二烯丙基双酚A催化改性酚醛型氰酸酯树脂的催化固化

研究了二烯丙基双酚A（DBA）催化改性酚醛型氰酸酯树脂（cy-5）,通过差示扫描量热法（DSC）、热重分析（TG）、冲击性能和动态热机械分析（DMA）测试,分析了改性树脂的热性能和力学性能。研究表明：DBA对cy-5有催化和增韧的双重作用,当DBA的添加量为5%（质量分数）时,催化效果最为明显,含10% DBA的改性树脂固化物的冲击强度达到7.41 kJ/m2,改性树脂固化物的玻璃化转变温度（Tg）和储能模量（E'）均有所降低,但幅度不大。     

氰酸酯树脂在高性能印刷电路板中的应用概况

综述了氰酸酯树脂及氰酸酯改性环氧树脂在高性能印刷电路板中的应用。论述了氰酸酯改性环氧树脂的机理与性能。以改性树脂基体制备的覆铜板介电性能明显得到提高，能满足高频使用的条件。     

酚醛型环氧树脂改性氰酸酯复合材料性能的研究

通过DSC分析,粘度、介电性能、力学性能及耐油性测试对酚醛型环氧树脂改性氰酸酯树脂复合材料的性能进行了研究。结果表明,改性氰酸酯树体系在70～160℃具有较低的粘度,理想工艺是在125～130℃下30～45min后开始加压;改性氰酸酯树脂表观活化能和反应级数分别为60.81kJ/mol和0.8846。改性氰酸酯复合材料具有良好的力学性能、介电性能和耐油性能。     

纤维缠绕用改性氰酸酯树脂体系研究

本文采用环氧树脂对氰酸酯树脂进行改性,研究出适合纤维湿法缠绕的改性氰酸酯体系.通过凝胶实验和DSC等方法研究了改性树脂体系的固化性能,以及改性树脂体系粘度随温度和时间的变化趋势,从而确定其纤维缠绕工艺温度、速度等参数及树脂体系的使用期.对改性树脂基体的热性能、介电性能、力学性能以及改性树脂基体与玻璃纤维、碳纤维的界面性能进行了研究.     

环氧改性氰酸酯树脂的研究

综述采用环氧树脂增韧改性氰酸酯树脂的共聚反应机理、固化催化体系，以及环氧树脂／氰酸酯树脂固化体系的性能和复合材料的性能。环氧树脂与氰酸酯树脂反应生成恶唑啉酮五元环，降低了氰酸酯树脂的交联密度，使韧性提高；催化剂可以明显提高共聚反应速度，改变产物含量；改性后的氰酸酯树脂具有优良的综合力学性能和成型工艺性，且介电性能及耐热／湿热性能无较大损失。     

树脂传递模塑工艺用改性氰酸酯树脂体系研究

由自制改性剂苯乙烯和丙烯酸正丁酯低聚物及TDE-85环氧树脂协同改性氰酸酯树脂,采用示差扫描量热仪,动态热机械分析仪,力学性能和粘度测试研究了改性后的氰酸酯树脂的性能。结果表明,改性氰酸酯树脂浇铸体玻璃化转变温度高于215℃,TDE-85环氧树脂质量分数为15%时,改性氰酸酯树脂浇铸体的综合性能最佳,拉伸强度为45 MPa,弯曲强度为86 MPa,冲击韧性为17 k J/m~2。改性树脂体系室温下6 h内粘度保持在1 000 m Pa·s以下,满足树脂传递模塑成型工艺的要求。     

5528氰酸酯树脂性能研究

对新型的5528改性氰酸酯树脂的介电性能、耐热性能、粘温特性和吸湿性能进行了研究,结果表明:5528氰酸酯树脂具有良好工艺性能,适合于湿法预浸和热熔预浸,介电性能优异,介电损耗正切值为0.005 26,远远低于纯氰酸酯固化物,而且对于频率的稳定性更好,适合宽频应用5。528氰酸酯树脂体系是适合高性能透波材料或高频印刷电路板应用的树脂基体。     

BMI/DBA/PC改性树脂体系的制备与性能研究

采用熔融预聚法制备N, N'-4, 4' -二苯甲烷双马来酰亚胺（BMI）/二烯丙基双酚A(DBA)/聚碳酸酯（PC） (BMI/DBA/PC) 改性树脂体系,研究了含有不同含量PC的改性树脂的力学性能、热稳定性及界面结构。结果表明,PC的加入能明显提高树脂的韧性和强度;当PC含量为8 %（质量分数,下同）时,相比BMI/DBA树脂浇铸体,BMI/DBA/PC树脂浇铸体的拉伸强度提高36.3 %,冲击强度提高109.1 %;改性树脂体系保持了优异的热稳定性和较高的热变形温度;改性树脂体系的相界面结构为PC相以微球状分散于BMI/DBA中,相界面较厚,界面作用较好。     

