共查询到20条相似文献,搜索用时 15 毫秒
1.
A.I. D’Souza M.G. Stapelbroek E.W. Robinson C. Yoneyama H.A. Mills M.A. Kinch M.R. Skokan H.D. Shih 《Journal of Electronic Materials》2008,37(9):1318-1323
Time series and Fourier-transform data on high-density vertically integrated photodiodes (HDVIP) at 0 and 50 mV reverse bias
in the dark have been studied. The detectors have a cutoff wavelength λ
c (60 K) of 10.5 μm. Examination of the detector current time series and Fourier-transform curves of these devices reveals a variety of interesting
characteristics: (i) time series displaying switching between four states characteristic of random telegraph signal (RTS)
noise, the noise current power spectrum having Lorentzian or double Lorentzian type characteristics, (ii) time series data
exhibiting wave-like characteristics with the noise current power spectrum being 1/f
2-like at low frequencies, (iii) time series having a mean value independent of time with the noise current power spectrum
being white, and (iv) time series nearly independent of time with the noise current power spectrum having 1/f characteristics. Although from a single array, the excess noise characteristics at low (mHz) frequencies were varied, most
of the detectors measured fell into one of these four categories. The predominance of detectors examined had minimal excess
low-frequency noise down to ~ 10 mHz. Detectors that displayed RTS noise in reverse bias were repeatable under subsequent
measurement. However, when measured at zero bias, the same detectors exhibited no RTS noise, the noise current power spectrum
being white in nature. 相似文献
2.
High-Performance LWIR MBE-Grown HgCdTe/Si Focal Plane Arrays 总被引:1,自引:0,他引:1
Richard Bornfreund Joe P. Rosbeck Yen N. Thai Edward P. Smith Daniel D. Lofgreen Mauro F. Vilela Aimee A. Buell Michael D. Newton Kenneth Kosai Scott M. Johnson Terry J. de Lyon John E. Jensen Meimei Z. Tidrow 《Journal of Electronic Materials》2007,36(8):1085-1091
We have been actively pursuing the development of long-wavelength infrared (LWIR) HgCdTe grown by molecular beam epitaxy (MBE)
on large-area silicon substrates. The current effort is focused on extending HgCdTe/Si technology to longer wavelengths and
lower temperatures. The use of Si versus bulk CdZnTe substrates is being pursued due to the inherent advantages of Si, which
include available wafer sizes (as large as 300 mm), lower cost (both for the substrates and number of die per wafer), compatibility
with semiconductor processing equipment, and the match of the coefficient of thermal expansion with silicon read-out integrated
circuit (ROIC). Raytheon has already demonstrated low-defect, high-quality MBE-grown HgCdTe/Si as large as 150 mm in diameter.
The focal plane arrays (FPAs) presented in this paper were grown on 100 mm diameter (211)Si substrates in a Riber Epineat
system. The basic device structure is an MBE-grown p-on-n heterojunction device. Growth begins with a CdTe/ZnTe buffer layer followed by the HgCdTe active device layers; the entire
growth process is performed in␣situ to maintain clean interfaces between the various layers. In this experiment the cutoff wavelengths were varied from 10.0 μm to 10.7 μm at 78 K. Detectors with >50% quantum efficiency and R
0
A ∼1000 Ohms cm2 were obtained, with 256 × 256, 30 μm focal plane arrays from these detectors demonstrating response operabilities >99%.
Work supported by the Missile Defense Agency (MDA) through CACI Technologies, Inc. subcontract no. 601-05-0088, NVESD technical
task order no. TTO-01, prime contract no. DAAB07-03-D-C214, (delivery order no. 0016) 相似文献
3.
Molecular beam epitaxy growth of high-quality HgCdTe LWIR layers on polished and repolished CdZnTe substrates 总被引:2,自引:0,他引:2
R. Singh S. Velicu J. Crocco Y. Chang J. Zhao L. A. Almeida J. Markunas A. Kaleczyc J. H. Dinan 《Journal of Electronic Materials》2005,34(6):885-890
We report here molecular beam epitaxy (MBE) mercury cadmium telluride (HgCdTe) layers grown on polished and repolished substrates
that showed state-of-the-art optical, structural, and electrical characteristics. Many polishing machines currently available
do not take into account the soft semiconductor materials, CdZnTe (CZT) being one. Therefore, a polishing jig was custom designed
and engineered to take in account certain physical parameters (pressure, substrate rotational frequency, drip rate of solution
onto the polishing pad, and polishing pad rotational velocity). The control over these parameters increased the quality, uniformity,
and the reproducibility of each polish. EPIR also investigated several bromine containing solutions used for polishing CZT.
