11 GHz ultrawide-bandwidth monolithic photoreceiver using InGaAspin PD and InAlAs/InGaAs HEMTs

A very-wide-bandwidth long-wavelength monolithically integrated photoreceiver is presented which comprises an InGaAs pin PD and a transimpedance amplifier. The receiver uses epilayers grown by one-step MOVPE. The InGaAs channel high-electron-mobility field effect transistor (HEMT) employs an Si planar-doped carrier supplying layer to obtain larger transconductance and uniform threshold voltage. The 0.5 μm gate length is used for HEMTs to enhance the speed of operation. This receiver shows a very wide bandwidth of 11 GHz, and opened eye for a 15 Gbit/s NRZ signal. This is the first demonstration of a long-wavelength monolithic photoreceiver receiving a 15 Gbit/s light signal     

50-nm self-aligned-gate pseudomorphic AlInAs/GaInAs high electronmobility transistors

The design and fabrication of a class of 50-nm self-aligned-gate pseudomorphic AlInAs/GaInAs high electron mobility transistors (HEMTs) with potential for ultra-high-frequency and ultra-low-noise applications are reported. These devices exhibit an extrinsic transconductance of 1740 mS/mm and an extrinsic current-gain cutoff frequency of 340 GHz at room temperature. The small-signal characteristics of a pseudomorphic and a lattice-matched AlInAs/GaInAs HEMT with similar gate length (50 nm) and gate-to-channel separation (17.5 nm) are compared. The former demonstrates a 16% higher transconductance and a 15% higher current-gain cutoff frequency, but exhibits a 38% poorer output conductance. An analysis of the high-field transport properties of ultra-short gate-length AlInAs/GaInAs HEMTs shows that a reduction of gate length from 150 to 50 nm neither enhances nor reduces their average velocity. In contrast, the addition of indium from 53% to 80% improves this parameter by 19%     

Very high gain millimeter-wave InAlAs/InGaAs/GaAs metamorphicHEMT's

We report the first demonstration of W-band metamorphic HEMTs/LNA MMICs using an AlGaAsSb lattice strain relief buffer layer on a GaAs substrate. 0.1×50 μm low-noise devices have shown typical extrinsic transconductance of 850 mS/mm with high maximum drain current of 700 mA/mm and gate-drain breakdown voltage of 4.5 V. Small-signal S-parameter measurements performed on the 0.1-μm devices exhibited an excellent f_T of 225 GHz and maximum stable gain (MSG) of 12.9 dB at 60 GHz and 10.4 dB at 110 GHz. The three-stage W-band LNA MMIC exhibits 4.2 dB noise figure with 18 dB gain at 82 GHz and 4.8 dB noise figure with 14 dB gain at 89 GHz, The gain and noise performance of the metamorphic HEMT technology is very close to that of the InP-based HEMT     

30 nm T-gate enhancement-mode InAlN/AlN/GaN HEMT on SiC substratesfor future high power RF applications

The DC and RF performance of 30 nm gate length enhancement mode (E-mode) InAlN/AlN/GaN high electron mobility transistor (HEMT) on SiC substrate with heavily doped source and drain region have been investigated using the Synopsys TCAD tool. The proposed device has the features of a recessed T-gate structure, InGaN back barrier and Al₂O₃ passivated device surface. The proposed HEMT exhibits a maximum drain current density of 2.1 A/mm, transconductance g_m of 1050 mS/mm, current gain cut-off frequency f_t of 350 GHz and power gain cut-off frequency f_max of 340 GHz. At room temperature the measured carrier mobility (μ), sheet charge carrier density (n_s) and breakdown voltage are 1580 cm²/(V·s), 1.9×10¹³ cm^-2, and 10.7 V respectively. The superlatives of the proposed HEMTs are bewitching competitor or future sub-millimeter wave high power RF VLSI circuit applications.     

