氮化铝薄膜的低温沉积

介绍了一种ECR微波放电和脉冲激光沉积相结合低温沉积AlN薄膜的新方法.在ECR氮等离子体环境中用脉冲激光烧蚀Al靶,以低于80℃的衬底温度在Si衬底上沉积了AlN薄膜.结合样品表征和等离子体光谱分析,探讨了膜层沉积的机理,等离子体中活性氮物质的存在是Al-N化合的重要因素,等离子体对衬底的辐照促进膜层的形成.     

氮化铝薄膜的低温沉积

介绍了一种 ECR微波放电和脉冲激光沉积相结合低温沉积 Al N薄膜的新方法 .在 ECR氮等离子体环境中用脉冲激光烧蚀 Al靶 ,以低于 80℃的衬底温度在 Si衬底上沉积了 Al N薄膜 .结合样品表征和等离子体光谱分析 ,探讨了膜层沉积的机理 ,等离子体中活性氮物质的存在是 Al- N化合的重要因素 ,等离子体对衬底的辐照促进膜层的形成     

用脉冲激光沉积方法制备氮化铝薄膜

介绍了用脉冲激光沉积 (PLD)方法制备AlN薄膜的工作 ,在Si(10 0 )衬底上得到了光滑平整、透明度高的AlN薄膜 ,由实验结果拟合得到能隙宽度为 5 7eV。考察了衬底温度和退火温度的影响。     

磁过滤阴极真空弧沉积薄膜研究

采用磁过滤阴极真空弧沉积技术对从弧源引起离子束中的大颗粒进行过滤后,在硅和聚合物表面进行离子注入和低能离子束沉积,可获得特性优异的沉积金属膜、超硬膜（类金刚石,CN膜）、陶瓷膜（TiN,TiC）等。电子显微镜观察表明,大颗粒已被过滤,表面结构致密,由于先进行离子注入,在基体表现预先形成了过滤层,从而改善了沉积膜的粘合特性,膜与基体的粘合特性有了明显提高。测量结果表明,沉积膜的硬度、抗磨损和抗腐蚀特性均有了明显提高。非晶金刚石薄膜表面硬度可达到56GPa。     

原子层沉积超薄氮化铝薄膜的椭圆偏振光谱法表征

采用原子层沉积(ALD)工艺在硅衬底上生长了35 nm以下不同厚度的超薄氮化铝(AlN)晶态薄膜。利用椭圆偏振光谱法在波长275~900 nm内测量并拟合薄膜的厚度及折射率和消光系数等光学参数。利用原子力显微镜(AFM)表征AlN晶粒尺寸随生长循环次数的变化,计算得到薄膜表面粗糙度并用于辅助椭偏模型拟合。针对ALD工艺特点建立合适的椭偏模型,可获得AlN超薄膜的生长速率为0.0535 nm/cycle,AlN超薄膜的折射率随着生长循环次数的增加而增大,并逐渐趋于稳定,薄膜厚度为6.88 nm时,其折射率为1.6535,薄膜厚度为33.01 nm时,其折射率为1.8731。该模型为超薄介质薄膜提供了稳定、可靠的椭圆偏振光谱法表征。     

氮化铝基板薄膜金属化工艺研究

氮化铝（ＡＩＮ）基板由于其优良的热性能和无毒性，成为一种重要的微电子材料。本文从以下三方面研究了氮化铝基板的薄膜金属化问题：（１）金属薄膜同ＡＩＮ基板的附着力；（２）ＡＩＮ基板上薄膜电阻的温度系数；（３）ＡＩＮ基板上ＮｉＣｒ薄膜电阻的功率密度。研究结果表明，氮化铝上薄膜金属化层的附着强度可以大于ＡＩＮ陶瓷本身。成功地将薄膜金属化氮化铝基板应用于功率混合电路和功率对晶体管模块中。     

氮化铝薄膜的椭偏法研究

文章采用真空磁过滤电弧离子镀法在单晶Si(100)基片上成功制备了氮化铝(AlN)薄膜,并利用椭偏法对AlN膜进行了研究.根据沉积方法的特点,建立合适的膜系进行拟合,得到薄膜的折射率、消光系数和几何厚度;分析薄膜与基片之间的附着方式为简单附着,以及引起薄膜材料比块体材料折射率偏小的原因为:薄膜中含有空隙,Al/N不符合化学剂量比,薄膜表面形成了Al2O3钝化层.     