The concentration of bromine, as well as the mechanical parameters, was varied in order to determine the optimal conditions
for polishing CZT. 相似文献
4.
In this paper standard techniques for characterization of HgCdTe liquid phase epitaxial layers (LPE) were presented. The performance of long wavelength p-on-n HgCdTe photodiodes fabricated by arsenic diffusion was described. The correlation between LPE HgCdTe material parameters and properties of the infrared photodiodes was demonstrated. 相似文献
5.
S. M. Johnson A. A. Buell M. F. Vilela J. M. Peterson J. B. Varesi M. D. Newton G. M. Venzor R. E. Bornfreund W. A. Radford E. P. G. Smith J. P. Rosbeck T. J. De Lyon J. E. Jensen V. Nathan 《Journal of Electronic Materials》2004,33(6):526-530
The heteroepitaxial growth of HgCdTe on large-area Si substrates is an enabling technology leading to the production of low-cost,
large-format infrared focal plane arrays (FPAs). This approach will allow HgCdTe FPA technology to be scaled beyond the limitations
of bulk CdZnTe substrates. We have already achieved excellent mid-wavelength infrared (MWIR) and short wavelength infrared
(SWIR) detector and FPA results using HgCdTe grown on 4-in. Si substrates using molecular beam epitaxy (MBE), and this work
was focused on extending these results into the long wavelength infrared (LWIR) spectral regime. A series of nine p-on-n LWIR
HgCdTe double-layer heterojunction (DLHJ) detector structures were grown on 4-in. Si substrates. The HgCdTe composition uniformity
was very good over the entire 4-in. wafer with a typical maximum nonuniformity of 2.2% at the very edge of the wafer; run-to-run
composition reproducibility, realized with real-time feedback control using spectroscopic ellipsometry, was also very good.
Both secondary ion mass spectrometry (SIMS) and Hall-effect measurements showed well-behaved doping and majority carrier properties,
respectively. Preliminary detector results were promising for this initial work and good broad-band spectral response was
demonstrated; 61% quantum efficiency was measured, which is very good compared to a maximum allowed value of 70% for a non-antireflection-coated
Si surface. The R0A products for HgCdTe/Si detectors in the 9.6-μm and 12-μm cutoff range were at least one order of magnitude below typical
results for detectors fabricated on bulk CdZnTe substrates. This lower performance was attributed to an elevated dislocation
density, which is in the mid-106 cm−2 range. The dislocation density in HgCdTe/Si needs to be reduced to <106 cm−2 to make high-performance LWIR detectors, and multiple approaches are being tried across the infrared community to achieve
this result because the technological payoff is significant. 相似文献
6.
Bake stability of long-wavelength infrared HgCdTe photodiodes 总被引:2,自引:0,他引:2
A. Mestechkin D. L. Lee B. T. Cunningham B. D. Mac Leod 《Journal of Electronic Materials》1995,24(9):1183-1187
The bake stability was examined for HgCdTe wafers and photodiodes with CdTe surface passivation deposited by thermal evaporation.
Electrical and electrooptical measurements were performed on various long-wavelength infrared HgCdTe photodiodes prior to
and after a ten-day vacuum bakeout at 80°C, similar to conditions used for preparation of tactical dewar assemblies. It was
found that the bakeout process generated additional defects at the CdTe/ HgCdTe interface and degraded photodiode parameters
such as zero bias impedance, dark current, and photocurrent. Annealing at 220°C under a Hg vapor pressure following the CdTe
deposition suppressed the interface defect generation process during bakeout and stabilized HgCdTe photodiode performance. 相似文献
7.
