Cure kinetics of multifunctional epoxies with 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane as hardener

The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000     

Thermal characterization of carbon‐nanofiber‐reinforced tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone epoxy composites

The thermal properties of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) resin and 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent, were investigated with differential scanning calorimetry (DSC), thermogravimetric analysis, and dynamic mechanical thermal analysis. DSC results showed that the presence of CNF had no pronounced influence on the heat of the cure reaction. However, the incorporation of CNF slightly improved the thermal stability of the epoxy. Furthermore, the storage modulus of the TGDDM/DDS epoxy was significantly enhanced, whereas the glass‐transition temperature was not significantly affected, upon the incorporation of CNFs. The storage modulus of 5 wt % CNF/epoxy composites at 25°C was increased by 35% in comparison with that of the pure epoxy. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 295–298, 2006     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

Preparation and characterization of siliconized epoxy/bismaleimide (N,N′‐bismaleimido‐4,4′‐diphenyl methane) intercrosslinked matrices for engineering applications

Novel hybrid intercrosslinked networks of hydroxyl‐terminated polydimethylsiloxane‐modified epoxy and bismaleimide matrix systems have been developed. Epoxy systems modified with 5, 10, and 15 wt % of hydroxyl‐terminated polydimethylsiloxane (HTPDMS) were developed by using epoxy resin and hydroxyl‐terminated polydimethylsiloxane with γ‐aminopropyltriethoxysilane (γ‐APS) as compatibilizer and dibutyltindilaurate as catalyst. The reaction between hydroxyl‐terminated polydimethylsiloxane and epoxy resin was confirmed by IR spectral studies. The siliconized epoxy systems were further modified with 5, 10, and 15 wt % of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry and thermogravimetric analysis of the matrix samples were also performed to determine the glass‐transition temperature and thermal‐degradation temperature of the systems. Data obtained from mechanical studies and thermal characterization indicate that the introduction of siloxane into epoxy improves the toughness and thermal stability of epoxy resin with reduction in strength and modulus values. Similarly the incorporation of bismaleimde into epoxy resin improved both tensile strength and thermal behavior of epoxy resin. However, the introduction of siloxane and bismaleimide into epoxy enhances both the mechanical and thermal properties according to their percentage content. Among the siliconized epoxy/bismaleimide intercrosslinked matrices, the epoxy matrix having 5% siloxane and 15% bismaleimide exhibited better mechanical and thermal properties than did matrices having other combinations. The resulting siliconized (5%) epoxy bismaleimide (15%) matrix can be used in the place of unmodified epoxy for the fabrication of aerospace and engineering composite components for better performance. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 38–46, 2001     

Synthesis,characterization, and properties of low viscosity tetra‐functional epoxy resin N,N,N′,N′‐ tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane

Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF₃‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.     

Preparation and characterization of bismaleimide (N,N′‐bismaleimido‐4,4′‐diphenyl methane)–unsaturated polyester modified epoxy intercrosslinked matrices

An intercrosslinked network of unsaturated polyester–bismaleimide modified epoxy matrix systems was developed. Epoxy systems modified with 10, 20, and 30% (by weight) of unsaturated polyester were made by using epoxy resin and unsaturated polyester with benzoyl peroxide and diaminodiphenylmethane as curing agents. The reaction between unsaturated polyester and epoxy resin was confirmed by IR spectral studies. The unsaturated polyester toughened epoxy systems were further modified with 5, 10, and 15% (by weightt) of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) of the matrix samples were performed to determine the glass transition temperature (T_g) and thermal degradation temperature of the systems, respectively. Mechanical properties, viz: tensile strength, flexural strength, and plain strain fracture toughness of intercrosslinked epoxy systems, were studied by ASTM methods. Data obtained from mechanical and thermal studies indicated that the introduction of unsaturated polyester into epoxy resin improves toughness but with a reduction in glass transition, whereas the incorporation of bismaleimide into epoxy resin improved both mechanical strength and thermal behavior of epoxy resin. The introduction of bismaleimide into unsaturated polyester‐modified epoxy resin altered thermomechanical properties according to their percentage concentration. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2853–2861, 2002     

Development of an epoxy system characterized by low water absorption and high thermomechanical performances

Water absorption and thermomechanical properties of epoxy systems based on multifunctional dicyclopentadiene epoxy novolac resin Tactix556 cured with 4,4′ diaminodiphenilsulfone (4,4′DDS) as curing agent has been studied. The base system was modified by the addition of a novel 40 : 60 PES : PEES (Polyethersulphone : Polyetheretheresulphone) amine‐ended copolymer to improve toughness properties. The effect of thermoplastic addition on water adsorption was studied by gravimetric experiments. The viscoelastic properties of the resulting blend were analyzed by means of dynamic mechanical thermal analysis. The formulated systems were compared with a system based on tetraglycidyl‐4,4′diaminodiphenylmethane resin (MY721) cured with 4,4′ diaminodiphenilsulfone. The use of Tactix556 resin showed that water uptake values were minimized while retaining high glass transition temperatures, and toughness values were found in the same range of standard toughened matrices used for aerospace composites. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4880–4887, 2006     

Studies on mechanical,thermal, and morphology of diglycidylether‐terminated polydimethylsiloxane‐modified epoxy–bismaleimide matrices

An epoxy matrix system modified by diglycidylether‐terminated polydimethylsiloxane (DGETPDMS) and bismaleimide (BMI) was developed. Epoxy systems modified with 4, 8, and 12% (by wt) of DGETPDMS were made using epoxy resin and DGETPDMS, with diaminodiphenylmethane as the curing agent. The DGETPDMS‐toughened epoxy systems were further modified with 4, 8, and 12% (by wt) of BMI, namely (N,N′‐bismaleimido‐4,4′‐diphenylmethane). DGETPDMS/BMI/epoxy matrices were characterized using differential scanning calorimetry, thermogravimetric analysis, and heat deflection temperature analysis. The matrices, in the form of castings, were characterized for their mechanical properties, viz. tensile strength, flexural strength, and impact test, as per ASTM methods. Mechanical studies indicate that the introduction of DGETPDMS into epoxy resin improves the impact strength, with reduction in tensile strength, flexural strength, and glass transition temperature, whereas the incorporation of BMI into epoxy resin enhances the mechanical and thermal properties according to its percentage content. However, the introduction of both DGETPDMS and BMI enhances the values of thermomechanical properties according to their percentage content. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 668–674, 2006     

Curing behavior study of polydimethylsiloxane‐modified allylated novolac/4,4′‐bismaleimidodiphenylmethane resin

The curing behavior of polydimethylsiloxane‐modified allylated novolac/4,4′‐bismaleimidodiphenylmethane resin (PDMS‐modified AN/BDM) was investigated by using Fourier transform infrared spectrometry (FTIR) and differential scanning calorimetry. The results of FTIR confirmed that the curing reactions of the PDMS‐modified AN/BDM resins, including “Ene” reaction and Diels–Alder reaction between allyl groups and maleimide groups, should be similar to those of the parent allylated novolac/4,4′‐bismaleimidodiphenylmethane (AN/BDM) resin. The results of dynamic DSC showed that the total curing enthalpy of the PDMS‐modified AN/BDM resins was lower than that of the parent resin. Incorporation of polydimethylsiloxane (PDMS) into the backbone of the allylated novolac (AN) resin favored the Claisen rearrangement reaction of allyl groups. The isothermal DSC method was used to study the kinetics of the curing process. The experimental data for the parent AN/BDM resin and the PDMS‐modified AN/BDM resins exhibited an nth‐order behavior. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis of polysiloxane‐type multifunctional flame retardant and its application in epoxy systems

Polymethyl(3‐glycidyloxypropyl)siloxane (PMGS) was synthesized as a flame‐retardant additive, which were cocured with diglycidyl ether of bisphenol‐A (DGEBA) using 4,4′‐diaminodiphenylsulfone as a curing agent. The structure of PMGS was confirmed through Fourier transform infrared and ¹H‐NMR spectra. The cured products were characterized with dynamic mechanical thermal analysis, thermogravimetric analysis, and oxygen index analyzer. With PMGS incorporated, the cured epoxy resin showed better thermal stability, higher limited oxygen index, and higher char yield. At moderate loading of PMGS, the storage modulus and glass transition temperature of the cured epoxy resin based on neat DGEBA were obviously improved. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Effect of chlorine substitution in 4,4′‐diaminodiphenylmethane hardener on shelf life and mechanical properties of epoxies

Curing of N,N,N′,N′‐tetraglycidyldiaminodiphenylmethane with new curing agents like 3,3′‐dichloro‐4,4′‐diaminodiphenylmethane and 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane in comparison with diaminodiphenylmethane and 4,4′‐diaminodiphenylsulphone (DDS) was carried out using dynamic differential scanning calorimetry. The shelf life of various epoxy formulations was evaluated by the residual cure exotherm method. The glass‐transition temperatures of cured epoxy formulations were determined using dynamic mechanical analysis. The mechanical properties such as the tensile strength, tensile modulus, flexural strength, and Izod impact strength were also evaluated and compared. The activation energy, frequency factor, and shelf life of chloro‐substituted hardener formulations were high as compared to those of unsubstituted hardener formulations. The marginal differences in the glass‐transition temperature, tensile strength, tensile modulus, and flexural strength and the small decrement in the Izod impact strength values were interpreted in terms of chlorine substitution. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 3082–3088, 2002; DOI 10.1002/app.2337     

An investigation of cure and thermal stability of poly(amide‐amidic acid) modified tetraglycidyl 4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone

In this work, poly(amide‐amidic acid) (PAA) was used to modify tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM)/4,4′‐diaminodiphenylsulfone (DDS) system. Results of non‐isothermal differential scanning calorimetry analysis indicated that PAA played a role of catalyst during the process of the curing reaction. The curing mechanism was studied by Fourier transform infrared spectroscopy, showing that the PAA acted as a co‐curing agent in the system. The glass transition temperature decreased firstly and then increased with the increase of the PAA content. PAA equally rendered TGDDM more fire resistant with higher char yield. On examining the fracture surface morphology using scanning electron microscopy, it was observed that there was no obvious phase separation when the content of PAA was less than 20 phr (per hundred weight of TGDDM/DDS resin), however, phase separation was observed when the content of PAA was 25 and 30 phr. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Studies on isotactic poly(phenyl glycidyl ether)‐modified epoxy resins. II. Toughening of epoxy resins

A semicrystalline polymer, isotactic poly(phenyl glycidyl ether) (i‐PPGE) was used as a modifier for epoxy resin; 1,8‐Diamino‐p‐methane (MNDA) and 4,4′‐Diamino diphenyl sulfone (DDS) were used as curing agents. In the MNDA‐cured resins, the dispersed phase were spherical particles with diameters in the range of 0.5–1.0 μm when the resin was blended with 5 phr i‐PPGE. In the DDS‐cured resins, the particle size distribution of the dispersed phase was much wider. The difference was traced back to the reactivity of the curing agent and the different regimes used for curing. Through dynamic mechanical analysis, it was found that in the MNDA‐cured systems, i‐PPGE had a lower crystallinity than in the DDS‐cured system. In spite of the remarkable difference in the morphology and microstructure of the modified resins cured with these two curing agents, the toughening effects of i‐PPGE were similar for these resins. The critical stress intensity factor (K_IC) was increased by 54% and 53%, respectively, for the resins cured by DDS and by MNDA, blending with 5 phr of the toughner. i‐PPGE was comparable with the classical toughners carboxyl‐terminated butadiene‐acrylonitrile copolymers in effectiveness of toughening the epoxy resin. An advantage of i‐PPGE was that the modulus and the glass‐transition temperature of the resin were less affected. However, this modifier caused the flexural strength to decrease somewhat. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1223–1232, 2002; DOI 10.1002/app.10445     

Modification of bismaleimide resin by poly(ethylene phthalate‐co‐ethylene terephthalate), poly(ethylene phthalate‐co‐ethylene 4,4′‐biphenyl dicarboxylate), and poly(ethylene phthalate‐co‐ethylene 2,6‐naphthalene dicarboxylate)

Aromatic polyesters were prepared and used to improve the brittleness of bismaleimide resin, composed of 4,4′‐bismaleimidodiphenyl methane and o,o′‐diallyl bisphenol A (Matrimid 5292 A/B resin). The aromatic polyesters included PEPT [poly(ethylene phthalate‐co‐ethylene terephthalate)], with 50 mol % of terephthalate, PEPB [poly(ethylene phthalate‐co‐ethylene 4,4′‐biphenyl dicarboxylate)], with 50 mol % of 4,4′‐biphenyl dicarboxylate, and PEPN [poly(ethylene phthalate‐co‐ethylene 2,6‐naphthalene dicarboxylate)], with 50 mol % 2,6‐naphthalene dicarboxylate unit. The polyesters were effective modifiers for improving the brittleness of the bismaleimide resin. For example, inclusion of 15 wt % PEPT (MW = 9300) led to a 75% increase in fracture toughness, with retention in flexural properties and a slight loss of the glass‐transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin. Microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The toughening mechanism was assessed as it related to the morphological and dynamic viscoelastic behaviors of the modified bismaleimide resin system. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2352–2367, 2001     

Synthesis and properties of novel 4,4′‐biphenylene‐bridged flame‐retardant cyanate ester resin

The bisphenol‐containing 4,4′‐biphenylene moiety was prepared by the reaction of 4,4′‐bis(methoxymethyl) biphenyl with phenol in the presence of p‐toluenesulfonic acid. The bisphenol was end‐capped with the cyanate moiety by reacting with cyanogen chloride and triethylamine in dichloromethane. Their structures were confirmed by Fourier transform infrared spectroscopy, ¹H‐NMR, and elemental analysis. Thermal behaviors of cured resin were studied by differential scanning calorimetry, dynamic mechanical analysis, and TGA. The flame retardancy of cured resin was evaluated by limiting oxygen index (LOI) and vertical burning test (UL‐94 test). Because of the incorporation of rigid 4,4′‐biphenylene moiety, the cyanate ester (CE) resin shows good thermal stability (T_g is 256°C, the 5% degradation temperature is 442°C, and char yield at 800°C is 64.4%). The LOI value of the CE resin is 42.5, and the UL‐94 rating reaches V‐0. Moreover, the CE resin shows excellent dielectric property (dielectric constant, 2.94 at 1 GHz and loss dissipation factor, 0.0037 at 1 GHz) and water resistance (1.08% immersed at boiling water for 100 h). © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Novel dibutyltin oxide–tributyl phosphate condensate as accelerator for the curing of the epoxy resin/4,4′‐diamino diphenyl sulfone system. I. Chemical reactions and properties of the cured resin

A crystalline condensate of dibutyltin oxide and tributyl phosphate (Sn‐P‐c) was more effective than the stannous octoate and dibutyltin dilaurate in accelerating the curing of the epoxy resin/4,4′‐diamino diphenyl sulfone (DDS) system, based on an equal tin concentration. Water took part in the reaction and played an important role in the morphology and mechanical properties of the cured resin when Sn‐P‐c was used as the accelerator. In the presence of Sn‐P‐c, water first reacted with glycidyl ether to yield glycerol ether; the yielded hydroxyl group may further catalyze the amino/epoxy group reaction. In the absence of water or polar hydroxyl additives, Sn‐P‐c did not completely dissolve in the resin systems, and the cured resin was translucent material with poor mechanical strength. In the presence of a small amount of water, the cured material became transparent. Both flexural strength and maximum deflection were increased greatly. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1229–1236, 2001     

Preparation and properties of high performance phthalide‐containing bismaleimide modified epoxy matrices

A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,4′‐diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (T_p) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high‐temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G′) in the glassy region while glass transition temperature (T_g) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Biphenyl liquid crystal epoxy containing flexible chain: Synthesis and thermal properties

A biphenyl type liquid crystal epoxy (LCE) monomer 4,4′-di(2,3-epoxyhexyloxy)biphenyl (LCBP4) containing flexible chain was synthesized and the curing behavior was investigated using 4,4′-diaminodiphenylmethane (DDM) as the curing agent. The effect of curing condition on the formation of the liquid crystalline phase was examined. The cured samples show good mechanical properties and thermal stabilities. Moreover, the relationship between thermal conductivity and structure of liquid crystalline domain was also discussed. The samples show high thermal conductivity up to 0.28–0.31 W/(m*K), which is 1.5 times as high as that of conventional epoxy systems. In addition, thermal conductive filler, Al₂O₃, was introduced into LCBP4/DDM to obtain higher thermal conductive composites. When the content of Al₂O₃ was 80 wt%, the thermal conductivity of the composite reached to 1.86 W/(m*K), while that of diglycidyl ether of bisphenol A (Bis-A) epoxy resin/DDM/Al₂O₃ was 1.15 W/(m*K). Compared with Bis-A epoxy resin, the formation of liquid crystal domains in the cured LCE resin enhanced the thermal conductivity synergistically with the presence of Al₂O₃. Furthermore, the introduction of Al₂O₃ also slightly increased the thermal stabilities of the cured LCE.     

Effect of backbone moiety in epoxies on thermal conductivity of epoxy/alumina composite

We chose two commercial epoxies, bisphenol A diglycidyl ether (DGEBA) and 3,3′,5,5′‐tetramethyl‐4,4′‐biphenol diglycidyl ether (TMBP), and synthesized one liquid crystalline epoxy (LCE), 4′4′‐bis(4‐hydroxybenzylidene)‐diaminophenylene diglycidyl ether (LCE‐DP) to investigate the effect of backbone moiety in epoxies on the thermal conductivity of epoxy/alumina composite. The DGEBA structure shows an amorphous state and the TMBP structure displays a crystal phase, whereas the LCE‐DP structure exhibits a liquid crystalline phase. The curing behaviors of them were examined employing 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent. The heat of curing of epoxy resin was measured with dynamic differential scanning calorimetry (DSC). Alumina (Al₂O₃) of commercial source was applied as an inorganic filler. Thermal conductivity was measured by laser flash method and compared with value predicted by two theoretical models, Lewis‐Nielsen and Agari‐Uno. The results indicated that the thermal conductivity of the LCE‐DP structure was larger than that of the commercial epoxy resins such as TMBP and DGEBA and the experimental data fitted quite well in the values estimated by Agari‐Uno model. POLYM. COMPOS., 2013. © 2013 Society of Plastics Engineers