Ta2O5高k介电薄膜的制备及其电学性质的研究

用射频磁控溅射法制备了Ta2O5高介电薄膜,并对其进行了退火处理。用C-V,(G/ω)-V和I-V方法研究了Al/Ta2O5/p-Si结构的电学特性,观测到了C-V和(G/ω)-V的频散效应。认为串联电阻、Si/Ta2O5界面的界面态密度、边缘俘获是频散效应的主要原因,提取了界面态密度和边缘俘获电荷的大小。同时也研究了不同的退火温度对这些参数以及漏电流的影响,经600℃退火后,样品的电容最大,俘获电荷密度和漏电流最小,器件的电学性能最佳。     

The influence of defects on device performance of MBE-grown Si homojunction and strained Si1-xGex/Si heterostructures

Different Si homojunction and strained Si_1-xGe_x/Si heterojunction diodes and bipolar transistors have been fabricated by Si-MBE. The effect of annealing on Si homojunction diodes and transistors are studied. It is found that annealing generally improves the Si device performance, such as the ideality factor and breakdown characteristics. The influence of⁶⁰Co γ irradiation on the Si_1-xGe_x/Si diode performances are investigated by studying the temperature dependence of their electrical characteristics, and the results are correlated with the quality of the MBE-films. γ irradiation causes a drop in material conductivity due to the generation of atom-displacement defects in the whole volume of the wafers and increases the defect density at hetero-interfaces. The forward I-V curves of Si_1-xGe_x/Si devices may shift towards lower or higher voltages, depending on the film quality and the irradiation dose. The increase of defect density in strained Si_1-xGe_x/Si films appears to occur easier for the films with lower quality. Electrical measurements and calculations show that the defect-associated tunneling process is important in current transport for these MBE grown Si homojunction and strained Si_1-xGe_x/Si heterojunction devices, which have initially medium film quality or have been treated by irradiation.     

/sup 60/Co gamma irradiation effects on n-GaN Schottky diodes

The effect of /spl gamma/-ray exposure on the electrical characteristics of nickel/n-GaN Schottky barrier diodes has been investigated using current-voltage (I-V), capacitance-voltage (C-V), and deep-level transient spectroscopy (DLTS) measurements. The results indicate that /spl gamma/-irradiation induces an increase in the effective Schottky barrier height extracted from C-V measurements. Increasing radiation dose was found to degrade the reverse leakage current, whereas its effect on the forward I-V characteristics was negligible. Low temperature (/spl les/50) post-irradiation annealing after a cumulative irradiation dose of 21 Mrad(Si) was found to restore the reverse I-V characteristics to pre-irradiation levels without significantly affecting the radiation-induced changes in C-V and forward I-V characteristics. Three shallow radiation-induced defect centers with thermal activation energies of 88 104 and 144 meV were detected by DLTS with a combined production rate of 2.12 /spl times/ 10/sup -3/ cm/sup -1/. These centers are likely to be related to nitrogen-vacancies. The effect of high-energy radiation exposure on device characteristics is discussed taking into account possible contact inhomogeneities arising from dislocations and interfacial defects. The DLTS results indicate that GaN has an intrinsically low susceptibility to radiation-induced material degradation, yet the effects observed in the Schottky diode I-V and C-V characteristics indicate that the total-dose radiation hardness of GaN devices may be limited by susceptibility of the metal-GaN interface to radiation-induced damage.     

Modeling growth rate of HfO2 thin films grown by metal-organic molecular beam epitaxy

HfO₂ dielectric layers were grown on the p-type Si (100) substrate by metal-organic molecular beam epitaxy (MOMBE). Hafnium-tetra-butoxide, Hf(O·t-C₄H₉)₄ was used as a Hf precursor and Argon gas was used as a carrier gas. The thickness of the HfO₂ film and intermediate SiO₂ layer were measured by scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). The properties of the HfO₂ layers were evaluated by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), high frequency (HF) capacitance-voltage (C-V) measurement, and current-voltage (I-V) measurement. C-V and I-V measurements have shown that HfO₂ layer grown by MOMBE has a high dielectric constant (k) of 20-22 and a low-level of leakage current density. The growth rate is affected by various process variables such as substrate temperature, bubbler temperature, Ar and O₂ gas flows and growth time. Since the ratio of O₂ and Ar gas flows are closely correlated, the effect of variations in O₂/Ar flow ratio on growth rate is also investigated using statistical modeling methodology.     

Diode laser fabrication using proton bombardment of PbTe

Diode lasers, in which the p-n junction was formed by causing type conversion in a p-type PbTe substrate using proton damage, have been made and their performance characterised. Variations of the energy, flux and fluence of the proton bombardment over wide ranges were found to have little or no effect on the diode I-V, C-V or power output characteristics, but such variations did affect the yield of diodes which lased. The C-V characteristics indicated that the p-n junctions were abrupt. The I-V characteristics suggested that the forward conduction current was dominated by a non-radiative multi-step tunnelling process.     

The analysis of the electrical characteristics and interface state densities of Re/n-type Si Schottky barrier diodes at room temperature

The main electrical characteristics of current-voltage (I-V) and capacitance-voltage (C-V) measurements at room temperature of the Re/n-type Si Schottky barrier diodes prepared by pulsed laser deposition (PLD) method have been examined. The values of the basic electrical properties such as forward saturation current (I_o), ideality factors (n), barrier heights (Ф_bo), rectification ratio (RR) and series resistances (R_S) were obtained from I-V and C-V measurements using different calculation methods. At low voltages (V ≤ 0.3 V), the electrical conduction was formed to take place by thermionic emission, whereas at high voltages (V > 0.3 V), a space charge limited conduction mechanism was shown. Furthermore, the interface state densities (N_SS) as a function of energy distribution (E_SS- E_V) was obtained from the I-V data by taking into account the bias dependence of the effective barrier height (Φ_b) for the Re/n-type Si Schottky barrier diodes.     

HEMT-Al_(0.3)Ga_(0.7)As层中DX中心对器件电学特性的影响研究

本文通过改变温度和光照条件,研究了深能级DX中心的温度特性对HEMT器件的I—V,C—V特性及噪声系数的影响。由实验及理论计算分别得到了I—T,C—T,F—T等曲线。结果表明,DX中心上的带电状态在153～230K之间变化较大,这一温度范围内DX中心对器件的饱和电流,栅电容及噪声系数影响也较大。本文还直接在HEMT器件上作了DLTS测量,得到的结果和理论分析基本相符。     

Electrical Characteristics of PEDOT:PSS Organic Contacts to HgCdTe

The electrical characteristics of organic (3,4-polyethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS) contacts to HgCdTe are studied as a potential alternative to metal/HgCdTe contacts. The use of organic PEDOT:PSS contacts offers the potential for an improved contact technology for HgCdTe IR detector arrays. In this work, PEDOT:PSS contacts are deposited on n-type and p-type HgCdTe epilayers by spin coating and patterned using a metal mask. Current-voltage (I-V) characteristics are measured on these contacts, showing nearly ohmic behavior. The temperature dependence of I-V characteristics (T = 40–300 K) shows increased resistance for decreasing temperature, consistent with the temperature dependence of HgCdTe resistivity, suggesting that the I-V characteristics are primarily dominated by the HgCdTe material.     

Capacitance–Voltage and Current–Voltage Measurements of Nitride Light-Emitting Diodes

Capacitance-voltage (C-V ) and current-voltage (I-V) characteristics of nitride light-emitting diodes were measured. The apparent carrier distributions obtained from the C-V curves yielded much information about the samples, including information about the presence of acceptor-like defects in the active layer and the problem of electron overflow. The inconsistency between the experimental and simulated I-V curves also supported the presence of the defects. After compensating the acceptor-like defects by Si dopants and adjusting the overlap between the depletion region and the light-emitting structure, device performance was improved.     

Electrical Characteristics of 10-kV 4H-SiC MPS Rectifiers with High Schottky Barrier Height

This paper reports the study of the fabrication and characterization results of 10-kilo-volt (kV) 4H-SiC merged PiN/Schottky rectifiers. A metal contact process was developed to make the Schottky contact on n-type SiC and ohmic contact on p-type SiC at the same time. The diodes with different Schottky contact width were fabricated and characterized for comparison. With the improvement quality of the Schottky contact and the passivation layer, the devices show low leakage current up to 10 kV. The on-state characteristics from room temperature to elevated temperature (423 K) were demonstrated and compared between structures with different Schottky contact width.     

