, they can act as nucleation seeds to facilitate the epitaxial growth, improving the crystalline quality and surface morphology of as-grown GaN epitaxial films. On the other hand, they also can compensate the huge compressive stress produced by Al buffer layer during the cooling process, achieving stress-free film. The density and volume of Al droplets greatly impact the properties of as-grown GaN epitaxial films. The GaN epitaxial film grown on the Al buffer layer with many small Al droplets uniformly distributed on it shows the best crystalline quality with the full-width at half maximum (FWHM) of GaN(0002) and GaN(10–12) as 0.5° and 0.7°, respectively, and flat surface with the smallest surface root-mean-square roughness of 3.8 nm. In addition, it also exhibits relatively better photoelectric properties with an FWHM of near band gap emission peak of 18 nm, carrier concentration of 2.0 × 10¹⁷ cm^?3, and mobility of 137.1 cm²/Vs. This work has revealed the advantages of Al buffer layer and the important effects of buffer layer surface on achieving high-quality GaN by PLD, which is of significance for various applications of GaN-based devices.     

Dislocation reduction in GaN film using Ga-lean GaN buffer layer and migration enhanced epitaxy

A GaN buffer layer grown under Ga-lean conditions by plasma-assisted molecular beam epitaxy (PAMBE) was used to reduce the dislocation density in a GaN film grown on a sapphire substrate. The Ga-lean buffer, with inclined trench walls on its surface, provided an effective way to bend the propagation direction of dislocations, and it reduced the dislocation density through recombination and annihilation processes. As a result, the edge dislocation density in the GaN film was reduced by approximately two orders of magnitude to 2 × 10⁸ cm^− 2. The rough surface of the Ga-lean buffer was recovered using migration enhanced epitaxy (MEE), a process of alternating deposition cycle of Ga atoms and N₂ radicals, during the PAMBE growth. By combining these two methods, a GaN film with high-crystalline-quality and atomically-flat surface can be achieved by PAMBE on a lattice mismatch substrate.     

Structural characterization of high temperature AlN intermediate layer in GaN grown by molecular beam epitaxy

Transmission electron microscopy has been used to study the structural quality of GaN grown on sapphire by plasma assisted molecular beam epitaxy using high temperature AlN intermediate layers with different thicknesses. The introduction of an AlN intermediate layer with an optimum thickness is observed to minimize the density of dislocations reaching the overgrown GaN surface. In this sample, the measured threading dislocation density reaching the surface of 1×10¹⁰ cm⁻² resulted to be seven times lower than that of a reference sample, without any AlN interlayer. The bending at the GaN/AlN interface and following interactions between dislocations have been observed in cross-sectional transmission electron micrographs. This fact explains the decrease of dislocation density reaching the GaN surface.     

Growth of continuous GaN films on ZnO buffer layer by chemical vapor deposition for ultraviolet photodetector

In this work, c-axis-oriented continuous GaN films have been synthesized by the chemical vapor deposition (CVD) method using ZnO material as the intermediate buffer layer. The GaN films with different growth temperatures exhibit high crystal quality and small surface roughness due to the same crystal structure and low lattice mismatches rate between GaN and ZnO materials. Meanwhile, the UV photodetector based on the CVD-grown GaN film exhibits a relatively high responsivity, fast rise and decay time, and good thermal stability. Our work provides a simple and promising CVD method to fabricate continuous GaN film for electronic and optoelectronic devices.

     

Defect structure in GaN pyramids

High-quality GaN/AlN layers grown on (111) Si substrates have been used as the seeding layer for lateral epitactic overgrowth of GaN. The selective overgrowth was controlled by depositing a Si₃N₄ mask on the GaN seed layer. Growth of additional GaN resulted in the formation of GaN pyramids above the apertures in the patterned Si₃N₄ mask. Transmission electron microscopy showed that the GaN pyramids, the GaN seed layer, and the AlN buffer layer in the samples have the following epitactic relationship with respect to the silicon substrate: and . The pyramids were found to consist of a defective core region and a nearly defect-free outer region. In the core of the pyramid (at, or above, the aperture in the mask), numerous dislocations thread through the pyramid perpendicular to the interface plane. Some of these threading dislocations, which originated from the GaN/AlN seed layer, bend abruptly through 90° at the edge of this core region. In the outer part of the GaN pyramid, the density of vertically propagating dislocations was much lower. Most of the dislocations in this region are closely parallel to the original (0001) substrate plane. The top few microns of material are found to be essentially defect-free. The growth mechanism of the GaN pyramids is discussed in light of this defect structure.     

