1V电源非线性补偿的高温度稳定性电压带隙基准源

阐述了电源电压为1V的非线性补偿CMOS电压带隙基准源,该基准源具有很高的温度稳定性.基准源电路中运用了rail-to-rail运算放大器(OPA).根据测试结果,室温下的输出电压为351.9mV,当温度在15～100℃变化时,输出电压在351.5～352.0mV之间变化,温度系数约为16.7ppm/℃.电路的功耗为0.16mW,芯片面积是0.18mm2.     

1V电源非线性补偿的高温度稳定性电压带隙基准源

阐述了电源电压为1V的非线性补偿CMOS电压带隙基准源,该基准源具有很高的温度稳定性.基准源电路中运用了rail-to-rail运算放大器(OPA).根据测试结果,室温下的输出电压为351.9mV,当温度在15～100℃变化时,输出电压在351.5～352.0mV之间变化,温度系数约为16.7ppm/℃.电路的功耗为0.16mW,芯片面积是0.18mm2.     

超低压差线性稳压器的带隙基准电路设计

设计了一种采用电流反馈及电阻分压技术,输出可调的,用于单片集成超低压差的CMOS线性稳压器的高性能带隙基准电压电路.它可产生1～1.2217V多个电压基准;当温度从-40～125℃变化时,温度系数为23×10-6/K;具有较高的电源抑制比(PSRR),其值为78dB.输入电压在2.5～6V变化时,基准电压的变化范围为1.221685±0.055mV,该电路还可为其它电路模块提供PTAT电流.     

一种改进型低温度系数带隙基准源电路

在传统带隙基准源的基础上,设计了一种改进型带隙基准源电路,能很好地抑制三极管集电极电流变化对输出的影响,获得很低的温度系数和很高的电源电压抑制比。基于BCD 0.18 μm工艺库,仿真结果表明,当电源电压VIN为4.5 V,温度范围为-40 ℃~140 ℃时,基准源电路的输出电压范围为1.2567~1.2581 V,温度系数为6.3 ×10-6/℃;电源电压在2.5~5 V范围内变化时,基准源电路输出的最大变化仅为1.66×10-4 V,线性调整率为0.006 64 %;低频电源电压抑制比高达97 dB。过温保护电路(OTP)仿真表明,该基准源电路有良好的温度特性,温度不高于140 ℃都可正常工作。     

一种高精度二阶温度补偿带隙基准电路设计

基于通过负温度系数电压控制工作于亚阈值区MOS管栅压产生随温度变化的补偿电流原理,采用中芯国际0.18μm CMOS工艺,设计了一款高精度二阶温度补偿带隙基准电压源。测试结果表明,当电源电压大于1.6V时,电路能够产生稳定的1.21V输出电压;在电源电压为1.6~3.4V,-20~135℃温度范围内,最小温度系数为2×10-6/℃,最大温度系数为3.2×10-6/℃;当电源电压在1.6~3.4V之间变化时,输出电压偏差为0.6mV,电源调整率为0.34mV/V;在1.8V电源电压下,电源抑制比为69dB,因此能够适应于高精度基准源。     

一种无电阻高精度基准电压源

基于TSMC 0.18 μm BCD工艺,设计了一种无电阻高精度基准电压源。利用具有高阶温度系数的电流消除VBE温度系数中的非线性项,对输出基准电压实现高阶补偿。与传统无电阻基准电压源中MOS管工作于亚阈值区不同,电路中的MOS管均工作于强反型区,具有更高的仿真模型精度。仿真结果表明,当温度在-55 ℃~125 ℃范围变化时,该基准电压源的温度系数为8.5×10-7/℃。在无滤波电容的情况下,电源抑制比可达-80 dB。当电源电压在2.5~5 V范围变化时,线性调整率小于0.3 mV/V。     

一种极低功耗的CMOS带隙基准源

随着SoC在便携产品中应用的迅猛发展,低功耗技术变得越来越重要。本文采用了0.18um的标准CMOS工艺来,设计了一种无电阻、工作在亚阈值区的低功耗、小面积的CMOS电压基准源。这个带隙基准可以灵活运用于极低功耗的SoC系统中。这个电路的电源电流大约为150nA,可以在1.5V～3.3V之间的电源电压下工作,基准源的输出电压的线性度为44.4ppm/V。当电源电压为1.5V,室温下带隙基准电路的输出电压为1.1126V,100Hz频率下的电源抑制比为-66dB,当温度在-20℃与80℃之间变化时,输出电压的温度系数是55ppm/℃。整个带隙基准的芯片面积是0.011mm2。     

一种高精度BiCMOS电流模带隙基准源

采用Xfab0.35μmBiCMOS工艺设计了一种高电源抑制比（PSRR）、低温漂、输出0.5V的带隙基准源电路。该设计中,电路采用新型电流模带隙基准,解决了传统电流模带隙基准的第三简并态的问题,且实现了较低的基准电压;增加了修调电路,实现了基准电压的微调。利用Cadence软件对其进行仿真验证,其结果显示,当温度在-40～＋120℃范围内变化时,输出基准电压的温度系数为15ppm/℃;电源电压在2～4V范围内变化时,基准电压摆动小于0.06mV;低频下具有-102.6dB的PSRR,40kHz前电源抑制比仍小于-100dB。     

一种可编程电压基准源设计与实现

提出了一种新的基于改进的电流模式带隙基准源的可编程基准源的设计与实现方法.电路采用Chartered 0.35μm 工艺仿真并流片.测试结果表明,温度变化范围为0～100℃,温度系数为±36.3ppm/℃(VID=11110).电源电压变化范围为2.7～5V,其相对变化值为5mV.当VID0频率为125kHz时,瞬态响应最大毛刺幅度约为20mV.5位VID码不同的输入状态,输出基准电压从1.1变到1.85V,变化步长为25mV.     

一种可编程电压基准源设计与实现

提出了一种新的基于改进的电流模式带隙基准源的可编程基准源的设计与实现方法.电路采用Chartered 0.35μm 工艺仿真并流片.测试结果表明,温度变化范围为0～100℃,温度系数为±36.3ppm/℃(VID=11110).电源电压变化范围为2.7～5V,其相对变化值为5mV.当VID0频率为125kHz时,瞬态响应最大毛刺幅度约为20mV.5位VID码不同的输入状态,输出基准电压从1.1变到1.85V,变化步长为25mV.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks