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1.
MOCVD生长源流量对p型GaN薄膜特性影响的研究   总被引:1,自引:1,他引:0  
利用金属有机物化学气相淀积(MOCVD)技术在蓝宝石衬底上生长p型GaN:Mg薄膜,对不同二茂镁(CP2Mg)流量和Ⅴ族和Ⅲ族摩尔(Ⅴ/Ⅲ)比生长的p型GaN:Mg薄膜特性进行研究。研究表明,增加Ⅴ/Ⅲ比,可以降低螺旋位错密度,提高p型GaN晶体质量。当Ⅴ/Ⅲ比为3 800时,Cp2Mg流量最高为170sccm,获得p型GaN(002)面峰值半高宽(FWHM)最窄为232"。同时研究发现,单纯提高Ⅴ/Ⅲ比对降低刃型位错影响较不明显。  相似文献   

2.
利用MOCVD生长了InGaN:Mg薄膜,研究了生长温度、掺Mg量对InGaN:Mg薄膜电学特性的影响.结果表明,空穴浓度随着生长温度的降低而升高.在相同的生长温度下,空穴浓度随掺Mg量的增加,先升高后降低.通过对这两个生长条件的优化,在760℃、CP2Mg与TMGa摩尔流量之比为2.2‰时制备出了空穴浓度高达2.4×1019cm-3的p-InGaN:Mg薄膜.这对进一步提高GaN基电子器件与光电子器件的性能有重要意义.  相似文献   

3.
利用MOCVD生长了InGaN:Mg薄膜,研究了生长温度、掺Mg量对InGaN:Mg薄膜电学特性的影响。结果表明,空穴浓度随着生长温度的降低而升高。在相同的生长温度下,空穴浓度随掺Mg量的增加,先升高后降低。通过对这两个生长条件的优化,在760°C、CP2Mg与TMGa摩尔流量之比为2.2‰时制备出了空穴浓度高达2.4×1019cm-3的p-InGaN∶Mg薄膜。这对进一步提高GaN基电子器件与光电子器件的性能有重要意义。  相似文献   

4.
利用金属有机物化学气相淀积(MOCVD)生长了InGaN/GaN多量子阱(MQW)蓝光发光二极管(LED),研究了不同Cp2Mg流量下生长的p-GaN盖层对器件电学特性的影响。结果表明,随着Cp2Mg流量的提高,漏电流升高,并且到达一临界点会迅速恶化;正向压降则先降低,后升高。进而研究相同生长条件下生长的p-GaN薄膜的电学特性、表面形貌及晶体质量,结果表明,生长p-GaN盖层时,Cp2Mg流量过低,盖层的空穴浓度低,电学特性不好;Cp2Mg流量过高,则会产生大量的缺陷,盖层晶体质量与表面形貌变差,使得空穴浓度降低,电学特性变差。因此,生长p-GaN盖层时,为使器件的正向压降与反向漏电流均达到要求,Cp2Mg流量应精确控制。  相似文献   

5.
对使用MOCVD方法在蓝宝石衬底上生长的典型InGaN样品进行了光致发光(PL)、霍耳(Hall)及扫描电镜(SEM)测量.结果表明:适当的生长温度(750℃)提高了样品中In的含量和PL强度。当Ⅴ/Ⅲ族比率大约5000时,750℃生长的样品背景载流子浓度约为2.21×1018cm-3,In含量约为11.54%.其室温394nm的带边峰,半高宽约为116meV,束缚能约为32.4meV,可能与束缚激子发光相关.该样品禁带宽度随温度变化的温度系数α(dE/dT)约为0.56×10-3eV/K.较高温度(800℃和900℃)生长的样品In含量较低,PL强度较弱,且在样品表面析出了金属In滴.  相似文献   

6.
利用低压金属有机化学气相沉积(LP-MOCVD)生长工艺,采用三乙基硼(TEB)源,在GaAs(001)衬底上生长了B并入比为0.4%~4.4%的一系列BxAl1-xAs合金。实验结果表明,BxAl1-xAs的最优生长温度为580℃;当生长温度为550℃和610℃时,BxAl1-xAs中B并入比都会下降,550℃时B并入比下降更为显著。在580℃最优生长温度下,B并入比随着TEB摩尔流量增加而提高,且B并入比从临界值2.1%增加至最大值4.4%时,DCXRDω-2θ扫描BxAl1-xAs衍射峰的半高宽值从51.8 arcsec升高到204.7 arcsec,原子力显微镜(AFM)测试表面粗糙度从2.469 nm增大到29.086 nm,说明B并入比超过临界值后BxAl1-xAs晶体质量已经逐渐严重恶化。  相似文献   