Controlling the crystallinity and roughness of atomic layer deposited titanium dioxide films

The surface roughness of thin films is an important parameter related to the sticking behaviour of surfaces in the manufacturing of microelectomechanical systems (MEMS). In this work, TiO2 films made by atomic layer deposition (ALD) with the TiCl4-H2O process were characterized for their growth, roughness and crystallinity as function of deposition temperature (110-300 degrees C), film thickness (up to approximately 100 nm) and substrate (thermal SiO2, RCA-cleaned Si, Al2O3). TiO2 films got rougher with increasing film thickness and to some extent with increasing deposition temperature. The substrate drastically influenced the crystallization behaviour of the film: for films of about 20 nm thickness, on thermal SiO2 and RCA-cleaned Si, anatase TiO2 crystal diameter was about 40 nm, while on Al2O3 surface the diameter was about a micrometer. The roughness could be controlled from 0.2 nm up to several nanometers, which makes the TiO2 films candidates for adhesion engineering in MEMS.     

Nanostructured GaN nucleation layer for light-emitting diodes

This paper addresses the formation of nanostructured gallium nitride nucleation (NL) or initial layer (IL), which is necessary to obtain a smooth surface morphology and reduce defects in h-GaN layers for light-emitting diodes and lasers. From detailed X-ray and HR-TEM studies, researchers determined that this layer consists of nanostructured grains with average grain size of 25 nm, which are separated by small-angle grain boundaries (with misorientation approximately 1 degrees), known as subgrain boundaries. Thus NL is considered to be single-crystal layer with mosaicity of about 1 degrees. These nc grains are mostly faulted cubic GaN (c-GaN) and a small fraction of unfaulted c-GaN. This unfaulted Zinc-blende c-GaN, which is considered a nonequilibrium phase, often appears as embedded or occluded within the faulted c-GaN. The NL layer contained in-plane tensile strain, presumably arising from defects due to island coalescence during Volmer-Weber growth. The 10L X-ray scans showed c-GaN fraction to be over 63% and the rest h-GaN. The NL layer grows epitaxially with the (0001) sapphire substrate by domain matching epitaxy, and this epitaxial relationship is remarkably maintained when c-GaN converts into h-GaN during high-temperature growth.     

Al预沉积层对金属有机物化学气相沉积方法在Si衬底上生长AlN缓冲层和GaN外延层的影响

采用金属有机物化学气相沉积法(MOCVD)在硅(Si)衬底制备铝/氮化铝/氮化镓(Al/AlN/GaN)多层薄膜,使用光学显微镜(OM)、原子力显微镜(AFM)、X射线衍射(XRD)等手段表征AlN和GaN薄膜的微观结构和晶体质量,研究了TMAl流量对AlN薄膜和GaN薄膜的形核和生长机制的影响。结果表明,预沉积Al层能促进AlN的形核和生长,进而提高GaN外延层的薄膜质量。TMAl流量太低则预沉积Al层不充分,AlN缓冲层的质量取决于由形核长大的高结晶度AlN薄膜与在气氛中团聚长大并沉积的低结晶度AlN薄膜之间的竞争,AlN薄膜的质量随着TMAl流量的升高而提高,GaN薄膜的质量也随之提高。TMAl流量太高则预沉积Al层过厚,AlN缓冲层的质量取决于由形核长大的高结晶度AlN薄膜与Al-Si回融蚀刻之间的竞争,AlN薄膜的质量随着TMAl流量的升高而降低,GaN薄膜的质量也随之降低。     

Ultra-thin atomic layer deposited TiN films: non-linear I-V behaviour and the importance of surface passivation

We report the electrical resistivity of atomic layer deposited TiN thin films in the thickness range 2.5-20 nm. The measurements were carried out using the circular transfer length method structures. For the films with thickness in the range of 10-20 nm, the measurements exhibited linear current-voltage (I-V) curves. The sheet resistance R(sh) was determined, and the resistivity was calculated. A value of 120 microohms-cm was obtained for a 20 nm TiN layer. With decreasing film thickness, the resistivity slightly increased and reached 135 microohms-cm for a 10 nm film. However, the measurements on 2.5-5.0 nm thick films revealed non-linear I-V characteristics, implying the dependence of the measured resistance, and therefore the resistivity, of the layers on applied voltage. The influence of the native oxidation due to the exposure of the films to air was taken into account. To fully eliminate this oxidation, a highly-resistive amorphous silicon layer was deposited directly after the ALD of TiN. The electrical measurements on the passivated 2.5- and 3.5 nm TiN layers then exhibited linear I-V characteristics. A resistivity of 400 and 310 microohms-cm was obtained for a 2.5- and 3.5 nm TiN film, respectively.     

