RF磁控溅射技术制备纳米硅

利用硅-SiO2复合靶,RF磁控溅射技术制备了三种富硅量不同的SiO2薄膜,并在较大的温度范围内进行了退火。利用x射线光电子能谱,对刚淀积的样品进行了分析,结果表明三种样品都存在纳米硅粒子。使用高分辨率透射电子显微镜和电子衍射技术研究了退火后样品中纳米硅粒子析出和结晶情况,富硅量较大的两种SiO2薄膜都观测到纳米硅晶粒。统计结果表明:复合靶中硅组分从20%增加到30%,纳米硅晶粒的平均尺寸增加了15%、密度增加了2.5倍,而且随着退火温度从900℃增加到1100℃,纳米硅晶粒的平均尺寸和密度都明显增加。     

Improving efficiency of organic solar cells by preparing aluminum-doped zinc oxide films by ion beam-assisted sputtering

This paper reports on the improvement of the efficiency of organic solar cells (OSCs) by using ion beam-assisted sputtering (IBAS) to synthesize the alumina-doped zinc oxide (AZO) anodes that are used therein. The anode voltage of the ion source and the substrate temperature during IBAS were varied. When the substrate temperature was 460 °C, increasing the anode voltage from 0 to 40 V increased the efficiency of the OSCs by ～50%. The optical, electrical, morphological, and interfacial properties of the AZO and organic layers were investigated. The improvement of OSCs was associated with an increase in the conductivity, FOM, surface work function of the AZO films, and a decrease in the contact resistance in AZO/CuPc interface.     

Low-temperature deposition of silicon oxide and silicon nitride by reactive magnetron sputtering

In this study, oxide and nitride films were deposited at room temperature through the reaction of silicon sputtered by argon and oxygen ions or argon and nitrogen ions at 250 and 350 W with 0.67 Pa pressure. It was observed that for both thin films the deposition rates increase with the applied RF power and decrease with the increase of the gas concentration. The Si/O and Si/N ratio were obtained through RBS analyses and for silicon oxide the values changed from 0.42 to 0.57 and for silicon nitride the values changed from 0.4 to 1.03. The dielectric constants were calculated through capacitance-voltage curves with the silicon oxide values varying from 2.4 to 5.5, and silicon nitride values varying from 6.2 to 6.7, which are good options for microelectronic dielectrics.     

溅射压强对磁控溅射法制备的ZnO:Zr透明导电薄膜性能的影响

Transparent conducting zirconium-doped zinc oxide films with high transparency and relatively low resistivity have been successfully prepared on water-cooled glass substrate by radio frequency magnetron sputtering at room temperature. The Ar sputtering pressure was varied from 0.5 to 3 Pa. The crystallinity increases and the electrical resistivity decreases when the sputtering pressure increases from 0.5 to 2.5 Pa. The cystallinity decreases and the electrical resistivity increases when the sputtering pressure increases from 2.5 to 3 Pa. When the sputtering pressure is 2.5 Pa, it is obtained that the lowest resistivity is 2.03 x 10^-3Ω .cm with a very high transmittance of above 94%. The deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate.     

Influence of the sputtering pressure on the properties of transparent conducting zirconium-doped zinc oxide films prepared by RF magnetron sputtering

Transparent conducting zirconium-doped zinc oxide films with high transparency and relatively low re-sistivity have been successfully prepared on water-cooled glass substrate by radio frequency magnetron sputtering at room temperature. The Ar sputtering pressure was varied from 0.5 to 3 Pa. The crystallinity increases and the electri-cal resistivity decreases when the sputtering pressure increases from 0.5 to 2.5 Pa. The cystallinity decreases and the electrical resistivity increases when the sputtering pressure increases from 2.5 to 3 Pa. When the sputtering pressure The deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate.     

Role of hydrogen in the surface passivation of crystalline silicon by sputtered aluminum oxide

Aluminum oxide films can provide excellent surface passivation on both p‐type and n‐type surfaces of silicon wafers and solar cells. Even though radio frequency magnetron sputtering is capable of depositing aluminum oxide with concentrations of negative charges comparable to some of the other deposition methods, the surface passivation has not been as good. In this paper, we compare the composition and bonding of aluminum oxide deposited by thermal atomic layer deposition and sputtering, and find that the interfacial silicon oxide layer and hydrogen concentration can explain the differences in the surface passivation. Copyright © 2010 John Wiley & Sons, Ltd.     