共聚改性氰酸酯树脂及其性能

利用环氧树脂和双马来酰亚胺树脂做改性剂,对氰酸酯树脂进行共聚改性,通过对粘度的测量描述了共聚树脂的固化反应情况。性能测试表明内聚改性氰酸酯树脂的冲击强度比纯氰酸酯树脂自聚体提高了2倍多,可达12.3kJ/cm^2,热变形温度高达235℃,并具有优异的介电性能,如10kHz 介电常数为2.25,介电损耗角正切＜10^-4。共聚树脂中的配比和固化条件对性能有影响。     

CEg基体及其纤维缠绕复合材料耐热性能研究

针对纤维缠绕的特点，对氰酸酯（CE）树脂进行了改性（改性后的氰酸酯树脂称为CEg基体），改性的目的是不仅使CE树脂适合纤维缠绕工艺，而且不降低纯CE树脂及其复合材料的耐热性能。通过实验摸索出适合纤维缠绕工艺的CEg基体配方及其工艺参数、固化参数。用SEM（扫描电镜）研究了T700／CE以及T700／CEg复合材料的剪切断口形貌；用TG／DTA研究了氰酸酯树脂改性前、后的复合材料热分解温度；用DSC研究了CE和CEg基体的玻璃化温度。研究结果表明：CEg基体最显著的特点是不仅使纤维缠绕工艺和固化工艺简单易行，而且不降低纯氰酸酯树脂及其复合材料的耐热性能。改性后的氰酸酯树脂可以充分发挥氰酸酯树脂的耐高温优势，这是本研究的特点，达到了预期的效果。     

Liquid crystalline epoxy resin modified cyanate ester for high performance electronic packaging

A high performance modified cyanate ester (CE) resin system with significantly improved toughness, water resistance and dimensional stability was developed by copolymerizing CE resin with liquid crystalline epoxy resin (LCE) for electronic packaging. Four LCE/CE resins with different contents of LCE were prepared to systemically evaluate the effect of the content of LCE on the key properties of the modified system such as mechanical, dielectric and thermal properties as well as water resistance. Results reveal that the addition of LCE to CE can not only decrease the curing temperature of CE, but also significantly improve the integrated properties including mechanical and dielectric properties, thermal resistance as well as water resistance of cured resin. For example, compared with the whole exothermic peak of CE, that of LCE10/CE significantly shifts toward low temperature with a gap of about 15°C. On the other hand, the impact strength of cured LCE10/CE resin (22 kJ/m²) is about 2.1 times of that of CE resin; while the water absorption of the former is only 81.2% of that of the latter. In addition, cured LCE/CE resins also exhibit lower and more stable dielectric loss than CE resin over the whole frequency range from 10 to 10⁶ Hz. All these improvements in macro-performance by the addition of LCE to CE resin are not only ascribed to the cross-linked chemical structure, but also attributed to the rigid structure of liquid crystalline resin. The outstanding integrated properties of LCE/CE resins suggest great potential to be applied in the field of high performance electronic packaging.     

双马来酰亚胺改性氰酸酯的研究进展

双马来酰亚胺树脂(BMI)具有优异的耐热性、电绝缘性、透波性、耐辐射性和阻燃性,并且其力学性能和尺寸稳定性良好;而氰酸酯树脂(CE)具有优异的介电性能。采用BMI改性CE,可实现树脂性能的最佳结合,故对近年来BMI改性CE的研究进展进行了综述。     

Static and dynamic mechanical properties of modified bismaleimide and cyanate ester interpenetrating polymer networks

Interpenetrating polymer networks (IPNs) based on different ratios of modified bismaleimide (BMI) resin [BMI/2,2′‐diallylbisphenol A (DBA)] and cyanate ester (CE) (b10) have been synthesized via prepolymerization followed by thermal curing. A systematic study of both static and dynamic mechanical properties of the cured BMI/DBA–CE IPN resin systems was conducted through flexural, impact testing, and dynamic mechanical analysis (DMA). The static mechanical investigation shows that the flexural strength, flexural strain at break, and impact strength of the cured BMI/DBA–CE IPN resin systems are relatively lower than that calculated by rule of mixture of two individuals: BMI/DBA and b10. However, the flexural moduli of the IPN resin systems have more consistent features compared to that calculated by rule of mixture. Single damping peaks are detected for the cured BMI/DBA–CE IPN resin systems, which suggests a substantial degree of interpenetration between two networks. The damping peaks of the cured BMI/DBA–CE IPN resin systems do tend to become broader with increasing concentration of BMI/DBA, whereas the intensity of damping peaks of the IPN resin systems decreases. The obtained results not only provide insight information about the characteristic structures of these BMI/DBA‐–CE IPN resin systems, but also give guidelines for their applications. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2000–2006, 2003     