High‐Brightness Blue Light‐Emitting Diodes Enabled by a Directly Grown Graphene Buffer Layer

Single‐crystalline GaN‐based light‐emitting diodes (LEDs) with high efficiency and long lifetime are the most promising solid‐state lighting source compared with conventional incandescent and fluorescent lamps. However, the lattice and thermal mismatch between GaN and sapphire substrate always induces high stress and high density of dislocations and thus degrades the performance of LEDs. Here, the growth of high‐quality GaN with low stress and a low density of dislocations on graphene (Gr) buffered sapphire substrate is reported for high‐brightness blue LEDs. Gr films are directly grown on sapphire substrate to avoid the tedious transfer process and GaN is grown by metal–organic chemical vapor deposition (MOCVD). The introduced Gr buffer layer greatly releases biaxial stress and reduces the density of dislocations in GaN film and In_xGa_1?xN/GaN multiple quantum well structures. The as‐fabricated LED devices therefore deliver much higher light output power compared to that on a bare sapphire substrate, which even outperforms the mature process derived counterpart. The GaN growth on Gr buffered sapphire only requires one‐step growth, which largely shortens the MOCVD growth time. This facile strategy may pave a new way for applications of Gr films and bring several disruptive technologies for epitaxial growth of GaN film and its applications in high‐brightness LEDs.     

The growth of GaN films by alternate source gas supply hot-mesh CVD method

Gallium nitride (GaN) films and Aluminium nitride (AlN) layers were deposited on SiC/Si (111) substrates by an alternating source gas supply or an intermittent supply of a source gas such as ammonia (NH₃), trimethylgallium (TMG) or trimethylaluminum (TMA) in a hot-mesh chemical vapor deposition (CVD) apparatus. The AlN layer was deposited as a buffer layer using NH₃ and TMA on a SiC layer grown by carbonization on Si substrates using propane (C₃H₈). GaN films were grown on an AlN layer by a reaction between NH_x radicals generated on a ruthenium (Ru) coated tungsten (W)-mesh and TMG molecules. An alternating source gas supply or an intermittent supply of one of the source gases during the film growth are expected to be effective for the suppression of gas phase reactions and for the enhancement of precursor migration on the substrate surface. By the intermittent supply of alkylmetal gas only during the growth of the AlN layer, the defect generation in the GaN films was reduced. GaN film growth by intermittent supply on an AlN buffer layer, however, did not lead to the improvement of the film quality.     

The growth behavior of GaN film on Si(111) substrate by an ion-beam assisted evaporation process

Highly oriented GaN thin films were grown on Si(111) substrate using an ion beam assisted evaporation method. Nitrogen ions, with a kinetic energy of about 40 eV, was supplied by a Kaufman ion source; and Ga vapor was supplied by thermal evaporation. The surface morphology of the nucleation layer, and the crystalline properties of 200–300 nm thick GaN epi-layer were investigated by atomic force microscopy, transmission electron microscopy, and X-ray diffraction. Film grown under a Ga-rich flux condition produced film growth behavior of large islands of hexagonal configuration. Crystallinity on such film, however, was of poorer quality than other films with smaller islands, grown under high nitrogen ion flux conditions. The full width at half-maximum of (0002) diffraction peak was measured at 52 arcminutes for the GaN epilayer single-stepwise grown at 660°C. Ion-enhanced decomposition occurred, causing no film formation at substrate temperatures above 710°C. Additionally, the effect of predeposition of a buffer layer on GaN crystallinity was investigated for surface roughness. AFM measurement revealed that the GaN buffer layer grown on Si(111) showed smooth surface under the relatively N₂⁺-sufficient condition. The introduction of thin GaN buffer layer, grown at 600°C under N₂⁺-sufficient condition, worked on reducing the lattice-mismatch stress and in-plane misorientation of grains, and thus enhancing the crystallinity of the two-stepwise grown GaN epi-layer. Characteristic behavior of GaN epi-layers, single or two stepwise grown on Si(111), show a type of granular (columnar) epitaxy.     

Anodic oxidation of gallium nitride

The anodic oxidation of n-type GaN (carrier concentration 4.6 × 10¹⁸ cm^–3) under laboratory illumination at a constant current density of 5 mA cm^–2 in sodium tungstate electrolyte is examined by high resolution microscopy and surface analysis. The GaN, deposited as a thin layer by molecular beam epitaxy, had an initially faceted surface. Anodic oxidation gives rise to local growth of an amorphous Ga₂O₃-based reaction product, often, but not exclusively, located in the vicinity of troughs formed by intersecting facets. At these regions dislocations in the GaN intersect the surface. The product is non-uniform in thickness and morphology, with pore-like features. With prolonged anodic treatment, local oxidation progresses as channels, which eventually reach the base of the GaN layer, leaving a porous skeleton. The formation of a uniform and compact film material on GaN is considered to be impeded by generation of nitrogen from the anodic reaction, with the strength of the Ga–N bonding focusing oxidation on regions of increased impurity, non-stoichiometry or defect concentration.