Ultra-low-noise cryogenic high-electron-mobility transistors

Quarter-micrometer gate-length high-electron-mobility transistors (HEMTs) for cryogenic low-noise application with very low light sensitivity have been developed. At room temperature, these exhibit a noise figure of 0.4 dB with associated gain of 15 dB at 8 GHz. At a temperature of 12.5 K the minimum noise temperature of 5.3±1.5 K has been measured at 8.5 GHz, which is the best noise performance observed to date for any microwave transistors. The results clearly demonstrate the potential for low-temperature low-noise applications     

High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment

We report a novel approach in fabricating high-performance enhancement mode (E-mode) AlGaN/GaN HEMTs. The fabrication technique is based on fluoride-based plasma treatment of the gate region in AlGaN/GaN HEMTs and post-gate rapid thermal annealing with an annealing temperature lower than 500/spl deg/C. Starting with a conventional depletion-mode HEMT sample, we found that fluoride-based plasma treatment can effectively shift the threshold voltage from -4.0 to 0.9 V. Most importantly, a zero transconductance (g/sub m/) was obtained at V/sub gs/=0 V, demonstrating for the first time true E-mode operation in an AlGaN/GaN HEMT. At V/sub gs/=0 V, the off-state drain leakage current is 28 /spl mu/A/mm at a drain-source bias of 6 V. The fabricated E-mode AlGaN/GaN HEMTs with 1 /spl mu/m-long gate exhibit a maximum drain current density of 310 mA/mm, a peak g/sub m/ of 148 mS/mm, a current gain cutoff frequency f/sub T/ of 10.1 GHz and a maximum oscillation frequency f/sub max/ of 34.3 GHz.     

Photoreceiver module using an InP HEMT transimpedance amplifier for over 40 gb/s

We developed a photoreceiver module for over 40 Gb/s that uses two ultrahigh- speed device technologies: an InP HEMT transimpedance amplifier (TIA) and a uni-traveling-carrier photodiode (UTC-PD). The TIA was designed to have a wide dynamic range by using cascade HEMT topology for the output buffer. We found that reducing the standing wave at the PD-TIA interface by decreasing the change of arg(S/sub 11/) of the TIA within the required frequency region is important for increasing the bandwidth of the module. We obtained a minimum sensitivity of -7.6 dBm and a dynamic range of 11 dB for 43-Gb/s nonreturn-to-zero optical input signal. Error-free operation of the module was confirmed at a data rate of 50 Gb/s.     

液氮制冷的AlGaN/GaN HEMT太赫兹探测器阵列特性研究

为充分发挥AlGaN/GaN高电子迁移率晶体管 (High-Electron-Mobility Transistor, HEMT)太赫兹探测器阵列的高电子迁移率优势,文中研究了HEMT太赫兹探测器阵列在77 K下的探测特性。使用液氮杜瓦为降温主体搭建了适用于焦平面 (Focal-Plane Array, FPA)芯片的低温系统,实现了对焦平面芯片常温与低温下的对比测试。温度从300 K降到77 K时,探测器阵列像元的平均响应度提高近3倍,平均噪声有小幅增大,340 GHz时平均噪声等效功率 (Noise Equivalent Power, NEP)从45.1 pW/Hz1/2降低到了19.4 pW/Hz1/2,灵敏度提高两倍以上。与硅透镜耦合的单元探测器相比,阵列像元的灵敏度提升仍有较大空间。主要是由于各像素点最佳工作电压的不一致,导致在给定统一工作电压下像元间的响应度和噪声都表现出较大的离散性,文中讨论了降低最佳工作电压离散度的可能解决方案。     

22 nm In0.75Ga0.25As channel-based HEMTs on InP/GaAs substrates for future THz applications

In this work, the performance of L_g=22 nm In_0.75Ga_0.25As channel-based high electron mobility transistor (HEMT) on InP substrate is compared with metamorphic high electron mobility transistor (MHEMT) on GaAs substrate. The devices features heavily doped In_0.6Ga_0.4As source/drain (S/D) regions, Si double δ-doping planar sheets on either side of the In_0.75Ga_0.25As channel layer to enhance the transconductance, and buried Pt metal gate technology for reducing short channel effects. The TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T, f_max and transconductance (g_{m_max}). The 22 nm InP HEMT shows an f_T of 733 GHz and an f_max of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz, respectively. InGaAs channel-based HEMTs on InP/GaAs substrates are suitable for future sub-millimeter and millimeter wave applications.     

输出功率密度为2.23W/mm的X波段AlGaN/GaN功率HEMT器件

MOCVD技术在蓝宝石衬底上制备出具有高迁移率GaN沟道层的AlGaN/GaN HEMT材料.高迁移率GaN外延层的室温迁移率达741cm2/(V·s),相应背景电子浓度为1.52×1016cm-3;非有意掺杂高阻GaN缓冲层的室温电阻率超过108Ω·cm,相应的方块电阻超过1012Ω/□.50mm HEMT外延片平均方块电阻为440.9Ω/□,方块电阻均匀性优于96％.用此材料研制出了0.2μm栅长的X波段HEMT功率器件,40μm栅宽的器件跨导达到250mS/mm,特征频率fT为77GHz;0.8mm栅宽的器件电流密度达到1.07A/mm,8GHz时连续波输出功率为1.78W,相应功率密度为2.23W/mm,线性功率增益为13.3dB.     

一种紧凑的GaN高电子迁移率晶体管大信号模型拓扑

GaN高电子迁移率晶体管（HEMT）以其复杂的器件特性使其大信号建模变得十分困难,尽管EEHEMT、Angelov等模型结构曾经成功应用于GaAs HEMT/MESFET的大信号模型,但当它们被用于GaN HEMT建模时却不再准确和完备.面向GaN HEMT器件的大信号模型,本文提出了一种紧凑的模型拓扑,此模型拓扑综合了GaN HEMT器件的直流电压-电流（I-V）特性、非线性电容、寄生参数、栅延迟漏延迟与电流崩塌、自热效应以及噪声等特性.经验证此模型拓扑在仿真中具有很好的收敛性,适用于GaN HEMT器件的大信号模型的建立,满足GaN基微波电路设计对器件模型的需求.     

MBE生长的跨导为186mS/mm的AlGaN/GaN HEMT

用分子束外延 ( MBE)技术研制出了 Al Ga N/Ga N高电子迁移率晶体管 ( HEMT)材料 ,其室温迁移率为 10 35cm2 /V· s、二维电子气浓度为 1.0× 10 13 cm - 2 ;77K迁移率为 2 6 53cm2 /V· s、二维电子气浓度为 9.6× 10 12 cm- 2 。用此材料研制了栅长为 1μm、栅宽为 80μm、源 -漏间距为 4μm的 Al Ga N/Ga N HEMT,其室温最大非本征跨导为 186 m S/mm、最大漏极饱和电流密度为 92 5m A/mm、特征频率为 18.8GH z。另外 ,还研制了具有 2 0个栅指 (总栅宽为 2 0× 80μm =1.6 mm )的大尺寸器件 ,该器件的最大漏极饱和电流为 1.33A。     

Experimental and theoretical noise analysis of microwave HEMTs

Low-frequency noise power and high-frequency noise figures in HEMTs (high electron mobility transistors) were measured and compared with calculations based on a one-dimensional noise model to characterize their low-noise properties. It was found that the drain noise current parameter Q in HEMTS is lower than that in GaAs MESFETs. The strong correlation between drain- and induced-gate-noise currents in HEMTs is due to the asymmetric distribution of noise generation along a channel, and the drain noise current is nearly canceled by those induced-gate-noise current. The intrinsic thermal noise from source and gate resistances is about 25% of the total output noise in the 0.25-μm gate-length HEMT considered     

Design of Cryogenic SiGe Low-Noise Amplifiers

This paper describes a method for designing cryogenic silicon-germanium (SiGe) transistor low-noise amplifiers and reports record microwave noise temperature, i.e., 2 K, measured at the module connector interface with a 50-Omega generator. A theory for the relevant noise sources in the transistor is derived from first principles to give the minimum possible noise temperature and optimum generator impedance in terms of dc measured current gain and transconductance. These measured dc quantities are then reported for an IBM SiGe BiCMOS-8HP transistor at temperatures from 295 to 15 K. The measured and modeled noise and gain for both a single-and two-transistor cascode amplifier in the 0.2-3-GHz range are then presented. The noise model is then combined with the transistor equivalent-circuit elements in a circuit simulator and the noise in the frequency range up to 20 GHz is compared with that of a typical InP HEMT.     

Sensitivity analysis of integrated InGaAs MSM-PD's and HEMToptoelectronic receiver array

A sensitivity analysis is given of a long wavelength optoelectronic receiver array consisting of InAlAs/InGaAs interdigitated Metal Semiconductor Metal photodetectors (MSM-PD's) and a HEMT preamplifier. It is shown that the capacitance varies with the finger width and spacing for a MSM-PD with same active area. Analytical expressions are derived for calculating the sensitivity of the receiver array by means of the equivalent circuit models of the MSM-PD's array and the HEMT. Major noise sources in the receiver array, such as shot noise in the photodetectors, thermal noise in the resistors, gate and drain noises as well as their correlation term in the HEMT, are considered. The influences of geometric parameters of the MSM-PD's and HEMT on the sensitivity of the receiver array are investigated. The optimum gate width of the HEMT is determined for a given MSM-PD array to obtain a high receiver sensitivity. It is also demonstrated that the optical signal related shot noise from the MSM-PD's makes a substantial contribution to the total noise of the receiver array     

Microwave noise characteristics of AlGaN/GaN HEMTs on SiC substrates for broad-band low-noise amplifiers

This letter reports high-performance passivated AlGaN/GaN high electron-mobility transistors (HEMTs) with 0.25-/spl mu/m gate-length for low noise applications. The devices exhibited a minimum noise figure (NF/sub min/) of 0.98 dB and an associated gain (G/sub a/) of 8.97 dB at 18 GHz. The noise resistance (R/sub n/), the measure of noise sensitivity to source mismatch, is 31/spl Omega/ at 18 GHz, which is relatively low and suitable for broad-band low noise amplifiers. The noise modeling analysis shows that the minimum noise figure of the GaN HEMT can be reduced further by reducing noise contributions from parasitics. These results demonstrate the viability of AlGaN/GaN HEMTs for low-noise as well as high power amplifiers.     

AlGaN/GaN HEMT结构热时间常数谱提取方法的研究

利用电学法对AlGaN/GaN 高电子迁移率晶体管(HEMTs)有源区瞬态温升进行测量.利用非参数拟合算法—局部加权回归散点平滑法(LOWESS)对原始测量数据进行平滑去噪处理,进而得到热时间常数谱,分析AlGaN/GaN HEMTs热传导路径物理结构。与传统平滑去噪方法—多阶指数拟合相比,通过LOWESS算法得到的热时间常数谱更丰富,得到RC网络更多,进而热传导路径结构分析更精细。结果表明,LOWESS非参数拟合算法能够更好的去除测量数据噪声,保留原始离散数据细微的变化趋势。通过该方法所提取的热时间常数谱能描述AlGaN/GaN HEMTs有源区温度细微变化,帮助研究人员精确分析热传导路径层次构成。     

Thermal stability investigations of AlGaN/GaN HEMTs with various high work function gate metal designs

The operation of high power RF transistor generates a huge amount of heat and thermal effect is a major consideration for improving the efficiency of power transistors. AlGaN/GaN high electron mobility transistors (HEMTs) on silicon substrates have been studied extensively because of their high thermal conductivity. This study comprehensively investigates the DC, low frequency noise, microwave and RF power performance of Al_0.27Ga_0.73N/GaN HEMTs on silicon substrates at temperatures from room temperature to 100 °C using high work function metals such as palladium (Pd) and iridium (Ir) gate metals. Although the conventional Ni gate exhibited a good metal work function with AlGaN, which is beneficial for increasing the Schottky barrier height of HEMTs, the diffusion of Ni metal toward the AlGaN and GaN layers influences the DC and RF stability of the device at high temperatures or over long-term operation. Pd and Ir exhibited less diffusion at high temperature than Ni, resulting in less degradation of device characteristics after high temperature operation.     

Cryogenic noise performance of HEMTs and MESFETs between 300 and700 MHz

The authors present the noise performance of amplifiers using HEMTs and MESFETs at room temperature and cryogenic temperatures, in the frequency range 300-700 MHz. Results demonstrate that these microwave devices can be applied at frequencies down to at least 300 MHz, giving amplifier noise temperatures below 2 K at 20 K ambient temperature     

High transconductance of 2.25 S/mm observed at 16 K for 195-nm-gate In/sub 0.75/Ga/sub 0.25/As/In/sub 0.52/Al/sub 0.48/As HEMT fabricated on [411]A-oriented InP substrate

We achieved a maximum transconductance (g/sub m/) of 2.25 S/mm at 16 K for a 195-nm-gate In/sub 0.75/Ga/sub 0.25/As/In/sub 0.52/Al/sub 0.48/As pseudomorphic high-electron mobility transistor (PHEMT) fabricated on a [411]A-oriented InP substrate, which is the highest value ever reported for HEMTs. This PHEMT also showed a much enhanced cutoff frequency (f/sub T/) of 310 GHz at 16 K, compared with its room temperature value (245 GHz). The significantly enhanced g/sub m/ and f/sub T/ at 16 K can be attributed to the higher saturation velocity in the region "under the gate," which is caused not only by suppressing the phonon scattering, but also by suppressing the interface roughness scattering due to the "(411)A super-flat InGaAs/InAlAs interfaces" (effectively atomically flat heterointerfaces over a wafer-size area).