7.
利用金属有机物化学气相淀积(MOCVD)生长了InGaN/GaN多量子阱(MQWs)结构,研究了生长停顿对InGaN/GaN MQWs特性的影响.结果表明,采用生长停顿,可以改善MQWs界面质量,提高MQWs的光致发光(PL)与电致发光(EL)强度;但生长停顿的时间过长,阱的厚度会变薄,界面质量变差,不仅In组分变低,富In的发光中心减少,而且会引入杂质,致使EL强度下降.  相似文献   

8.
我们研究了生长温度、TMIn/TEGa和Ⅴ/Ⅲ比对 InGaN/GaN多量子阱表面v型缺陷的影响。当TMIn的流量从180sccm增加到200sccm,v型缺陷的密度也从2.721018/cm2 增加到了5.241018 /cm2, v型缺陷的深度和宽度也随着TMIn流量的增加而增加。当生长温度从748℃增加到758℃, v型缺陷的密度分别是2.05108/cm2, 2.72108/cm2 和 4.23108/cm2,V型缺陷的密度随着生长温度的增加而增加。当NH3的流量从5000sccm增加到8000sccm, v型缺陷的密度分别为 6.341018/cm2, 2.721018/cm2, 4.131018/cm2。我们在753℃, TMIn 流量为180sccm, NH3 流量为6600sccm时,得到了晶体质量最好的InGaN/GaN 多量子阱,表面平整,v型缺陷的密度也比较少。V型缺陷的深度从10nm到30nm,宽度从100nm到200nm,为了抑制v型缺陷对GaN基LEDs反向电流(IR)和静电放电 (ESD) 的影响,我们需要生长更厚的p-GaN来填充这些v型缺陷。  相似文献   

9.
为了测试Mg:Er:LiNbO3晶体的光损伤阈值和红外光谱,采用Czochralski技术生长出优质的Mgx:Ery:LiNbO3(x=0.02,0.04,0.06,0.08,y=0.01(摩尔分数))晶体。通过实验得出Mg(0.06):Er:LiNbO3和Mg(0.08):Er:LiNbO3晶体抗光损伤阈值比LiNbO3晶体提高2个数量级以上,且它们的红外光谱OH-吸收峰移到3535cm-1附近;在波长510nm~580nm范围内得到Mg:Er:LiNbO3晶体稳态发射谱。结果表明,Mg2+浓度增加抗光损伤能力增加,掺进摩尔分数为0.04的MgO是Mg:Er:LiNbO3晶体寿命最长的晶体。  相似文献   

10.
利用X射线衍射(XRD)测量用MOCVD生长的InGaN样品,观察到InN相.通过X射线衍射理论,计算得到InN相在InGaN中的含量.通过退火和变化生长条件发现InN相在InGaN薄膜中的含量与生长时N2载气流量、反应室压力和薄膜中存在的应力有关.进一步的分析表明InGaN合金中出现InN相的主要原因是相分离.  相似文献   

11.
Mg-doped InGaN/GaN p-type short-period superlattices (SPSLs) are developed for hole injection and contact layers of green light-emitting diodes (LEDs). V-defect-related pits, which are commonly found in an InGaN bulk layer, can be eliminated in an InGaN/GaN superlattice with thickness and average composition comparable to those of the bulk InGaN layer. Mg-doped InGaN/GaN SPSLs show significantly improved electrical properties with resistivity as low as ∼0.35 ohm-cm, which is lower than that of GaN:Mg and InGaN:Mg bulk layers grown under optimized growth conditions. Green LEDs employing Mg-doped InGaN/GaN SPSLs for hole injection and contact layers have significantly lower reverse leakage current, which is considered to be attributed to improved surface morphology. The peak electroluminescence intensity of LEDs with a SPSL is compared to that with InGaN:Mg bulk hole injection and contact layers.  相似文献   

12.
The influence of the growth temperature,TMIn/TEGa andⅤ/Ⅲratio on the V-defects of InGaN/GaN multi-quantum wells(MQWs) has been investigated and discussed.When the TMIn flow increases from 180 to 200 sccm,the density of V-defects increases from 2.72×1018 to 5.24×1018 cm-2,and the V-defect width and depth increase too.The density also increases with the growth temperature.The densities are 2.05×108,2.72×1018 and 4.23×108 cm-2,corresponding to a growth temperature of 748,753 and 758℃respectively.When the NH3 flows are 5000,6600 and 8000 sccm,the densities of the V-defects of these samples are 6.34×1018,2.72×1018 and 4.13×1018 cm-2,respectively.A properⅤ/Ⅲratio is needed to achieve step flow growth mode.We get the best quality of InGaN/GaN MQWs at a growth temperature of 753℃TMIn flow at 180 sccm,NH3 flow at 6600 sccm,a flatter surface and less V-defects density.The depths of these V-defects are from 10 to 30 nm,and the widths are from 100 to 200 nm.In order to suppress the influence of V-defects on reverse current and electro-static discharge of LEDs,it is essential to grow thicker p-GaN to fill the V-defects.  相似文献   

13.
Blue and green dual wavelength InGaN/GaN multi-quantum well (MQW) light-emitting diode (LED) has wide applications in full color display, monolithic white LED and solid state lighting, etc. Blue and green dual wavelength LEDs, which consist of InGaN strain-reduction layer, green InGaN/GaN MQW and blue InGaN/ GaN MQW, were grown by metal-organic chemical vapor deposition (MOCVD), and the luminescence properties of dual wavelength LEDs with different well arrangements were studied by photoluminescence and electrolumines-cence. The experimental results indicated that well position played an important role on the luminescence evolvement from photoluminescence to electroluminescence.  相似文献   

14.
The edge-emitting electroluminescence (FL) state of polarization of blue and green InGaN/GaN light-emitting diodes (LEDs) grown in EMCORE’s commercial reactors was studied and compared to theoretical evaluations. Blue (∼475 nm) LEDs exhibit strong EL polarization, up to a 3:1 distinction ratio. Green (∼530 nm) LEDs exhibit smaller ratios of about 1.5:1. Theoretical evaluations for similar InGaN/GaN superlattices predicted a 3:1 ratio between light polarized perpendicular (E⊥c) and light polarized parallel (E‖c) to the c axis. For the blue LEDs, a quantum well-like behavior is suggested because the E⊥c mode dominates the E‖c mode 3:1. In contrast, for the green LEDs, a mixed quantum well (QW)-quantum dot (QD) behavior is proposed, as the ratio of E⊥c to E‖c modes drops to 1.5:1. The EL polarization fringes were also observed, and their occurrence may be attributed to a symmetric waveguide-like behavior of the InGaN/GaN LED structure. A large 40%/50% drop in the surface root mean square (RMS) from atomic force microscopy (AFM) scans on blue/green LEDs with and without EL fringes points out that better surfaces were achieved for the samples exhibiting fringing. At the same time, a 25%/10% increase in the blue/green LED photoluminescence (PL) intensity signal was found for samples displaying EL interference fringes, indicating superior material quality and improved LED structures.  相似文献   

15.
We investigated the electrical and structural qualities of Mg-doped p-type GaN layers grown under different growth conditions by metalorganic chemical vapor deposition (MOCVD). Lower 300 K free-hole concentrations and rough surfaces were observed by reducing the growth temperature from 1,040°C to 930°C. The hole concentration, mobility, and electrical resistivity were improved slightly for Mg-doped GaN layers grown at 930°C with a lower growth rate, and also an improved surface morphology was observed. In0.25Ga0.75N/GaN multiple-quantum-well light emitting diodes (LEDs) with p-GaN layers grown under different conditions were also studied. It was found from photoluminescence studies that the optical and structural properties of the multiple quantum wells in the LED structure were improved by reducing the growth temperature of the p-layer due to a reduced detrimental thermal annealing effect of the active region during the GaN:Mg p-layer growth. No significant difference in the photoluminescence intensity depending on the growth time of the p-GaN layer was observed. However, it was also found that the electroluminescence (EL) intensity was higher for LEDs having p-GaN layers with a lower growth rate. Further improvement of the p-GaN layer crystalline and structural quality may be required for the optimization of the EL properties of long-wavelength (∼540 nm) green LEDs.  相似文献   

16.
The advantages of the p-AIInGaN/GaN superlattices' (SLs) structure as an electron blocking layer (EBL) for InGaN blue light-emitting diodes (LEDs) were studied by experiment and APSYS simulation. Elec- troluminescence (EL) measurement results show that the LEDs with the p-AllnGaN/GaN SLs' structure EBL ex- hibited better optical performance compared with the conventional A1GaN EBL due to the enhancement of hole concentration and hole carrier transport efficiency, and the confinement of electrons' overflow between multiple quantum-wells (MQWs) and EBL.  相似文献   

17.
用MOCVD技术生长GaN:Mg外延膜,在550~950℃温度范围内,对样品进行热退火,并进行室温Hall、光致发光谱(PL)测试.Hall测试结果表明,850℃退火后空穴浓度达到8×1017 cm-3以上,电阻率降到0.8Ω·cm以下.室温PL谱有两个缺陷相关发光峰,位于2.8eV的蓝光峰(BL)以及3.27eV附近的紫外峰(UVL).蓝光峰对紫外峰的相对强度(BL/UVL)在550℃退火后升高,之后随着退火温度的升高(650~850℃)而下降,继续提高退火温度至950℃,BL/UVL急剧上升.空穴浓度先随着Mg掺杂浓度的增加而升高;但继续增加Mg掺杂浓度,空穴浓度反而下降.这些结果表明要实现空穴浓度达1018 cm-3,不仅要考虑H的钝化作用,还要考虑Mg受主的自补偿效应.  相似文献   

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