Impact of gate material engineering(GME) on analog/RF performance of nanowire Schottky-barrier gate all around (GAA) MOSFET for low power wireless applications: 3D T-CAD simulation

In this paper Gate Material Engineered (GME) Gate-Stack (GS) silicon nanowire Schottky-Barrier (SB) Gate All Around (GAA) MOSFET and Single Material Gate Stack Schottky-Barrier Source/Drain Gate All Around (SM-GS-SB-S/D GAA) structures are proposed for low- power wireless applications. The Analog/RF performance for wireless applications of these devices are demonstrated. The effect of Schottky-Barrier (Metal) S/D is studied for Single Metal (SM)–SB-GAA, (Dual Metal) DM-SB-GAA, SM-GS-SB-GAA and GME-GS-SB-GAA MOSFETs, and it is found that GME-GS-SB-GAA MOSFET with metal drain source shows much improved performance in terms of transconductance (g_m), output conductance (g_d), Early Voltage (V_EA), Maximum Transducer Power Gain, cut-off frequency (f_T), and I_on/I_off ratio. Further, harmonic distortion for wireless applications is also studied using ATLAS-3D device simulator. Due to low parasitic S/D resistance the metal Source/Drain DM-GS-SB-S/D-GAA MOSFET demonstrates remarkable I_on of~31.8 μA/μm and saturation transconductance g_m of~68.2 μS with improved third order derivative of transconductance g_m3.     

Role of Schottky barrier height at source/drain contact for electrical improvement in high carrier concentration amorphous InGaZnO thin film transistors

We report the fabrication of bottom-gate thin film transistors (TFTs) at various carrier concentrations of an amorphous InGaZnO (a-IGZO) active layer from ~10¹⁶ to ~10¹⁹ cm⁻³, which exceeds the limit of the concentration range for a conventional active layer in a TFT. Using the Schottky TFTs configuration yielded high TFT performance with saturation mobility (μ_sat), threshold voltage (V_TH), and on off current ratio (I_ON/I_OFF) of 16.1 cm²/V s, −1.22 V, and 1.3×10⁸, respectively, at the highest carrier concentration active layer of 10¹⁹ cm⁻³. Other carrier concentrations (<10¹⁹ cm⁻³) of IGZO resulted in a decrease of its work function and increase in activation energy, which changes the source/drain (S/D) contact with the active layer behavior from Schottky to quasi Ohmic, resulting in achieving conventional TFT. Hence, we successfully manipulate the barrier height between the active layer and the S/D contact by changing the carrier concentration of the active layer. Since the performance of this Schottky type TFT yielded favorable results, it is feasible to explore other high carrier concentration ternary and quaternary materials as active layers.