共查询到19条相似文献,搜索用时 125 毫秒
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热超声倒装焊在制作大功率GaN基LED中的应用 总被引:2,自引:0,他引:2
设计了适合于倒装的大功率GaN基LED芯片结构,在倒装基板硅片上制作了金凸点,采用热超声倒装焊接(FCB)技术将芯片倒装在基板上.测试结果表明获得的大面积金凸点连接的剪切力最高达53.93 g/bump,焊接后的GaN基绿光LED在350 mA工作电流下正向电压为3.0 V.将热超声倒装焊接技术用于制作大功率GaN基LED器件,能起到良好的机械互连和电气互连. 相似文献
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提出采用 自隔离散热技术解决大功率倒装单片集成LED芯片散热与绝缘之间的矛盾问题.基于自隔离散热技术原理,利用微纳加工技术,通过在AlN陶瓷基板上生长隔离金属岛制备自隔离散热基板.采用多胞串并联网络结构设计大功率倒装单片集成LED芯片,芯片尺寸为1.5 mmx4.5 mm.在200 mA的驱动电流下,大功率倒装单片集成LED芯片的正向电压为8.3 V,反向漏电流小于100 nA.当输入电流为2 A时,大功率倒装单片集成LED芯片的输入功率为20W,其最大光输出功率为8.3 W,插墙效率为42.08%,峰值热阻约为1.23 K/W,平均热阻约为1.17 K/W. 相似文献
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凸点芯片倒装焊接技术 总被引:4,自引:1,他引:3
凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。目前主要有C4、热超声和导电粘接剂等工艺方法,本文介绍了这三种工艺的技术特点、工艺流程及应用领域。 相似文献
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A flip-chip bonding (FCB) method suitable for the surface acoustic wave (SAW) filter was developed. In this method, the gold-ball bumps formed on the chip are directly bonded onto the ceramic substrate by thermosonic bonding. After FCB, they are sealed with a cap without using underfill resin. To obtain high bond strength, characteristic properties of the substrate electrode and the ball bump, were optimized. Furthermore, bondability has been improved by adopting a ramp-up loading profile. The reliability test was carried out with 6-pin SAW chips, and we confirmed the sufficient reliability of bonds. 相似文献
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砷化镓(GaAs)发光二极管LED芯片既可作为发光器件,也可作为光电显示器件,并以其低能耗高亮度的优势被广泛应用,然而由于GaAs材料在机械性能上的不足,使其很容易在组装过程中产生键合陷坑,并对大批量生产造成影响。文章通过对比分析GaAs与Si的机械特性以及GaAs发光二极管的键合特殊性,较为系统地阐述了GaAs发光二极管产生键合陷坑的原因,并针对超声能量、键合压力、载片台温度等键合参数对GaAs发光二极管产生键合陷坑的影响,进行了充分的单项试验,根据试验结果制定了减少GaA s发光二极管键合陷坑的键合方法,极大提高了GaAs发光二极管的键合可靠性。 相似文献
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Thermosonic flip-chip bonding process with a nonconductive paste (NCP) was employed to improve the processability and bonding strength of the flip-chip onto flex substrates (FCOF). A non-conductive paste was deposited on the surface of the copper electrodes over the flex substrate, and a chip with eight gold bumps bonded onto the copper electrodes by the thermosonic flip-chip bonding process.For the chips and flex substrates assembly, ultrasonic power is important in the removal of some of the non-conductive paste on the surface of copper electrodes during thermosonic bonding. Accordingly, gold stud bumps in this study were directly bonded onto copper electrodes to form successful electrical paths between chips and the flex substrate. A particular ultrasonic power resulted in some metallurgical bonding between the gold bumps and the copper electrodes, increasing the bonding strength. The ultrasonic power was not only to remove the NCP from the copper electrodes, but also formed metallurgical bonds during the thermosonic flip-chip bonding process with NCP.In this study, the parameters of the bonding of chips onto flex substrates using thermosonic flip-chip bonding process with NCP were a bonding force of 4.9 N, a curing time of 40 s, a curing temperature of 140 °C and an ultrasonic power of 14.46 W. The processability and bonding strength of flip-chips on flex substrates using thermosonic bonding process with NCP was verified in this study. This process has great potential to be applied to the packaging of consumed electronic products. 相似文献
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In this paper, a parameter driven monitoring model is introduced, in which a flip-chip LED module was investigated during a power cycling test. This approach was investigated to develop a monitoring model to describe thermally induced solder fatigue as root cause of flip-chip failure in a power cycling test. As monitoring parameter the thermal resistance of the LED module was used, which was determined by thermal impedance measurements of the whole LED module, as well as for each LED chip itself. Further analyses of the occurring temperature at the LED junction recorded of each chip during the power cycling test were used to generate a prediction model. The evaluation of the temperature change allowed to forecast the number of cycles until failure. 相似文献
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Cheng-Li Chuang Jong-Ning Aoh Qing-An Liao Chun-Chieh Hsu Shi-Jie Liao Guo-Shing Huang 《Journal of Electronic Materials》2008,37(11):1742-1750
The purpose of this study was to develop the thermosonic flip-chip bonding process for gold stud bumps bonded onto copper
electrodes on an alumina substrate. Copper electrodes were deposited with silver as the bonding layer and with titanium as
the diffusion barrier layer. Deposition of these layers on copper electrodes improves the bonding quality between the gold
stud bumps and copper electrodes. With appropriate bonding parameters, 100% bondability was achieved. Bonding strength between
the gold stud bumps and copper electrodes was much higher than the value converted from the standards of the Joint Electron
Device Engineering Council (JEDEC). The effects of process parameters, including bonding force, ultrasonic power, and bonding
time, on bonding strength were also investigated. Experimental results indicate that bonding strength increased as bonding
force and ultrasonic power increased and did not deteriorate after prolonged storage at elevated temperatures. Thus, the reliability
of the high-temperature storage (HTS) test for gold stud bumps flip-chip bonded onto a silver bonding layer and titanium diffusion
barrier layer is not a concern. Deposition of these two layers on copper electrodes is an effective and direct method for
thermosonic flip-chip bonding of gold stud bumps to a substrate, and ensures excellent bond quality. Applications such as
flip-chip bonding of chips with low pin counts or light-emitting diode (LED) packaging are appropriate. 相似文献
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文章以太阳能供电的LED照明系统为研究对象,探讨了其基本构成,重点探讨了太阳能充电控制器的设计及其电路实现。设计了以PWM控制器CS51221为控制核心的充电控制器的电路,探讨了相关元器件参数的计算方法:分析了LED照明驱动系统的组成及其功能,设计了以NCP3066为核心的LED驱动电路、光敏二极管开关电路、PWM波调光电路;完成了简易太阳能供电LED照明系统电路的硬件,并对其功能及工作性能参数进行了测试和分析。结果表明,该LED照明系统满足设计要求,系统运行良好。 相似文献