Reaction kinetics,thermal properties of tetramethyl biphenyl epoxy resin cured with aromatic diamine

Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with p‐phenylenediamine (PDA) was performed by differential scanning calorimeter using an isoconversional method with dynamic conditions. The effect of the molar ratios of TMBP to PDA on the cure reaction kinetics was studied. The results showed that the curing of epoxy resins contains different stages. The activation energy was dependent of the degree of conversion. At the early of curing stages, the activation energy showed the activation energy took as maximum value. The effects of rigid rod groups and molar ratios of TMBP to PDA for the thermal properties were investigated by the DSC, DMA and TGA. The cured 2/1 TMBP/PDA system with rigid rod groups and high crosslink density had shown highest T_g and thermal degradation temperature. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Properties of epoxy nanoclay system based on diaminodiphenyl sulfone and diglycidyl ether of bisphenol F: influence of post cure and structure of amine and epoxy

Materials were prepared with Cloisite 30B, diglycidyl ether of bisphenol F and diaminodiphenyl sulfone (DDS) to investigate the relationship between exfoliation and property enhancement. A higher level of exfoliation was found with 4,4′‐DDS than in the material cured with 3,3′‐DDS. The material with 4,4′‐DDS that exhibited a higher degree of exfoliation also resulted in larger improvements in physical properties with nanoclay. Increasing the ratio of trifunctional to difunctional epoxy led to a significant decrease in the level of clay dispersion. Increasing the ratio of trifunctional epoxy in the nanocomposite also caused a decrease in T_g with the addition of nanoclay. However, an increase in T_g with increasing clay loadings was detected in samples with a higher degree of exfoliation, with only difunctional epoxy. Similar behaviour was found for samples with and without a post cure. Excessive post cure led to a decrease in thermal stability in Cloisite 30B‐containing samples. Copyright © 2007 Society of Chemical Industry     

Flame retardant epoxy polymers using phosphorus‐containing polyalkylene amines as curing agents

Two series of novel phosphorus‐containing poly(alkylene) amines with or without aromatic groups were synthesized via reacting phosphoryl chloride derivatives with commercially available polyetheramines, ethylenediamine and N‐phenyl‐1,4‐phenylenediamine, respectively. Chemical structures of the amines were characterized with FTIR, NMR, P (phosphorus) content measurement, and amine content titration. These amines were then utilized as curing agents to react with diglycidyl ether of bisphenol A for preparing phosphorus containing epoxy polymers. The introduction of soft ? P? O? linkage, polyalkyene, and hard aromatic group into the backbones of the synthesized phosphorus‐containing amine (PCA) provides epoxy resins with tunable flexibility. Thermal analysis of differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) reveals that these resulted epoxy resins possess moderate T_g's and thermal stability. Furthermore, high char yields in TGA and high limited oxygen index (LOI) values indicate that these phosphorus‐containing epoxy (PCE) resins are capable of exhibiting excellent flame retardant properties. These polymers can be potentially utilized in flame retardant epoxy coatings and other applications. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 3526–3538, 2001     

Tetrafunctional epoxy as an all‐purpose modifier for homopolymerized bisphenol A diglycidyl ether

In some applications, homopolymerized epoxies, which offer better biocompatibility and lower water absorption than amine‐ and anhydride‐cured epoxy, are more preferable; however, using homopolymerized epoxy as matrix in composites still remains a challenge. Herein, homopolymerized bisphenol A diglycidyl ether curing systems with simultaneously improved tensile strength, impact strength, and glass transition temperature (T_g) were achieved by addition of small amounts of tetra‐functional epoxies (TFTEs) with different spacer lengths. Effects of spacer length in TFTE on thermal and mechanical properties were investigated. Results indicated that TFTE with the longest spacer length shows the best mechanical performance. In addition, effects of TFTE loading on thermal and mechanical properties were discussed. Compared with neat bisphenol A diglycidyl ether, addition of 5% tetraglycidyl‐1,10‐bis(triphenylmethane) decane leads to simultaneous improvements in tensile strength, impact strength, and T_g. Effects of thermal cycling on the mechanical properties were also reported. Results suggest that the modified homopolymerized epoxy shows good performances and could be used as matrix materials and possibly in some dental applications. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46431.     