Grain boundary layer behavior in ZnO/Si heterostructure

The grain boundary layer behavior in ZnO/Si heterostucture is investigated. The current-voltage (I-V) curves, deep level transient spectra (DLTS) and capacitance-voltage (C-V) curves are measured. The transport cur-rents of ZnO/Si heterojunction are dominated by grain boundary layer as high densities of interracial states existed. The interesting phenomenon that the crossing of In I-V curves of ZnO/Si heterojunction at various measurement temper-atures and the decrease of its effective barrier height with the decrement of temperature are in contradiction with the ideal heterojunction thermal emission model is observed. The details will be discussed in the following.     

Fast neutron radiation damage effects on high resistivity silicon junction detectors

P ⁺ −n ^{−n +} silicon radiation detectors made of high resistivity Si material (ρ ≥ 2 kΩ-cm) were irradiated to a neutron fluence of a few times of 10¹³ n/cm². Dependence of detector leakage current, reverse bias capacitance, and effective doping concentration of the Si substrate on the neutron fluence have been systematically studied. It has been found that the detector leakage current increases linearly with neutron fluence in the range studies, with a damage constant of α = 9 × 10⁻¹⁷ A/cm(ΔI = αΔAϕ_n @#@), and the C-V characteristics of detectors irradiated to ϕ_n > 10¹² n/cm² become frequency dependent. Models using several defect levels in the band gap are proposed to describe the frequency dependent C-V effects and the electrical field profile after high neutron fluence irradiation. This research was supported by the U.S. Department of Energy: Contract No. DE-AC02-76CH00016.     

无坑洞n-3C-SiC/p-Si(100)的LPCVD外延生长及其异质结构特性

在MBE/CVD高真空系统上,利用低压化学气相淀积(LPCVD)方法在直径为50mm的单晶Si(100)衬底上生长出了高取向无坑洞的晶态立方相碳化硅(3C-SiC)外延材料,利用反射高能电子衍射(RHEED)和扫描电镜(SEM)技术详细研究了Si衬底的碳化过程和碳化层的表面形貌,获得了制备无坑洞3C-SiC/Si的优化碳化条件,采用霍尔(Hall)测试等技术研究了外延材料的电学特性,研究了n-3C-SiC/p-Si异质结的I-V、C-V特性及I-V特性对温度的依赖关系.室温下n-3C-SiC/p-Si异质结二极管的最大反向击穿电压达到220V,该n-3C-SiC/p-Si异质结构可用于制备宽带隙发射极SiC/Si HBTs器件.     

CdTe/ZnS复合钝化层对长波碲镉汞器件性能的影响研究

采用CdTe/ZnS复合钝化技术对长波HgCdTe薄膜进行表面钝化,并对钝化膜生长工艺进行了改进。采用不同钝化工艺分别制备了MIS器件和二极管器件,并进行了SEM、C-V和I-V表征分析,研究了HgCdTe/钝化层之间的界面特性及其对器件性能的影响。结果表明,钝化工艺改进后所生长的CdTe薄膜更为致密且无大的孔洞,CdTe/HgCdTe界面晶格结构有序度获得改善;采用改进的钝化工艺制备的MIS器件C-V测试曲线呈现高频特性,界面固定电荷面密度从改进前的1.671011 cm-2下降至5.691010 cm-2;采用常规钝化工艺制备的二极管器件在较高反向偏压下出现较大的表面沟道漏电流,新工艺制备的器件表面漏电现象获得了有效抑制。     

大束流离子注入形成CoSi2/Si肖特基结电学特性

文中研究了使用大束流金属离子注入形成的CoSi2/Si肖特基结的特性。肖特基结由离子注入和快速热退火两步工艺形成。Co离子注入剂量为3×1017ion/cm2,注入电压25kV。快速热退火温度为850°C,时间为1min。应用I-V和C-V测量进行参数提取。I-V分析得到势垒高度约为0.64eV,理想因子为1.11,C-V分析得到势垒为0.72eV。最后依据实验结果对工艺提出了改进意见。     

AuSiC Schottky barrier diodes

Results of the experimental study of Au n-type SiC Schottky barrier diodes at room temperature are presented. The diodes are fabricated by vacuum-evaporating gold on chemically etched n-type hexagonal (6H) SiC surfaces and exhibit excellent forward current vs voltage characteristics with the exponential factor n of about 1·07±0·02 for voltages between 0·35 and 0·85 V. The linear part of the characteristic, in a semi-logarithmic plot, extends over seven orders of magnitude in current. The forward current-voltage characteristics are found to agree quantitatively with the theory based on thermionic emission with the barrier height modified by image force lowering. The Schottky barrier height is determined from three independent techniques: differential capacitance vs voltage, photoresponse, and forward current vs voltage methods. The barrier height deduced from the three methods is about 1·40±0·05 V.     

