Optical characteristics of wurtzite ZnTe thin films

The growth of wurtzite ZnTe thin films with thickness between 250 and 1000 nm on borosilicate glass substrates by electron beam evaporation is reported. The formation of the wurtzite structure was confirmed using X-ray diffraction. The films showed diffraction peaks originating from the (110), (016) and (116) planes, indicating absence of any preferred orientation. The transmission of all the films was of the order of 80% in the near IR region. The refractive index of the wurtzite ZnTe phase increased with increase in thickness from 3.0 at 250 nm to 4.2 for the 1000 nm thickness film at a wavelength of 1800 nm. The optical band gap of these films increased with thickness showing values of 0.85, 0.9 and 0.98 eV at 250, 400 and 1000 nm thickness, respectively. Chemical composition studies revealed that the films were mildly non-stoichiometric with excess Te. Comparison with the zinc blende structure of ZnTe shows that the wurtzite structure has a higher refractive index, lower band gap and lower charge carrier concentration.     

A comparative study on the growth of InAlN films on different substrates

This work investigates the growth of InAlN films on Si (111), sapphire (001), GaAs (100) and glass substrates and compares the structural, morphological, electrical and optical properties of these films. One micron thick InAlN films were synthesized on these substrates at 300 °C by using reactive magnetron co-sputtering system. The structural analysis showed the formation of polycrystalline InAlN films on all the substrates having preferred orientation along (101) plane. The films grown on sapphire and silicon displayed better structural quality than the films grown on GaAs and glass. The morphological results revealed identical granular features on all the substrates with small variation in the grain size. The electrical resistivity of InAlN film on sapphire was the lowest one (8×10⁻³ Ω-cm) whereas the highest carrier concentration (8×10²⁰ cm⁻³) was obtained for the film deposited on glass. The energy band gap of InAlN films was determined through UV–vis absorption and reflectance spectroscopy. The band gap value obtained on the glass was slightly higher as compared to its value on the other substrates. The changes in InAlN properties on different substrates were explained on the basis of lattice mismatch, crystallite size, residual strain and orientation of the substrates.     

Effect of thickness on the structural,optical and electrical properties of RF magnetron sputtered GZO thin films

Gallium-doped zinc oxide (GZO) thin films with very high conductivity and transparency were successfully deposited by RF magnetron sputtering at a substrate temperature of 400 °C. The dependence of the film properties over the thickness was investigated. X-ray diffraction (XRD) results revealed the polycrystalline nature of the films with hexagonal wurtzite structure having preferential orientation along [001] direction normal to the substrate. The lowest resistivity obtained from electrical studies was 5.4×10⁻⁴ Ω cm. The optical properties were studied using a UV–vis spectrophotometer and the average transmittance in the visible region (400–700 nm) was found to be 92%, relative to the transmittance of a soda–lime glass reference for a GZO film of thickness 495 nm and also the transparency of the films decreases in the near IR region of the spectra. The mobility of the films showed a linear dependence with crystallite size. GZO film of thickness 495 nm with the highest figure of merit indicates that the GZO film is suitable as an ideal transparent conducting oxide (TCO) material for solar cell applications.     

N2O treatment enhancement-mode InAlN/GaN HEMTs with HfZrO2 High-k insulator

A normally-off InAlN/GaN MIS-HEMT with HfZrO₂ gate insulator was realized and investigated. By using N₂O plasma treatment beneath the gate region, 13 nm InAlN Schottky layer was oxidized to AlON_x + 4 nm InAlN Schottky layer. The strong polarization induced carriers in traditional InAlN/GaN 2 DEG quantum well was reduced for enhancement-mode operation. High-k thin film HfZrO₂ was used for gate insulator of E-mode device to further suppress gate leakage current and enhance device gate operation range. The maximum drain current of E-mode InAlN/GaN MIS-HEMT was 498 mA/mm and this value was higher than previous published InAlN/GaN E-mode devices. The measurement results of low-frequency noise also concluded that the low frequency noise is attributed to the mobility fluctuation of the channel and N₂O plasma treatment did not increase fluctuation center of gate electrode.     