离子束增强沉积氮化铝薄膜的电绝缘性能研究

AlN薄膜作为绝缘层材料，在微电子领域的高温高功率器件中有很大应用潜力。采用离子束增强沉积(IBED)法制备了AlN薄膜，采用X光电子能谱(XPS)和电容-电压/电流-电压(C-V/I-V)等方法对AlN薄膜的微观结构和绝缘性能进行了研究，得到了影响薄膜电绝缘性能的主要参数。研究结果表明，沉积过程中向IBED系统通入一定的氮气可有效提高薄膜的N／Al，使其接近化学计量比(从0．53：1到0．81：1)及电绝缘性能(击穿电场约为1．42MV／cm)。     

FBAR用氮化铝压电薄膜研究

介绍了FBAR用复合氮化铝(AlN)压电薄膜的制作方法。采用双S枪中频(40kHz)磁控反应性溅射铝靶制作出了AlN压电薄膜。采用双S枪直流(DC)磁控溅射钼(Mo)靶制作出了Mo电极薄膜。对AlN压电薄膜、Mo电极薄膜进行了X线衍射(XRD)分析,结果表明,AlN压电薄膜(002)面、Mo薄膜(110)面择优取向优良。对?4″Si基AlN压电薄膜进行了膜厚测试,结果表明,其膜厚均匀性优于±0.5%。对?4″Si基AlN压电薄膜、Mo薄膜进行了应力测试,结果表明,其应力分别在-100~+100 MPa及-150~+220 MPa;对?4″Si基Mo/AlN/Mo/AlN复合压电薄膜应力进行了应力测试,结果表明,其应力低达-71.518 5 MPa。对?4″Si基AlN压电薄膜进行了化学成分分析,结果表明,其Al∶N原子比为51.8∶48.2。     

FBAR用氮化铝压电薄膜研究

介绍了FBAR用复合氮化铝(AlN)压电薄膜的制作方法。采用双S枪中频(40 kHz)磁控反应性溅射铝靶制作出了AlN压电薄膜。采用双S枪直流(DC)磁控溅射钼(Mo)靶制作出了Mo电极薄膜。对AlN压电薄膜、Mo电极薄膜进行了X线衍射(XRD)分析,结果表明,AlN压电薄膜(002)面、Mo薄膜(110)面择优取向优良。对4″Si基AlN压电薄膜进行了膜厚测试,结果表明,其膜厚均匀性优于±0.5%。对4″Si基AlN压电薄膜、Mo薄膜进行了应力测试,结果表明,其应力分别在-100~+100 MPa及-150~+220 MPa;对4″Si基Mo/AlN/Mo/AlN复合压电薄膜应力进行了应力测试,结果表明,其应力低达-71.518 5 MPa。对4″Si基AlN压电薄膜进行了化学成分分析,结果表明,其Al∶N原子比为51.8∶48.2。     

反应式脉冲激光溅射淀积AlN薄膜化学稳定性研究

就反应式脉冲激光溅射淀积制备氮化铝薄膜的过程，讨论了激光脉冲能量密度及脉冲频率对所有制备薄膜结构性能的影响，并对薄膜的化学稳定性作了比较详细的研究，结果表明，当薄膜中存在有未反应的单质铝时，薄膜的化学稳定性较差。比较而言具有高取向性，择优生长的致密ＡＩＮ微晶膜的化学稳定性优于结构相对疏松的非晶膜。     

Influences of laser energy density and annealing on structure properties of AIN films prepared by pulsed laser deposition

Aluminum nitride （AlN） films with h〈100〉 crystalline orientation are fabricated on p-Si （100） substrates at room tempera- ture by pulsed laser deposition. The effects of laser energy density and annealing on the quality of the films are studied by x-ray diffraction, Fourier transform infrared spectroscopy and scanning electron microscopy. The crystalline quality of AlN films is improved considerably by increasing the laser energy density while there is increased number of farraginous particles on the surface. The annealing treatment at 600~C produces a recrystallization process in the film, characterized by the improvement of the original crystallinity, the appearance of new crystalline orientations, and the increase of the crystallites. The surface becomes rougher due to the increase of the grain size during annealing.     

脉冲激光溅射沉积YBCO超导薄膜

从激光与材料相互作用理论出发,分析了激光烧蚀材料等离子体羽辉的空间运动特征和成分分布;以YBCO/SrTiO_3为对象,从实验上系统研究了脉冲激光溅射沉积薄膜过程中薄膜质量与基片温度、基片-靶材距离、气体压强、激光脉冲能量以及重复频率等参数的关系;总结出在SrTiO_3(100)单晶基片上溅射沉积YBCO高温超导薄膜的最佳实验参数。     

Thermal stability of Hfl'aON films prepared by physical vapor deposition

We investigate the thermal stability of HfTaON films prepared by physical vapor deposition using high resolution transmission electronic microscope (HRTEM) and X-ray photoelectron spectroscopy (XPS). The results indicate that the magnetron-sputtered HtTaON films on Si substrate are not stable during the post-deposition an-healing (PDA). HfTaON will react with Si and form the interfacial layer at the interface between HfTaON and Si substrate. Hf-N bonds are not stale at high temperature and easily replaced by oxygen, resulting in significant loss of nitrogen from the bulk film. SiO2 buffer layer introduction at the interface of HfTaON and Si substrate may effec-tively suppress their reaction and control the formation of thicker interfacial layer. But SiO2 is a low k gate dielectric and too thicker SiO2 buffer layer will increase the gate dielectric's equivalent oxide thickness. SiON prepared by oxidation of N-implanted Si substrate has thinner physical thickness than SiO2 and is helpful to reduce the gate dielectric's equivalent oxide thickness.     

液相法电沉积类金刚石薄膜的表面形貌研究

采用脉冲直流电源,以甲醇有机溶液作为碳源,在常压60℃的条件下,采用电化学沉积方法在不锈钢表面制备了类金刚石碳薄膜.在电沉积过程中电流密度最高达到150 mA/cm2,沉积速度为500 m/h.用原子力显微镜和扫描电镜表征了薄膜的表面形貌,透射电镜和电子衍射谱表征了薄膜的结构.结果表明:沉积的类金刚石碳DLC膜是由均匀分布的球形纳米颗粒组成,粒度约为300 nm～400 nm,而且致密光滑;不锈钢上沉积的类金刚石薄膜,薄膜的生长是在基体表面划刻的边缘形核中心开始生长,并且生长先由基体的边缘向中心然后逐渐覆盖基体表面.     

利用物理气相淀积工艺制备的HfTaON薄膜热力学稳定性研究

We investigate the thermal stability of HfTaON films prepared by physical vapor deposition using high resolution transmission electronic microscope （HRTEM） and X-ray photoelectron spectroscopy （XPS）. The results indicate that the magnetron-sputtered HfTaON films on Si substrate are not stable during the post-deposition annealing （PDA）. HfTaON will react with Si and form the interfacial layer at the interface between HfTaON and Si substrate. Hf-N bonds are not stale at high temperature and easily replaced by oxygen, resulting in significant loss of nitrogen from the bulk film. SiO2 buffer layer introduction at the interface of HfraON and Si substrate may effectively suppress their reaction and control the formation of thicker interfacial layer. But SiO2 is a low k gate dielectric and too thicker SiO2 buffer layer will increase the gate dielectric＇s equivalent oxide thickness. SiON prepared by oxidation of N-implanted Si substrate has thinner physical thickness than SiO2 and is helpful to reduce the gate dielectric＇s equivalent oxide thickness.     

Ultralow-k silicon containing fluorocarbon films prepared by plasma-enhanced chemical vapor deposition

Low dielectric constant materials as interlayer dielectrics (ILDs) offer a way to reduce the RC time delay in high-performance ultra-large-scale integration (ULSI) circuits. Fluorocarbon films containing silicon have been developed for interlayer applications below 50-nm linewidth technology. The preparation of the films was carried out by plasma-enhanced chemical vapor deposition (PECVD) using gas precursors of tetrafluorocarbon as the source of active species and disilane (5 vol.% in helium) as a reducing agent to control the ratio of F/C in the films. The basic properties of the low dielectric constant (low-k) interlayer dielectric films are studied as a function of the fabrication process parameters. The electrical, mechanical, chemical, and thermal properties were evaluated including dielectric constant, surface planarity, hardness, residual stress, chemical bond structure, and shrinkage upon heat treatments. The deposition process conditions were optimized for film thermal stability while maintaining a relative dielectric value as low as 2.0. The average breakdown field strength was 4.74 MV/cm. The optical energy gap was in the range 2.2–2.4 eV. The hardness and residual stress in the optimized processed SiCF films were, respectively, measured to be in the range 1.4–1.78 GPa and in the range 11.6–23.2 MPa of compressive stress.     

Investigation of textured aluminum nitride films prepared by chemical vapor deposition

Textured polycrystalline aluminum nitride films are grown on a silica substrate by chemical vapor deposition using metallic aluminum and ammonium chloride as the initial reagents. The good texture and crystal quality of the prepared films are confirmed by raster electron microscopy, Raman spectroscopy, and X-ray diffraction.     

Effects of deposition pressure on the properties of transparent conductive ZnO:Ga films prepared by DC reactive magnetron sputtering

Gallium (Ga)-doped zinc oxide (ZnO:Ga) transparent conductive films were deposited on glass substrates by DC reactive magnetron sputtering. Effects of deposition pressure on the structural, electrical and optical properties of ZnO:Ga films were investigated. X-ray diffraction (XRD) studies show that the films are highly oriented with their crystallographic c-axis perpendicular to the substrate almost independent of the deposition pressure. The morphology of the film is sensitive to the deposition pressure. The transmittance of the ZnO:Ga thin films is over 90% in the visible range and the lowest resistivity of ZnO:Ga films is 4.48×10⁻⁴ Ω cm.     

DC磁控溅射制备的TiNx薄膜组分及性能分析

利用DC磁控溅射法在p-Si(111)衬底上制备了TiNx薄膜.利用X射线能谱仪(EDX)、X射线衍射(XRD)、紫外/可见分光光度计、四探针电阻率测试仪等分析了薄膜的组分、结构和光电特性.结果表明,薄膜中N/Ti原子比接近于1;衬底温度对薄膜的择优取向影响显著,240℃附近是TiNx薄膜结晶择优取向由(111)向(200)转变的临界点;薄膜在近红外波段平均反射率随衬底温度的升高,先增大后减小;薄膜的电阻率随着衬底温度的升高而显著降低.