20.8 Gb/s GaAs LSI self-routing switch for ATM switching systems

An 8×8 self-routing hardware switch providing 20.8 Gb/s throughput has been developed for asynchronous transfer mode (ATM) switching systems. The basic architecture of this switch is a Batcher-Banyan network. A new mechanism for data processing and distributing high-speed signals is proposed. This switching system consists of three LSIs using a 0.5-μm gate GaAs MESFET technology. These LSIs are a switching network LSI for exchanging packet cells with eight cell channels, a negotiation network for screening of cells destined for the same output port, and a demultiplexer LSI for converting the cell streams from the switching network LSI to the eight streams per channel. These LSIs are mounted in a 520-pin multichip module package. The total number of logic gates is 13.3 k, and the power dissipation is 24 W. The switching system fully operates at a data rate of 2.6 Gb/s, and its throughput is 20.8 Gb/s     

A 2 Gb/s expandable space-division switching LSI and networkarchitecture for gigabit-rate broad-band circuit switching

An expandable space-division (SD) switch architecture and a bipolar circuit design for gigabit-per-second crosspoint-switch LSIs are described. An expandable 2-Gb/s 16×16 crosspoint switch LSI which employs a novel switch structure, a novel circuit design, and a super self-aligned process (SST-1A) is developed. A switching module and partial 1:n nonblock, full 1:1 nonblock switching network architecture are also presented. Using the LSI and the switching network architecture, an experimental 620-Mb/s network system is demonstrated     

An ISDN echo-cancelling transceiver chip set for 2B1Q coded U-interface

A three-chip set for a 2B1Q U-interface transceiver has been developed. The chip set is composed of an analog front-end (AFE), echo-canceller (EC), and receiver (RCV) LSIs. The AFE LSI includes a 12-b accuracy oversampling analog/digital converter. The EC and RCV LSIs are 26- and 16-bit microprogrammable digital signal processors, respectively. A digital phase-locked loop is used to minimize the analog part. Residual echo increase by a timing phase jump is compensated for by a newly introduced additional adaptive filter. Infinite impulse response filters and multiresponse filters reduce the necessary number of taps for both the echo canceller and the decision-feedback equalizer. The AFE and the two digital signal processor LSIs are implemented in 1.6- and 1.2-μm double-metal layer CMOS processes, respectively. A 6-km loop coverage was realized with a less than 10^-7 error rate. Total power consumption by the chip set is 580 mW at 5-V single supply     

A 1.8 Gb/s GaAs optoelectronic universal switch LSI withmonolithically integrated photodetector and laser driver

A high-speed monolithic optical interface switch LSI is developed using a GaAs MSM photodetector and large-scale integrated electric circuits. This LSI operates universally as a 1.8 Gb/s optical-input/optical-output four-channel time-division switch, a 1.8 Gb/s optical-input/electrical-output 1:4 demultiplexer, a 2.0 Gb/s electrical-output 4:1 multiplexer, and a 2.8 Gb/s electrical-input/electrical-output 4×4 space-division switch. It uses a new multistage 2×2 switch block with small hardware and high-speed operation. It can be expanded to a 16×16 optical-input/optical-output time-division switch operating at up to 1.8 Gb/s for broadband-ISDN     

A 10-Gb/s (1.25 Gb/s×8)4×2 0.25-μm CMOS/SIMOX ATMswitch based on scalable distributed arbitration

This paper presents the design and implementation of a scalable asynchronous transfer mode switch. We fabricated a 10-Gb/s 4×2 switch large-scale integration (LSI) that uses a new distributed contention control technique that allows the switch LSI to be expanded. The developed contention control is executed in a distributed manner at each switch LSI, and the contention control time does not depend on the number of connected switch LSI's. To increase the LSI throughput and reduce the power consumption, we used 0.25-μm CMOS/SIMOX (separation by implanted oxygen) technology, which enables us to make 221 pseudo-emitter-coupled-logic I/O pins with 1.25-Gb/s throughput. In addition, power consumption of 7 W is achieved by operating the CMOS/SIMOX gates at -2.0 V. This consumption is 36% less than that of bulk CMOS gates (11 W) at the same speed at -2.5 V. Using these switch LSI's, an 8×8 switching multichip module with 80-Gb/s throughput was fabricated with a compact size     

