Large-area low-capacitance InP/InGaAs MSM photodetectors forhigh-speed operation under front and rear illumination

Large-area long-wavelength metal-semiconductor-metal (MSM) photodetectors fabricated on the Fe-doped InP/InGaAs material system have been characterised under front and rear illumination employing different thicknesses of the photoactive layer. With a 350 μm diameter detection area, theoretically limited capacitance values (0.75 pF) and very low depletion voltages (<1 V) were obtained. For an active layer thickness of 0.7 μm, the devices show an external quantum yield of up to 60% and a bandwidth of 0.95 GHz at 10 V bias     

Small-junction-area GaInAs/InP pin photodiode with monolithicmicrolens

Reports on a back-illuminated GaInAs/InP pin photodiode with a monolithic microlens fabricated by the authors. The photodiode has both an ultrabroad bandwidth of 18 GHz and a high quantum efficiency of about 84%. It achieves this by using a small pin junction area while maintaining a large fibre alignment tolerance by incorporating an InP microlens. The photodiode capacitance was 20 fF for a junction diameter of approximately 15 μm     

High-speed front-illuminated GaInAsP/InP pin photodiode

Describes a high-speed front-illuminated GaInAsP/InP pin photodiode for use at the optical wavelength of 1.3 μm. The device is grown on an n⁺-InP substrate and uses polyimide both as a passivation layer and as a bonding pad holder to reduce parasitic capacitance. An optoelectronic sampling measurement of the impulse response shows a pulsewidth (FWHM) of 28 ps. A 3 dB bandwidth in excess of 18 GHz has been achieved     

带有复合掺杂层集电区的InP/InGaAs/InP DHBT直流特性分析

设计了一种新结构InP/InGaAs/InP双异质结双极晶体管(DHBT),在集电区与基区之间插入n -InP层,以降低集电结的导带势垒尖峰,克服电流阻挡效应.采用基于热场发射和连续性方程的发射透射模型,计算了n -InP插入层掺杂浓度和厚度对InP/InGaAs/InP DHBT集电结导带有效势垒高度和I-V特性的影响.结果表明,当n -InP插入层掺杂浓度为3×1019cm-3、厚度为3nm时,可以获得较好的器件特性.采用气态源分子束外延(GSMBE)技术成功地生长出InP/InGaAs/InP DHBT结构材料.器件研制结果表明,所设计的DHBT材料结构能有效降低集电结的导带势垒尖峰,显著改善器件的输出特性.     

Ultrahigh fT and fmax new self-alignmentInP/InGaAs HBT's with a highly Be-doped base layer grown by ALE/MOCVD

We report on a new self-alignment (SA) process and microwave performance of ALE/MOCVD grown InP/InGaAs heterojunction bipolar transistors (HBT's) with a base doping concentration of 1×10² 0 cm^-3. We obtained f_T of 161 GHz and f_max of 167 GHz with a 2×10 μm emitter. These high values indicate the best performance of InP/InGaAs HBT's ever reported, in so far as we know. These values were attained by reducing the base resistance using ALE/MOCVD and base-collector capacitance using a new SA process. These results indicate the great potential of these devices for ultrahigh-speed application     

Microwave noise performance of InP/InGaAs heterostructure bipolartransistors

The authors report the first low-noise InP/InGaAs heterostructure bipolar transistor (HBT). Minimum noise figures of 0.46, 2.0, and 3.33 dB were measured at 2, 10, and 18 GHz, respectively. The noise performance of this InP/InGaAs HBT with an emitter size of 3.5×3.5 μm² is compared to that for FETs having a 1-μm gate length. The measured minimum noise figures agree well with calculated data using a modified Hawkins model. Broadband low-noise operation is observed because of the short transit time for injected nonequilibrium electrons to transverse the base and collector depletion region     

Avalanche buildup time of an InP/InGaAsP/InGaAs APD at high gain

Under a high-gain operating condition, the presence of a multiplication process in the InGaAs(P) regions of an InP/InGaAsP/InGaAs avalanche photodiode (APD) having a structure of separated absorption and multiplication regions could lead to significant enhancement of the avalanche buildup time. As a result, the bandwidth of the device could be reduced considerably. The dependence of the avalanche multiplication factor and the intrinsic response time on the reverse bias voltage, the heterointerface field, the doping concentrations, and the width of the InP layer is examined in detail for the case in which hole injection is assumed. It is shown, for example, that for a fixed value of doping concentrations, reduction of the excess noise factor and enhancement of the gain-bandwidth product of the device can be achieved at the same time by a proper increase of the width of the InP layer     

High fmax InP double heterojunction bipolar transistorswith chirped InGaAs/InP superlattice base-collector junction grown byCBE

We report the performance of InP Double Heterojunction Bipolar Transistors (DHBT's) with a chirped InGaAs/InP superlattice B-C junction grown by CBE. The B-C junction of the DHBT was graded with a 10-period InGaAs/InP chirped superlattice (CSL) between the InGaAs base and the lightly doped InP collector. A highly doped thin layer was also included at the end of the CSL to offset the quasi-electric field arising from the grade and suppress further the carrier blocking effect across the B-C heterojunction. The InP/InGaAs CSL DHBT demonstrated a high BV_CEO of 18.3 V with a typical current gain of 55 with minimal carrier blocking up to high current densities. Maximum cutoff frequencies of f_max=146 GHz and f_r=71 GHz were obtained from the fabricated 2×10 μm²-emitter DHBT     

10Gbit/s台面型InGaAs/InP pin高速光电探测器

利用数值计算方法分析了高速光电探测器的耗尽区宽度与响应度及响应速度的关系.分析结果表明,耗尽区宽度选择应在响应度和响应速度之间折中,在响应度满足使用要求的情况下,尽量提高响应速度.利用该分析结果设计了台面型InGaAs/InP pin高速光电探测器材料结构.通过优化腐蚀工艺与钝化工艺,解决了器件腐蚀形貌和钝化问题.结合其他微细加工工艺完成了器件的制备,器件光敏区直径50 μm.测试结果显示,在反向偏压为5V时,暗电流小于1 nA,电容约为0.21 pF.此外,在1 310 nm激光辐照下,器件的响应度约为0.95 A/W,-3 dB带宽超过10 GHz,其性能满足10 Gbit/s光纤通信应用要求.     

High-speed 1.5 μm self-aligned constricted mesa DFB lasers grownentirely by MOCVD

Ultrahigh-speed 1.5 μm wavelength self-aligned constricted mesa GaInAsP-InP distributed-feedback lasers grown entirely by low-pressure metalorganic chemical-vapor deposition are discussed. A self-aligned process was applied to lower the stray InP junction capacitance to as low as 1.6 pF. A record bandwidth of 13 GHz in the 1.5 μm wavelength region was demonstrated     

Reduction of base-collector capacitance in InP/InGaAs HBT's using anovel double polyimide planarization process

The parasitic base-collector capacitance (C_BC) in InP/InGaAs heterojunction bipolar transistors (HBTs) has been reduced using a novel double polyimide planarization process which avoids damage of the extrinsic base layer. The extrinsic base metal outside the base-collector mesa is placed on the polyimide by polyimide coating and etch-back to the base layer. We obtained f_T of 81 GHz and f _MAX of 103 GHz with a 2×10 μm emitter. Performance comparison between two devices with the same area of 2×2 μm but with different base-collector mesa area showed 56% reduction of C_BC and 35% increase of f_T and f_MAX     

Metamorphic InP/InGaAs heterojunction bipolar transistors on GaAssubstrate: DC and microwave performances

High-performance InP/In_0.53Ga_0.47As metamorphic heterojunction bipolar transistors (MHBTs) on GaAs substrate have been fabricated using In_xGa_1-xP strain relief buffer layer grown by solid-source molecular beam epitaxy (SSMBE). The MHBTs exhibited a dc current gain over 100, a unity current gain cutoff frequency (f_T) of 48 GHz and a maximum oscillation frequency (f_MAX) of 42 GHz with low junction leakage current and high breakdown voltages. It has also been shown that the MHBTs have achieved a minimum noise figure of 2 dB at 2 GHz (devices with 5×5 μm ² emitter) and a maximum output power of 18 dBm at 2.5 GHz (devices with 5×20 μm² emitter), which are comparable to the values reported on the lattice-matched HBTs (LHBTs). The dc and microwave characteristics show the great potential of the InP/InGaAs MHBTs on GaAs substrate for high-frequency and high-speed applications     

Planar InP/InGaAsP three-dimensional graded-junction avalanche photodiode

A new planar InP/InGaAsP avalanche photodiode, which is fabricated by Be⁺implantation through a dish-shaped InGaAs mask, has been developed. A three-dimensional graded junction is obtained and a uniform gain as high as 30 achieved without edge or surface breakdown. The dish-shaped InGaAs implantation mask is formed by a photoelectrochemical etching technique. Device modeling indicates that the graded junction and low doping concentration can prevent edge breakdown and greatly suppress the surface field. The diode has a separated absorption and multiplication structure grown by hydride vapor-phase epitaxy. These devices exhibit low primary dark currents (≈ 1 nA), and high quantum efficiencies close to that of an InGaAs p-i-n at 1.3-µm wavelength. Sensitivity measurements at bit rates of 1.7 Gbit/s give a minimum average receiver power required for 10^-9BER of -35.5 dBm.     

High-speed performance of OMCVD grown InAlAs/InGaAs MSMphotodetectors at 1.5 μm and 1.3 μm wavelengths

A report is presented on the fabrication of high-speed In_0.53 Ga_0.47As metal-semiconductor-metal (MSM) photodetectors incorporating a high-quality lattice-matched InAlAs barrier enhancement layer, grown by organometallic chemical vapor deposition (OMCVD). Fast responses of ~55 ps full-width half-maximum at 1.5 μm and ~48 ps at 1.3 μm wavelengths are observed, corresponding to intrinsic device bandwidths of ~8 GHz and ~11 GHz, respectively. The absence of any tail to the pulse response, and of any low-bias DC gain, indicates a low-trap density at the InAlAs/InGaAs heterointerface. Bias independent dark currents of 10-20 μA are observed below breakdown, which occurred at >30 V in devices with a 500-A-thick InAlAs layer     

High-speed InP/InGaAsP/InGaAs avalanche photodiodes grown bychemical beam epitaxy

High-performance InP/InGaAsP/InGaAs avalanche photodiodes (APDs) grown by chemical beam epitaxy are described. These APDs exhibit low dark current (less than 50 nA at 90% of breakdown), good external quantum efficiency (greater than 90% at a wavelength of 1.3 μm), and high avalanche gain (≃40). In the low-gain regime, bandwidths as high as 8 GHz have been achieved. At higher gains, a gain-bandwidth-limited response is observed; the gain-bandwidth product is 70 GHz     

InGaAs/InP DHBTs with 120-nm collector having simultaneously high f/sub /spl tau//, f/sub max//spl ges/450 GHz

InP/In/sub 0.53/Ga/sub 0.47/As/InP double heterojunction bipolar transistors (DHBT) have been designed for increased bandwidth digital and analog circuits, and fabricated using a conventional mesa structure. These devices exhibit a maximum 450 GHz f/sub /spl tau// and 490 GHz f/sub max/, which is the highest simultaneous f/sub /spl tau// and f/sub max/ for any HBT. The devices have been scaled vertically for reduced electron collector transit time and aggressively scaled laterally to minimize the base-collector capacitance associated with thinner collectors. The dc current gain /spl beta/ is /spl ap/ 40 and V/sub BR,CEO/=3.9 V. The devices operate up to 25 mW//spl mu/m/sup 2/ dissipation (failing at J/sub e/=10 mA//spl mu/m/sup 2/, V/sub ce/=2.5 V, /spl Delta/T/sub failure/=301 K) and there is no evidence of current blocking up to J/sub e//spl ges/12 mA//spl mu/m/sup 2/ at V/sub ce/=2.0 V from the base-collector grade. The devices reported here employ a 30-nm highly doped InGaAs base, and a 120-nm collector containing an InGaAs/InAlAs superlattice grade at the base-collector junction.     

Heterojunction InP/GaInAs phototransistors/bipolar transistorsgrown by MOVPE

Heterojunction InP/GaInAs phototransistors with base terminals have been fabricated by atmospheric pressure metal organic vapour phase epitaxy. When operated as bipolar transistors, the devices exhibit high current gain (>1600) and good junction ideality factors (1.06 for the base/emitter and 1.25 for the base/collector junction). When operated as phototransistors, the devices have large optical gain (>800) at an incident power of 1 μW, at a wavelength of 1.3 μm     

High performance of Fe:InP/InGaAs metal/semiconductor/metalphotodetectors grown by metalorganic vapor phase epitaxy

An InGaAs metal-semiconductor-metal (MSM) photodetector with an Fe-doped InP Schottky barrier enhancement layer is described. With 5-V bias, the detector has negligible low-frequency gain, a low dark current of 200 nA, a responsivity of 0.3 A/W, and an impulse response with a 1/ e fall time of 65 ps, corresponding to a 3 dB bandwidth of 2.5 GHz. The device layer structure is a very attractive candidate for integration with high-performance InGaAs/InP FETs     

High-speed InP/InGaAs avalanche photodiodes with a compositionallygraded quaternary layer

InP/InGaAs avalanche photodiodes (APDs) with a compositionally graded quaternary layer at the heterointerface between the InGaAs absorption and InP multiplication regions were fabricated and tested. A comparison of samples with the graded layer and with conventional three quaternary layers showed that the frequency characteristics for samples with the graded layer did not deteriorate at a low bias voltage even below -100°C, unlike APDs with three InGaAsP layers. Thus, no hole trapping occurred at the InP/InGaAs heterointerface with the graded layer. A sample with the graded layer showed a cutoff frequency exceeding 9 GHz at a low multiplication factor of 2. The authors found InP/InGaAs APDs with the compositionally graded quaternary layer to be useful over a wide temperature range     

Microwave performance of ion-implanted InP JFETs

These devices have a planar structure with the channel and gate regions formed by the selective implantation of silicon and beryllium into an Fe-doped semi-insulating InP substrate. The nominal gate length is 2 μm with a channel doping of 10¹⁷ cm^-3 and thickness of 0.2 μm. The measured values of f_T and f_max are 10 and 23 GHz, respectively. Examination of the equivalent circuit parameters and their variation with bias led to the following conclusions: (a) a relatively gradual channel profile results in lower than desired transconductance, but also lower gate-to-channel capacitance; (b) although for the present devices, the gate length and transconductance are the primary performance-limiting parameters, the gate contact resistance also reduces the power gain significantly; (c) the output resistance appears lower than that of an equivalent GaAs MESFET, and requires a larger V_DS to reach its maximum value; and (d) a dipole layer forms and decouples the gate from the drain with a strength that falls between that of previously reported GaAs MESFETs and InP MESFETs