Variation of the structural,optical and electrical properties of CBD CdO with processing temperature

Nanostructures of CdO thin films are prepared by chemical bath deposition (CBD) technique. The synthesized film is annealed in static air by using the hotplate at 373, 473, 573 and 673 K for 10 min. The effect of annealing temperature on structural, morphological, optical and electrical properties of CdO thin films has been investigated. The prepared thin films are characterised by X-ray diffraction (XRD), atomic force microscope (AFM), optical reflection microscope (ORM), UV–Visible Spectrophotometer and electrical resistivity. XRD shows the emergence of the cubic phase of CdO film in a preferred orientation (111) plane at 573 K. The AFM and ORM show that CdO films have smooth homogeneous surface in the formula with the emergence of nanoclusters gathering as nanoparticles with the average of grain size about 100 nm at 573 K. The optical properties prove that deposited films have high transparency within the visible range of the spectrum that reaches to more than 85% with a wide band gap that extends from 2.42 eV to 2.7 eV. The electrical properties of the CdO films show that resistivity decreases with increased annealing temperatures. In addition, it is proved that more than one activation energy appears and they change according to the temperature of annealing and this comes as a result of the polycrystalline structure. This study indicates that the properties of CdO thin films could be improved with annealing temperature and these films can be used in many technological applications.     

Effect of rapid thermal annealing on properties of thermally evaporated nanostructured CdTe thin film treated with CdCl2

The effects of rapid thermal annealing on properties of crystalline nanostructured CdTe films treated with CdCl₂ and prepared by vacuum evaporation are described. X-ray diffraction confirmed the crystalline nature of post-treated films with high preferential orientation around 23.7°, corresponding to a (1 1 1) diffracted plane of cubic phase. Optical band gap of CdTe films increased from 1.4 eV to 1.48 eV after annealing at 500 °C for 90 s. Atomic force microscopy of annealed films revealed an increase in root mean square roughness and grain size with increased annealing time. Electrical measurements of as-grown and annealed films are consistent with p-type; film resistivity has decreased significantly with increased annealing time.     

Near infra-red transparent Mo-doped In2O3 by hetero targets sputtering for phosphorescent organic light emitting diodes

We report a highly near infrared (NIR) transparent MoO₃-doped In₂O₃ (IMO) film prepared by hetero target sputtering for use as a transparent anode in phosphorescent organic light emitting diodes (OLEDs). Effective activation of Mo dopant in the In₂O₃ matrix and good crystallinity with the (2 2 2) preferred orientation from by rapid thermal annealing (RTA) led to the lowest resistivity of 4.25 × 10^?4 Ohm cm and sheet resistance of 16.9 Ohm/square, comparable to a conventional ITO anode without lose of transparency in the NIR region. Due to high carrier mobility in the IMO matrix, IMO film exhibited higher transmittance in the visible and NIR regions compared to ITO film even though it has a similar resistivity. Both synchrotron X-ray scattering and high resolution transmission electron microscope examinations showed that the optimized IMO film annealed at 600 °C had a rectangular shaped columnar structure with a strongly preferred (2 2 2) orientation. Identical current density–voltage–luminance and quantum efficiency of the phosphorescent OLED fabricated on an IMO anode were comparable to those of the OLED on a reference ITO anode due to the high transparency and low resistivity of the IMO anode.     