A 9.6-Gb/s HEMT ATM switch LSI with event-controlled FIFO

An asynchronous-transfer-mode (ATM) switch LSI was designed for the broadband integrated services digital network (B-ISDN) and fabricated using 0.6-μm high-electron-mobility-transistor (HEMT) technology. To enhance the high-speed performance of direct-coupled FET logic (DCFL), event-controlled logic was used instead of conventional static memory for the first-in first-out (FIFO) buffer circuit. The 4.8-mm×4.7-mm chip contains 7100 DCFL gates. The maximum operating frequency was 1.2 GHz at room temperature with a power dissipation of 3.7 W. The single-chip throughput was 9.6 Gb/s. An experimental 4-to-4 ATM switching module using 16 switch LSIs achieved a throughput of 38.4 Gb/s     

A 1.5 Gb/s 8×8 cross-connect switch using a time reservationalgorithm

An input queuing type switching architecture that uses a high-performance contention resolution algorithm to achieve high-speed and large-capacity cross-connect switching is presented. The algorithm, called the time reservation algorithm, features time scheduling and pipeline processing. The performance of this switch is evaluated by computer simulation. The throughput of this switch is about 90%, without requiring high internal operation speeds. Three LSI designs are developed to verify the feasibility of the high-speed switch. They are the input buffer controller LSI, the contention-resolution module LSI, and the space-division switching LSI. The LSIs were constructed with an advanced Si-bipolar high-speed process. Also, 8×8 cross-connect switching boards are introduced. The measured maximum port speed is 1.55 Gb/s     

Scalable 10 Gbit/s 4×20.25 μm CMOS/SIMOX ATM switch LSIcircuit based on distributed contention control

A scalable 10 Gbit/s 4×2 ATM switch LSI circuit has been fabricated. It employs a new distributed contention control technique that makes the LSI circuit expandable. To increase the LSI circuit throughput, 0.2 μm CMOS/SIMOX (separation by implanted oxygen) technology is used. It allows the LSI circuit to offer 221 I/O pins, an operating speed of 1.25 Gbit/s and 7 W power consumption     

High-speed monolithically integrated silicon photoreceivers fabricated in 130-nm CMOS technology

A complementary metal-oxide-semiconductor (CMOS) monolithically integrated photoreceiver is presented. The circuit was fabricated in a 130-nm unmodified CMOS process flow on 2-/spl mu/m-thick silicon-on-insulator substrates. The receiver operated at 8 Gb/s with 2-dBm average input optical power and a bit error rate of less than 10/sup -9/. The integrated lateral p-i-n photodetector was simultaneously realized with the amplifier and had a responsivity of 0.07 A/W at 850 nm. The measured receiver sensitivities at 5, 3.125, 2, and 1 Gb/s, were -10.9, -15.4, -16.5, and -19 dBm, respectively. A 3-V single-supply operation was possible at bit rates up to 3.125 Gb/s. The transimpedance gain of the receivers was in the range 53.4-31 dB/spl Omega/. The circuit dissipated total power between 10 mW and 35 mW, depending on the design.     

A 0.3-μm CMOS 8-Gb/s 4-PAM serial link transceiver

An 8-Gb/s 0.3-μm CMOS transceiver uses multilevel signaling (4-PAM) and transmit preshaping in combination with receive equalization to reduce intersymbol interference due to channel low-pass effects. High on-chip frequencies are avoided by multiplexing and demultiplexing the data directly at the pads. Timing recovery takes advantage of a novel frequency acquisition scheme and a linear phase-locked loop that achieves a loop bandwidth of 35 MHz, phase margin of 50°, and capture range of 20 MHz without a frequency acquisition aid. The transmitted 8 Gb/s data are successfully detected by the receiver after a 10-m coaxial cable. The 2×2 mm² chip consumes 1.1 W at 8 Gb/s with a 3-V supply     

A self-aligned gate III-V heterostructure FET process forultrahigh-speed digital and mixed analog/digital LSI/VLSI circuits

A planar ion-implanted self-aligned gate process for the fabrication of high-speed digital and mixed analog/digital LSI/VLSI integrated circuits is reported. A 4-b analog-to-digital converter, a 2500-gate 8×8 multiplier/accumulator, and a 4500-gate 16×16 complex multiplier have been demonstrated using enhancement-mode n⁺ -(Al,Ga)As/MODFETs, superlattice MODFETs, and doped channel heterostructure field-effect transistors (FETs) whose epitaxial layers were grown by molecular-beam epitaxy. With nominal 1-μm gate-length devices, direct-coupled FET logic ring oscillators with realistic circuit structures have propagation delays of 30 ps/stage at a power dissipation of 1.2 mW/stage. In LSI circuit operation, these gates have delays of 89 ps/gate at a power dissipation of 1.38 mW/gate when loaded with an average fan-out of 2.5 gates and about 1000 μm of high-density interconnects. High-performance voltage comparator circuits operated at sampling rates greater than 2.5 GHz at Nyquist analog input rates and with static hysteresis of less than 1 mV at room temperature. Fully functional 4-b analog-to-digital circuits operating at frequencies up to 2 GHz were obtained     

A 2 K-word dictionary search processor (DISP) LSI with anapproximate word search capability

A 2 K-word dictionary search processor (DISP) LSI has been developed. The DISP LSI consists mainly of a 160-kb content addressable memory (CAM) to store keywords and a cellular automaton processor (CAP) to perform concurrent and approximate word searches against the stored keywords. This CAP performs distance calculation based on dynamic programming (DP), which is necessary in approximate word searches, through the use of an array of extremely simple processor elements. CAP hardware size is less than 1/10 of that of a conventional systolic array processor. The DISP LSI, which was fabricated using a 0.8-μm, triple-layer-Al, CMOS fabrication technology, has a die size of 13.02×12.51 mm² and contains about 1.2-million transistors. It operates at a clock frequency of 33 MHz with a 5-V power supply, and it typically consumes 800 mW     

A CMOS clock recovery circuit for 2.5-Gb/s NRZ data

This paper describes a phase-locked clock recovery circuit that operates at 2.5 Gb/s in a 0.4-μm digital CMOS technology. To achieve a high speed with low power dissipation, a two-stage ring oscillator is introduced that employs an excess phase technique to operate reliably across a wide range. A sample-and-hold phase detector is also described that combines the advantages of linear and nonlinear phase detectors. The recovered clock exhibits an rms jitter of 10.8 ps for a PRBS sequence of length 2⁷-1 and a phase noise of -80 dBc/Hz at a 5-MHz offset. The core circuit dissipates a total power of 33.5 mW from a 3.3-V supply and occupies an area of 0.8×0.4 mm²     

A 4 Gbits/s GaAs 16:1 multiplexer/1:16 demultiplexer LSI chip

A GaAs 16:1 multiplexer (MUX)/1:16 demultiplexer (DMUX) LSI chip, which operates at data rates from 50 Mb/s up to 4 Gb/s in a multilayer ceramic package, is described. The LSI chip incorporates trees of 2:1 MUX and 1:2 DMUX. The 2:1 MUX is composed of a master-slave D-flip-flop (DFF) joined with a 2-1 selector. The 1:2 DMUX consists of DFFs which are either a master-slave or the tristage type. The package has 76 pins and consists of five layers, including four power layers, and is applicable up to 7.7 GHz operation. The LSI chip is fabricated using a flat-gate self-aligned implantation for n⁺-layer technology (FG-SAINT process)     

Ge-on-SOI-Detector/Si-CMOS-Amplifier Receivers for High-Performance Optical-Communication Applications

In this paper, an overview and assessment of high-performance receivers based upon Ge-on-silicon-on-insulator (Ge-on-SOI) photodiodes and Si CMOS amplifier ICs is provided. Receivers utilizing Ge-on-SOI lateral p-i-n photodiodes paired with high-gain CMOS amplifiers are shown to operate at 15 Gb/s with a sensitivity of -7.4 dBm (BER=10^-12) while utilizing a single supply voltage of only 2.4 V. The 5-Gb/s sensitivity of similar receivers is constant up to 93 degC, and 10-Gb/s operation is demonstrated at 85 degC. Error-free (BER<10^-12) operation of receivers combining a Ge-on-SOI photodiode with a single-ended high-speed receiver front end is demonstrated at 19 Gb/s, using a supply voltage of 1.8 V. In addition, receivers utilizing Ge-on-SOI photodiodes integrated with a low-power CMOS IC are shown to operate at 10 Gb/s using a single 1.1-V supply while consuming only 11 mW of power. A perspective on the future technological capabilities and applications of Ge-detector/Si-CMOS receivers is also provided     

