一种带分段曲率补偿的带隙基准电压源

在传统带隙基准电路的基础上,设计了一种带分段曲率补偿的带隙基准电压源。利用亚阈值区MOS管的漏电流与栅-源电压呈指数关系而产生的非线性补偿电流,分别对温度特性曲线的低温段和高温段进行补偿。该电路采用0.18 μm 标准CMOS工艺进行设计,仿真结果表明,输出基准电压为600 mV,在-40 ℃~125 ℃温度范围内的温度系数为9.4×10-7/℃。     

基于新型高阶温度曲率补偿的低温漂带隙基准源

为满足多种超高精度装备系统应用需求,基于新型高阶温度曲率补偿技术设计了一种新型低温漂带隙基准源。该电路在传统Brokaw带隙基准源基础上,引入新型的高阶温度曲率补偿电路,在高温段和低温段分别采用相应高阶补偿技术,补偿带隙基准源的高阶温度系数,使该新型低温漂带隙基准源具有极低的电压温度系数,并获得更高精度的基准电压。该电路由基准电压产生电路、高阶温度曲率补偿电路和反馈电路组成。该电路基于40 V特色双极工艺进行电路、版图设计、仿真验证和流片。仿真结果显示,在-55～125℃,输出基准电压精度为0.009 7%,温度系数为9.8×10^-7/℃。实测精度为0.010 6%,温度系数为1.04×10^-6/℃,可为24 bit模数转换器(ADC)提供高精度基准电压。     

一种简单的高精度3阶补偿带隙电压基准源

基于普通带隙基准原理,设计了一种简单的3阶补偿带隙基准电路.这种补偿方式无需改变普通带隙基准的结构,仅增加很少的器件就能实现3阶补偿,具有电路实现简单、功耗低、容易嵌入传统带隙基准等优点.设计采用0.5 μm BiCMOS工艺,仿真结果表明,在-40℃～120℃温度范围内,5V工作电压下,该带隙基准源的输出电压为1.204 V,温度系数为1.9×10-6 V/℃,在1 kHz时,电源抑制比为58 dB.     

一种非线性二阶补偿的CMOS带隙基准源

该文依据带隙基准的基准原理设计-基于CSMC0.5um标准CMOS工艺的非线性二阶补偿的带隙基准电压源,在基准中利用非线性电流INL进行二阶补偿,该基准源的工作温度为-25℃～-125℃.温度系数为24×10-6V/℃.增加基于冗余晶体管的启动电路电流仅为1-2uA,具有较小的功耗,较好的可靠性.常温下的输出电压为1....     

带2阶补偿的CMOS带隙基准电压源

基于CSMC 0.5μm CMOS工艺,设计了一种具有低温度系数、带2阶补偿的带隙基准电压源.在传统放大器反馈结构带隙基准源的基础上,利用MOS器件的“饱和电流与过驱动电压成平方关系”产生2阶补偿量,对传统的带隙基准进行高阶补偿.具有电路实现简单,容易添加到传统带隙基准电路的优点.仿真结果表明,设计的基准电压源在5V电源电压下功耗为860 μW,最低工作电压为1.24 V,在-50℃～125℃的温度范围内获得了1.42×10-5/℃的温度系数,低频时的电源抑制比达到-86.3 dB.     

一种高温段曲率补偿基准电压源的设计

在传统电流型带隙基准源的基础上,设计了一种高温段曲率补偿基准电压源。利用工作在亚阈值区的PMOS晶体管的漏电流与栅源电压的指数关系产生非线性补偿电流,对温度特性曲线的高温段进行补偿。采用0.18 μm 标准CMOS工艺对电路进行设计与仿真,结果显示输出基准电压为600 mV,1 kHz下的电源电压抑制比为-55.5 dB,在-40 ℃~125 ℃温度范围内的温度系数为2.26×10-6/℃。     

带2阶温度补偿的多输出带隙基准电压源

基于传统带隙基准的原理,通过优化电路结构,消除双极晶体管基极．发射极电压中的非线性项,设计了一种带2阶补偿的多输出带隙基准电压源。整个电路采用CSMC0．5μmCMOS工艺模型进行仿真。Spectre仿真结果表明,在-55～125℃的温度范围内,带隙基准电压源的温度系数为3．1ppm／℃,在5V电源电压下,输出基准电压为1．2994V;带隙基准电压源的电源抑制比在低频时为84．5dB;在5v电源电压下,可以同时输出0—5V多个基准电压。     

一种新型CMOS带隙基准电压源

传统带隙基准源电路采用PNP型三极管来产生ΔVbe,此结构使运放输入失调电压直接影响输出电压的精度。文章在对传统CMOS带隙电压基准源电路原理的分析基础上,提出了一种综合了一阶温度补偿和双极型带隙基准电路结构优点的高性能带隙基准电压源。采用NPN型三极管产生ΔVbe,消除了运放失调电压影响。该电路结构简洁,电源抑制比高。整个电路采用SMIC 0.18μmCMOS工艺实现。通过Cadence模拟软件进行仿真,带隙基准的输出电压为1.24V,在-40℃~120℃温度范围内其温度系数为30×10-6/℃,电源抑制比(PSRR)为-88 dB,电压拉偏特性为31.2×10-6/V。     

一种曲率补偿的高精度带隙基准源设计

基于CSMC 0.5μm CMOS工艺,设计了一种带曲率补偿的低温漂带隙基准源。采用折叠式共源共栅放大器反馈结构带隙基准源,利用晶体管的VBE与IC的温度特性产生T1n T补偿量,对传统的带隙基准进行曲率补偿。仿真结果表明,在5 V供电电压下,-40~125℃温度范围内,基准电压的波动范围为1.2715~1.2720 V,温漂为3.0×10~(-6)/℃,低频时电路电源抑制比为-86 d B。     

一种高阶补偿低温漂带隙基准源

基于0.18μm CMOS工艺，设计一种带有高阶补偿结构的低温漂系数带隙基准电路。在传统带隙基准的结构上，利用当三极管的集电极电流工作在不同温度特性下的基极与发射极的电位之差含有的高阶补偿量，对传统结构进行补偿，从而得到一个温度系数极低的带隙基准源。仿真结果表明，所设计电路整体结构简单、易实现，在-55～125℃的温度范围内，温漂系数仅为2.52 ppm/℃，低频时的电源抑制比为-78 dB。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks