一种用于全MOS电压基准源的新颖预抑制电路

提出了一种用于全MOS电压基准源的新颖预抑制电路。采用一个大宽长比PMOS管和负反馈环路,将预抑制电压与基准电压之差固定为一个阈值电压。获得的预抑制电压用来为全MOS电压基准源供电,极大地改善了基准电压的电源调整率、温度稳定性和电源电压抑制比。采用Nuvoton 0.35 μm 5 V标准CMOS工艺进行仿真,整个电路的版图尺寸为64 μm×136 μm。结果表明:电压基准源的输出基准电压为1.53 V;电源电压在3.4~5.5 V范围内,线性调整率为97.8 μV/V;PSRR在10 Hz处为-143.2 dB,在100 Hz处为-123.3 dB,在1 kHz处为103.3 dB;环境温度在-45 ℃~125 ℃范围内,平均温度系数为8.7×10-6/℃。     

高电源抑制比低温度系数超低功耗基准电压源

在0.18 μm标准CMOS工艺模型下,利用亚阈值及深线性区MOS管的特性,设计了一种新颖的偏置电流产生电路,并采用此电路设计出一种具有高电源抑制比、低温度系数的全MOS型基准电压源。该电压源采用全MOS结构,不使用电阻,功耗超低。电源电压在0.9~3 V变化时,该电压源均可正常工作,输出电压约为558 mV。1.2 V电源电压下,在－55 ℃~100 ℃温度范围内,该电压源的温度系数为2.3×10-5/℃,低频电源抑制比为－81 dB,总功耗约为127 nW。     

一种改进型低温度系数带隙基准源电路

在传统带隙基准源的基础上,设计了一种改进型带隙基准源电路,能很好地抑制三极管集电极电流变化对输出的影响,获得很低的温度系数和很高的电源电压抑制比。基于BCD 0.18 μm工艺库,仿真结果表明,当电源电压VIN为4.5 V,温度范围为-40 ℃~140 ℃时,基准源电路的输出电压范围为1.2567~1.2581 V,温度系数为6.3 ×10-6/℃;电源电压在2.5~5 V范围内变化时,基准源电路输出的最大变化仅为1.66×10-4 V,线性调整率为0.006 64 %;低频电源电压抑制比高达97 dB。过温保护电路(OTP)仿真表明,该基准源电路有良好的温度特性,温度不高于140 ℃都可正常工作。     

一种结构简单的高精确度带隙基准源设计

设计了一款快速启动、高稳定性的实用型带隙基准电压源。基准源电路基于110 nm的CMOS标准工艺实现,使用Cadence软件进行仿真。仿真表明,在室温下,电源电压为3.3 V时,输出基准电压为1.2 V;在-40 ℃~85 ℃范围内温度漂移系数为33 ppm/℃;电路启动时间为0.5 μs;电源电压抑制比在低频时达到-61 dB;功耗为0.967 mW;版图面积为50 μm×180 μm。该电路结构简单,易于集成,可应用于高速、高精确度的数模转换器(DAC)。     

一种改进型BiCMOS带隙基准源的仿真设计

依据带隙基准原理,设计了一种基于90 nm BiCMOS工艺的改进型带隙基准源电路.该电路设置运算跨导放大器以实现低压工作,用共源-共栅MOS管提高电路的电源抑制比,并加设了新颖的启动电路.HSPICE仿真结果表明,在低于1.1 V的电源电压下,所设计的电路能稳定地工作,输出稳定的基准电压约为610 mV;在电源电压V_(DD)为1.2 v、温度27℃、频率为10 kHz以下时,电源噪声抑制比约为-45 dB;当温度为-40～120℃时,电路的温度系数约为11 × 10~(-6)℃,因此该基准源具有低工作电压、高电源抑制比、低温度系数等性能优势.     

一种全MOS高精度基准电压源电路

基于0.35 μm CMOS工艺,设计了一种高精度基准电压源电路。采用全MOS管实现电路,避免使用大电阻以减小芯片面积。采用新型可变电阻方法,实现了精确补偿。采用两级式基准电压源,提高了电源抑制比。使用Cadence Virtuoso对该基准电压源进行仿真。结果表明,当温度范围 为-40 ℃~125 ℃ 时,基准电压为1.146 V,温度系数为1.025×10-5 ℃-1。在27 ℃时,静态电流为6.57 μA,PSRR分别为-96.64 dB @100 Hz、-93.94 dB@10 kHz。电源电压在2.9~5 V范围变化时,基准电压的线性调整度为0.047％。该电路适用于低功耗、高精度的模拟集成电路。     

一种无电阻高精度基准电压源

基于TSMC 0.18 μm BCD工艺,设计了一种无电阻高精度基准电压源。利用具有高阶温度系数的电流消除VBE温度系数中的非线性项,对输出基准电压实现高阶补偿。与传统无电阻基准电压源中MOS管工作于亚阈值区不同,电路中的MOS管均工作于强反型区,具有更高的仿真模型精度。仿真结果表明,当温度在-55 ℃~125 ℃范围变化时,该基准电压源的温度系数为8.5×10-7/℃。在无滤波电容的情况下,电源抑制比可达-80 dB。当电源电压在2.5~5 V范围变化时,线性调整率小于0.3 mV/V。     

一种低电压低功耗高PSRR CMOS基准电路

设计了一种工作在亚阈值区的高精度、低电压、低功耗CMOS基准电路。电路采用0.18 μm CMOS工艺实现,在1.2 V电源电压下,输出202 mV的基准电压,在-40 ℃~130 ℃范围内的温度系数为6.5×10-5/℃,消耗2.46 μA电流。电源电压从1.1 V变化到3.6 V时,输出基准电压仅变化0.336 mV。该基准电路的电源电压抑制比(PSRR)在直流处达到-93 dB,10 MHz处达到-63 dB。设计了一种多路快速启动电路,只需13 μs即可完成启动。利用高阈值电压晶体管与普通阈值电压晶体管的V_th之差作为负温度系数电压源,使输出基准电压对工艺角不敏感。     

高电源抑制比的CMOS亚阈值多输出电压基准

基于工作在亚阈值区的MOS器件,运用CMOS电流模基准时CATA和PTAT电流求和的思想,提出一种具有低温漂系数、高电源抑制比(PSRR)的CMOS电压基准源,该电路可同时提供多个输出基准电压,且输出电压可调.该基准源基于CSMC 0.5 μm标准CMOS工艺,充分利用预调节电路并改进电流模基准核心电路,使整个电路的电源抑制比在低频时达到122 dB,温度系数(TC)在0～100℃的温度范围内约7 ppm/℃.     

基于阈值电压的电压基准源设计

提出一种新的电压基准结构。利用工作在亚阈值区的MOS管,产生与T2相关的电流进行温度补偿。采用电压预调节结构,改善PSRR。设计了一种低温漂、高PSRR的基于阈值电压的电压基准源。采用SMIC 0.18 μm 1P6M工艺对电路进行设计,最小输入电源电压为1.8 V,输出基准电压为0.835 V。仿真结果表明,在0℃～125℃范围内,温度系数为4.49×10-5/℃,PSRR在低频时为92 dB,在1 MHz时为86.7 dB,静态电流为11.8 μA。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.