Dual-band infrared detectors made on high-quality HgCdTe epilayers grown by molecular beam epitaxy on CdZnTe or CdTe/Ge substrates 总被引:2,自引:0,他引:2
P. Ballet F. Noël F. Pottier S. Plissard J. P. Zanatta J. Baylet O. Gravrand E. De Borniol S. Martin P. Castelein J. P. Chamonal A. Million G. Destefanis 《Journal of Electronic Materials》2004,33(6):667-672
In this paper, we present all the successive steps for realizing dual-band infrared detectors operating in the mid-wavelength
infrared (MWIR) band. High crystalline quality HgCdTe multilayer stacks have been grown by molecular beam epitaxy (MBE) on
CdZnTe and CdTe/Ge substrates. Material characterization in the light of high-resolution x-ray diffraction (HRXRD) results
and dislocation density measurements are exposed in detail. These characterizations show some striking differences between
structures grown on the two kinds of substrates. Device processing and readout circuit for 128×128 focal-plane array (FPA)
fabrication are described. The electro-optical characteristics of the devices show that devices grown on Ge match those grown
on CdZnTe substrates in terms of responsivity, noise measurements, and operability. 相似文献
8.
K. D. Maranowski J. M. Peterson S. M. Johnson J. B. Varesi A. C. Childs R. E. Bornfreund A. A. Buell W. A. Radford T. J. de Lyon J. E. Jensen 《Journal of Electronic Materials》2001,30(6):619-622
HgCdTe p-on-n double layer heterojunctions (DLHJs) for mid-wave infrared (MWIR) detector applications have been grown on 100
mm (4 inch) diameter (211) silicon substrates by molecular beam epitaxy (MBE). The structural quality of these films is excellent,
as demonstrated by x-ray rocking curves with full widths at half maximum (FWHMs) of 80–100 arcsec, and etch pit densities
from 1 106 to 7 106 cm−2. Morphological defect densities for these layers are generally less than 1000 cm−2. Improving Hg flux coverage of the wafer during growth can reduce void defects near the edges of the wafers. Improved tellurium
source designs have resulted in better temporal flux stability and a reduction of the center to edge x-value variation from
9% to only 2%. Photovoltaic MWIR detectors have been fabricated from some of these 100mm wafers, and the devices show performance
at 140 K which is comparable to other MWIR detectors grown on bulk CdZnTe substrates by MBE and by liquid phase epitaxy. 相似文献
9.
Heteroepitaxy of HgCdTe (211)B on Ge substrates by molecular beam epitaxy for infrared detectors 总被引:3,自引:0,他引:3
J. P. Zanatta P. Ferret G. Theret A. Million M. Wolny J. P. Chamonal G. Destefanis 《Journal of Electronic Materials》1998,27(6):542-545
Epitaxial growth of (211)B CdTe/HgCdTe has been achieved on two inch germanium (Ge) by molecular beam epitaxy (MBE). Germanium
was chosen as an alternative substrate to circumvent the weaknesses of CdZnTe wafers. The ease of surface preparation makes
Ge an attractive candidate among many other alternative substrates. Best MBE CdTe growth results were obtained on (211) Ge
surfaces which were exposed to arsenic and zinc fluxes prior to the MBE growth. This surface preparation enabled CdTe growth
with B-face crystallographic polarity necessary for the HgCdTe growth. This process was reproducible, and produced a smooth
and mirror-like surface morphology. The best value of the {422} x-ray double diffraction full width at half maximum measured
from the HgCdTe layer was 68 arc-s. We present the 486 point maps of FWHM statistical values obtained from CdTe/Ge and HgCdTe/CdTe/Ge.
High resolution microscopy electron transmission and secondary ion mass spectroscopy characterization results are also presented
in this paper. High-performance middle wavelength infrared HgCdTe 32-element photodiode linear arrays, using the standard
LETI/LIR planar n-on-p ion implanted technology, were fabricated on CdTe/Ge substrates. At 78K, photodiodes exhibited very
high R0A figure of merit higher than 106 Ωcm−2 for a cutoff wavelength of 4.8 μm. Excess low frequency noise was not observed below 150K. 相似文献
10.
J. P. Zanatta G. Badano P. Ballet C. Largeron J. Baylet O. Gravrand J. Rothman P. Castelein J. P. Chamonal A. Million G. Destefanis S. Mibord E. Brochier P. Costa 《Journal of Electronic Materials》2006,35(6):1231-1236
The Leti-Lir has studied II–VI compounds for infrared (IR) detection for more than 20 years. The need to reduce the production
cost of IR focal plane arrays (FPAs) sparked the development of heteroepitaxy on large-area substrates. Germanium has been
chosen as the heterosubstrate for the third generation of IR detectors. First, we report on the progress achieved in HgCdTe
growth on 3-in. and 4-in. (211)B CdTe/Ge. Then, we discuss the choice of a new machine for larger size and better homogeneity.
Finally, we present the latest results on third-generation IR multicolor and megapixel devices. First-time results regarding
a middle wavelength infrared (MWIR) dual-band FPA, with a reduced pitch of 25 μm, and a MWIR 1,280×1,024 FPA will be shown.
Both detectors are based on molecular beam epitaxy (MBE)-grown HgCdTe on Ge. The results shown validate the choice of Ge as
the substrate for third-generation detectors. 相似文献
11.
M. Reddy J.M. Peterson D.D. Lofgreen J.A. Franklin T. Vang E.P.G. Smith J.G.A. Wehner I. Kasai J.W. Bangs S.M. Johnson 《Journal of Electronic Materials》2008,37(9):1274-1282
Molecular beam epitaxy (MBE) growth of HgCdTe on large-size Si (211) and CdZnTe (211)B substrates is critical to meet the
demands of extremely uniform and highly functional third-generation infrared (IR) focal-panel arrays (FPAs). We have described
here the importance of wafer maps of HgCdTe thickness, composition, and the macrodefects across the wafer not only to qualify
material properties against design specifications but also to diagnose and classify the MBE-growth-related issues on large-area
wafers. The paper presents HgCdTe growth with exceptionally uniform composition and thickness and record low macrodefect density
on large Si wafers up to 6-in in diameter for the detection of short-wave (SW), mid-wave (MW), and long-wave (LW) IR radiation.
We have also proposed a cost-effective approach to use the growth of HgCdTe on low-cost Si substrates to isolate the growth-
and substrate-related problems that one occasionally comes across with the CdZnTe substrates and tune the growth parameters
such as growth rate, cutoff wavelength (λ
cutoff) and doping parameters before proceeding with the growth on costly large-area CdZnTe substrates. In this way, we demonstrated
HgCdTe growth on large CdZnTe substrates of size 7 cm × 7 cm with excellent uniformity and low macrodefect density.
Received December 7, 2007; accepted February 25, 2008 相似文献
12.
J. B. Varesi A. A. Buell R. E. Bornfreund W. A. Radford J. M. Peterson K. D. Maranowski S. M. Johnson D. F. King 《Journal of Electronic Materials》2002,31(7):815-821
We are continuing to develop our growth and processing capabilities for HgCdTe grown on 4-in. Si substrates by molecular beam
epitaxy (MBE). Both short-wave and mid-wave infrared (SWIR and MWIR) double-layer hetero-junctions (DLHJs) have been fabricated.
In order to improve the producibility of the material, we have implemented an in-situ growth composition-control system. We
have explored dry etching the HgCdTe/Si wafers and seen promising results. No induced damage was observed in these samples.
Detector results show that the HgCdTe/Si devices are state-of-the-art, following the diffusion-limited trend line established
by other HgCdTe technologies. Focal-plane array (FPA) testing has been performed in order to assess the material over large
areas. The FPA configurations range from 128×128 to 1,024×1,024, with unit cells as small as 20 μm. The MWIR responsivity
and NEDT values are comparable to those of existing InSb FPAs. Pixel operabilities well in excess of 99% have been measured.
We have also explored the role of growth macrodefects on diode performance and related their impact to FPA operability. The
SWIR HgCdTe/Si shows similar results to the MWIR material. Short-wave IR FPA, median dark-current values of less than 0.1
e−/sec have been achieved. 相似文献
13.
14.
J.G.A. Wehner R.H. Sewell C.A. Musca J.M. Dell L. Faraone 《Journal of Electronic Materials》2007,36(8):877-883
Investigation into resonant-cavity-enhanced (RCE) HgCdTe detectors has revealed a discrepancy in the refractive index of the
CdTe layers grown by molecular beam epitaxy (MBE) for the detectors, compared with the reported value for crystalline CdTe.
The refractive index of the CdTe grown for RCE detectors was measured using ellipsometry and matches that of CdTe with an
inclusion of approximately 10% voids. X-ray measurements confirm that the sample is crystalline and strained to match the
lattice spacing of the underlying Hg(1−x)Cd(x)Te, while electron diffraction patterns observed during growth indicate that the CdTe layers exhibit some three-dimensional
structure. Secondary ion mass spectroscopy results further indicate that there is enhanced interdiffusion at the interface
between Hg(1−x)Cd(x)Te and CdTe when the Hg(1−x)Cd(x)Te is grown on CdTe, suggesting that the defects are nucleated within the CdTe layers. 相似文献
15.