Structural and electrical resistivity characteristics of vacuum arc ion deposited zirconium nitride thin films

Zirconium nitride (ZrN) thin films were grown on glass and aluminum substrates using a dual cathodic arc ion deposition technique. The effects of various negative bias voltages and flow ratios of N₂/Ar on the stoichiometric ratio of nitrogen to zirconium (N/Zr), deposition rate, structure, surface morphology and electrical resistivity of the ZrN layer were investigated. Rutherford backscattering spectroscopy measurements indicated a drop in the deposition rate and a slight increase in stoichiometric ratio (N/Zr) with the increase of bias voltage up to −400 V, although the latter still remained slightly less than unity (~0.92). Deposition rate of the film showed an increase with the argon addition. X-ray diffraction patterns depicted mostly polycrystalline nature of the films, with preferential orientation of (2 0 0) planes in the −100 V to −300 V bias voltage range. For 70–50% nitrogen and at a bias voltage of −400 V, the (1 1 1) orientation of ZrN film predominated. The films were smoother at a lower bias of −100 V, while the roughness increased slightly at a higher bias voltage possibly due to (increased) preferential re-sputtering of zirconium-rich clusters/islands. Changes in the resistivity of the films were correlated with stoichiometry, crystallographic orientation and crystalline quality.     

Controlling the diameter of silicon nanowires grown using a tin catalyst

Silicon nanowires were grown on ITO-coated glass substrates via a pulsed plasma enhanced chemical vapor deposition method, using tin as a catalyst. The thin films of catalyst, with different thicknesses in the range 10–100 nm, were deposited on the substrates by a thermal evaporation method. The effect of the thickness of the thin film catalyst on the morphology of the silicon nanowires was investigated. The scanning/transmission electron microscopy images showed that the wire diameter increased as the thickness of the thin film catalyst increased. The nanowires grown using a thin film thickness of 10 nm were inhomogeneous in diameter, whereas the other thicknesses led to an increase in the homogeneity of the diameters of the nanowires. The dominant wire diameter of the grown silicon nanowires ranged from 70 to 80 nm with 10 nm catalyst thin film thickness, and increased to a range of 190–200 nm with 100 nm catalyst thin film thickness.     

The effects of carrier gas and substrate temperature on ZnO films prepared by ultrasonic spray pyrolysis

ZnO films were deposited on glass substrates in the temperature range of 350–470 °C under an atmosphere of compressed air or nitrogen (N₂) by using ultrasonic spray pyrolysis technique. Structural, electrical and optical properties of the ZnO films were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM), electrical two-probe and optical transmittance measurements. The ZnO films deposited in the range of 350–430 °C were polycrystalline with the wurtzite hexagonal structure having preferred orientation depending on the substrate temperature. The ZnO films deposited below 400 °C had a preferred (100) orientation while those deposited above 400 °C mostly had a preferred (002) orientation. The resistivity values of ZnO films depended on the types of carrier gas. The ZnO thin films deposited under N₂ atmosphere in the range of 370–410 °C showed dense surface morphologies and resistivity values of 0.6–1.1 Ω-cm, a few orders of magnitude lower than those deposited under compressed air. Hydrogen substition in ZnO possibly contributed to decreasing resistivity in ZnO thin films deposited under N₂ gas. The Hall measurements showed that the behavior of ZnO films deposited at 410 °C under the N₂ atmosphere was n-type with a carrier density of 8.9–9.2×10¹⁶ cm^-3 and mobility of ～70 cm²/Vs. ZnO thin films showed transmission values at 550 nm wavelength in a range of 70–80%. The values of band gaps extrapolated from the transmission results showed bandgap shrinkage in an order of milli electron volts in ZnO films deposited under N₂ compared to those deposited under compressed air. The calculation showed that the bandgap reduction was possibly a result of carrier–carrier interactions.     

Bias voltage dependence properties of Nb-doped indium tin oxide thin films by RF magnetron sputtering at room temperature

Niobium doped indium tin oxide (ITO:Nb) thin films were fabricated on glass substrates by RF magnetron sputtering from one piece of ceramic target material at room temperature. The bias voltage dependence of properties of the ITO:Nb films were investigated by adjusting the bias voltage. Structural, electrical and optical properties of the films were investigated using X-ray diffraction (XRD), atomic force microscopy (AFM), UV–visible spectroscopy, and electrical measurements. XRD patterns showed a change in the preferential orientations of polycrystalline crystalline structure from (222) to (400) crystal plane with the increase of negative bias voltage. AFM analysis revealed that the smooth film was obtained at a negative bias voltage of -120 V. The root mean square (RMS) roughness and the average roughness are 1.37 nm and 1.77 nm, respectively. The films with the lowest resistivity as low as 1.45×10⁻⁴ Ω cm and transmittance over 88% have been obtained at a negative bias voltage of −120 V. Band gap energy of the films, depends on substrate temperature, varied from 3.56 eV to 3.62 eV.     

Influence of processing and annealing steps on electrical properties of InAlN/GaN high electron mobility transistor with Al2O3 gate insulation and passivation

We report on preparation and electrical characterization of InAlN/AlN/GaN metal–oxide–semiconductor high electron mobility transistors (MOS HEMTs) with Al₂O₃ gate insulation and surface passivation. About 12 nm thin high-κ dielectric film was deposited by MOCVD. Before and after the dielectric deposition, the samples were treated by different processing steps. We monitored and analyzed the steps by sequential device testing. It was found that both intentional (ex situ) and unintentional (in situ before Al₂O₃ growth) InAlN surface oxidation increases the channel sheet resistance and causes a current collapse. Post deposition annealing decreases the sheet resistance of the MOS HEMT devices and effectively suppresses the current collapse. Transistors dimensions were source-to-drain distance 8 μm and gate width 2 μm. A maximum transconductance of 110 mS/mm, a drain current of ～0.6 A/mm (V_GS = 1 V) and a gate leakage current reduction from 4 to 6 orders of magnitude compared to Schottky barrier (SB) HEMTs was achieved for MOS HEMT with 1 h annealing at 700 °C in forming gas ambient. Moreover, InAlN/GaN MOS HEMTs with deposited Al₂O₃ dielectric film were found highly thermally stable by resisting 5 h 700 °C annealing.     

Growth of ITO thin films on polyimide substrate by bias sputtering

Transparent conducting indium tin oxide thin films were deposited on polyimide substrates by RF bias sputtering of ITO target. The influences of bias voltage on the structural and electrical properties of the films were investigated. In order to correlate the material characteristics with the plasma parameters during sputtering, we employed Langmuir probe and optical emission spectral studies. The films deposited onto positively biased substrates were poorly crystalline. An improvement in crystallinity was observed with increase in negative bias. The films deposited at a bias voltage of ?20 V showed a preferred orientation in the [1 1 1] direction and has minimum resistivity compared to films grown at other biasing conditions. The measured plasma parameters were correlated to the film properties. The ITO films thus grown have been used as the channel layer for the fabrication of thin film transistor.     

Synthesis and some surface studies of laminated ZnO/TiO2 transparent bilayer by two-step growth

A laminated bilayer was prepared by first depositing titanium dioxide (TiO₂) nanocrystals on indium tin oxide (ITO) coated glass by a two-electrode cell. Zinc oxide (ZnO) thin film was thereafter deposited on the TiO₂ by two different techniques: electrochemical deposition and vacuum evaporation. The films were characterized by some surface probing techniques. Morphological study revealed that particle size of the TiO₂ underlayer increases between 110 and 138 nm with increase in deposition voltage. It also showed that ZnO thin film (overlayer) completely covered the underlying TiO₂ without chemical interaction between constituents of both layers. Cross-sectional FESEM study gave values of layered film thickness below 55 µm. Exhibition of strong diffraction peak at plane (121) indicated preference of TiO₂ film's growth orientation. It also suggested a feature of phase-pure brookite. Optical studies showed that each film exhibited strong absorption edge at λ=~330 nm and transmitted fairly across visible light region. Energy band gap lied between 3.24 and 3.43 eV. This study demonstrated successive layer deposition of transparent metal oxide structures from inorganic reagents. It also reaffirmed TiO₂ as a recipe for barrier layer that can hinder transition of holes from absorber to transparent front contact of nanostructured photonic devices.     