P-silicon thin film fabricated by magnetron sputtering and aluminium induced crystallization for Schottky silicon solar cells

Solar cells consist of n-Si wafer and p-Si polycrystalline thin film, which was solely fabricated by magnetron sputtering, and aluminium induced crystallization, are presented in this paper. Firstly, the material and electrical properties of the fabricated p-Si thin films including the crystallization ratio, grain size, morphology, carrier density and mobility were studied by Raman spectroscopy, X-ray diffraction (XRD), scanning electron microscopy and Hall Effect measurement, respectively. The p-Si polycrystalline thin film formed under optimal process conditions had the crystallization ratio of ~ 99% and the grain size of ~ 64.6 nm, determined from the data of Raman spectroscopy and XRD. The hole concentration in the fabricated p-Si polycrystalline thin films was mainly in the order of 10¹⁷ cm⁻³ to 10¹⁹ cm⁻³, and their corresponding mobility values ranged from 15 cm²/V s to 65 cm²/V s. Then solar cells with the device structure of Al electrode/n-Si wafer/p-Si thin film/Al electrode were fabricated, and their electrical properties were measured both under dark and illumination conditions by the semiconductor performance tester and solar simulator. The measured J-V curves under dark condition confirmed the creation of a p-n junction with the ideality factor of 1.55, rectification ratio of 410 at ± 1 V, and the reverse saturation current of 246 nA/cm². The efficiency of 2.19%, with an open circuit voltage of 448 mV and a short circuit current density of 11.2 mA/cm², was achieved under AM1.5G standard illuminations.     

离子注入硅退火过程中平面形核和结晶问题研究

According to the thermodynamic and kinectic theory, considering variation of bulk free energy and superficial energy after nucleation as well as migration of atom, we study deeply planar nucleation and crystallization that relate to two possible transition mechanism in the process of annealing of ion implanted Si. 1） Liquid/Solid transition: critical nucleation work is a half of increased superficial energy and inversely proportional to the supercooling . Compared with bulk nucleation, the radius of critical nucleus decrease by a half, nucleation rate attain its maximum at T=1/2Tm; 2） Amorphous/Crystal transition: atoms containing in critical nucleus and on its surface, as well as critical nucleation work are all directly proportional to the height of nucleus, nucleation barrier is a half of superficial energy too. Taking SiGe semiconductor as an example, we calculate that the value of its elastic strain energy is 0.03eV/atom, and get more reasonable result after taking its effect to transition into account. In one word, we reach such a conclusion through calculation: for annealing of ion implanted Si, no matter what transition way—liquid or solid, the planar nucleation and recrystallization process is actually carried out layer by layer on crystal substrate, probability forming “rod-like”nucleus is much larger than probability of “plate-like”nucleus.     

Effects of annealing on the structural and optical properties of zinc sulfide thin films deposited by ion beam sputtering

We report the structural and optical properties of ZnS thin films fabricated by ion-beam sputtering. X-ray diffraction (XRD) and transmission electron microscopy (TEM) results revealed a polycrystalline ZnS film with zinc blende phase as manifested by diffraction from the (111), (220) and (311) planes. Annealing resulted in the appearance of a metastable wurtzite phase with a concentration up to 26.6%. An energy bandgap, estimated from absorption spectra, was found to vary between 3.32 and 3.40 eV. The lower energy of this bandgap, as compared to bulk ZnS, is associated with the structural point defects along with mixed zinc blende and wurtzite phases of the polycrystalline ZnS films. Ion beam sputtering deposition can be used to tune the optical bandgap for potential applications in optoelectronic materials.     

Planar nucleation and crystallization in the annealing process of ion implanted silicon

According to thermodynamic and kinetic theory,considering the variation of bulk free energy and superficial energy after nucleation as well as the migration of atoms,we study systematically the planar nucleation and crystallization that relate to two possible transition mechanisms in the annealing process of ion implanted S i:(1) liquid/solid transition:the critical nucleation work is equal to half the increased superficial energy and inversely proportional to the supercoolingΔT.Compared with bulk nuclea...     

Photoluminescence properties of YVO4:Eu3+,Ba2+ nanoparticles prepared by an ion exchange method

YVO₄:Ba²⁺ nanoparticles with a Ba²⁺ doping concentration x=0%, 1%, 3%, 5%, 7% and 9% were synthesized by a solvothermal method and then they were codoped with Eu³⁺ ions by an ion exchange method to form the YVO₄:Eu³⁺,Ba²⁺ nanoparticles. It was found that the photoluminescence intensity of the as-prepared YVO₄:Eu³⁺,Ba²⁺ nanoparticles steadily increased with x until x=7%, and then decreased for higher x. Thermal annealing resulted in considerable enhancement in their photoluminescence, and higher annealing temperature led to stronger photoluminescence enhancement. The emission intensity of the YVO₄:Eu³⁺,Ba²⁺ (x=7%) nanoparticles annealed at 500 °C was about 205% stronger than the sample without Ba²⁺ doping. Thermal annealing of the ion-exchanged YVO₄:Eu³⁺,Ba²⁺ nanoparticles at 500 °C and 700 °C resulted in photoluminescence enhancement of about 14 times and 27 times, respectively. The asymmetric ratio of Eu³⁺ in the ion-exchanged YVO₄:Eu³⁺,Ba²⁺ nanoparticles was found to increase after annealing.     

Nitridation of hafnium oxide by reactive sputtering

Hafnium oxide films were RF sputtered from HfO₂ target in Ar/O₂ or Ar/N₂ ambient on silicon substrates. The composition of the deposited films was analyzed by X-ray photoelectron spectroscopy (XPS). For samples sputtered in Ar/N₂, it was observed that nitrogen was incorporated in the bulk of hafnium oxide films in the form of HfON, and SiON layer was formed at the silicon-insulator interface. After annealing the hafnium oxide films at 600-700 °C, MOS structures were fabricated and used for electrical characterization. The effects of nitridation of hafnium oxide on both the capacitance-voltage and current-voltage characteristics of the MOS capacitors were discussed.     

射频磁控溅射法制备掺锆氧化锌透明导电薄膜

利用射频磁控溅射法在室温下制备出了掺锆氧化锌(ZnO∶Zr)透明导电薄膜。研究了溅射压强对ZnO∶Zr薄膜表面形貌、结构、光学和电学性能的影响。结果表明:ZnO∶Zr薄膜为六角纤锌矿结构的多晶薄膜,且具有c轴择优取向,溅射压强对薄膜电阻率有显著影响,压强为1.5Pa时,电阻率具有最小值1.77×10–3Ω·cm。所制备的ZnO∶Zr薄膜具有良好的附着性能,在可见光区平均透过率超过93%。     

Growth and visible photoluminescence of highly oriented (1 0 0) zinc oxide film synthesized on silicon by plasma immersion ion implantation

High-quality (1 0 0) ZnO films with smooth surface topography have been synthesized on Si substrate by plasma immersion ion implantation. The materials exhibit compressive stress because of room temperature growth. After annealing at different temperatures, various visible photoluminescence bands are observed. The optical phenomenon as well as the transition mechanism which may involve defects such as [Zn_I], [V_Zn], and [O_i⁻] induced by the high substrate bias are discussed in this paper.     

Memory characteristics of MOSFETs with densely stacked silicon nanocrystal Layers in the gate oxide synthesized by low-energy ion beam

Densely stacked silicon nanocrystal layers embedded in the gate oxide of MOSFETs are synthesized with Si ion implantation into an SiO/sub 2/ layer at an implantation energy of 2 keV. In this letter, the memory characteristics of MOSFETs with 7-nm tunnel oxide and 20-nm control oxide at various temperatures have been investigated. A threshold voltage window of /spl sim/ 0.5 V is achieved under write/erase (W/E) voltages of +12 V/-12 V for 1 ms. The devices exhibit good endurance up to 10/sup 5/ W/E cycles even at a high operation temperature of 150/spl deg/C. They also have good retention characteristics with an extrapolated ten-year memory window of /spl sim/ 0.3 V at 100/spl deg/C.     

Formation of silicon nanocrystals by thermal annealing of low-pressure chemical-vapor deposited amorphous SiNx (x=0.16) thin films

Silicon nanocrystals have been produced by thermal annealing of SiN_x thin film obtained by low pressure chemical vapor deposition using a mixture between disilane and ammonia. Morphological, structural, and photoluminescence properties of the thin film were investigated using X-ray diffraction, scanning electron microscopy, Raman spectroscopy and photoluminescence spectroscopy. The results revealed a high crystallinity of film with a crystalline volume fraction exceeded 70%, and a dominance of silicon nanocrystallites having the sizes within the range 2.5–5 nm and density ~1.98.10¹²/cm². The PL peaks consist of nanocrystalline silicon and amorphous silicon. The luminescence from the silicon nanocrystals was dominant.     

基于光谱椭偏术的Si球表面氧化层厚度测量

为改善X射线晶体密度法测得的阿伏伽德罗常数的标准不确定度,研制了一种基于光谱椭偏术和二维Si球扫描机构的Si球表面氧化层厚度自动扫描测量系统,用于测量直径约93.6 mm、质量约1 kg的单晶Si球表面氧化层平均厚度。用本文系统对标准Si球表面进行400点扫描测量实验,得到氧化层厚度分布,且测得其平均厚度为6.00（2...     

High-quality conformal silicon oxide films prepared by multi-step sputtering PECVD and chemical mechanical polishing

High-quality conformal oxide films were obtained by using multi-step sputtering (MSSP) plasma enhanced chemical vapor deposition (PECVD) process with argon ion sputtering and chemical mechanical polishing (CMP). The repeated deposition by plasma enhanced chemical vapor deposition (PECVD) and anisotropic etching of oxide films by multi-step sputtering PECVD improve the step coverage and gap filling capability significantly. The argon plasma treatment enhances the binding energy of Si-O in the SiO₂ network, and the temperature dependence of stress for MSSP oxide film showed no hysteresis after the heating cycle up to 440 °C. The stress-temperature slope of MSSP oxide film was found to be much less than that of conventional PECVD oxide film. The slope for 1.1 μm thick film is about 5.8×10⁵ dynes/cm²/°C which is smaller than that of thermally grown oxide film. It seems that MSSP oxide film reduces stress-temperature hysteresis and becomes more dense and void-free in the narrow gaps with inter-metal spacing of 0.5 μm. After filling of the narrow gap, we adopted the CMP process for global planarization and obtained good planarization performance. The uniformity of the film thickness was about 4% and the degree of the planarization was over 95% after CMP process.     

Magnetic properties of ZnO:Cu thin films prepared by RF magnetron sputtering

ZnO films and ZnO:Cu diluted magnetic semiconductor films were prepared by radio frequency magnetron sputtering on Si (111) substrates, with targets of ZnO and Zn0.99Cu0.01 O, respectively. The plasma emission spectra were analyzed by using a grating monochromator during sputtering. The X-ray photoelectron spectroscopy measurements indicate the existence of Zni defect in the films, and the valence state of Cu is 1. The X-ray diffraction measurements indicate that the thin films have a hexagonal wurtzite structure and have a preferred orientation along the c-axis. The vibrating sample magnetometer measurements indicate that the sample is ferromagnetic at room temperature, and the origin of the magnetic behavior of the samples is discussed.     

射频磁控溅射法制备ZnO:Cu薄膜的磁性研究

ZnO films and ZnO：Cu diluted magnetic semiconductor films were prepared by radio frequency mag-netron sputtering on Si （111） substrates, with targets of ZnO and Zn0.99Cu0.01O, respectively. The plasma emission spectra were analyzed by using a grating monochromator during sputtering. The X-ray photoelectron spectroscopy measurements indicate the existence of Zni defect in the films, and the valence state of Cu is 1＋. The X-ray diffraction measurements indicate that the thin films have a hexagonal wurtzite structure and have a preferred orientation along the c-axis. The vibrating sample magnetometer measurements indicate that the sample is ferromagnetic at room temperature, and the origin of the magnetic behavior of the samples is discussed.