ZnO/Si异质结中的晶界层行为研究

本文利用电容-电压,电流-电压和深能级瞬态谱研究了ZnO/Si异质结的晶界层行为和载流子的输运机制。当存在高密度界面态时,ZnO/Si异质结的载流子输运受到晶界层的控制。我们观察到了有趣的现象,不同测量温度下得到的ZnO/Si异质结正向lnI-V曲线发生交叉,另外得到ZnO/Si异质结的有效势垒高度随着测量温度的下降而下降,这与理想的异质结热发射模型是相矛盾的。本文的随后各节对上面提到的现象做出解释。     

Photovoltaic effect and carrier transport mechanisms in Hg1-Mnxtdiodes

Hg_1-xMn_xTe semiconducting semimagnetic alloy has been examined in the context of its possible applications in infrared detectors. For analysis of detector properties the intrinsic carrier concentration has been calculated as a function of temperature and crystal composition. The starting material was In-doped Hg_1-xMn_xTe grown by the modified Bridgman method. The as-grown crystals with manganese content of 12-19% were p-type with carrier concentration and mobility of 100 cm²/ Vs at 77 K. An-type layer was formed on the surface by the annealing process in saturated Hg-vapour at 270-320° for 2 hrs. Capacitance-voltage curves have C^-3 dependence on applied voltage indicating that the junction is linearly graded. From standard electrical measurements and spectral characteristics the main detector parameters were determined and compared to those of Hg_1-xCd_xTe devices. The influence of material properties on detector parameters was analyzed. In order to estimate the carrier transport mechanisms, differential resistivities and current-voltage curves were measured over a wide range of temperaturesi.e. 25 to 300 K. From the temperature dependence of the R₀A product, it was established that at high temperatures (150-300 K) the carrier transport is dominated by a recombination-generation mechanism. In low temperature region the excess current at forward bias is probably attributed to carrier tunneling via energy states distributed randomly within the forbidden gap. At reverse bias the leakage surface or volume currents dominate in the carrier transport.     

Electrical properties of ZnO Nano-particles embedded in polyimide

The ZnO nano-particles were made in the polyimide dielectric matrix by using the chemical reaction between the zinc metal film and polyamic acid. The concentration of the ZnO particle is about 1.5×10¹² cm⁻², with average size below 10 nm, and its shapes are almost spherical. Then, the polyimide layer is a stable dielectric material with a dielectric constant of 2.9. To investigate the electrical properties of ZnO particles in the polyimide insulator film, we fabricated a metal-insulator-semiconductor (MIS) structure and measured capacitance-voltage (C-V) with temperature modulation. At room temperature, C-V hysteresis with a voltage gap of 2.8 V appeared in the MIS structure using SiO₂/Si substrate. As the measuring temperature decreased, the C-V curves were shifted slightly to the accumulation region with gate bias. It was considered that the electrical charging may occur dominantly in nanoparticles, having only a few defects at the interface of the polyimide/SiO₂ and the polyimide/ZnO.     

Schottky barrier height of sputtered TiN contacts on silicon

The Schottky barrier height of sputtered TiN on both p- and n-type silicon was determined by I-V and C-V measurements. The barrier height is found to increase on n-Si and to decrease on p-Si, upon thermal annealing. The experimental results are explained in terms of sputtering damage. This damage is modeled by donor-like traps whose concentration decays exponentially from the silicon surface. A characteristic length equal to 45 Å accounts for the observed characteristics. The trap-free values of the barrier height were obtained by I-V measurements after sequential thermal annealing up to 600°C. These values are φ_Bn = 0.55 V on n-type and φ_Bp = 0.57 V on p-type silicon.