Performance of Ge-on-Si p-i-n Photodetectors for Standard Receiver Modules

Ge on Si p-i-n photodetectors with areas which are compatible with commercially available receivers have been fabricated and tested. A dark current density of 6 mA/cm² at -1-V bias has been measured at room temperature; when heated to 85 degC, the measured dark current increases by a factor of nine. A responsivity of 0.59 A/W at 850 nm has been measured from these Ge detectors, which matches or exceeds commercially available GaAs devices. We have measured bandwidths approaching 9 GHz at -2-V bias from 50-mum diameter Ge detectors, and have observed eye diagrams comparable to those obtained from GaAs-based receivers at 4.25 Gb/s     

A 250-Mb/s 32×32 CMOS crosspoint LSI for ATM switchingsystems

A 32×32 crosspoint LSI and a time-slot controlled asynchronous-transfer-mode (ATM) switch architecture utilizing the LSI are presented. The ATM switch, which is classified as an input-buffer-type ATM switch, enables 99% throughput and broadcasting capability. The crosspoint LSI is characterized by the bit-map oriented and pipelined connection control method which can switch and broadcast 160-Mb/s ATM cells, 32×32 switch cells which have less parasitic capacitance, and emitter-coupled-logic (ECL) compatible interfaces which are compatible with a 160-MHz broadband ISDN data rate. The LSI has been fabricated by a 1-μm CMOS process. The chip size is 7.4 mm×7.4 mm. According to the evaluation, operation at 250 Mb/s is confirmed. 1.2-W power consumption is observed at 160-Mb/s operating condition     

An expandable time-division circuit switching LSI and networkarchitecture for broadband ISDN

A broadband network architecture is proposed that integrates multimedia services, such as data, video, and telephony information, using 52-Mb/s based STM-paths at the user network interface (UNI). The user can access any new service via the STM-based access network via either synchronous transfer mode (STM) switching or asynchronous transfer mode (ATM) switching. STM circuit switching supports long duration, constant bandwidth data transfer services such as video and high-definition television (HDTV) distribution and will also be used for the crossconnect system. Circuit switching can provide transparent transmission during long connection periods. This paper also proposes an expandable time-division switch architecture, an expandable time-division switching LSI, and an expandable switching module for small to large size system applications. The proposed time-division switching LSI, module, and system handle 52-Mb/s bearer signals and have throughputs of 2.4 Gb/s, 10 Gb/s, and 40 Gb/s, respectively. The time-division switch realizes video distribution with 1:n connections. Finally, a local switching node that features an expandable 52-Mb/s time-division circuit switching network is shown for multimedia access networking     

An auto-gain control transimpedance amplifier with low noise andwide input dynamic range for 10-Gb/s optical communication systems

This paper describes a 10-Gb/s transimpedance amplifier (TIA), fabricated in a 0.1-μm-p-HEMT technology. To improve the optical overload characteristics, an automatic gain control (AGC) circuit is included. The measured results show excellent performance, transimpedance of 63.3 dBΩ (1.46 kΩ), bandwidth of 8.0 GHz, and equivalent input noise current density of 6.5 pA/rtHz. When the bit error rate is 10^-9, the minimum sensitivity and the optical overload are -21.2 dBm, +4.3 dBm, respectively, using a 0.8 A/W pin photodiode (PD). The power dissipation is about 0.5 W from a single -5-V supply. The die area is 1.3×1.6 mm²     

High average and high peak brightness slab laser

A high average and high peak brightness Nd:YAG MOPA laser system composed of a laser-diode-pumped Nd:YAG master oscillator, flash-lamp-pumped slab power amplifiers and a phase conjugated mirror was developed. The system demonstrates an average output power of 235 W at a repetition rate of 320 Hz and a peak power of 30 MW at a pulse duration of 24 ns with M²=1.5. Both an average brightness of 7×10⁹ W/cm²·sr and a peak brightness of 1×10¹⁵ W/cm2·sr are achieved simultaneously. The system design rules that we confirmed suggest that by replacing lamp pumping in the amplifier with laser-diode pumping, an average output power of ~1 kW can be obtained at ~1 kHz with a higher average brightness of ~3×10¹⁰ W/cm²·sr and a higher peak brightness of ~3×10¹⁵ W/cm²·sr