Effect of annealing temperature on optical and electrical properties of lead sulfide thin films

Lead sulfide (PbS) thin films with 150 nm thickness were prepared onto ultra-clean quartz substrate by the RF-sputtering deposition method. Deposited thin films of PbS were annealed at different temperatures 100 °C, 150 °C, 200 °C, 250 °C and 300 °C. X-ray diffraction pattern of thin films revealed that thin films crystallized at 150 °C. Crystalline thin films had cubic phase and rock salt structure. The average crystallite size of crystalline thin films was 22 nm, 28 nm and 29 nm for 150 °C, 200 °C and 250 °C respectively. From 150 °C to 250 °C increase in annealing temperature leads to increase in crystallite arrangement. FESEM images of thin films revealed that crystallite arrangement improved by increasing annealing temperature up to 250 °C. Increase in DC electrical conductivity by increasing temperature confirmed the semiconductor nature of crystalline thin films. Increase in dark current by increasing annealing temperature showed the effect of crystallite arrangement on carrier transport. Photosensitivity decreased by increasing annealing temperature for crystalline thin films that it was explained at the base of thermal quenching of photoconductivity and adsorption of oxygen at the surface of thin films that leads to the formation of PbO at higher temperatures.     

Effect of substrate temperature on structural,morphological, optical and electrical properties of MnIn2S4 thin films prepared by nebulizer spray pyrolysis technique

Manganese indium sulphide (MnIn₂S₄) thin films were deposited using an aqueous solution of MnCl₂, InCl₃ and (NH₂)₂CS in the molar ratio 1:2:4 by simple chemical spray pyrolysis technique. The thin film substrates were annealed in the temperature range between 250 and 350 °C to study their various physical properties. The structural properties as studied by X-ray diffraction showed that MnIn₂S₄ thin films have cubic spinel structure. The formation of cube and needle shaped grains was clearly observed from FE-SEM analysis. The energy dispersive spectrum (EDS) predicts the presence of Mn, In and S in the synthesized thin film. From the optical studies, it is analyzed that the maximum absorption co-efficient is in the order between 10⁴ and 10⁵ cm⁻¹ and the maximum transmittance (75%) was noted in the visible and infrared regions. It is noted that, the band gap energy decreases (from 3.20 to 2.77 eV) with an increase of substrate temperature (from 250 to 350 °C). The observations from photoluminescence studies confirm the emission of blue, green, yellow and red bands which corresponds to the wavelength range 370–680 nm. Moreover, from the electrical studies, it is observed that, as the substrate temperature increases the conductivity also increases in the range 0.29–0.41×10⁻⁴ Ω⁻¹ m⁻¹. This confirms the highly semiconducting nature of the film. The thickness of the films was also measured and the values ranged between 537 nm (250 °C) to 483 nm (350 °C). This indicates that, as the substrate temperature increases, the thickness of the film decreases. From the present study, it is reported that the MnIn₂S₄ thin films are polycrystalline in nature and can be used as a suitable ternary semiconductor material for photovoltaic applications.     

Effect of annealing on the structural and optical properties of laser ablated nanostructured barium tungstate thin films

High quality BaWO₄ thin films are successfully deposited on quartz substrate for a duration of 30 min using pulsed laser ablation technique and using a laser radiation of wavelength 355 nm and the effect of thermal annealing on the structural and optical properties is studied by using techniques like X-ray diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy, micro-Raman, FTIR and UV–visible spectroscopy. All the films show monoclinic crystalline structure with (2 0 2) plane as the preferred orientation of crystal growth. From the XRD analysis it is found that the optimum annealing temperature for better crystallization of the BaWO₄ film is 700 °C and there is no phase change observed with annealing temperature. The presence of the characteristic bands for the BaWO₄ in the Raman spectra of the films suggests the formation of BaWO₄ crystalline phase in all the films. SEM and AFM analyses show that as the annealing temperature increases the connectivity between individual grains increases and shows an ordered packing. The geometrical optimization and energy calculation of the title compound were done using the Gaussian 09 software package and the calculations were carried out using the CAM-B3LYP functional combined with standard Lanl2Dz basis set. The thickness of the films was calculated using lateral SEM images and also from optical transmission spectral data using PUMA software.     

The significant effect of film thickness on the properties of chalcopyrite thin absorbing films deposited by RF magnetron sputtering

In this paper, thickness dependent structural, surface morphological, optical and electrical properties of RF magnetron sputtered CuIn_0.8Ga_0.2Se₂ (CIGS) thin films were studied using X-ray diffraction (XRD), Transmission electron microscopy (TEM), Field emission scanning electron microscopy (FE-SEM), Atomic force microscopy (AFM), UV–vis–NIR spectrophotometer and Keithley electrical measurement unit. The peak intensity along (112) plane as well as crystallite size was found to increase with thickness. However, for higher film thickness >1.16 μm, crystallinity reduced due to higher % of Cu content. TEM analysis confirmed pollycrysallinity as well as chalcopyrite phase of deposited films. The band gap was found to decrease with increase in thickness yielding a minimum value of 1.12 eV for film thickness 1.70 μm. The I–V characteristics showed the ohmic behavior of metal semiconductor contact with higher conductivity for film thickness 1.16 μm.     

Texture of electrodeposited tin layers and its influence on their corrosion behavior

Differences in the degree of corrosion of pure thin tin films electrodeposited on copper substrates were investigated in dependence on the layer thickness and the texture of the tin layers. The change of the preferred orientation of the tin layer deposited by applying different current densities was analyzed using X-ray diffraction. A graphical evaluation was used to determine the degree of corrosion after sample exposition to NaCl contaminations and humidity. Results show that a preferred orientation along the lattice planes (3 2 1) and (2 2 0) enhances the corrosion resistance of the tin layer by about one order of magnitude compared to a non-textured sample based on the corroded area. In contrast, a texture along (1 0 1) and (1 1 2) accelerates the oxidation of tin by a factor of about three to four compared with a randomly orientated specimen. The corrosion dependence on the preferred orientation decreases with increasing layer thickness. Moreover, scanning electron micrographs show no effect to the size of the tin grains on variations of the current density. In summary, changes in the process parameters of the electrodeposition lead to a variation of texture and thus modify the chemical and corrosion properties of the resulting tin layers. Consequently reliability properties like solderability or whisker growth in further applications depend on these parameters.     

Optical,electrical and photovoltaic properties of thermally evaporated 3-amino-2-[(2-nitrophenyl)diazinyl]-3-(piperidin-1-yl)acrylonitrile thin films

Thin films with various thickness of 3-amino-2-[(2-nitrophenyl)diazinyl]-3-(piperidin-1-yl)acrylonitrile (ANPA) were produced by conventional thermal evaporation. The dependence of the optical, electrical, and photovoltaic properties on the film thickness was investigated. X-ray diffraction showed that the films have an amorphous structure. The optical properties were investigated in terms of transmittance and reflectance in the spectral range 200–2500 nm. Spectral distribution analysis of the absorption coefficient revealed that the films have an indirect allowed electronic interband transition. The optical bandgap decreased from 2.47 to 2.1 eV for an increase in film thickness from 105 to 265 nm. The direct current electrical conductivity of the films was measured for sandwich-structured samples as a function of the heating temperature and film thickness. The films exhibited semiconductor behavior and electrical conduction was attributed to hopping of charge carriers in localized states. ANPA films of differing thickness were deposited on p-type Si single-crystal substrates. The influence of film thickness on the electrical and photovoltaic parameters of Au/ANPA/p-Si/Al heterojunction solar cells was investigated.