基于谐振法测试微波介质材料的介电参数

介电常数是介质材料的主要性能参数之一,该文讨论了微波介质的介电参数的理论计算,分析了谐振法的模型,研制了基于谐振法测量微波介质材料介电参数的测量系统.通过对多个样品进行实测,结果表明与参考值比较吻合,评价了该测量系统测量结果不确定度,从而建立了微波频段内微波介质材料介电常数测量平台.     

低介电常数微波介质陶瓷研究进展

综述了国内外低介电常数微波介质陶瓷近10年来的研究进展,总结了低介电常数微波介质陶瓷的晶体结构、成分体系和烧结工艺等相互之间的制约关系,以及对介电性能影响的规律;归纳了研究中存在的问题,并对其它的低介电常数微波介质陶瓷也进行了简要介绍.最后展望了低介电常数微波介质陶瓷今后的发展方向.     

基于VC++的介质复介电常数带状线法自动测试系统的研究

随着微波技术的迅猛发展,对微波介质材料提出了新的要求,对介质材料的各种性能的测量有了更多的需求,复介电常数是介质的一个主要参数,本文就微波介质复介电常数测量的带状线法进行了一个简单的介绍,并重点就基于VC++所编制的自动测量程序做了相关的论述。自动化测量可以大大提高我们的工作效率。     

滤波器用微波介质陶瓷材料

具有高介电常数的微波介质陶瓷可以使微波器件小型化.这一类材料要具有高的介电常数,非常低的介电损耗和良好的温度稳定性.本文主要介绍了微波介质陶瓷的结构与性能的关系,微波介质陶瓷材料体系.     

低介电常数微波介质陶瓷研究进展

随着微波通信技术向毫米波段延伸,低介电常数微波介质陶瓷的开发成为介质材料的研究热点。概述了Al2O3系、硅酸盐系、AAl2O4系(A=Zn、Mg)、钨酸盐系、磷酸盐系及石榴石结构化合物体系等低介电常数微波陶瓷材料体系的研究进展,并指出了低介电常数微波介质陶瓷目前存在的问题及发展趋势。     

高k栅介质薄膜材料研究进展

金属-氧化物-半导体场效应晶体管(MOSFET),要求其器件特征尺寸越来越小,当光刻线宽小于100nm尺度范围后,栅介质氧化物层厚度开始逐渐接近(1～1.5)nm,这时电子的直接隧穿而导致栅极漏电流随栅氧化层厚度的下降而指数上升,此外,当栅氧化层薄到一定程度后,其可靠性问题,尤其是与时间相关的击穿及栅电极中的杂质向衬底的扩散等问题,将严重影响器件的稳定性和可靠性.因此需要寻找一种具有高介电常数的新型栅介质材料来替代SiO2,在对沟道具有相同控制能力的条件下(栅极电容相等),利用具有高介电常数的介质材料(一般称为高k材料)作为栅介质层可以增加介质层的物理厚度,这将有效减少穿过栅介质层的直接隧穿电流,并提高栅介质的可靠性.本文介绍了高k栅介质薄膜材料的制备方法,综述了高k栅介质薄膜材料研究的应用要求及其研究发展动态.     

高介电常数栅极电介质材料的研究进展

随着半导体技术的飞速发展,作为硅基集成电路核心器件的MOSFET的特征尺寸正以摩尔定律的速度缩小.然而,当传统栅介质层SiO2的厚度减小到原子尺寸时,由于量子隧穿效应的影响,SiO2将失去介电性能,致使器件无法正常工作.因此,必须寻找新的高介电常数材料来替代它.目前,高介电常数材料是微电子行业最热门的研究课题之一.主要介绍了栅介质层厚度减小所带来的问题(即研究高介电常数材料的必要性)、新型栅电介质材料的性能要求,并简要介绍和评述了近期主要高介电常数栅介质材料的研究状况及其应用前景.     

微扰和标定技术测量薄膜微波介电常数

提出了一种测量介质薄膜微波段介电常数的方法.该方法基于金属空腔谐振器微扰理论,用已知介电常数的基片作为标样,标定测量系统的有关参数,然后分别测量空腔、基片插入空腔、镀有介质薄膜的基片插入空腔三种情况下的谐振腔谐振频率,计算出镀覆于基片上介质薄膜的微波复介电常数.本文SiO2和MgTiO3-CaTiO3(MCT)介质陶瓷薄膜作了实验测量验证,结果表明该方法具有良好的测量精度(小于6%).     

低介微波介质陶瓷基板材料研究进展

低介电常数能减小基板与电极之间的交互耦合损耗并提高电信号的传输速率,高品质因数有利于提高器件工作频率的可选择性和简化散热结构设计,近零的谐振频率温度系数有助于提高器件的频率温度稳定特性。特别在工作频率逐渐提高的情况下,介电损耗不断增大,器件发热量迅速增加,材料的热导率成为一个需要重点考虑的因素。由于陶瓷材料的热导率是有机材料的20倍左右,因此,低介电常数微波介质陶瓷成为制备高性能基板的理想材料。此外,基板材料还需具备高强度和优越的表面/界面特性等综合性能。鉴于此,首先评述了介电常数小于15的低介微波介质陶瓷材料体系的研究进展情况,在此基础上,介绍了降低基板材料介电常数的方法和表面致密化措施,最后指出了在高性能低介微波介质陶瓷基板材料研制过程中面临的问题及今后的发展方向。     

低温共烧陶瓷技术(LTCC)与低介电常数微波介质陶瓷

简述了低温共烧陶瓷技术(LTCC)的特点及微波介质陶瓷实现低温共烧的性能要求,重点介绍了LTCC低介电常数微波介质陶瓷的分类及微波介电性能,分析和讨论了LTCC低介电常数微波介质陶瓷存在的问题,针对LTCC低介电常数陶瓷材料今后的发展方向提出了自己的看法。     

A hypersingular integral equation for current density on the surface of a microstrip vibrator

The problem of finding the current-density distribution on the surface of a microstrip vibrator (MV) in the framework of a thin ideally conducting strip, deposited on a dielectric substrate with one-sided metallization, is reduced to solution of a hypersingular integral equation (HSIE). The dependences of the input impedance on the vibrator length and substrate thickness are presented.     

Wideband microstrip antennas with sandwich substrate

A broadband microstrip antenna with low?high?low (sandwich) dielectric constant substrate combination using a microstrip line-via feed is presented for ultra-wideband applications. The proposed antenna consists of three dielectric substrates; low dielectric constant substrates that contain the microstrip feed line as well as parasitic patches and a high dielectric constant substrate that contains the driven patch. To achieve a large impedance bandwidth, parasitic patches and microstrip line-via combination feed to the driven patch in the multilayered microstrip antenna are used. The proposed antenna designed, fabricated and measured on the sandwich substrate. The antenna has measured 10 dB return loss bandwidth of 46.9% and directive gain .5.2 dBi at boresight across the impedance bandwidth. The total height of antenna is 5.77 mm or 0.077λ ^{at 4 GHz.}     

Investigation of adjacent spacing dependent microwave absorption properties of lamellar structural Ti3C2Tx MXenes

Ti₃C₂Tx MXenes and their composites play a vital role in the research on microwave absorbing materials. Herein, the different interlamellar spaces of Ti₃C₂Tx MXene materials were prepared by an etching process. The dependence of the microwave absorbing properties of the Ti₃C₂Tx MXene nanosheets on different interlamellar spaces was studied. The complex permittivity, dielectric loss, impedance matching characteristic and the minimum reflection loss (RL) value with the variation in interlamellar space were systematically investigated. Results showed that 40% ratio paraffin-bonded composites (S3) have a strong electromagnetic wave absorption performance and large effective absorbing bandwidth. The maximum RL reaches −36.3 dB at 4.67 GHz with the thickness of 4.5 mm, ascribed to its a high dielectric loss and good impedance matching characteristics. The RL value of Ti₃C₂Tx MXenes is strongly dependent on the inter-lamellar space. The enhanced microwave absorption originates from the unique 2-D structure, good impedance matching characteristics, and enhanced space-charge polarization effects. This work provides a new avenue for exploring high-performance microwave absorbers based on MXene materials.     

Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers

We report on the influence of the dielectric substrate on the performance of microstrip dipole-antenna-coupled microbolometers. The location, the width, and the magnitude of the resonance of a printed dipole are altered when the dielectric substrate is backed by a ground plane. A thicker dielectric substrate shifts the antenna resonance toward shorter dipole lengths and leads to a stronger and slower detector response. The incorporation of an air layer into the antenna substrate further increases thermal impedance, leading to an even stronger response and shifting the antenna resonance toward longer dipole lengths.     

Multipatches multilayered UWB microstrip antennas

The authors present multipatches multilayered ultra-wideband (UWB) microstrip antennas. The antenna comprises a driven patch radiator with five parasitic patch radiators. Two antennas with different dielectric substrate combinations are studied. The antenna with low-high-low dielectric constant substrate combination (Antenna no. 1) has an improved performance in terms of impedance bandwidth, gain, overall antenna size and beam-squinting over the antenna with low-low-low dielectric constant substrate combination (Antenna no. 2). The low-high-low dielectric constant combination consisting of three dielectric substrates, namely low dielectric constant (ϵr = 3.38) for both bottom and upper substrate but, high dielectric constant (ϵr = 6.15) for middle substrate. Five parasitic patches and multi-dielectric layers are used for wide impedance bandwidth and less boresight gain variation with frequency. A measured 10 dB return loss bandwidth of 48% with boresight gain .5.0 dBi is achieved. Antenna no. 1 can have 8% wider impedance bandwidth, 40% overall area reduction and less beam-squinting compared with Antenna no. 2.     