Improved thermosets obtained from diglycidyl ether of bisphenol A/4,4′‐diaminodiphenylsulfone based on a new epoxy‐terminated hyperbranched polymer

A new hyperbranched polymer (HBP) with a flexible aromatic skeleton and terminal epoxy groups was synthesized to improve the toughness of diglycidyl ether of bisphenol A. The HBP was characterized using nuclear magnetic resonance, Fourier transfer infrared spectroscopy and gel permeation chromatography. The effect of HBP on the thermomechanical and mechanical properties of modified epoxy systems was studied. For evaluating the efficiency of the modified epoxy systems, composite samples using glass fiber cloth were molded and tested. Using dynamic mechanical analysis, a slight reduction in glass transition temperature (T_g) with increasing HBP content was observed. Analysis of fracture surfaces revealed a possible effect of HBP as a toughener and showed no phase separation in the modified resin systems. The results showed that the addition of 15 phr HBP maximized the toughness of the modified resin systems with 215 and 40% increases in impact and flexural strengths, respectively. T_g and heat resistance of cured modified resin systems decreased slightly with an increase in HBP content and, at 15 phr HBP, only a 2.6% decrease in thermomechanical properties was observed. Meanwhile, a molded composite with HBP showed improved mechanical properties and retention rate at 150 °C as compared to that made with neat resin. © 2015 Society of Chemical Industry     

New epoxy resins. I. The stability of epoxy–trialkoxyboroxines triaryloxyboroxine system

A polymer with high aromaticity and/or cyclic ring structures chain backbone usually has high heat, thermal, and flame resistance. Two diglycidyl ethers of bisphenols were prepared from 4,4′ isopropylidenediphenol (DGEBA) and 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) for evaluation. Four boroxines—trimethoxyboroxine (TMB), triethoxyboroxine (TEB), triisopropoxyboroxine (TIPB) and triphenoxyboroxine (TPB)—were used as the curing agents. DGEBA and DGEBF cured with various boroxines indicate that the trend for their respective glass transition temperature (T_g's), degradation temperatures (T_d's), and gel fractions are TMB-cured epoxy ≈ TEB-cured epoxy < TIPB cured epoxy < TPB cured epoxy. The DGEBF system usually has a higher T_g, T_d, gel fraction, oxygen index (OI), and char yield than the related DGEBA system. DGEBF/DGEBA (80/20 mol ratio) shows a synergistic effect in regard to char formation. This effect exists not only in the copolymer system but also in blended homopolymers of the separately cured resins. A modified mechanism for the polymerization of phenyl glycidyl ether (PGE) with TMB has been proposed.     

Synthesis and characterization of diamide–diimide–diamines based on p‐amino benzoic acid and their curing and thermal behavior with epoxy blends containing phosphorus/silicon in the main chain

Diimide–diacid ( I ) having an imide group in its rigid structure was synthesized by the refluxing of 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride [4,4′‐carbonyldiphthalic anhydride (BTDA)] and p‐amino benzoic acid in a mixture of acetic acid and pyridine (3 : 2 v/v). The chloroderivative of the diacid ( I ) was synthesized by its reaction with thionyl chloride, this was followed by condensation with different diamines with phenyl, naphthyl, ether, sulfide, and cardo groups to generate a series of diamide–diimide–diamines (DADIDAs). The resultant DADIDAs were characterized by elemental analysis and spectroscopic techniques, namely, Fourier transform infrared spectroscopy and NMR spectroscopy, and were used as epoxy curing agents to impart flame retardancy to the epoxy system. Two epoxy blends (designated as ES and EP) were prepared by the homogeneous mixing of diglycidyl ether of bisphenol A (DGEBA) with 1,3‐bis(3‐glycidyloxypropyl)tetramethyl disiloxane and DGEBA with tris(glycidyloxy)phosphine oxide: each in a ratio of 3 : 2 respectively. The synergistic effect of phosphorus/silicon with nitrogen on the thermal properties of the modified epoxy system was studied. The curing behavior of the epoxy resins formulated by the reaction of stoichiometric amounts of ES/EP with the synthesized DADIDAs were determined by differential scanning calorimetry, and the thermal stabilities of the cured epoxies were evaluated by thermogravimetric analyses (TGAs) under nitrogen and air. TGA indicated that the residual weight percentage of polymers at 800°C was in the range 36.4–60.0 in nitrogen, and in air, it was up to 6.5. However, the major loss in weight in air occurred at elevated temperature; this demonstrated their potential use as flame‐retardant epoxy systems for electronic/electrical encapsulants. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Epoxy resin containing the poly(sily ether): Preparation,morphology, and mechanical properties

The poly(sily ether) with pendant chloromethyl groups (PSE) was synthesized by the polyaddition of dichloromethylsilane (DCM) and diglycidylether of bisphenol A (DGEBA) with tetrabutylammonium chloride (TBAC) as a catalyst. This polymer was miscible with diglycidyl ether of bisphenol A (DGEBA), the precursor of epoxy resin. The miscibility is considered to be due mainly to entropy contribution because the molecular weight of DGEBA is quite low. The blends of epoxy resin with PSE were prepared through in situ curing reaction of diglycidyl ether of bisphenol A (DGEBA) and 4,4′‐diaminodiphenylmethane (DDM) in the presence of PSE. The DDM‐cured epoxy resin/PSE blends with PSE content up to 40 wt % were obtained. The reaction started from the initial homogeneous ternary mixture of DGEBA/DDM/PSE. With curing proceeding, phase separation induced by polymerization occurred. PSE was immiscible with the 4,4′‐diaminodiphenylmethane‐cured epoxy resin (ER) because the blends exhibited two separate glass transition temperatures (T_gs) as revealed by the means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). SEM showed that all the ER/PSE blends are heterogeneous. Depending on blend composition, the blends can display PSE‐ or epoxy‐dispersed morphologies, respectively. The mechanical test showed that the DDM‐cured ER/PSE blend containing 25 wt % PSE displayed a substantial improvement in Izod impact strength, i.e., epoxy resin was significantly toughened. The improvement in impact toughness corresponded to the formation of PSE‐dispersed phase structure. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 505–512, 2003     

Synthesis and Characterization of Dicyclopentadiene – cresol Epoxy Resin

Summary Starting from cresol, the synthesis of dicyclopentadiene (DCPD) – cresol epoxy resin was conducted. DCPD-containing phenol resin (DPR) was prepared via Friedel–Crafts alkylation, whereas DCPD-containing epoxy resin (DER) was prepared via epoxidation of DPR with epichlorohydrin. The chemical structure was characterized with FTIR and ¹HNMR. Cure behaviors and glass transition temperature (T_g) of the resulting polymers were studied by differential scanning calorimeter (DSC). The results clearly indicated that cured polymer with a mixture of DCPD-cresol epoxy resin and diglycidyl ether of bisphenol A (E51) had higher T_g comparing with E51.     

Synthesis of polysiloxane‐type multifunctional flame retardant and its application in epoxy systems

Polymethyl(3‐glycidyloxypropyl)siloxane (PMGS) was synthesized as a flame‐retardant additive, which were cocured with diglycidyl ether of bisphenol‐A (DGEBA) using 4,4′‐diaminodiphenylsulfone as a curing agent. The structure of PMGS was confirmed through Fourier transform infrared and ¹H‐NMR spectra. The cured products were characterized with dynamic mechanical thermal analysis, thermogravimetric analysis, and oxygen index analyzer. With PMGS incorporated, the cured epoxy resin showed better thermal stability, higher limited oxygen index, and higher char yield. At moderate loading of PMGS, the storage modulus and glass transition temperature of the cured epoxy resin based on neat DGEBA were obviously improved. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Preparation of 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether with improved toughness behavior

A high‐performance difunctional epoxy resin, 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether (DHPOP), was synthesized by a two‐step method. The curing behavior of DHPOP was investigated by nonisothermal differential scanning calorimetry method and the curing kinetics results revealed that the introduction of ether linkage could improve the activity of epoxy groups, leading to a lower curing temperature and apparent activation energy compared with that of the commercial bisphenol‐A diglycidyl ether (DGEBA). A series of copolymers were then prepared by varying the mass ratio of DHPOP and DGEBA, which were cured with 4,4′‐diaminodiphenyl methane. The effect of DHPOP contents on thermal and mechanical properties and fracture morphology was studied. As expected, with the increase of DHPOP in the network, the impact strength and char yield were significantly enhanced, while the glass transition temperature (T_g) remained unchanged because of the increase of crosslink density. The excellent toughness endows the DHPOP with the promising potential for the application as high‐performance resin matrix. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46458.     