氰酸酯树脂改性研究进展

氰酸酯树脂(CE)具有优异的介电性能、较高的玻璃化转变温度和强度、良好的耐化学腐蚀性和耐热性等优点,然而其固化物脆性较大,并且其韧性常常不能满足使用要求。从提高CE韧性角度,介绍了各种CE的改性方法(包括橡胶弹性体改性、热固性树脂改性、热塑性树脂改性和互穿聚合物网络改性等)及其应用研究进展。针对改性过程中存在的问题,提出了CE改性的未来发展方向。     

Preparation and properties of novel resins based on cyanate ester and hyperbranched polysiloxane

A novel kind of high performance cyanate ester (CE) resins was developed by copolymerizing 2, 2′-bis(4-cyanatophenyl) iso-propylidene with hyperbranched polysiloxane (HBPSi). HBPSi was synthesized through the hydrolysis of 3-(trimethoxysilyl)propyl methacrylate. The effect of the stoichiometry between CE and HBPSi on the structure and property of modified CE resins was investigated systematically. Results show that the incorporation of HBPSi can not only effectively promote the curing reaction of CE, but also increase the apparent free volume fraction of the cured network, and thus brings significant influence on the performances of the resultant resin. The impact strength of modified CE resin with 15 wt% of HBPSi is 19.6 KJ/m², which is more than 2 times of that of pure CE resin. In addition, the toughened CE resin also exhibits better thermal stability, dielectric property and moisture resistance than original CE resin. The novel modified CE system successfully overcomes the key shortcomings of original CE resin, importantly, this work demonstrates that the new method proposed in this work for modifying CE resin by hyperbranched polymers maybe a right road to be used for developing high performance thermosetting resins.     

环氧及酚醛树脂增韧改性氰酸酯树脂研究

用环氧树脂(EP)及酚醛树脂(PF)对氰酸酯树脂(CE)进行增韧改性,对改性CE的凝胶时间和DSC曲线进行研究并确定了改性CE的固化工艺。红外光谱分析表明改性CE固化时形成了柔韧性结构。研究了改性CE的力学性能、热性能、电性能及微观形态,发现EP的加入可增加CE的柔韧性,PF的加入可使CE的热稳定性损失减小。当CE/EP/PF的质量比为70/15/15时改性CE的弯曲强度和冲击强度分别从改性前的123.6 MPa、5.2 kJ/m2提高到134.5 MPa、16.7 kJ/m2,耐热性及电性能改变不大。     

雷达罩用高性能氰酸酯树脂制备及性能

采用马来酸酐(MAH)改性低分子量聚苯醚(PPE),通过熔融共混法将改性聚苯醚(MAH-PPE)与氰酸酯(CE)树脂进行共混,分析研究MAH-PPE添加量对CE体系热性能、力学性能和介电性能的影响.研究结果表明,MAH-PPE对CE树脂的固化具有明显催化作用,动态热机械和热重分析表明,加入MAH-PPE对CE的耐热性影...     

High‐performance hyperbranched poly(phenylene oxide) modified bismaleimide resin with high thermal stability,low dielectric constant and loss

High‐performance hyperbranched poly(phenylene oxide)‐modified bismaleimide resin with high thermal stability, low dielectric constant, and loss was developed, which is made up of hyperbranched poly(phenylene oxide) (HBPPO), 4,4′‐bismaleimidodiphenylmethane (BDM), and o, o′‐diallylbisphenol A (DBA). The curing reactivity, morphology, and performance of BDM/DBA/HBPPO resin were systemically investigated, and similar investigations for BDM/DBA resin were also carried out for comparison. Results show that BDM/DBA/HBPPO and BDM/DBA resins have similar curing mechanism, but the former can be cured at lower temperature than the later; in addition, cured BDM/DBA/HBPPO resin with suitable HBPPO content has better thermal stability and dielectric properties (lower dielectric constant and loss) than BDM/DBA resin. The difference in macroproperties between BDM/DBA/HBPPO and BDM/DBA resins results from the different chemical structures and morphologies of their crosslinking networks. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011