Cornstalk-derived macroporous carbon materials with enhanced microwave absorption

Biomass transformation is being considered as a green and sustainable strategy for carbon-based functional materials in many fields. To produce porous structure favorable for microwave absorption, we demonstrate herein the successful synthesis of macroporous carbon materials with cornstalk as a biomass precursor. It is found that two kinds of typical biological structures in cornstalk, linear vascular bundles and parenchyma cells, can be well preserved during high-temperature pyrolysis. Mercury intrusion porosimetry and N₂ adsorption indicate that these cornstalk-derived carbon materials have very high porosity, which is mainly from desirable macroporous structure rather than conventional micro/mesopores. Electromagnetic (EM) analysis reveals that dielectric loss is the only pathway for the consumption of EM energy, and high pyrolysis temperature favors strong dielectric loss through conductive loss and interfacial polarization loss. Meanwhile, pyrolysis temperature also affects the matching degree of characteristic impedance. When the pyrolysis temperature reaches 750 °C, good dielectric loss and impedance matching endow the sample (CSC-750) with excellent microwave absorption performance, including strong reflection loss, broad response bandwidth, and relatively thin absorber thickness. The advantages of macroporous structure are further highlighted in impedance matching and multiple reflection by comparing with a macropore-free counterpart.

     

Effects of dielectric substrate thickness on plasma immersion ion implantation

A one-dimensional plasma fluid model is developed for investigating the effects of dielectric substrate thickness on plasma immersion ion implantation. By considering the effects of secondary electron emission from the dielectric substrate and using finite difference schemes, evolution of plasma sheath, ion fluence and dielectric surface potential versus time and substrate thickness are evaluated. It was demonstrated that with the increasing dielectric thickness, sheath width and ion fluence over the dielectric surface decrease and surface potential reduces. These effects can be attributed to the accumulation of positive ions and ejection of secondary electrons from the dielectric surface and thereby lessening the strength of the electric field over the dielectric substrate. It is also shown that the secondary electrons have a profound effect on implantation results and must be considered in plasma immersion ion implantation of dielectric materials.     

The effect of a thin ferroelectric film on the propagation characteristics of a microstrip transmission line

The properties of a microstrip line (MSL) on a bilayered substrate containing a thin ferroelectric layer are theoretically studied. The propagation parameters are calculated using an approach based on a two-dimensional full-wave electrodynamic model. The influence of the fringing electric field in the ferroelectric layer on the MSL characteristics is studied. It is shown that correct modeling of microwave devices based on bilayered substrates with ferroelectric layers must take into account the properties of these layers even despite very small thickness.     

Analysis of a digital microstrip optical switch: a novel method

A time domain analysis of an optically controlled digital microstrip switch for microwave integrated circuits on Si substrates is studied. A new model for high-frequency pulse propagation on a microstrip optical switch for different optical parameters is presented. A frequency-dependent macromodel for a microstrip line with a gap is implemented in Spice 3, taking into consideration high-frequency pulse dispersion, conductor and dielectric losses, metallization thickness, gap length, and different optical parameters such as optical energy, surface recombination velocities, and diffusion of generated carriers. In addition, the developed model has been used to optimize the switching frequency, gap length, level of optical power, and suitable substrate material parameters.     

NiO/Ni Heterojunction on N-Doped Hollow Carbon Sphere with Balanced Dielectric Loss for Efficient Microwave Absorption

Hollow carbon spheres are potential candidates for lightweight microwave absorbers. However, the skin effect of pure carbon-based materials frequently induces a terrible impedance mismatching issue. Herein, small-sized NiO/Ni particles with heterojunctions on the N-doped hollow carbon spheres (NHCS@NiO/Ni) are constructed using SiO₂ as a sacrificing template. The fabricated NHCS@NiO/Ni displayed excellent microwave absorbability with a minimum reflection loss of −44.04 dB with the matching thickness of 2 mm and a wider efficient absorption bandwidth of 4.38 GHz with the thickness of 1.7 mm, superior to most previously reported hollow absorbers. Experimental results demonstrated that the excellent microwave absorption property of the NHCS@NiO/Ni are attributed to balanced dielectric loss and optimized impedance matching characteristic due to the presence of NiO/Ni heterojunctions. Theoretical calculations suggested that the redistribution of charge at the interfaces and formation of dipoles induced by N dopants and defects are responsible for the enhanced conduction and polarization losses of NHCS@NiO/Ni. The simulations for the surface current and power loss densities reveal that the NHCS@NiO/Ni has‑ applicable attenuation ability toward microwave under the practical application scenario. This work paves an efficient way for the reasonable design of small-sized particles with well-defined heterojunctions on hollow nanostructures for high-efficiency microwave absorption.