Synthesis and properties of a novel bismaleimide resin containing 1,3,4‐oxadiazole moiety and the blend systems thereof with epoxy resin

A new bismaleimide monomer, 2‐((4‐maleimidophenoxy)methyl)‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (Mioxd), was designed and synthesized. The chemical structure of the monomer was confirmed by means of Fourier transform infrared (FTIR) spectroscopy, proton nuclear magnetic resonance (¹H NMR) spectroscopy and elemental analysis, and its thermal properties were characterized using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Mioxd as a reactive modifier was blended with epoxy resin based on bisphenol A diglycidyl ether (DGEBA) in weight ratio of 5, 10, and 15%, using 4,4′‐diaminodiphenyl sulfone (DDS) as hardener. The effect of Mioxd addition on the cure behavior and thermal properties of the blend resins was studied by DSC, TGA, and dynamic mechanical analysis (DMA). DSC investigations showed that the main exothermic peak temperature (T_p) of the blend systems did not obviously shift with increasing Mioxd content whereas a new shoulder appeared and gradually grew on the high temperature side of the exothermic peak. The results of DMA measurements exhibited the glassy storage modulus (G') and glass transition temperatures (T_g) increased as the Mioxd content was increased, the cured blends investigated were miscible and no phase separation occurred. Further, the thermal decomposition temperature first decreased and then increased, but the char yield at 600°C increased with an increase in Mioxd content. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Synthesis,phase behaviors,and mechanical properties of biphenyl‐type epoxy resins and composites

Diglycidyl ether of 3,3′,5,5′‐tetramethyl‐4,4′‐biphenyl (TMBPDGE) which has been found great applications in semiconductor packaging was synthesized. The liquid crystalline phases of diglycidyl ether of 4,4′‐dihydroxybiphenol (BPDGE) cured with phenol novolac (PN) were studied by wide angle X‐ray diffraction (WAXD) and polarized optical microscopy (POM). BPDGE was in situ copolymerized with TMBPDGE to improve its thermal and mechanical properties by means of the LC domains retained in the crosslinked networks. The results indicated that a nematic phase was formed and fixed with proper curing schedule when BPDGE was cured with PN that had no neighboring active hydrogens and the LC domains could also be efficiently embedded into the composite systems. Dynamic mechanical properties showed that epoxy networks containing LC domains displayed higher α‐relaxation temperature and linear elastic modulus traces. The impact toughness and T_g were improved with the addition of BPDGE. Scanning electron microscope observation of the fracture surfaces showed that there was a change in failure mechanism in the composite systems. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Studies on thermal and morphological behavior of siliconized epoxy bismaleimide matrices

Novel bismaleimide‐modified siliconized epoxy intercrosslinked network systems were developed. Siliconized epoxy systems containing 5, 10, and 15% siloxane units were prepared using epoxy resin and hydroxyl‐terminated polydimethylsiloxane (HTPDMS) with γ‐aminopropyltriethoxysilane (γ‐APS) as a compatibilizer and dibutyltindilaurate as a catalyst. The siliconized epoxy systems were further modified with 5, 10, and 15% (wt %) of bismaleimide [(N,N′‐bismaleimido‐4,4′‐diphenylmethane) (BMI)] and cured by diaminodiphenylmethane (DDM). Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat‐distortion temperature measurement of the matrix samples were carried out to assess their thermal behavior. DSC thermograms of the BMI‐modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g) of the cured BMI‐modified epoxy and siliconized epoxy systems increases with increasing BMI content. Thermogravimetric analysis and heat‐distortion temperature measurements indicate that the thermal degradation temperature and heat‐distortion temperature of the BMI‐modified epoxy and siliconized epoxy systems increase with increasing BMI content. The morphology of the BMI‐modified siliconized epoxy systems was also studied by scanning electron microscopy (SEM). © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2330–2346, 2001     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

Synthesis,characterization, and properties of a novel epoxy resin containing both binaphthyl and biphenyl moieties

