激光面加工熔凝区的低压磨粒流抛光影响因素的实验研究

为研究低压磨粒流抛光激光面加工熔凝区的可行性,构建旋转式低压磨粒流抛光装置对激光加工铜片进行抛光实验,并采用不同评定方法描述磨料种类、挤压力、抛光时间对抛光效果的影响.结果表明:采用低压磨粒流抛光可有效去除激光面加工熔凝区;在低压范围内,材料去除量会随磨料含量、抛光时间呈非线性增长,随挤压力呈接近线性增长;抛光初期表面粗糙度变化幅度较小,抛光一段时间后变化幅度会显著增大.     

微磨料汽雾超声抛光加工技术及实验研究

提出了一种新型精密抛光加工方法,即用含有微磨料的抛光液经超声振动使之雾化形成汽雾流,用此含有微磨料的汽雾流冲蚀工件表面而去除工件材料。通过产生汽雾流的超声振动分析和实验对这一微磨料汽雾超声抛光加工技术进行了研究。结果表明:这一方法可以实现对工件表面的抛光处理,而且比传统的抛光加工方法具有加工冲蚀力更柔软、加工质量更好,并且没有喷嘴损耗等优点。     

强约束喷嘴内部流场的数值模拟与实验研究

针对磨料射流抛光硬脆材料工件曲面中的射流束发散与冲击损伤的问题,提出了强约束磨粒射流抛光新方法。为验证该方法的可行性和有效性,设计了一种新的抛光工具头。基于欧拉-欧拉多相流模型和标准k-ε湍流模型,利用FLUENT软件对喷嘴内部磨粒流进行了数值仿真,计算得到抛光工具头内部的磨粒流速度和压力分布。在仿真的基础之上,根据硬脆材料工件曲面的加工特点搭建抛光加工实验平台,确定加工参数并进行实验。仿真和加工实验结果表明:抛光工具头的结构设计能有效提高磨粒流的出口速度,并且减小磨粒流的压力损失;出口处的速度以平行于工件表面的剪切速度为主;明显降低了工件表面的法向冲击损伤,提高了工件表面质量。     

磁流变变间隙动压平坦化加工力特性研究

磁流变变间隙动压平坦化加工利用工件的轴向低频振动使磁流变液产生挤压强化效应,可以有效提高加工效果并使光电晶片快速获得纳米级表面粗糙度。通过旋转式测力仪试验研究不同变间隙参数对磁流变变间隙动压平坦化加工过程中抛光正压力的影响规律,结果表明,在工件轴向低频振动作用下,抛光正压力形成脉冲正值和负值周期性的动态变化过程;将工件轴向低频振动过程分解为下压过程与拉升过程,下压速度和拉升速度对动态抛光力有不同的响应特性;随着最小加工间隙的减小抛光正压力会急剧增大;设置最小加工间隙停留时间观察抛光正压力变化,可以发现在工件最小加工间隙停留期间抛光力从峰值逐渐衰减并趋于平稳;挤压振动幅值对抛光正压力影响较小。建立了磁流变变间隙动压平坦化加工材料去除模型,弄清了在动态压力作用下,磨料更新及其附加运动机制,研究了磁流变变间隙动压平坦化加工过程中磨料颗粒对工件表面柔性划擦和微量去除的作用机理,为磁流变变间隙动压平坦化加工的工艺优化提供了理论依据。     

微磨料超声汽雾流抛光加工技术及实验研究

提出了一种新型精密抛光加工方法,即微磨料超声汽雾流抛光加工。它是用含有微磨料的抛光液经超声振动使之雾化形成汽雾流,用此含有微磨料的汽雾流进行冲蚀工件表面而去除工件材料的加工方法。通过对此方法的技术分析和实验研究,认为这一新型的抛光方法在精密加工上是可行的,能够达到去除工件材料,提高表面质量的目的。     

增材制造弯孔道的磨粒流抛光仿真与试验

以增材制造弯孔道工件为研究对象,采用固液两相磨粒流抛光技术对弯孔道内壁面进行抛光。基于Realizable k-ε模型的Mixture固液两相流模型对于不同的进口压力之下磨粒流精密抛光弯孔道内部的过程进行了数值模拟,并且通过正交试验探索了进口压力、磨料浓度及磨粒粒度等工艺参数对表面抛光质量的影响。试验结果表明,进口压力的增大有利于磨粒流对于增材制造弯孔道的内壁面进行更好的抛光;各个工艺参数对于磨粒流抛光增材制造弯孔道内表面粗糙度的影响从强到弱的顺序依次为进口压力、磨料浓度和磨粒粒度;最后通过试验得出了抛光的最佳工艺参数进口压力为6 MPa,磨料浓度为0.20,磨粒粒度为400目,表面加工质量得到了显著提高。     

超声振动辅助抛光材料去除机理研究

超声振动辅助抛光是一种特种精密加工方法，其材料去除过程包含机械、物理、化学等多种因素，研究材料去除机理具有重要意义。对超声流场及超声流场作用下单颗磨粒对工件表面冲击作用进行仿真，分析超声流场作用下抛光过程的材料去除机理。仿真分析表明，在超声作用下，流场产生极强的横向剪切流，横向剪切流携裹着磨粒对工件表面产生冲击作用，从而实现材料去除。材料去除量与磨粒冲击角有关，磨粒冲击角越大，材料去除量越大。随着抛光的进行，工件表面逐渐趋于平整，磨粒冲击角也随之减小，逐渐趋于0°,此时不再有材料去除，工件抛光完成。     

超声振动抛光中材料去除原理与力学分析

根据超声振动抛光原理分析了弹塑性材料抛光过程中的材料去除方式;建立了弹塑性材料的材料去除模型,给出了磨粒速度、冲击载荷和工件表面受力变形的数学表达式;分析讨论了抛光过程和抛光参数的影响并用已有实验验证了该模型的合理性。     

集群磁流变变间隙动压平坦化加工试验研究

为了提高光电晶片集群磁流变平坦化加工效果,提出集群磁流变变间隙动压平坦化加工方法,探究各工艺参数对加工效果的影响规律。以蓝宝石晶片为研究对象开展了集群磁流变变间隙动压平坦化加工和集群磁流变抛光对比试验,通过检测加工表面粗糙度、材料去除率,观测加工表面形貌、集群磁流变抛光垫中磁链串受动态挤压前后形态变化,研究挤压幅值、工件盘转速、挤压频率以及最小加工间隙等工艺参数对加工效果的影响规律。试验结果表明：集群磁流变平坦化加工在施加工件轴向微幅低频振动后,集群磁流变抛光垫中形成的磁链串更粗壮,不但使其沿工件的径向流动实现磨粒动态更新、促使加工界面内有效磨粒数增多,而且在工件与抛光盘之间的加工间隙产生动态抛光压力、使磨粒与加工表面划擦过程柔和微量化,形成了提高材料去除效率、降低加工表面粗糙度的机制。对于2英寸蓝宝石晶电（1英寸=2.54 cm）集群磁流变变间隙动压平坦化加工与集群磁流变抛光加工效果相比,材料去除率提高19.5%,表面粗糙度降低了42.96%,在挤压振动频率1 Hz、最小加工间隙1 mm、挤压幅值0.5 mm、工件盘转速500 r/min的工艺参数下进行抛光可获得表面粗糙度为Ra0.45 nm的超光滑表面,材料去除率达到3.28 nm/min。证明了集群磁流变变间隙动压平坦化加工方法可行有效。     

磨粒流精密光整加工的微切削机理

利用磨粒流的流变特性,通过对应力张量的分析,研究了磨粒流加工中的微切削力。提出了磨粒流加工是兼挤压与微去除方式为一体的复合加工,微切削动力主要来自于磨粒挤压力、磨粒的犁削力及磨料介质的剪切力。建立了磨粒流动力学模型,通过改变磨粒流流道的加工条件和测试加工过程的接触区压力、去除量及表面粗糙度等参数,用量化的方式揭示了磨粒流加工中抽象微切削力的变化规律。最后,结合COMSOL Multiphysics软件的CFD模块数值仿真了剪切力。结果显示:基于加模芯的方法有效地提高了磨粒流加工的微切削力,滑块4经15次循环后表面粗糙度由加工前的2.918μm下降为1.027μm,而去除量下降了0.09g。实验表明,磨粒流加工中去除量确有变化,但随着加工次数增加去除作用迅速削弱,而表面粗糙度在挤压力的作用下仍有所降低。     

Research on unbounded abrasive polishing process with assisted ultrasonic vibration of workpiece

Ultrasonic-assisted machining was an effective method to improve the material removal quality especially to difficult-to-cut metal materials. The ultrasonic vibration was usually superimposed on the machining tool but seldom on the workpiece, although the ultrasonic vibration of workpiece could improve the processability of material more effectively. In this paper, a rectangle hexahedron ultrasonic sonotrode with optimized slots was developed as a platform to realize the assisted ultrasonic vibration of workpiece and the ultrasonic-assisted polishing process of austenitic stainless steel was also studied. The unbounded abrasive was selected as polishing medium, and the path compensation strategy of soft polishing tool was carried out for getting uniform polishing force. The orthogonal experiments were designed to study the optimization of ultrasonic polishing parameters and the relation between different types of ultrasonic polishing path and polishing quality. The results appear that the horizontal ultrasonic vibration of workpiece can reduce polishing force and improve polished surface roughness, which can also reinforce the proportion of plastic shear effect in the material removal process. The ultrasonic polishing path keeping consistent with workpiece vibration direction can get more uniform polishing force and better surface roughness. And the 45° oblique crossing ultrasonic path can get the maximum average polishing force reduction by 75.2 %.     

Automated Polishing of Die Steel Surfaces

An experimental study is presented that investigates the effects of various controllable polishing parameters on the resulting surface, when using a flexible abrasive disk on die steel. The objective is to achieve a robust process that results in a consistent surface finish, the roughness of which can be specified and controlled. Experimental results indicate that the inclination angle of the disk with respect to the workpiece, and the feedrate have optimal values that minimise variability of the surface finish, while the normal force applied to the disk should be used to control nominal surface roughness.     

磁场分布对多磨头磁流变抛光材料去除的影响

为研究磁场分布对材料去除的影响,设计轴向充磁异向排布、轴向充磁同向排布、径向充磁异向排布、径向充磁同向排布4种磁铁充磁和排布方式,利用有限元软件Maxwell仿真不同磁场的磁力线分布及抛光轮表面的磁感应强度分布,并采用数字特斯拉计测量实际磁感应强度。对单晶硅基片进行定点抛光试验,检测抛光斑沿抛光轮轴向的去除轮廓及峰值点的表面形貌。仿真和实际磁感应强度检测结果表明,不同磁场分布方式对抛光区的磁场分布有很大影响,磁铁轴向充磁同向排布与径向充磁异向排布时,具有较高的磁场强度和较好的多磨头效果。定点抛光试验表明,采用轴向充磁同向排布与径向充磁异向排布这两种方式时,能实现多点加工,其中轴向充磁同向排布时加工效率较高;但采用径向充磁同向排布时,由于抛光区磁感应强度较低,磁流变微磨头无法对工件进行有效地抛光。峰值点表面形貌检测结果表明,采用不同磁场分布方式时,对工件表面均是以塑性去除方式去除。研究表明,通过优化磁铁充磁和排布方式,可实现多磨头磁流变抛光的加工原理。     

A study on the application of newly developed magneto-elastic abrasive to improving the surface roughness of the bore

Spiral polishing mechanism refers to the technology of applying a high-speed turning screw rod in the process of workpiece surface polishing. For the purpose of increasing the machining effect, a powerful ring magnet was installed around the workpiece. In this study, the new self-developed magneto-elastic abrasive would be used to polish the inner wall of the bore, the so-called workpiece surface, under the attraction of the surrounding magnet and the drive of the turning rod. The new magneto-elastic abrasive not only eased the polishing force by its flexibility but also avoided deep scratches on the workpiece surface. The control of machining parameters on surface roughness and material removal were discussed to look for the best combination of the parameters; at the same time, the effects of each parameter on the workpiece surface topography after the polishing were also examined. The results of the experiment indicated that magnetic flux density and magneto-elastic abrasive concentration affected the surface roughness the most. In addition, the newly developed magneto-elastic abrasive significantly improved the polishing effect of the workpiece surface, at the rate of 94 %.     

Mechanisms in oxide-carbide ceramic BOK 60 grinding

The paper presents an experimental study of micro-cutting intended to aid the optimization of the grinding process of the oxide–carbide ceramic BOK 60. The necessity for investigating the mechanisms occurring between the abrasive material and the ceramic is imposed by the fact that grinding is the dominant technology used to achieve the required quality of the workpiece surface finish. The investigations were carried out to determine the normal and tangential cutting forces, the critical penetration depth, and the crack generation angle on the workpiece surface as a function of the grain penetration speed and depth. The micro-cutting process was performed with a single diamond cone-shaped grain at varying depths of cut. It was found that the critical grain penetration depth separating ductile flow from brittle fracturing ranges from 3 to 5?μm, while radial cracks on the ceramic’s surface are distributed at an angle from 35° to 75°, measured relative to the direction of the diamond grain’s motion.     

铜电致化学抛光抛光液的成分及其作用

电致化学抛光是通过电化学反应生成刻蚀剂并利用扩散控制反应实现工件表面无应力抛光的新方法,抛光液的特性则是实现扩散控制反应和可控去除的关键因素。分析电致化学抛光的基本原理,并根据理论模型提出了抛光液所应具备的基本条件。针对铜的电致化学抛光,提出以FeSO_4为电活性中介体,H_2SO_4为p H调节剂,BTA为侧向电子传导抑制剂的抛光液。通过使用XRD以及XPS等表征手段对加工后的表面进行分析,研究了铜抛光液中的p H调节剂H_2SO_4以及侧向电子传导抑制剂BTA的作用机理。研究结果表明,pH调节剂H_2SO_4的主要功能为去除Cu表面的氧化层,从而促进刻蚀反应的进行,而BTA则通过吸附于铜工件表面,从而有效地抑制了加工过程中的侧向电子传导。     

A study on the magneto-assisted spiral polishing on the inner wall of the bore with magnetic hot melt adhesive particles (MHMA particles)

The spiral polishing mechanism employed a fast turning screw rod to drive the abrasive for workpiece surface polishing. In this study, the powerful ring magnet installed around the workpiece would attract the self-developed magnetic hot melt adhesive particles (MHMA particles) during the process of polishing, driving the SiC particles against the workpiece, the inner wall of the bore. At the same time, the flexibility of MHMA particles helped improve the surface quality of the bore by preventing the SiC particles from heavily scratching it. The effects of magnetic flux density, size and concentration of SiC particles, concentration of MHMA particles, viscosity of silicone oil, revolution speed of the spindle as well as machining time and machining gap on operation temperature, slurry viscosity, surface roughness, and material removal were discussed and the best parameter combination was identified based on the results of the experiment. The effects of each machining parameter on the finished surface topography of the workpiece were also examined. Both analysis of variance and F-test indicated that magnetic flux density and the concentration of MHMA particles were the two most important variables affecting the surface roughness. In other words, magnetic force helped improve spiral polishing. Furthermore, the results showed that adding new MHMA particles to the slurry greatly improved the surface quality, at a rate of 90 %, and reduced the workpiece surface roughness from 0.9 μm down to 0.094 μm.     

Simultaneous tool posture and polishing force control of unknown curved surface using serial-parallel mechanism polishing machine

In automotive manufacturing, the repair polishing process of an automotive body is still manually performed by skilled polishing workers. This is because skilled workers can appropriately control the polishing motion and force according to the workpiece conditions based on their experience. However, the number of skilled workers has been decreasing. Additionally, the skill development of younger workers has not been satisfactorily conducted. To overcome such problems, in a previous research investigation, we developed a serial-parallel mechanism polishing machine that effectively reproduced the polishing motion and force of skilled workers. This replication system, however, had limited use because the acquired polishing techniques could not adapt to various workpiece conditions, such as shape and size. The present study aimed to expand the polishing method for application to curved surfaces, in other words, adapt the replication system to changes in the workpiece shape. In the past polishing methods for curved surfaces, the workpiece shape was acquired by using CAD data or external sensors that often led to an increase in process time and cost. However, the newly proposed method in this study requires neither CAD data nor external sensors, and was able to effectively achieve simultaneous posture and force control on unknown curved surface. The experimental results showed that the skilled polishing techniques were successfully replicated on an unknown curved surface and the surface roughness was greatly improved by integrating the newly proposed method into the skilled polishing replication system.