Performance of molecular-beam epitaxy-grown midwave infrared HgCdTe detectors on four-inch Si substrates and the impact of defects 总被引:4,自引:0,他引:4
J. B. Varesi A. A. Buell J. M. Peterson R. E. Bornfreund M. F. Vilela W. A. Radford S. M. Johnson 《Journal of Electronic Materials》2003,32(7):661-666
We are continuing development of the growth of midwave infrared (MWIR) HgCdTe by molecular-beam epitaxy (MBE) on 4-in. Si
substrates and the fabrication of state-of-the-art detectors and focal plane arrays (FPAs). Array formats of up to 2048 ×
2048 and unit cells as small as 20 μm have been made. We regularly measure response operability values in excess of 99% on
these arrays. These values typically exceed expectations, with the number of outages corresponding to as-grown defect densities
four times lower than what we measure. We have investigated this operability discrepancy and now can account for it. Comparisons
of measured properties were used to establish trends between defect occurrence and pixel operability. These correlations show
that a combination of defect removal and low-impact defects provide the explanation. Having this knowledge will allow for
better operability predictions and assist in efforts to reduce defect impact on FPA performance. 相似文献
16.
MBE growth of HgCdTe on silicon substrates for large-area infrared focal plane arrays: A review of recent progress 总被引:3,自引:0,他引:3
T. J. de Lyon J. E. Jensen M. D. Gorwitz C. A. Cockrum S. M. Johnson G. M. Venzor 《Journal of Electronic Materials》1999,28(6):705-711
We review the rapid progress that has been made during the past three years in the heteroepitaxial growth of HgCdTe infrared
detector device structures on Si substrates by molecular-beam epitaxy. The evolution of this technology has enabled the fabrication
of high performance, large-area HgCdTe infrared focal-plane arrays on Si substrates. A key element of this heteroepitaxial
approach has been development of high quality CdTe buffer layers deposited on Si(112) substrates. We review the solutions
developed by several groups to address the difficulties associated with the CdTe/Si(112) heteroepitaxial system, including
control of crystallographic orientation and minimization of defects such as twins and threading dislocations. The material
quality of HgCdTe/Si and the performance of HgCdTe detector structures grown on CdTe/Si(112) composite substrates is reviewed.
Finally, we discuss some of the challenges related to composition uniformity and defect generation encountered with scaling
the MBE growth process for HgCdTe to large-area Si substrates. 相似文献
17.
T. Nguyen C. A. Musca J. M. Dell J. Antoszewski L. Faraone 《Journal of Electronic Materials》2003,32(7):615-621
A long-wavelength infrared (LWIR) HgCdTe photodiode fabrication process has been developed based on reactive ion etching (RIE)
plasma-induced p-to-n type conversion for junction formation. The process has been successfully applied to produce devices
using both vacancy-doped and gold-doped liquid phase epitaxy (LPE)-grown p-type HgCdTe material with a cut-off wavelength
of 10 μm at 77 K. The fabrication procedure is outlined and results are presented on completed devices that indicate the effect
of variations in processing parameters. The fabricated devices have been characterized by measurements of the diode dark I-V
characteristic over the temperature range 20–200 K, as well as by spectral responsivity measurements. Analysis of the device
I-V data, variable area data, and modeling of diode dark current mechanisms indicates that gold-doped material results in
higher performing devices compared to vacancy-doped material. Device performance is found to be strongly affected by trap-assisted
tunneling currents and surface leakage currents at zero bias. Nonoptimum surface passivation is likely to be the major factor
limiting performance at this early stage of device technology development. 相似文献
18.
M. Reddy J. M. Peterson S. M. Johnson T. Vang J. A. Franklin E. A. Patten W. A. Radford J. W. Bangs D. D. Lofgreen 《Journal of Electronic Materials》2009,38(8):1764-1770
This paper presents the progress in the molecular beam epitaxy (MBE) growth of HgCdTe on large-area Si and CdZnTe substrates
at Raytheon Vision Systems. We report a very high-quality HgCdTe growth, for the first time, on an 8 cm × 8 cm CdZnTe substrate.
This paper also describes the excellent HgCdTe growth repeatability on multiple 7 cm × 7 cm CdZnTe substrates. In order to
study the percentage wafer area yield and its consistency from run to run, small lots of dual-band long-wave infrared/long-wave
infrared triple-layer heterojunction (TLHJ) layers on 5 cm × 5 cm CdZnTe substrates and single-color double-layer heterojunction
(DLHJ) layers on 6-inch Si substrates were grown and tested for cutoff wavelength uniformity and micro- and macrovoid defect
density and uniformity. The results show that the entire lot of 12 DLHJ-HgCdTe layers on 6-inch Si wafers meet the testing
criterion of cutoff wavelength within the range 4.76 ± 0.1 μm at 130 K and micro- and macrovoid defect density of ≤50 cm−2 and 5 cm−2, respectively. Likewise, five out of six dual-band TLHJ-HgCdTe layers on 5 cm × 5 cm CdZnTe substrates meet the testing criterion
of cutoff wavelength within the range 6.3 ± 0.1 μm at 300 K and micro- and macrovoid defect density of ≤2000 cm−2 and 500 cm−2, respectively, on the entire wafer area. Overall we have found that scaling our HgCdTe MBE process to a 10-inch MBE system
has provided significant benefits in terms of both wafer uniformity and quality. 相似文献
19.
T. J. De Lyon G. L. Olson J. A. Roth J. E. Jensen A. T. Hunter M. D. Jack S. L. Bailey 《Journal of Electronic Materials》2002,31(7):688-693
The application of spectroscopic ellipsometry (SE) for real-time composition determination during molecular beam epitaxy (MBE)
growth of Hg1−xCdxTe alloys with x>0.5 is reported. Techniques previously developed for SE determination of composition in long-wavelength infrared
(LWIR) HgCdTe have been successfully extended to near-infrared HgCdTe avalanche photodiode (APD) device structures with x
values in the range of 0.6–0.8. Ellipsometric data collected over a spectral range of 1.7–5 eV were used to measure depth
profiles of HgCdTe alloy composition through the use of an optical model of the growth surface. The optical model used a dielectric-function
database collected through the growth of a set of HgCdTe calibration samples with x ranging from 0.6 to 0.8. The sensitivity
of this SE method of composition determination is estimated to be Δx ∼0.0002 at x=0.6, which is sufficiently low to sense
composition changes arising from flux variations of less than 0.1%. Errors in composition determination because of Hg-flux
variations appear to be inconsequential, while substrate-temperature fluctuations have been observed to alter the derived
composition at a rate of −0.0004/°C. By comparing the composition inferred from SE and postgrowth 300 K IR transmission measurements
on a set of APD device structures, the run-to-run precision of the Se-derived composition (at x=0.6) is estimated to be ±0.0012,
which is equivalent to the precision achieved with the same instrumentation during the growth of mid-wavelength infrared (MWIR)
HgCdTe alloys in the same MBE system. 相似文献
20.
Uniform low defect density molecular beam epitaxial HgCdTe 总被引:3,自引:0,他引:3
J. Bajaj J. M. Arias M. Zandian D. D. Edwall J. G. Pasko L. O. Bubulac L. J. Kozlowski 《Journal of Electronic Materials》1996,25(8):1394-1401
This paper describes recent advances in MBE HgCdTe technology. A new 3 inch production molecular beam epitaxy (MBE) system,
Riber Model 32P, was installed at Rockwell in 1994. The growth technology developed over the years at Rockwell using the Riber
2300 R&D system was transferred to the 32P system in less than six months. This short period of technology transfer attests
to our understanding of the MBE HgCdTe growth dynamics and the key growth parameters. Device quality material is being grown
routinely in this new system. Further advances have been made to achieve better growth control. One of the biggest challenges
in the growth of MBE HgCdTe is the day-to-day control of the substrate surface temperature at nucleation and during growth.
This paper describes techniques that have led to growth temperature reproducibility within + - 1°C, and a variation in temperature
during substrate rotation within 0.5°C. The rotation of the substrate during growth has improved the uniformity of the grown
layers. The measured uniformity data on composition for a typical 3 cm × 3 cm MBE HgCdTe/CdZnTe shows the average and standard
deviation values of 0.229 and 0.0006, respectively. Similarly, the average and standard deviation for the layer thickness
are 7.5 and 0.06 μm, respectively. P-on-n LWIR test structure photodiodes fabricated using material grown by the new system
and using rotation during growth have resulted in high-performance (R0)A, quantum efficiency) devices at 77 and 40K. In addition, 128 × 28 focal plane arrays with excellent performance and operability
have been demonstrated. 相似文献