A new epoxy resin containing both binaphthyl and biphenyl moieties in the skeleton (BLBPE) was synthesized and confirmed by electrospray ionization mass spectroscopy, ¹H‐nuclear magnetic resonance spectroscopy, and infrared spectroscopy. To evaluate the combined influence of two moieties, one epoxy resin containing binaphthyl moiety and another containing biphenyl moiety were also synthesized, and a commercial biphenyl‐type epoxy resin (CER3000L) was introduced. Thermal properties of their cured polymers with phenol p‐xylene resins were characterized by differential scanning calorimetry, dynamic mechanical, and thermogravimetric analyses. The cured polymer obtained from BLBPE showed remarkably higher glass transition temperature and lower moisture absorption, as well as comprehensively excellent thermal stability. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis,thermal behavior,and cone calorimetry of organophosphorus epoxy materials

An organophosphorus epoxy resin with diglycidyl ether of bisphenol A (DGEBA), which has improved fire performance, was synthesized from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and DGEBA. The epoxy resin was then cured with an isomeric mixture of 3,5‐diethyltoluene‐2,4‐diamine and 3,5‐diethyltoluene‐2,6‐diamine. The reaction kinetics were measured by Fourier transform IR, ¹H‐NMR, and differential scanning calorimetry. The effect of the incorporation of a phosphorus species into the epoxy network structures was also measured using thermogravimetric, thermal conductivity, and dynamic mechanical thermal analyses. The fire performance was measured using cone calorimetry, which showed that a significant improvement was achieved by the addition of only 1–4% phosphorus into the epoxy backbone. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 3696–3707, 2003     

Azo initiator selection to control the curing order in dimethacrylate/epoxy interpenetrating polymer networks

Differential Scanning calorimetry (DSC) and Fourier‐transform infrared (FT‐IR) spectroscopic studies have been undertaken of the cure of interpenetrating polymer networks (IPNs) formed with imidazole‐cured diglycidyl ether bisphenol‐A (DGEBA) and with either diethoxylated bisphenol‐A dimethacrylate (DEBPADM) or bisphenol‐A diglycidyl dimethacrylate (bisGMA), polymerized by a range of azo initiators (AIBN64, VAZ088, VR110 and AZO168). Due to the differing decomposition rates of the azo initiators, the neat dimethacrylate resin either cured faster than (with AIBN64 and VAZO88), or similar to (VR110), or slower than (AZO168), the neat epoxy resin. In the neat DGEBA/1‐methyl imidazole (1‐MeI), DEBPADM/AIBN64, DEBPADM/VAZO88 and DEBPADM/VR110 resins, close to full cure was achieved. For the neat, high‐temperature DEBPADM/AZO168 resin, full cure was not attained, possibly due to the compromise between using a high enough temperature for azo decomposition while avoiding depolymerization or decomposition of the methacrylate polymer. IPN cure studies showed that, by appropriate initiator selection, it was possible to interchange the order of cure of the components within the IPN so that either the dimethacrylate or epoxy cured first. In the isothermal cure of the 50:50 DEBPADM/AIBN64:DGEBA/1‐Mel IPN system, the cure rate of both species was less than in the parent resins, due to a dilution effect. For this system, the dimethacrylate cured first and to high conversion, due to plasticization by the unreacted epoxy, but the subsequent cure of the more slowly polymerizing epoxy component was restricted by the high crosslink density developed in the IPN. After post‐curing, however, high conversion of both reactive groups was observed and the fully cured IPN exhibited a single high‐temperature T_g, close to the T_g values of the parent resins. In the higher‐temperature, isothermal cure of the 50:50 DEBPADM/VR110:DGEBA/1‐Mel IPN system, the reactive groups cured at a similar rate and so the final conversions of both groups were restricted, while in the 50:50 DEBPADM/AZO168:DGEBA/1‐Mel system it was the epoxy which cured first. Both of these higher‐temperature azo‐initiated IPN systems exhibited single T_gs, indicating a single‐phase structure; however, the T_gs are significantly lower than expected, due to plasticization by residual methacrylate monomer and/or degradation products resulting from the high cure temperature. Copyright © 2004 Society of Chemical Industry     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.